Evaporation film material structure and evaporation equipment

Abstract

The utility model provides an evaporation film material structure and evaporation equipment, and relates to the technical field of evaporation film coating. The evaporation film material structure comprises a film material block and film material particles, the film material block and the film material particles are the same in component, and the film material particles are laid on the whole top face of the film material block. According to the evaporation film material structure, during evaporation, splashing caused by further expansion of cracks of the film material blocks can be avoided, the evaporation rate is stable, and the evaporation film material structure can adapt to long-time evaporation.

Description

Technical Field

[0001] The present application relates to the technical field of evaporation coating, and in particular to an evaporation coating material structure and an evaporation coating device. Background Art

[0002] Electron beam evaporation coating technology uses a high-energy electron beam to evaporate the evaporated film material and deposit it on the surface of the object to be processed to form a thin film. In the evaporation coating process, granular film materials or block film materials are usually used as evaporation film materials. There are large gaps between granular film materials, which are prone to film splashing during evaporation; and the granular film material has a small amount of film material in the crucible, which requires multiple additions. Block film materials are prone to explosion when the electron beam hits the block film material. Therefore, the evaporation of existing evaporation film materials is unstable, which affects the uniformity and density of the coating after forming. Utility Model Content

[0003] In order to overcome the deficiencies in the prior art, the present application provides a vapor deposition film material structure and a vapor deposition device.

[0004] This application provides the following technical solutions:

[0005] In a first aspect, the present application provides a vapor deposition film material structure, comprising: a film material block and film material particles, wherein the film material block and the film material particles have the same composition, and the entire top surface of the film material block is paved with the film material particles.

[0006] In a possible implementation manner, the membrane material particles are arranged around the membrane material block, and the membrane material particles cover the entire outer surface of the membrane material block.

[0007] In a possible implementation manner, the film material block is cylindrical.

[0008] In a possible implementation, the film material block and the film material particles are both arranged in a crucible, the crucible is in the shape of an inverted frustum, and the bottom surface of the film material block is consistent with the shape and size of the bottom surface of the crucible.

[0009] In a possible implementation manner, a ratio d between a diameter of a top surface of the membrane material particle and a diameter of a top surface of the membrane material block satisfies the relationship: 1≤d<2.

[0010] In a possible implementation, the overall thickness of the film material particles is between 1-3 mm.

[0011] In a possible implementation, the thickness of the film block is between 10-12 mm.

[0012] In a possible implementation manner, the film material block is a sapphire block; and the film material particles are aluminum oxide particles.

[0013] In a possible implementation manner, the membrane material block is a quartz block; and the membrane material particles are silicon dioxide particles.

[0014] In a second aspect, the present application further provides an evaporation device, which includes a crucible and an electron gun; the crucible is used to accommodate the above-mentioned evaporation film material structure; and the electron gun is used to heat the evaporation film material structure.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The evaporation film material structure of the present application is composed of a film material block and film material particles laid on the top surface of the film material block; when the film material particles are heated and melted, a molten pool can be formed, and the continuously dissolved molten pool can transfer heat to the film material block to promote the melting of the film material block; because the film material block has a high density and no internal voids, the utilization rate of the film material during evaporation of the evaporation film material structure can be improved, and the occurrence of splashing can be reduced. The molten pool formed by the film material particles promotes the melting of the film material block, which can effectively prevent the film material block from being subjected to a relatively concentrated thermal shock, and when the film material particles are melted, the molten pool can fill the cracks of the film material block, thereby preventing the film material block from bursting.

[0017] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, preferred embodiments are given below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram showing the structure of the evaporated film material in the first embodiment of the present application is shown;

[0020] Figure 2 A schematic diagram showing another angle of the evaporated film material structure of the first embodiment of the present application;

[0021] Figure 3 A schematic diagram of the vapor-deposited film material structure of the second embodiment of the present application is shown.

[0022] Description of main component symbols:

[0023] 100 - evaporation film material structure; 110 - film material block; 120 - melting part; 121 - heating interface; 122 - pre-melting area; 130 - support part; 200 - crucible. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] For ease of understanding, the problems existing in the use of existing vapor deposition film materials are described in detail.

[0030] The granular film material is made of multiple particles of the same material stacked together. There are large gaps between the particles, which results in a low density of the film material in the crucible and cannot be evaporated for a long time. In addition, since the granular film material is easily penetrated (the electron beam penetrates the particle layer) and the evaporation interface is uneven, the heating state of each particle during evaporation is different, resulting in the vaporized evaporated film material not being able to volatilize stably, affecting the uniformity and density of the film after forming.

