Hot melt adhesive sample treatment device

Abstract

The utility model belongs to the technical field of hot melt adhesive detection, and discloses a hot melt adhesive sample processing device which comprises a sample seat, a pressing plate and a cutter, and a sample placing area is arranged on the sample seat; the pressing plate is arranged above the sample seat in a lifting manner, and a mounting hole is formed in the pressing plate; the cutter is of a cylindrical structure with an opening in the lower end, the cutter is arranged in the mounting hole in a telescopic mode in the vertical direction, and the cutter can be matched with the hot melt adhesive sample mold to cut off the hot melt adhesive protruding out of the hot melt adhesive sample mold in the annular direction; the sample seat has a first state and a second state, in the first state, the projection of the sample placing area towards the pressing plate is staggered from the mounting hole, and in the second state, the projection of the sample placing area towards the pressing plate is right opposite to the mounting hole. According to the hot melt adhesive sample treatment device, the shape and the size of the hot melt adhesive sample can be consistent with those of the inner cavity of the hot melt adhesive sample mold, and the subsequent detection precision can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of hot melt adhesive detection, in particular to a hot melt adhesive sample processing device. Background Art

[0002] Hot melt adhesive is a plastic adhesive. Its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. It is popular because the product itself is solid, easy to package, transport, store, solvent-free, pollution-free, non-toxic; and has the advantages of simple production process, high added value, high bonding strength, and fast speed.

[0003] The softening point is the temperature at which the hot melt adhesive starts to flow. It is a performance indicator of the quality and process of the hot melt adhesive, and is also a reference for selecting a hot melt adhesive applicator. Therefore, when selecting hot melt adhesive, it is necessary to test the softening point of the hot melt adhesive.

[0004] During testing, in order to ensure repeatability between parallel experiments, the hot melt adhesive in the mold needs to be cut manually and evenly. However, due to differences in labor strength, hot melt adhesive state, etc., the shape and size of the hot melt adhesive after cutting cannot be guaranteed to be consistent, which can easily affect the validity of the test results. Utility Model Content

[0005] The purpose of the utility model is to provide a hot melt adhesive sample processing device, which can process hot melt adhesive samples. The shape and size of the processed hot melt adhesive samples are consistent with the inner cavity shape and size of the hot melt adhesive sample mold, which is conducive to improving the accuracy of subsequent test results.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A hot melt adhesive sample processing device, used in conjunction with a hot melt adhesive sample mold, comprises a sample holder, a pressing plate, a lifting mechanism, a cutter and a telescopic mechanism, wherein a sample placement area is provided on the sample holder; the pressing plate is liftably arranged above the sample holder, and a mounting hole is arranged on the pressing plate; the lifting mechanism is configured to drive the pressing plate to be lifted and lowered; the cutter is configured as a cylindrical structure with an opening at the lower end, and the cutter is telescopically arranged in the mounting hole along the vertical direction, and the cutter can cooperate with the hot melt adhesive sample mold to cut off the hot melt adhesive protruding from the hot melt adhesive sample mold in an annular direction; the telescopic mechanism is configured to drive the cutter to extend or retract into the mounting hole; the sample holder has a first state and a second state, and when in the first state, the projection of the sample placement area in the direction of the pressing plate is staggered with the mounting hole, and when in the second state, the projection of the sample placement area in the direction of the pressing plate is directly opposite to the mounting hole.

[0008] Preferably, a plurality of the sample placement areas are arranged at intervals on the sample holder, a plurality of the mounting holes corresponding to the sample placement areas are arranged on the pressing plate, and the cutter is arranged in any of the mounting holes.

[0009] Preferably, a rotating mechanism is further included, the sample placement areas are distributed on the sample holder along a circumferential array, the mounting holes are distributed on the pressure plate along a circumferential array, and the rotating mechanism is configured to drive the sample holder or the pressure plate to rotate around its own axis.

