Downward pressing type chip testing device
By designing a down-pressure chip test device, using a linkage down-pressure heating mechanism and protective sensor probe, the problems of low detection efficiency and adhesion of the heating module to the chip in the prior art are solved, and efficient and safe chip high-temperature detection is achieved.
Patent Information
- Application Number
- CN202420969731.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-07
AI Technical Summary
Existing chip testing equipment mostly adopts a single-to-single structure, which has low detection efficiency and lacks detection protection structures, making it easy to stick to the heating module and the chip.
A down-pressure chip testing device is designed, using a linkage down-pressure heating mechanism to detect multiple chips at a time, and by setting up anti-stupid sensors and anti-adhesion probes, the equipment is operated normally and prevented chip damage.
It realizes high-temperature detection of multiple chips at the same time, improves detection efficiency and safety, and avoids adhesion between the heating module and the chip.
Smart Images
Figure CN222561733U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a downward pressing chip testing device, and relates to the technical field of chip testing equipment. Background Art
[0002] Chips are core parts of electronic devices. The product quality of chips often has an important impact on the overall product. Therefore, the quality of chips needs to be tested during the chip production process.
[0003] Since the chip will generate a lot of heat during use, it is usually necessary to simulate the chip operation and test the chip under high temperature conditions to test whether the chip can normally control the device to start up, restart, etc. The existing testing equipment mostly adopts a one-to-one structure and can only test a small number of chips or a single chip at the same time. The detection efficiency is low, and due to the lack of a detection protection structure, the heating module and the chip are prone to adhesion during heating. Therefore, a downward pressure core testing device is proposed to solve the problems existing in the prior art. Utility Model Content
[0004] The purpose of the utility model is to provide a downward pressure chip testing device to address the defects or shortcomings in the prior art. By setting up a linked downward pressure heating mechanism, it is possible to perform high-temperature detection on multiple chips at one time, and by setting up anti-fool sensors and anti-adhesion probes, the operation behavior of the equipment can be detected to ensure the normal operation of the equipment without causing damage to the chips.
[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: it includes a fixed base plate 1, a movable base plate 2, and a test tray 3. The movable base plate 2 is movably arranged on the fixed base plate 1, and the test tray 3 is arranged at the front end of the movable base plate 2. Guide rail seats 5 are arranged at both ends of the fixed base plate 1, and movable guide rails 8 are arranged at both ends of the movable base plate 2. The movable guide rails 8 are slidably connected with the guide rail seats 5, and a connecting arm 7 is arranged between the two movable guide rails 8. A downward pressure cylinder 6 is arranged on the movable base plate 2, and the push rod of the downward pressure cylinder 6 is connected to the connecting arm 7. A downward pressure arm 4 is slidably arranged between the two guide rail seats 5, and the downward pressure arm 4 is movably connected with the movable guide rail 8. Two heating blocks 11 are symmetrically arranged at the bottom of the lower pressure arm 4, a buffer pressure block 13 is arranged at the bottom of the heating block 11, and an anti-sticking probe 13-3 is arranged at the bottom of the buffer pressure block 13. A plurality of test seats 21 are arranged on the test tray 3, and an anti-foolproof sensor 20 is arranged through the test seat 21.
[0006] Furthermore, a movable cylinder 9 is disposed at the bottom of the fixed base plate 1 , and a connecting plate 10 is disposed at the end of the push rod of the movable cylinder 9 to connect with the end of the movable base plate 2 .
[0007] Furthermore, a heat insulation board 12 connected to the lower pressure arm 4 is arranged on the top of the heating block 11 , a thermocouple 15 is arranged on the opposite side of the heating block 11 , and a heating tube 14 is arranged inside the heating block 11 .
[0008] Furthermore, the buffer pressing block 13 is provided with two spring grooves 13 - 1 , and springs 13 - 2 are provided in the spring grooves 13 - 1 .
[0009] Furthermore, a limiting groove 8 - 1 is provided at a position corresponding to the moving guide rail 8 and the lower pressing arm 4 , and limiting posts 18 are provided at both ends of the lower pressing arm 4 , and the limiting posts 18 pass through the limiting groove 8 - 1 .
