Display device

Abstract

The utility model relates to a display device, the display device comprises a backlight assembly and an LCD assembly, the backlight assembly comprises a metal frame, a rubber frame and a light source, the metal frame comprises a bottom frame and a side frame, the side frame is additionally provided with a bending part at the light source position, the bending part is parallel to the bottom frame, and the light source abuts against the inner side face of the bending part, so that the display device can dissipate heat of the light source; the influence of heat on the driving chip is avoided, the bending part of the metal frame serves as the position where the black and white glue is attached, the light source cannot be separated from other parts when the black and white glue is torn off, and therefore the problems of light leakage and the like are avoided, in addition, the heat dissipation path of the display device is optimized through the further arranged functional layer structure, and the heat dissipation efficiency is improved. On the basis of arranging the bending part, other functional layers are matched, so that the heat of the light source can be further quickly conducted out, and a heat dissipation path is guided to the back surface of the metal frame to improve the heat dissipation effect.

Description

[Technical field]

[0002] The present application belongs to the field of display technology, and in particular, relates to a display device. [Background technology]

[0004] Thin-film transistor liquid crystal display is a common display device, which is composed of backlight components and LCD components FPC assembled together. The backlight components are assembled from glue iron, reflective sheet, light guide plate, LED light bar, diffusion film, lower brightness enhancement film, upper brightness enhancement film and black and white glue in order from bottom to top. The backlight LED lamp is directly below the driver chip. When the LED lamp is lit for a long time, it will continue to generate heat. At present, the brightness requirements for TFT display modules are relatively high, so LED lamps will use dual-core lamps. In this way, the power will double and the heat generated will also double. Therefore, as time goes by, the heat under the driver chip continues to accumulate and cannot be effectively dissipated.

[0005] In the prior art, heat is dissipated by an iron frame on the back of the backlight without any special treatment. Although this method is easy to assemble, the heat cannot be dissipated in a timely and sufficient manner. Since the driver chip itself has no overheating protection function, the heat under the driver chip continues to accumulate and cannot be effectively dissipated. The driver chip will fail due to excessive temperature, resulting in the TFT module not being able to display normally. In particular, TFT display modules for automotive and medical use are likely to fail due to no display.

[0006] In addition, when assembling the current thin-film transistor liquid crystal display, it is necessary to tear off the black and white plastic front protective film. In this process, the upper and lower brightness enhancement films and the LED light strip are easily lifted up, which will cause the LED light to separate from the plastic iron, resulting in poor backlight leakage. The above problems are known to technicians in this field. [Summary of the invention]

[0008] The purpose of the present application is to provide a display device, which can timely and fully dissipate the heat of the light source by improving the metal frame, and also improve the position of the black and white adhesive to avoid the separation of other structures caused by the black and white adhesive.

[0009] The purpose of the present application is achieved through the following technical solutions: The present application provides a display device, including a backlight assembly and an LCD assembly, wherein the backlight assembly includes a metal frame, a plastic frame, a reflective sheet, a light guide plate, a diffusion film, black and white plastic, and a light source;

[0010] The metal frame includes a bottom frame and a side frame, the side frame is provided with a bending portion at the position of the light source, the bending portion is parallel to the bottom frame, and the light source abuts against the inner side surface of the bending portion;

[0011] The reflective sheet is arranged on the bottom frame, the light guide plate is arranged on the reflective sheet, and the diffusion film is arranged on the light guide plate;

[0012] The black and white glue is disposed between the backlight assembly and the LCD assembly, and includes a portion attached to the bent portion;

[0013] The plastic frame is arranged in the metal frame.

[0014] In one embodiment, the thickness of the side frame is greater than the thickness of the bottom frame.

[0015] In one embodiment, the thickness of the bent portion is greater than the thickness of the side frame.

[0016] In one embodiment, a heat conducting layer and a reflective layer are formed on the side frame and the inner side of the bent portion.

[0017] In one of the embodiments, a heat insulation layer is provided between the bending portion and the black and white glue.

[0018] In one embodiment, a lower brightness enhancement film and an upper brightness enhancement film are further disposed on the diffusion film.