[0031] In order to improve the overall utilization rate of granular film materials and reduce the gaps inside the granular film materials, the prior art usually uses a flux to fix multiple granular layers. The flux refers to the ion beam emitted by the electron gun, which melts the particles between the granular layers in the form of energy to pre-melt the granular film material into a whole. However, the light spot emitted by the electron gun has limited ability to melt thicker film materials; therefore, multiple flux operations are required to melt the granular layers layer by layer. Multiple flux operations increase time costs and usage costs.

[0032] The block film materials in the prior art are mostly formed by pre-treating and sintering granular materials, which increases the density, makes it less prone to breakdown, and allows for more uniform gas volatilization during evaporation. However, due to the large internal stress of the block film materials, when the light spot emitted by the electron gun acts on the block film materials, the gas released from the block film materials can easily cause the block film materials to explode, thereby affecting the formation of the coating on the surface of the processed object.

[0033] Embodiment 1

[0034] See also Figures 1 to 3 In one embodiment of the present application, there is provided a vapor deposition film material structure 100. The vapor deposition film material structure 100 can be vaporized under the heating of the vapor deposition device, so that particles are deposited on the surface of the object to be processed and form a thin film.

[0035] The evaporation film material structure 100 includes a film material block 110 and film material particles. The film material block 110 and the film material particles have the same composition, and the entire top surface of the film material block 110 is paved with the film material particles.

[0036] The film material particles laid on the top surface of the film material block 110 can form a molten pool when heated. The continuously melting molten pool can transfer heat to the film material block 110, so that the film material block 110 is heated and melted. The molten pool causes the film material block 110 to melt, which can effectively prevent the film material block 110 from being subjected to a relatively concentrated thermal shock, and the molten pool can fill the cracks generated by the film material block 110 due to heating, thereby preventing the cracks from further expanding and causing splashing, and effectively preventing the film material block 110 from bursting during evaporation. The gas volatilized during evaporation of the evaporation film material structure 100 is mainly provided by the film material block 110; because the interior of the film material block 110 is dense and uniform, and there is no gap, when the evaporation film material structure 100 is placed in the crucible 200 of the evaporation equipment, the amount of evaporation film material in the crucible 200 is relatively large, so that the evaporation film material structure 100 can adapt to long-term evaporation, and the rate during evaporation is relatively stable.

[0037] In some embodiments, the shape of the film material block 110 is the same as the shape of the inside of the crucible 200, so that the film material block 110 is just placed in the crucible 200. After the film material block 110 is placed in the crucible 200, the film material particles are spread on the top of the film material block 110, so that the film material block 110 and the film material particles are pre-melted into an integral structure.

[0038] See also Figure 1 In some embodiments, the vapor-deposited film material structure 100 further includes a supporting portion 130 and a melting portion 120; the supporting portion 130 and the melting portion 120 are both composed of a plurality of the film material particles.

[0039] The support portion 130 is disposed between the crucible 200 and the outer peripheral surface of the film material block 110 , and the film material particles constituting the support portion 130 cover the entire outer peripheral surface of the film material block 110 .

[0040] The melting portion 120 is disposed on the top of the film material block 110 , and the film material particles constituting the melting portion 120 cover the entire top surface of the film material block 110 , and some of the film material particles in the melting portion 120 are in contact with the film material particles in the supporting portion 130 .

[0041] When the shape of the film block 110 does not completely match the shape of the inside of the crucible 200, the support portion 130 can fix the film block 110 after being connected to the film block 110 through a pre-melting process to prevent the film block 110 from bursting during evaporation.

[0042] The molten pool formed after the film material particles in the melting part 120 are heated and melted can transfer heat to the film material block 110 and the film material particles in the supporting part 130, so as to promote the melting of the film material block 110 and the film material particles in the supporting part 130. The molten pool formed when the film material particles in the melting part 120 are melted can fill the cracks of the film material block 110. When the film material particles in the melting part 120 are exhausted, the molten pool formed when the film material particles in the supporting part 130 are melted can continue to fill the cracks of the film material block 110 to bond the cracks, further reducing the explosion problem of the film material block 110 during evaporation.

[0043] In some embodiments, the film material block 110 is cylindrical, the inner shape of the crucible 200 is in the shape of an inverted truncated cone, and the bottom surface of the film material block 110 is consistent with the shape and size of the inner bottom surface of the crucible 200. The bottom surface of the film material block 110 is placed on the inner bottom surface of the crucible 200, and the film material particles constituting the support portion 130 are arranged between the inner side wall of the crucible 200 and the curved surface of the film material block 110, and the film material particles constituting the support portion 130 are arranged around the circumference of the film material block 110 and cover the entire curved surface of the film material block 110. The melting portion 120 is located at the opening of the crucible 200, and the film material particles constituting the melting portion 120 are laid on the top surface of the film material block 110 and the top of the support portion 130.