[0010] Preferably, a monitoring mechanism is further included, wherein the output end of the rotating mechanism is connected to the sample holder, and the monitoring mechanism includes an infrared receiver and an infrared transmitter, wherein one of the infrared receiver and the infrared transmitter is located at one side of the sample holder, and the other is arranged in the sample working area, and the height of the infrared receiver and the infrared transmitter is the same as the height of the upper surface of the hot melt adhesive sample mold.

[0011] Preferably, the sample holder includes a mounting plate and a sample rack, the mounting plate is configured as a cavity structure and a through hole is opened in a circumferential direction on the top surface, the sample rack includes a buffer and a sample placement table, the buffer is located in the mounting plate and is arranged corresponding to the through hole, the sample placement table is arranged on the top surface of the buffer, and the upper surface of the sample placement table is the sample placement area.

[0012] Preferably, the cross-sectional size of the sample placement platform is the same as the cross-sectional size of the hot melt adhesive sample mold, and there is a gap between the sample placement platform and the inner wall of the through hole.

[0013] Preferably, the sample placement area is provided with a positioning groove for inserting a positioning block on the hot melt adhesive sample mold.

[0014] Preferably, a heating element is further included, and the heating element is configured to heat the cutter.

[0015] Preferably, the cutter is a metal cutter, the heating element is a coil, the coil is fixed in the mounting hole, and the coil generates a high-frequency magnetic field when energized.

[0016] Preferably, it further comprises a base and a support frame, wherein the sample holder is arranged on the base, one end of the support frame is connected to the base, and the other end is connected to the lifting mechanism, and the pressing plate is arranged at the output end of the lifting mechanism.

[0017] Beneficial effects of the utility model: the hot melt adhesive sample processing device in the utility model is provided with a liftable pressing plate above the sample holder, and when the sample holder is in a first state, the pressing plate descends to flatten the portion of the hot melt adhesive sample on the sample holder that protrudes out of the hot melt adhesive sample mold in the height direction, and when the sample holder is in a second state, the cutter can extend out of the mounting hole and cooperate with the outer wall surface of the hot melt adhesive sample mold to cut off the hot melt adhesive pressed out of the hot melt adhesive sample mold during the flattening process. At this time, the shape and size of the hot melt adhesive sample are completely consistent with the shape and size of the inner cavity of the hot melt adhesive sample mold, thereby ensuring the consistency of the shape and size of the hot melt adhesive sample after being processed by the hot melt adhesive sample processing device, which is beneficial to improving the accuracy of subsequent detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a hot melt adhesive sample processing device in an embodiment of the utility model;

[0019] Figure 2 It is a top view of the sample tray in the embodiment of the utility model.

[0020] In the figure:

[0021] 1. Pressing plate; 2. Cutter; 3. Lifting mechanism; 31. Mounting seat; 32. Sliding shaft; 33. Rotating shaft; 4. Sample seat; 41. Mounting plate; 41a. Through hole; 42. Sample rack; 421. Sample placement table; 5. Base; 6. Support frame. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0023] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In the present utility model, unless otherwise clearly stipulated and limited, the first feature may be in direct contact with the second feature when it is “above” or “below” the second feature, or may be in contact with the second feature not directly but through another feature between them. Moreover, the first feature “above”, “above” and “above” the second feature has features directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature “below”, “below” and “below” the second feature has features directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0025] In the description of this embodiment, the terms "upper", "lower", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplified operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0026] refer to Figure 1-Figure 2 As shown, in an embodiment of the utility model, a hot melt adhesive sample processing device is proposed, which is used to process the hot melt adhesive placed in the hot melt adhesive sample mold so that the shape and size of each hot melt adhesive sample are consistent with the inner cavity of the hot melt adhesive sample mold, and the hot melt adhesive sample is a cylindrical structure with an open top. The hot melt adhesive sample device includes a pressing plate 1, a cutter 2, a lifting mechanism 3, a telescopic mechanism and a sample holder 4. The sample holder 4 is provided with a sample placement area for placing the hot melt adhesive sample mold. The pressing plate 1 can be lifted and lowered above the sample holder 4. The lifting mechanism 3 is configured to drive the pressing plate 1 to lift and lower. The pressing plate 1 is provided with a mounting hole. The cutter 2 is configured to be a cylindrical shape with an open bottom and is telescopically arranged in the mounting hole in a vertical direction. The cutter 2 can cut off the hot melt adhesive protruding from the hot melt adhesive sample mold in the circumferential direction. The telescopic mechanism is configured to drive the cutter 2 to extend or retract into the mounting hole. The sample holder 4 has a first state and a second state. In the first state, the projection of the sample placement area on the sample holder 4 toward the pressing plate 1 is offset from the mounting hole. In the second state, the projection of the sample placement area on the sample holder 4 toward the pressing plate 1 is opposite to the mounting hole.