[0010] Furthermore, the guide rail seat 5 is a corner structure, including a longitudinal guide seat 5-1 and a transverse guide seat 5-2. The longitudinal guide seat 5-1 is provided with a guide rail, and a longitudinal clamping block 16 is movably provided on the guide rail, and the longitudinal clamping block 16 is connected to the lower pressure arm 4. The transverse guide seat 5-2 is provided with a transverse clamping block 17.
[0011] Furthermore, a guide rail is also provided on the top of the movable guide rail 8 , and the guide rail is movably connected to the transverse clamping block 17 .
[0012] Furthermore, opposite buffer springs 19 are symmetrically arranged on both sides of the fixed base plate 1 , and the positions of the buffer springs 19 correspond to the guide rail seat 5 .
[0013] Furthermore, travel slide rails 22 are provided on both sides of the fixed base plate 1 and are slidably connected to the movable base plate 2 .
[0014] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: by setting up a linked downward pressure heating mechanism, high-temperature detection can be performed on multiple chips at a time, and by setting up anti-fool sensors and anti-adhesion probes, the operation behavior of the equipment can be detected to ensure the normal operation of the equipment without causing damage to the chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 It is a structural schematic diagram of the utility model;
[0017] Figure 2 yes Figure 1 A second angle view of
[0018] Figure 3 yes Figure 1 Schematic diagram of the partial structural disassembly state;
[0019] Figure 4 It is a schematic diagram of the structure of the guide rail seat 5 in the utility model;
[0020] Figure 5 It is a schematic diagram of the exploded structure of the buffer pressing block in the utility model.
[0021] Explanation of the reference numerals in the accompanying drawings: fixed base plate 1, movable base plate 2, test tray 3, lower pressure arm 4, guide rail seat 5, lower pressure cylinder 6, connecting arm 7, movable guide rail 8, movable cylinder 9, connecting plate 10, heating block 11, heat insulation plate 12, buffer pressure block 13, heating tube 14, thermocouple 15, longitudinal clamping block 16, transverse clamping block 17, limit column 18, buffer spring 19, anti-foolproof sensor 20, test seat 21, travel slide rail 22, limit groove 8-1, spring groove 13-1, spring 13-2, anti-sticking probe 13-3. DETAILED DESCRIPTION
[0022] See also Figure 1-5 As shown, the technical solution adopted in this specific embodiment is: it includes a fixed base plate 1, a movable base plate 2, and a test tray 3. The movable base plate 2 is movably arranged on the fixed base plate 1, and the test tray 3 is arranged at the front end of the movable base plate 2. Guide rail seats 5 are arranged at both ends of the fixed base plate 1, and movable guide rails 8 are arranged at both ends of the movable base plate 2. The movable guide rails 8 are slidably connected with the guide rail seats 5, and a connecting arm 7 is arranged between the two movable guide rails 8. A downward pressing cylinder 6 is arranged on the movable base plate 2, and the push rod of the downward pressing cylinder 6 is connected to the connecting arm 7. A downward pressing arm 4 is slidably arranged between the two guide rail seats 5, and the downward pressing arm 4 is movably connected with the movable guide rail 8. Two heating blocks 11 are symmetrically arranged at the bottom of the downward pressing arm 4, and a buffer pressing block 13 is arranged at the bottom of the heating block 11. The part is provided with an anti-sticking probe 13-3, and a plurality of test seats 21 are provided on the test tray 3. An anti-foolproofing sensor 20 is provided throughout the test seat 21. In order to improve the travel monitoring during the operation of the equipment and ensure the normal operation of the equipment, an anti-foolproofing sensor and an anti-sticking probe are provided in this embodiment. The anti-foolproofing sensor can monitor the travel steps of the equipment during the downward pressure heating and the relevant moving mechanism during the movement process. When the equipment travel is abnormal, a prompt signal can be issued in time, which is convenient for timely intervention and processing of the equipment. The anti-sticking probe monitors the heating surface of the heating block and the chip during the heating process to prevent the heating block and the chip from adhering to each other due to excessive temperature, thereby ensuring that the chip can perform normal startup, restart and other detection actions in a heated environment;
[0023] In order to realize the detection operation of a large number of chips, a linked pressing mechanism is set in the present embodiment, that is, when the pressing cylinder pushes the connecting arm, the movable guide rail drives the pressing arm to press down, and when the pressing cylinder push rod is retracted, the connecting arm drives the pressing arm upward to facilitate the placement and removal of chips. In the present embodiment, a structure for simultaneous detection of 8 chips is illustrated. According to actual needs, more test sockets can be set to detect a larger number of chips at the same time, which effectively improves the chip detection speed and efficiency and ensures the safety of chip detection.