[0044] The overall shape of the melting portion 120 is substantially cylindrical, and the thickness of the melting portion 120 is relatively uniform, so as to ensure that when the electron beam heats different regions of the melting portion 120 , the heating temperatures of the different regions are consistent.

[0045] The diameter of the top surface of the melting portion 120 is equal to the diameter of the opening of the crucible 200 .

[0046] In some embodiments, a ratio d between a diameter of the top surface of the melting portion 120 and a diameter of the top surface of the film material block 110 satisfies the relationship: 1≤d<2.

[0047] The diameter of the top surface of the melting portion 120 is not less than the diameter of the top surface of the film material block 110, so as to ensure that the film material particles in the melting portion 120 can cover the top surface of the film material block 110. If the ratio between the diameter of the top surface of the melting portion 120 and the diameter of the top surface of the film material block 110 is too large, it will affect the heat transfer of the melting portion 120 to the film material block 110.

[0048] Preferably, when the ratio d between the top diameter of the melting portion 120 and the diameter of the film material block 110 is 1.5, the melting portion 120 has a better effect of heat transfer to the film material block 110 .

[0049] In some embodiments, the thickness of the fusion portion 120 is between 1 mm and 3 mm.

[0050] Since the electron beam emitted by the electron gun has limited action capability, if the thickness of the melting portion 120 is too thick, the electron beam cannot completely penetrate the melting portion 120, resulting in uneven temperature inside the melting portion 120. If the thickness of the melting portion 120 is too thin, the molten pool formed by the melting portion 120 cannot effectively fill the cracks of the film block 110.

[0051] Preferably, when the thickness of the melting portion 120 is 2 mm, the electron beam emitted by the existing electron gun can penetrate the melting portion 120 to ensure that the internal temperature of the melting portion 120 is relatively uniform when the melting portion 120 melts, and the melting portion 120 forms a large amount of molten pool, which can effectively fill the cracks of the membrane block 110.

[0052] In some embodiments, the thickness of the film block 110 is between 10-12 mm.

[0053] If the thickness of the film material block 110 is too thin, it is not conducive to long-term evaporation. If the thickness of the film material block 110 is too thick, the material at the bottom of the film material block 110 cannot be fully heated.

[0054] Preferably, when the thickness of the film material block 110 is 11 mm, the evaporation time of the evaporation film material structure 100 is longer, and the material at the bottom of the film material block 110 can be fully utilized.

[0055] See also Figure 1 and Figure 2 The top side of the melting portion 120 has a heating interface 121. In order to improve the flatness of the heating interface 121 and reduce the gap inside the melting portion 120, the melting portion 120 needs to be connected to the film material block 110 into an integral structure through a pre-melting process.

[0056] The film material block 110 is placed in the crucible 200, and after the film material particles constituting the melting portion 120 are laid on the top surface of the film material block 110, the electron gun emits an electron beam toward the heating interface 121 to heat and melt the melting portion 120. After the pre-melting is completed, evaporation is performed. During the evaporation process, the electron beam hits the thin molten material on the top to volatilize the molten liquid to plate the product. The heat of the electron beam heats and melts the film material block 110 at the same time to continuously provide molten material. The film material block 110 will not explode, thereby stabilizing the volatilization of the molten liquid and improving the efficiency and stability of the coating.

[0057] After the pre-melting process, the film material particles in the melting part 120 are heated and melted, and the melt formed during the melting can fill the gaps between the film material particles to improve the flatness of the heating interface 121. The improvement of the flatness of the heating interface 121 can make the height of the light spot hitting different areas of the heating interface 121 consistent, thereby ensuring that the energy received by different areas of the heating interface 121 is consistent.

[0058] In some embodiments, due to the limited size of the spot formed by the electron beam irradiating the heating interface 121, it is impossible to irradiate the entire top surface of the molten portion 120 at one time. The heating interface 121 has a plurality of intersecting pre-melting areas 122, and the electron beam sequentially irradiates different pre-melting areas 122 to ensure uniform heating of the molten portion 120 when it is heated.

[0059] Preferably, the heating interface 121 is provided with a plurality of pre-melting regions 122 of the same shape and size; the plurality of pre-melting regions 122 are all circular, and the diameter of the pre-melting region 122 is the same as the diameter of the light spot; one pre-melting region 122 is located directly above the top surface of the film material block 110, and the remaining pre-melting regions 122 are evenly arranged around the circumference thereof. There is an overlapping area between adjacent pre-melting regions 122.

[0060] The pre-melting steps are as follows:

[0061] Step 1: The muzzle of the electron gun moves to above the pre-melting area 122 located in the middle, and emits an electron beam into the pre-melting area 122 located in the middle.