[0027] The hot melt adhesive sample processing device is provided with a liftable pressing plate 1 above the sample holder 4. When the sample holder 4 is in a first state, the pressing plate 1 descends to flatten the portion of the hot melt adhesive sample on the sample holder 4 that protrudes out of the hot melt adhesive sample mold in the height direction. When the sample holder 4 is in a second state, the cutter 2 can extend out of the mounting hole and cooperate with the outer wall surface of the hot melt adhesive sample mold to cut off the hot melt adhesive pressed out of the hot melt adhesive sample mold during the flattening process. At this time, the shape and size of the hot melt adhesive sample are completely consistent with the shape and size of the inner cavity of the hot melt adhesive sample mold, thereby ensuring the consistency of the shape and size of the hot melt adhesive sample after being processed by the hot melt adhesive sample processing device, which is beneficial to improving the accuracy of subsequent detection.

[0028] The specific shape of the cutter 2 is adapted to the shape of the hot melt adhesive sample mold. Taking the hot melt adhesive sample mold as a cylindrical shape, for example, the cutter 2 is set to a cylindrical shape and its inner diameter is the same as the outer diameter of the hot melt adhesive sample mold; if the hot melt adhesive sample mold is set to a square cylinder shape, the cutter 2 is also set to a square cylinder shape and the inner peripheral contour size is the same as the outer peripheral contour size of the hot melt adhesive sample mold. In summary, the inner peripheral wall of the cutter 2 can completely fit the outer peripheral wall of the hot melt adhesive sample mold, so that when the cutter 2 moves toward the hot melt adhesive sample mold and gradually sleeves on the outside of the hot melt adhesive sample mold, the hot melt adhesive protruding from the hot melt adhesive sample mold along the circumferential direction is cut off.

[0029] In this embodiment, in order to improve the processing speed of the hot melt adhesive sample, a plurality of sample placement areas are arranged at intervals on the sample holder 4, and a plurality of hot melt adhesive sample molds can be placed in the sample placement areas one by one. At the same time, a plurality of mounting holes corresponding to the sample placement areas are arranged on the pressing plate 1, and a cutter 2 is arranged in any mounting hole.

[0030] On this basis, the transformation of the state of the sample holder 4 is achieved by the relative rotation of the sample holder 4 and the pressing plate 1, and the sample placement area and the mounting holes are respectively distributed along the annular array on the sample holder 4 and the pressing plate 1. At this time, the hot melt adhesive sample processing device also includes a rotating mechanism, which is configured to drive the sample holder 4 or the pressing plate 1 to rotate around its own axis.

[0031] In other embodiments, the transformation of the state of the sample holder 4 may also be achieved through a relative translation movement between the sample holder 4 and the pressing plate 1 , which will not be described in detail here.

[0032] In this embodiment, the output end of the rotating mechanism is connected to the sample holder 4, that is, the sample holder 4 can rotate around its own axis, and the sample holder 4 can be switched between the first state and the second state by rotating the sample holder 4. Specifically, the sample holder 4 and the pressing plate 1 are both set to be circular.

[0033] In this embodiment, the rotating mechanism includes an annular track arranged below the sample holder, and a plurality of supporting rollers are arranged in the sample holder 4 and one of the annular tracks to rotate at intervals along the annular direction. The supporting rollers serve to support the sample holder 4 to maintain the flatness of the upper surface of the sample holder 4. At least one supporting roller is connected to a motor to drive the sample holder 4 to rotate.