[0024] To be more specific, a moving cylinder 9 is provided at the bottom of the fixed base plate 1, and a connecting plate 10 is provided at the end of the push rod of the moving cylinder 9 and is connected to the end of the moving base plate 2. The moving cylinder is provided to drive the moving base plate to move forward and backward on the fixed base plate, and travel slide rails 22 are provided on both sides of the fixed base plate 1 and are slidably connected to the moving base plate 2 to ensure smooth movement of the moving base plate.
[0025] To be more specific, a heat insulating plate 12 is arranged on the top of the heating block 11 and is connected to the lower pressure arm 4, a thermocouple 15 is arranged on the opposite side of the heating block 11, and a heating tube 14 is arranged in the heating block 11. The heat insulating plate is arranged on the heating block to prevent the lower pressure arm from being damaged by high temperature, and a thermocouple is arranged on one side of the heating block to detect the temperature of the heating block after being heated by the heating tube, so as to ensure that the heating block operates within the set temperature.
[0026] More specifically, the buffer block 13 is provided with two spring grooves 13-1, and a spring 13-2 is provided in the spring groove 13-1. The setting of the spring can play a buffering role when the buffer block contacts the chip, preventing the chip from being damaged by a more extreme impact.
[0027] To be more specific, a limiting groove 8-1 is set at the position corresponding to the movable guide rail 8 and the lower pressure arm 4, and a limiting column 18 is set at both ends of the lower pressure arm 4. The limiting column 18 passes through the limiting groove 8-1. In this embodiment, the up and down movement of the lower pressure arm is achieved by the cooperation between the limiting column and the limiting groove. The limiting groove is inclined, so when the movable guide rail moves forward and backward, it can drive the limiting column to move up and down, thereby driving the lower pressure arm to move up and down.
[0028] To be more specific, the guide rail seat 5 is a corner structure, including a longitudinal guide seat 5-1 and a transverse guide seat 5-2. A guide bar is arranged on the longitudinal guide seat 5-1, and a longitudinal clamping block 16 is movably arranged on the guide bar, and the longitudinal clamping block 16 is connected to the lower pressure arm 4. A transverse clamping block 17 is arranged on the transverse guide seat 5-2. A guide bar is also arranged on the top of the movable guide rail 8, and the guide bar is movably connected to the transverse clamping block 17. When the movable guide rail moves back and forth in the guide rail seat, the transverse clamping block cooperates with the guide bar on the top of the movable guide rail to realize the forward and backward movement of the movable guide rail, and when the lower pressure arm moves up and down under the drive of the limit column, the longitudinal clamping block cooperates with the guide bar on the longitudinal guide seat to realize the up and down movement of the lower pressure arm on the guide rail seat.
[0029] To be more specific, opposite buffer springs 19 are symmetrically arranged on both sides of the fixed base plate 1, and the position of the buffer spring 19 corresponds to the guide rail seat 5. When the mobile cylinder drives the mobile base plate to move, buffering is performed by the buffer springs at two locations to prevent damage to the equipment due to excessive movement.
[0030] Working principle of the utility model: Taking LPDDR4 detection equipment as an example, during detection, the chip is first placed on the test seat 21, and the equipment is started. At this time, the moving cylinder 9 is started first, driving the moving base plate to move forward. When the heating block 11 reaches the top of the test seat 21, the pressing cylinder 6 is started, driving the connecting arm 7 to move backward. Under the action of the limiting groove 8-1, the limiting column 18 drives the pressing arm 4 to press down, and the heating block 11 and the buffer pressing block 13 are pressed down onto the chip. The heating tube 14 starts heating, and the thermocouple 15 detects the heating temperature at the same time. The anti-sticking probe 13-3 also detects the adhesion between the chip and the heating block 11, and the anti-fool sensor 20 monitors the heating process as a whole, and multiple protective detection mechanisms monitor and protect the heating detection operation of the equipment at the same time. The linked downward pressure heating method can effectively heat multiple chips, thereby effectively improving the test efficiency. When the detection is completed, the downward pressure cylinder 6 starts, the connecting arm 7 retreats, the limit column 18 moves upward along the limit groove 8-1, and drives the downward pressure arm 4 upward, the heating block 11 is separated from the chip, and the anti-sticking probe 13-3 and the anti-foolproof sensor still monitor the operation status. When the downward pressure arm 4 reaches the highest point, the moving cylinder 9 starts and drives the moving base plate 2 to retreat. At this time, the chip can be taken out and a new chip can be put in for the next round of detection.