[0062] Step 2: The muzzle of the electron gun moves to above any of the pre-melting areas 122 arranged along the circumferential direction, and emits an electron beam into the pre-melting area 122 below the muzzle.

[0063] Step three, the muzzle of the electron gun moves in a clockwise direction or a counterclockwise direction to emit electron beams into the corresponding pre-melting areas 122 in sequence.

[0064] In the fourth step, steps 1 to 3 are repeated until the melting portion 120 is connected to the film material block 110 .

[0065] After the pre-melting process, the gap inside the melting portion 120 can be effectively reduced, and the flatness of the heating interface 121 can be improved, so that the film material particles in the melting portion 120 are heated evenly.

[0066] During pre-melting, the melt sinking in the melting part 120 can make the film material particles in the supporting part 130 adhere to the film material block 110, thereby fixing the film material block 110 and preventing the film material block 110 from bursting during evaporation.

[0067] Please refer again Figure 2 In a specific embodiment, the evaporation film material structure is composed of a film material block, film material particles laid on the top surface of the film material block, and film material particles arranged around the film material block. The structure is composed of a film material block and film material particles laid on the top surface of the film material block.

[0068] When the electron gun is pre-melted, the ion beam is first hit at position 1. There is a 2mm thick granular film material on the top of the block film material. The granular film material is melted first. Because the energy of the blocking ion beam of the granular film material above is reduced, the block film material below will not splash but will only crack. After cracking, the melted granular film material above penetrates into the block film material. Fill the central gap of the block film material, and then pre-melt parts 2, 3, 4, 5, 6, 7, 8, and 9. The granular film material at the edge melts and penetrates into the edge gap.

[0069] After pre-melting is completed, the stress in the cracks of the block film material itself is destroyed, and the subsequent coating will no longer cause splashing problems. In addition, because the gaps between the center and the periphery are filled by the molten granular film material, the coating will not be uneven due to gaps or unevenness in the film material.

[0070] See also Figure 3 In some embodiments, the film material block 110 is in the shape of a triangular prism, and the diameter of the outer circle of the bottom surface of the film material block 110 is the same as the diameter of the inner bottom surface of the crucible 200 .

[0071] As required, the film block 110 may also be in other shapes such as a quadrangular prism.

[0072] In some embodiments, the film material block 110 is a sapphire block; and the film material particles are aluminum oxide particles.

[0073] In another embodiment, the film material block 110 is a quartz block; and the film material particles are silicon dioxide particles.

[0074] The vapor deposition film material structure 100 provided in this embodiment is such that the film material particles laid on the top surface of the film material block 110 can form a molten pool when heated, and the sinking molten pool can adhere to the cracks generated by the film material block 110 when heated, thereby avoiding film material splashing caused by the expansion of the cracks and effectively preventing the film material block 110 from bursting during vapor deposition.

[0075] Embodiment 2

[0076] The present application also provides an evaporation device, including a crucible 200 and an electron gun; the crucible 200 is used to accommodate the evaporation film material structure 100 of any of the above embodiments; the electron gun is used to heat the evaporation film material structure 100.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0078] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A vapor deposition film material structure, characterized in that: include: Film material blocks and film material particles, wherein the film material blocks and the film material particles have the same composition, and the entire top surface of the film material block is paved with the film material particles; The membrane material particles are arranged around the membrane material block, and the membrane material particles cover the entire outer surface of the membrane material block.

2. The vapor deposition film material structure according to claim 1, characterized in that: The film material block is cylindrical.

3. The vapor deposition film material structure according to claim 2, characterized in that: The film material block and the film material particles are both arranged in a crucible, and the crucible is in the shape of an inverted frustum of a cone. The bottom surface of the film material block is consistent with the shape and size of the bottom surface of the crucible.

4. The vapor deposition film material structure according to claim 3, characterized in that: The ratio d between the diameter of the top surface of the membrane material particle and the diameter of the top surface of the membrane material block satisfies the relationship: 1≤d<2.

5. The vapor deposition film material structure according to claim 1, characterized in that: The overall thickness of the film material particles is between 1 and 3 mm.

6. The vapor deposition film material structure according to claim 1 or 5, characterized in that: The thickness of the film block is between 10 and 12 mm.

7. The vapor deposition film material structure according to claim 1, characterized in that: The film material block is a sapphire block; the film material particles are aluminum oxide particles.

8. The vapor deposition film material structure according to claim 1, characterized in that: The membrane material block is a quartz block; the membrane material particles are silicon dioxide particles.

9. A vapor deposition device, characterized in that: It comprises a crucible and an electron gun; the crucible is used to accommodate the evaporated film material structure described in any one of claims 1 to 8; the electron gun is used to heat the evaporated film material structure.

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