[0034] In other embodiments, the rotating mechanism may be a motor that is transmission-connected to the sample holder 4 .

[0035] refer to Figure 1 As shown, the hot melt adhesive sample processing device also includes a base 5 and a support frame 6. The base 5 serves as the installation base of the entire hot melt adhesive sample processing device. The rotating mechanism is arranged on the base 5 and connected to the sample holder 4. The support frame 6 is arranged in an L shape, and its vertical end is connected to the base 5, and its horizontal end is connected to the lifting mechanism 3. The pressing plate 1 is arranged at the output end of the lifting mechanism 3 so that it can be lifted and lowered with the pressing plate 1 under the action of the lifting mechanism 3.

[0036] In this embodiment, the lifting mechanism 3 includes a mounting seat 31, a rotating shaft 33, a sliding shaft 32 and a transmission structure. The mounting seat 31 is fixed to the end of the support frame 6 away from the base 5, and a guide hole is provided thereon that passes through the mounting seat 31 in the vertical direction. The sliding shaft 32 is slidably arranged in the guide hole through a bearing. The pressing plate 1 is fixed to the lower end of the sliding shaft 32. The rotating shaft 33 is rotatably arranged on the mounting seat 31 through a bearing and is connected to the sliding shaft 32 through a transmission structure. The transmission structure is used to convert the rotational motion of the rotating shaft 33 into the vertical lifting motion of the sliding shaft 32. As for the rotational power of the rotating shaft 33, it can come from a motor or from a manual drive, such as a handle fixed to the rotating shaft 33, and the rotation of the rotating shaft 33 is achieved by rotating the handle.

[0037] Preferably, the transmission structure includes a transmission rod and a guide groove horizontally provided on the sliding shaft 32, one end of the transmission rod is connected to the rotating shaft 33, and the other end is slidably disposed in the guide groove. When the rotating shaft 33 rotates under the action of an external force, the transmission rod is driven to rotate together, and under the joint action of the guide groove and the guide hole, the sliding shaft 32 only performs vertical lifting motion, thereby realizing the lifting and lowering of the pressing plate 1 relative to the mounting seat 31.

[0038] In other embodiments, the transmission structure includes a cam connected to the rotating shaft 33 and a baffle fixed on the sliding shaft. The cam abuts against the lower surface of the baffle. When the rotating shaft 33 rotates, the cam rotates accordingly, and the baffle moves up and down as the outer peripheral contour of the cam changes.

[0039] In other embodiments, the lifting mechanism may also be an electric cylinder or a telescopic cylinder directly connected to the pressing plate 1 .

[0040] In this embodiment, the telescopic mechanism includes a vertically arranged electric cylinder, the mounting hole is arranged through the mounting seat 31, the two ends of the electric cylinder are respectively connected to the cutter 2 and the mounting seat 31, and the extension and retraction of the cutter 2 is achieved by the extension and retraction of the electric cylinder. In order to achieve the synchronous extension and retraction of multiple cutters 2, the telescopic mechanism also includes a base plate sleeved outside the mounting seat 31 and located above the pressure plate 1, and multiple cutters 2 are mounted on the base plate. The electric cylinder is connected to the base plate, and the extension and retraction of the cutter 2 is achieved by driving the base plate to move.

[0041] In order to improve the cutting efficiency of the cutter 2, the hot melt adhesive sample processing device also includes a heating element, which is configured to heat the cutter 2. The heated cutter 2 can quickly cut off the excess hot melt adhesive pressed out by the pressing plate 1, and the cutting edge is smooth and flat.

[0042] Preferably, the cutter 2 is a metal cutter, and the heating element is a coil, which is fixed in the mounting hole. When the coil is energized, a high-frequency magnetic field is generated, and the cutter 2 is induced by the magnetic field to achieve rapid heating.