[0019] In one of the embodiments, the upper surface of the heat insulation layer is flush with the upper surface of the upper brightness enhancement film.

[0020] In one embodiment, the light source further includes a flexible circuit board, and the flexible circuit board includes a lead-out portion.

[0021] In one embodiment, the projection area of ​​the bent portion is larger than the projection area of ​​the light source, and the bent portion completely covers the light source.

[0022] In one of the embodiments, the outer sides of the side frame and the bottom frame further include a heat dissipation film layer, and the area of ​​the heat dissipation film layer extending on the bottom frame is greater than 50% of the area of ​​the bottom frame.

[0023] Compared with the prior art, this application has the following beneficial effects:

[0024] 1. The present application improves the metal frame, sets a bending portion on the side frame of the metal frame, and sets the light source at the bending portion, so as to dissipate the heat of the light source and avoid the influence of the heat on the driving chip;

[0025] 2. The bending part is where the black and white adhesive is applied. When the protective film of the black and white adhesive is removed, the light source will not be separated from other parts, thus avoiding problems such as light leakage.

[0026] 3. By further setting up a heat insulation layer, a heat conduction layer, a reflective layer and a heat dissipation film layer, while optimizing the light utilization effect of the light source, the heat dissipation path of the heat dissipation structure near the light source is optimized to further improve the heat dissipation effect.

Brief Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of an embodiment of a display device of the present application.

[0029] Figure 2 It is a schematic diagram of the exploded structure of the backlight assembly of the display device of the present application.

[0030] Figure 3 It is a structural schematic diagram of another embodiment of the display device of the present application. [Specific implementation method]

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0034] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0035] See also Figure 1 , Figure 2 , Figure 1 is a schematic diagram of the structure of the display device of the present application, Figure 2: is a schematic diagram of the exploded structure of the backlight assembly of the display device of the present application. The display device in a preferred embodiment of the present application dissipates the heat of the light source 200 by improving the metal frame structure to avoid the influence of the heat on the driving chip. The display device specifically includes a backlight assembly and an LCD assembly 400. The backlight assembly includes a metal frame, a glue frame 140, a reflective sheet 150, a light guide plate 160, a diffusion film 170, a black and white glue 300 and a light source 200; the LCD assembly 400 is combined with the backlight assembly through the black and white glue 300, and the LCD assembly 400 is fixed by the black and white glue 300 to avoid light leakage at the edge of the backlight assembly. The backlight assembly provides backlight to the LCD assembly 400 through the light-transmitting portion of the black and white glue 300. The shape, size, etc. of each assembly can be specifically selected according to needs.

[0036] The metal frame includes a bottom frame 110 and a side frame 120. The side frame 120 is provided with a bending portion 130 at the position of the light source 200. The bending portion 130 is parallel to the bottom frame 110. The light source 200 abuts against the inner side of the bending portion 130. The abutment means that the light source 200 will eventually abut against the bending portion 130. Other materials may be included between the two. The purpose is to establish a heat conduction path between the light source 200 and the bending portion 130. The bending portion 130 is located between the LCD component 400 and the light source 200. Here, the bottom frame 110 is provided with a bending portion 130. 10. The side frame 120 and the bending portion 130 are an integral whole. The three parts are used as a metal frame as a whole. They are formed by cutting and stamping according to the size and parts that need to be formed in the end. In a specific embodiment, the bending portion 130 is located between the LCD glass and the LED lamp. The LED lamp may include a flexible circuit board and an adhesive layer adhered to the light guide plate 160 (not specifically shown in the figure). When the display device is assembled, the LED light bar and the light guide plate 160 are first combined together, and the part including the LED light bar is placed in the bending portion 130.

[0037] The reflective sheet 150 is arranged on the bottom frame 110, the light guide plate 160 is arranged on the reflective sheet 150, and the diffusion film 170 is arranged on the light guide plate 160; the light source 200 is arranged at one end of the light guide plate 160, and the light emitted by the light source 200 is evenly diffused by the light guide plate 160. The light guide plate 160 is usually made of a transparent material with high transmittance, a smooth surface and scattering and refraction functions, and converts the point light source 200 or line light source 200 emitted by the light source 200 into a surface light source 200, and finally supplies a light source 200 with sufficient brightness and uniform distribution by cooperating with the diffusion film 170.