[0031] The above description is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.
Claims
1. A downward pressure chip testing device, characterized in that: The invention comprises a fixed bottom plate (1), a movable bottom plate (2) and a test tray (3); the movable bottom plate (2) is movably arranged on the fixed bottom plate (1); the test tray (3) is arranged at the front end of the movable bottom plate (2); guide rail seats (5) are arranged at both ends of the fixed bottom plate (1); movable guide rails (8) are arranged at both ends of the movable bottom plate (2); the movable guide rails (8) are slidably connected to the guide rail seats (5); a connecting arm (7) is arranged between the two movable guide rails (8); a downward pressing cylinder (6) is arranged on the movable bottom plate (2); and a downward pressing cylinder (6) is arranged on the movable bottom plate (2). The push rod of the cylinder (6) is connected to the connecting arm (7), a lower pressure arm (4) is slidably arranged between the two guide rail seats (5), and the lower pressure arm (4) is movably connected to the movable guide rail (8), two heating blocks (11) are symmetrically arranged at the bottom of the lower pressure arm (4), a buffer pressure block (13) is arranged at the bottom of the heating block (11), and an anti-sticking probe (13-3) is arranged at the bottom of the buffer pressure block (13), a plurality of test seats (21) are arranged on the test tray (3), and an anti-foolproof sensor (20) is arranged through the test seat (21).
2. The downward pressure chip testing device according to claim 1, characterized in that: A movable cylinder (9) is arranged at the bottom of the fixed base plate (1), and a connecting plate (10) is arranged at the end of the push rod of the movable cylinder (9) and is connected to the end of the movable base plate (2).
3. The downward pressure chip testing device according to claim 1, characterized in that: A heat insulation board (12) connected to the lower pressure arm (4) is arranged on the top of the heating block (11), a thermocouple (15) is arranged on the opposite side of the heating block (11), and a heating tube (14) is arranged inside the heating block (11).
4. The downward pressure chip testing device according to claim 1, characterized in that: The buffer pressure block (13) is provided with two spring grooves (13-1), and springs (13-2) are arranged in the spring grooves (13-1).
5. The downward pressure chip testing device according to claim 1, characterized in that: The movable guide rail (8) is provided with a limiting groove (8-1) at a position corresponding to the lower pressing arm (4), and limiting columns (18) are provided at both ends of the lower pressing arm (4), and the limiting columns (18) penetrate the limiting groove (8-1).
6. The downward pressure chip testing device according to claim 1, characterized in that: The guide rail seat (5) is a corner structure, comprising a longitudinal guide seat (5-1) and a transverse guide seat (5-2); a guide rail bar is arranged on the longitudinal guide seat (5-1); a longitudinal clamping block (16) is movably arranged on the guide rail bar, and the longitudinal clamping block (16) is connected to the lower pressure arm (4); and a transverse clamping block (17) is arranged on the transverse guide seat (5-2).
7. The downward pressure chip testing device according to claim 1, characterized in that: A guide rail is also provided on the top of the movable guide rail (8), and the guide rail is movably connected to the transverse clamping block (17).
8. The downward pressure chip testing device according to claim 1, characterized in that: The fixed base plate (1) is symmetrically provided with opposite buffer springs (19) on both sides, and the positions of the buffer springs (19) correspond to the guide rail seats (5).
9. The downward pressure chip testing device according to claim 1, characterized in that: Travel slide rails (22) are provided on both sides of the fixed base plate (1) and are slidably connected to the movable base plate (2).