[0043] In order to detect whether the flatness of the hot melt adhesive sample processed by the hot melt adhesive sample processing device meets the requirements, the hot melt adhesive sample processing device also includes a monitoring mechanism, which is used to monitor the flatness of the upper surface of the hot melt adhesive sample. In this embodiment, the monitoring mechanism includes an infrared receiver and an infrared transmitter, one of the infrared receiver and the infrared transmitter is set on the base 5 and located on one side of the sample holder 4, and the other is set in the sample working area. Of course, the infrared receiver or infrared transmitter set in the sample working area corresponds to the number of sample working areas, and the height of the infrared receiver and the infrared transmitter is the same as the height of the upper surface of the hot melt adhesive sample mold. When the sample holder 4 rotates, the infrared receiver can receive the infrared rays emitted by the infrared sensor, which means that the flatness of the upper surface of the hot melt adhesive sample meets the requirements, otherwise it means that it does not meet the requirements.

[0044] In order to achieve a closed loop, the hot melt adhesive sample processing device also includes a controller and an alarm mechanism. The alarm mechanism and the monitoring mechanism are both connected to the controller in communication. The controller is used to control the alarm mechanism, the monitoring mechanism, the lifting mechanism 3, the rotating mechanism, the telescopic mechanism and the heating element to execute corresponding instructions. For example, when the monitoring mechanism detects that the flatness of the upper surface of the hot melt adhesive sample does not meet the requirements, the controller controls the alarm mechanism to sound an alarm to remind the operator. The control principle of the controller and the connection method with each functional mechanism belong to the prior art and will not be described in detail here. The alarm mechanism can use a voice alarm or a light alarm, and no specific limitation is made here.

[0045] In this embodiment, the sample holder 4 includes a mounting plate 41 and a sample rack 42. The mounting plate 41 is configured as a cavity structure and a plurality of through holes 41a are provided on the top surface along the circumferential direction. The sample rack 42 includes a buffer and a sample placement table 421. The plurality of buffers are located in the mounting plate 41 and are arranged one-to-one with the through holes 41a. The sample placement table 421 is arranged on the top surface of the buffer, and its upper surface is used as a sample placement area for placing a hot melt adhesive sample mold. The buffer can provide a buffer for the sample placement table 421 to prevent the sample placement table 421 from being damaged under the pressure of the pressing plate 1. Preferably, the buffer includes a spring. In order to provide guidance for the buffer and prevent the sample placement table 421 from tilting, the buffer also includes a guide rod, which is vertically fixed in the mounting plate 41 and the spring is sleeved on the guide rod. It can be understood that the length of the spring is greater than the length of the guide rod.

[0046] In order to prevent the hot melt adhesive sample mold from shifting relative to the sample holder 42, thereby ensuring that the cutter 2 can be coaxial with the hot melt adhesive sample mold when cutting the hot melt adhesive sample, a positioning groove is also provided on the sample placement table 421, and a positioning block is correspondingly provided on the hot melt adhesive sample mold. The positioning block can be inserted into the positioning groove to realize the plug-in positioning between the hot melt adhesive sample mold and the sample placement table 421.

[0047] In order to reduce the difficulty of cleaning the excess hot melt adhesive cut off later and facilitate recycling, in this embodiment, the cross-sectional size of the sample placement platform 421 is the same as the cross-sectional size of the hot melt adhesive sample mold, and there is a gap between the sample placement platform 421 and the inner wall of the through hole 41a. When the excess hot melt adhesive is cut off by the cutter 2, it can enter the installation plate 41 along the gap between the inner wall of the through hole 41a and the sample placement platform 421, so as to collect the cut hot melt adhesive.

[0048] The hot melt adhesive sample processing device also includes a fan, and the sample holder 4 is rotatably embedded in the mounting groove provided on the base 5, and a chip discharge port is provided on one side of the sample holder 4, and a connecting channel connecting the mounting groove and the fan is also provided on the base 5. When the sample holder 4 stops rotating, the chip discharge port faces the connecting channel, and the fan is started to suck out the hot melt adhesive in the sample holder 4, thereby reducing the difficulty of cleaning the sample holder 4 by the operator in the later stage.