[0038] The black and white tape 300 is arranged between the backlight assembly and the LCD assembly 400, and includes a portion adhered to the bent portion 130; the black and white tape 300 is adhered to the bent portion 130 at a position corresponding to the light source 200. The bent portion 130 serves as a location where the black and white tape 300 is adhered. When the black and white tape 300 is torn off, the light source 200 will not be separated from other parts, and problems such as light leakage can be avoided. The bent portion 130 in the present application serves as both an installation component of the light source 200 and a location where the black and white tape 300 is adhered. While dissipating heat, it prevents the black and white tape 300 from affecting the adhesion of other components when the protective film is torn off.

[0039] The rubber frame 140 is arranged in the metal frame. The relevant specific method is to combine the rubber frame 140 with the metal frame or directly select a frame integrating metal and rubber. The rubber frame 140 is a circle of sealing strip fixed on the surface of the display screen, which is used to prevent dust, water vapor and other impurities from entering the inside of the screen, thereby avoiding affecting the screen display effect, extending the service life of the display, supporting and protecting the display module, preventing the module from being impacted and damaged by external forces, and also protecting the electronic components and circuits inside the module to prevent them from being affected and disturbed by the external environment.

[0040] The material of the plastic frame 140 is a material with high thermal conductivity, and the light source 200 can be against the plastic frame 140. In this case, a heat dissipation path can be established through the plastic frame 140, and multiple heat dissipation paths can be established at the same time to improve the heat dissipation effect.

[0041] In addition, the LCD assembly 400 includes a driving chip, and the LCD assembly 400 and the backlight assembly may each independently include a lead-out component, such as a flexible circuit board.

[0042] The bending portion 130 of the present application is arranged between the light source 200 and the driving chip. Since the bending portion 130 is made of metal material, the thermal conductivity of the bending portion 130 is higher than that of other parts, and can isolate the heat conduction between the backlight assembly and the LCD assembly 400. On the basis of setting the bending portion 130, in conjunction with the installation and lead-out of the light source 200, the light source 200 is placed against the bending portion 130. This arrangement can ensure that on the basis of having the bending portion 130, assembly and the establishment of a heat dissipation path can be conveniently performed.

[0043] Specifically, the thickness of the side frame 120 is greater than that of the bottom frame 110, and the thickness of the bending portion 130 is greater than that of the side frame 120. The thickness of the bending portion 130 is greater than that of the side frame 120 and the thickness of the side frame 120 is greater than that of the bottom frame 110, which can make the heat conduction and isolation effect better. Since the bending portion 130 is also made of metal material, there is still a heat conduction path for conducting heat to the driver chip. By increasing the thickness and connecting the side frame 120 and the bottom frame 110, the heat is preferentially conducted from the side frame 120 to the bottom frame 110. Since the bottom frame 110 has a large area, the heat can be quickly dissipated outward, thereby further ensuring the rapid outward conduction of internal heat after the LCD assembly 400 and the backlight assembly are stacked.

[0044] Please read further Figure 3 , Figure 3 It is a structural schematic diagram of another embodiment of the display device of the present application. In this embodiment, a heat-conducting layer 520 and a reflective layer 510 are formed on the inner side of the side frame 120 and the bending portion 130 of the display device. The thermal conductivity of the heat-conducting layer 520 is greater than the thermal conductivity of the metal frame. The heat-conducting layer 520 is arranged close to the bending portion 130 and the inner side of the side frame 120, and can quickly conduct heat toward the bottom frame 110. The reflective layer 510 can reflect the light emitted by the light source 200 toward the light guide plate 160, thereby improving the utilization rate of light.

[0045] Specifically, a heat insulating layer 530 is arranged between the bending portion 130 and the black and white glue 300. Since the bending portion 130 is also made of metal material, there is still a heat conduction path for transferring heat to the driving chip. By arranging the heat insulating layer 530 between the bending portion 130 and the black and white glue 300, the heat conduction path from the bending portion 130 to the LCD assembly 400 can be blocked, so that most of the heat of the light source 200 is transferred from the bending portion 130 to the side frame 120, and then from the side frame 120 to the bottom frame 110, thereby avoiding internal accumulation of heat and conduction to the LCD assembly 400.