[0049] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A hot melt adhesive sample processing device, used in conjunction with a hot melt adhesive sample mold, characterized in that: include: A sample holder (4), wherein a sample placement area is provided on the sample holder (4); A pressing plate (1) is arranged above the sample holder (4) in a liftable manner, and a mounting hole is provided on the pressing plate (1); A lifting mechanism (3) is configured to drive the pressing plate (1) to move up and down; The cutter (2) is a cylindrical structure with an open lower end. The cutter (2) is vertically telescopically arranged in the mounting hole. The cutter (2) can cooperate with the hot melt adhesive sample mold to cut off the hot melt adhesive protruding from the hot melt adhesive sample mold in the circumferential direction. A telescopic mechanism, configured to drive the cutter (2) to extend out of or retract into the mounting hole; The sample holder (4) has a first state and a second state. When in the first state, the projection of the sample placement area in the direction of the pressing plate (1) is offset from the mounting hole. When in the second state, the projection of the sample placement area in the direction of the pressing plate (1) is opposite to the mounting hole.

2. The hot melt adhesive sample processing device according to claim 1, characterized in that: The sample holder (4) is provided with a plurality of sample placement areas at intervals, the pressing plate (1) is provided with a plurality of mounting holes corresponding one-to-one to the sample placement areas, and the cutter (2) is provided in any mounting hole.

3. The hot melt adhesive sample processing device according to claim 2, characterized in that: It also includes a rotating mechanism, wherein the sample placement area is distributed along a circumferential array on the sample holder (4), the mounting holes are distributed along a circumferential array on the pressing plate (1), and the rotating mechanism is configured to drive the sample holder (4) or the pressing plate (1) to rotate around its own axis.

4. The hot melt adhesive sample processing device according to claim 3, characterized in that: The invention also comprises a monitoring mechanism, wherein the output end of the rotating mechanism is connected to the sample holder (4), and the monitoring mechanism comprises an infrared receiver and an infrared transmitter, wherein one of the infrared receiver and the infrared transmitter is located on one side of the sample holder (4), and the other is arranged in the sample placement area, and the height of the infrared receiver and the infrared transmitter is the same as the height of the upper surface of the hot melt adhesive sample mold.

5. The hot melt adhesive sample processing device according to claim 1, characterized in that: The sample holder (4) comprises a mounting plate (41) and a sample rack (42); the mounting plate (41) is arranged as a cavity structure and a through hole (41a) is provided on the top surface along a circumferential direction; the sample rack (42) comprises a buffer and a sample placement platform (421); the buffer is located in the mounting plate (41) and is arranged corresponding to the through hole (41a); the sample placement platform (421) is arranged on the top surface of the buffer; and the upper surface of the sample placement platform (421) is the sample placement area.

6. The hot melt adhesive sample processing device according to claim 5, characterized in that: The cross-sectional size of the sample placement platform (421) is the same as the cross-sectional size of the hot melt adhesive sample mold, and there is a gap between the sample placement platform (421) and the inner wall of the through hole (41a).

7. The hot melt adhesive sample processing device according to any one of claims 1 to 6, characterized in that: The sample placement area is provided with a positioning groove for inserting the positioning block on the hot melt adhesive sample mold.

8. The hot melt adhesive sample processing device according to any one of claims 1 to 6, characterized in that: It also comprises a heating element, which is configured to heat the cutter (2).

9. The hot melt adhesive sample processing device according to claim 8, characterized in that: The cutter (2) is a metal cutter (2), and the heating element is a coil. The coil is fixed in the mounting hole, and the coil can generate a high-frequency magnetic field when energized.

10. The hot melt adhesive sample processing device according to any one of claims 1 to 6, characterized in that: It also comprises a base (5) and a support frame (6), wherein the sample holder (4) is arranged on the base (5), one end of the support frame (6) is connected to the base (5), and the other end is connected to the lifting mechanism (3), and the pressing plate (1) is arranged at the output end of the lifting mechanism (3).

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