[0046] Specifically, a lower brightness enhancement film 180 and an upper brightness enhancement film 190 are further provided on the diffusion film 170. The lower brightness enhancement film 180 and the upper brightness enhancement film 190 are provided to provide a uniform surface light source 200, so that the light originally scattered in all directions by the light source 200 is concentrated toward the front, reducing the loss of light and recycling the light that is not used outside the viewing angle, thereby improving the overall brightness and uniformity.

[0047] Specifically, the upper surface of the heat insulating layer 530 is flush with the upper surface of the upper brightness enhancement film 190, and the upper surfaces of the two layers are flush. When the black and white tape 300 is affixed, the black and white tape 300 is affixed to a flat surface, so that the upper surface of the black and white tape 300 is also a flat surface. When the LCD component 400 is set, the flatness of the surface is also ensured, thereby avoiding light leakage at the edge. On the basis of optimizing the heat dissipation path in the present application, it can further be compatible with the optical requirements of the component.

[0048] Specifically, the light source 200 also includes a flexible circuit board 210, and the flexible circuit board 210 includes a lead-out portion, which can pass through the side frame 120 so that the lead-out portion can be connected to the circuit board and other installation positions. The specific installation method and matching method are not specifically limited in this application.

[0049] Specifically, the projection area of ​​the bending portion 130 is larger than the projection area of ​​the light source 200, and the bending portion 130 completely covers the light source 200. The above-mentioned setting method can completely cover the light source 200 and fully realize the establishment of the heat conduction path. In addition, when the area is larger than the projection area of ​​the light source 200, redundant dimensions can be left during assembly to increase the convenience of installation.

[0050] Specifically, the outer sides of the side frame 120 and the bottom frame 110 also include a heat dissipation film layer 540, and the area of ​​the heat dissipation film layer 540 extending on the bottom frame 110 is greater than 50% of the area of ​​the bottom frame 110. The thermal conductivity of the heat dissipation film layer 540 is greater than the thermal conductivity of the metal frame. Through the above-mentioned setting method, the internal heat can be extracted from the inside more quickly and dissipated through the bottom frame 110 with a larger area, thereby realizing the rapid extraction and dissipation of internal heat.

[0051] The installation method of the display device is as follows: combine the glue frame 140 with the metal frame or directly select a frame integrating metal and glue, install the reflective sheet 150 into the frame, assemble the light source 200 and the light guide plate 160 together, specifically, an LED light bar can be used, and the LED light bar is adhered to the light guide plate 160 by double-sided tape. After the light source 200 and the light guide plate 160 are assembled, the end of the light source 200 is inserted into the metal frame formed with a bending portion 130, and the light source 200 is accommodated in the U-shaped groove formed by the bending portion 130, and the diffusion film 170, the lower brightness enhancement film 180, and the upper brightness enhancement film 190 are further installed in the metal frame in sequence. After each film is installed in the metal frame, the black and white glue 300 is applied to the metal frame, and the lower end of the black and white glue 300 (the end close to the light source 200) is applied to the bending portion 130 of the metal frame. After the black and white glue 300 is applied, the LCD component 400 is further installed. The specific assembly method of the LCD component 400 is not further specifically limited in this application.

[0052] Before the above installation, the metal frame is further bent to form a bending portion 130 , and portions of the metal frame corresponding to the bending portion 130 and the side frame 120 can also be selected with different thicknesses according to thickness requirements.

[0053] Before applying the black and white tape 300 , a heat insulation layer 530 is formed on the bending portion 130 to further isolate the heat conduction between the LED and the driver chip. More preferably, after the heat insulation layer 530 is formed, the upper surface of the heat insulation layer 530 is flush with the upper surface of the upper brightness enhancement film 190 .

[0054] Through the above-mentioned installation method, the backlight assembly includes a metal frame (the metal frame may include a glue frame 140), a reflective sheet 150, a light guide plate 160, a diffusion film 170, a lower light-enhancing film 180, an upper light-enhancing film 190, and a black and white glue 300 from bottom to top. The backlight assembly includes a flexible circuit board and a light source 200. The backlight assembly, the LCD assembly 400, and the driving chip are assembled to form a display device.

[0055] The backlight assembly and the LCD assembly respectively have lead-out parts. For example, the backlight assembly is provided with a flexible circuit board corresponding to the light source, and the LCD assembly is also provided with a flexible circuit board for lead-out. In order to facilitate the connection with other parts, the two are arranged at the same end. If the heat is not controlled, the heat of the light source will affect the driver chip. Through the method of the present application, when the light source and the driver chip are arranged at the same end, the heat can be timely exported, and the light source can be placed against the bending part for easy assembly. That is, the present application can control the heat while ensuring the convenience of assembly, thereby simplifying the device structure and installation steps.

[0056] From the foregoing, it can be seen that the display device of the present application improves the metal frame structure and sets functional layers such as a heat-conducting layer and a reflective layer, so that the display device can dissipate the heat of the light source to avoid the influence of the heat on the driving chip. The bent portion of the metal frame serves as the location for the black and white tape to be pasted. When the black and white tape is torn off, it will not cause the light source to be separated from other parts, thereby avoiding problems such as light leakage. In addition, the further set functional layer structure optimizes the heat dissipation path of the display device. On the basis of setting the bent portion, it cooperates with other functional layers to enable the heat of the light source to be further quickly discharged, and the heat dissipation path is guided to the back of the metal frame, thereby improving the heat dissipation effect through a large heat dissipation area.

[0057] The above is only a specific implementation of the present application, and any other improvements made based on the concept of the present application are deemed to be within the protection scope of the present application.

Claims

1. A display device, comprising a backlight assembly and an LCD assembly (400), characterized in that: The backlight assembly comprises a metal frame, a plastic frame (140), a reflective sheet (150), a light guide plate (160), a diffusion film (170), black and white plastic (300) and a light source (200); The metal frame comprises a bottom frame (110) and a side frame (120); a bending portion (130) is added to the side frame (120) at the position of the light source (200); the bending portion (130) is parallel to the bottom frame (110); and the light source (200) abuts against the inner side surface of the bending portion (130); The reflective sheet (150) is arranged on the bottom frame (110), the light guide plate (160) is arranged on the reflective sheet (150), and the diffusion film (170) is arranged on the light guide plate (160); The black and white glue (300) is arranged between the backlight assembly and the LCD assembly (400), and includes a portion adhered to the bent portion (130); The plastic frame (140) is arranged inside the metal frame.

2. The display device according to claim 1, wherein: The thickness of the side frame (120) is greater than the thickness of the bottom frame (110).

3. The display device according to claim 2, wherein: The thickness of the bent portion (130) is greater than the thickness of the side frame (120).

4. The display device according to any one of claims 1 to 3, characterized in that A heat conducting layer (520) and a reflective layer (510) are formed inside the side frame (120) and the bent portion (130).

5. The display device according to claim 1, wherein: A heat insulation layer (530) is provided between the bending portion (130) and the black and white glue (300).

6. The display device according to claim 5, characterized in that A lower brightness enhancement film (180) and an upper brightness enhancement film (190) are also provided on the diffusion film (170).

7. The display device according to claim 6, wherein: The upper surface of the heat insulation layer (530) is flush with the upper surface of the upper brightness enhancement film (190).

8. The display device according to claim 1, wherein: The light source (200) further comprises a flexible circuit board (210), wherein the flexible circuit board (210) comprises a lead-out portion.

9. The display device according to claim 1, wherein: The projection area of ​​the bent portion (130) is larger than the projection area of ​​the light source (200), and the bent portion (130) completely covers the light source (200).

10. The display device according to claim 1, wherein: The outer sides of the side frame (120) and the bottom frame (110) further include a heat dissipation film layer (540), and the area of ​​the heat dissipation film layer (540) extending on the bottom frame (110) is greater than 50% of the area of ​​the bottom frame (110).

Images