Power supply

Abstract

The utility model discloses a power supply which comprises a circuit board, a heat dissipation shell and a plurality of heating assemblies. Each heating assembly comprises a heat conduction iron core and a magnetic coil. The heat conduction iron core is in thermal contact with the heat dissipation shell. The magnetic coil is arranged on the heat conduction iron core and is electrically connected to the circuit board. And the magnetic coils of the plurality of heating components are coaxially arranged and are connected in series through a circuit board.

Description

Technical Field

[0001] The utility model relates to a power supply, in particular to a power supply comprising a plurality of coaxially arranged magnetic coils. Background Art

[0002] Generally speaking, a computer mainly includes a case, a power supply, a motherboard, a CPU, a display adapter, and an expansion card. The power supply and the motherboard are installed in the case, and the power supply can convert the external AC power into a DC power supply and provide a DC voltage to the motherboard.

[0003] When the power supply provides DC voltage to the motherboard, a lot of heat is generated. Generally speaking, manufacturers will add heat dissipation components to dissipate heat from the power supply. However, the accuracy of the current power supply in controlling the inductance is still insufficient, making the current output by the power supply unstable. This will reduce the heat dissipation efficiency of the power supply and thus reduce the service life of the power supply. Therefore, how to improve the heat dissipation efficiency of the power supply to extend the service life of the power supply is one of the problems that R&D personnel should solve. Utility Model Content

[0004] The invention provides a power supply, so as to improve the heat dissipation efficiency of the power supply and prolong the service life of the power supply.

[0005] The power supply disclosed in one embodiment of the present invention comprises a circuit board, a heat dissipation housing and a plurality of heating components. Each of these heating components comprises a heat conductive iron core and a magnetic coil. The heat conductive iron core is in thermal contact with the heat dissipation housing. The magnetic coil is disposed on the heat conductive iron core and electrically connected to the circuit board. The magnetic coils of these heating components are coaxially arranged and connected in series through the circuit board.

[0006] In the above power supply, the heat-conducting iron cores and the magnetic coils are arranged in the heat dissipation housing.

[0007] In the above power supply, the heat dissipation housing includes a bottom plate, a plurality of side plates and a top plate, the side plates are connected, and the bottom plate and the top plate are respectively connected to opposite sides of the side plates.

[0008] In the power supply device, each of the side plates includes a first base and a first fin portion, the first fin portion is disposed on the first base, and the top plate includes a second base and a second fin portion, the second fin portion is disposed on the second base.

[0009] The power supply mentioned above further comprises a plurality of first fasteners, a plurality of second fasteners and a plurality of third fasteners, the side panels are fixed to each other via the first fasteners, the side panels are fixed to the bottom panel via the second fasteners, and the top panel is fixed to the side panels via the third fasteners.

[0010] The above-mentioned power supply, wherein each of the heat-conducting iron cores includes a first heat-conducting portion, a second heat-conducting portion, a first column and a second column, the first heat-conducting portion is connected to the second heat-conducting portion, the first column is arranged on the first heat-conducting portion, the second column is arranged on the second heat-conducting portion, and the first column is connected to the second column, and each of the magnetic coils is arranged on the first column and the second column, and is located between the first heat-conducting portion and the second heat-conducting portion.

[0011] In the above power supply, the thickness of each of the first heat-conducting parts is different from the thickness of each of the second heat-conducting parts.

[0012] In the above power supply, the magnetic coils are composed of flat copper wires.

[0013] In the above-mentioned power supply, the thickness of one circle of the magnetic coils is 0.3 mm, and the line width of the magnetic coils is 6 mm.

[0014] In the above-mentioned power supply, the number of turns of each of the magnetic coils is 47.

[0015] According to the power supply of the above embodiment, since the magnetic coils of the heating components are arranged coaxially so that the magnetic coils are connected in series, the power supply can store more electric energy and distribute the current through the circuit board, so the accuracy of the power supply in controlling the inductance can be improved, making the current output by the power supply more stable. In this way, the heat dissipation efficiency of the power supply can be improved to extend the service life of the power supply.

[0016] The above description of the content of the present invention and the following description of the implementation methods are used to demonstrate and explain the principles of the present invention and provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of a power supply according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of a power supply with the circuit board omitted.

[0019] Figure 3 for Figure 1 An exploded diagram of the power supply omitting the circuit board.

[0020] Figure 4 for Figure 1 Schematic diagram of the exploded view of the heat generating components of the power supply.

[0021] Figure 5 for Figure 1 A schematic cross-sectional view of a power supply with the circuit board omitted.

[0022] Figure 6 for Figure 1 A schematic cross-sectional view of a heat generating component of a power supply.

[0023] Figure 7 for Figure 1 A schematic plan view of a magnetic coil of a power supply.

[0024] Figure 8 for Figure 1 A schematic side view of a magnetic coil of a power supply.

[0025] Wherein, the reference numerals are:

[0026] 10: Power supply

[0027] 11: Circuit Board

[0028] 12: Heat dissipation housing

[0029] 121: Bottom plate

[0030] 122: Side panel

[0031] 1221: First base

[0032] 1222: first fin portion

[0033] 123: Top plate

[0034] 1231: Second base

[0035] 1232: Second fin portion

[0036] 13: Heating components

[0037] 131: Heat-conducting iron core

[0038] 1311: first heat transfer part

[0039] 1312: Second heat transfer part

[0040] 1313: First Column

[0041] 1314: Second Column

[0042] 132: Magnetic coil

[0043] 14: First fastener

[0044] 15: Second fastener

[0045] 16: The third fastener

[0046] 17: Heat transfer fluid

[0047] T1~T3:Thickness

[0048] W: Line width DETAILED DESCRIPTION

[0049] See also Figures 1 to 3 . Figure 1 It is a three-dimensional schematic diagram of a power supply according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a power supply with the circuit board omitted. Figure 3 for Figure 1 An exploded diagram of the power supply omitting the circuit board.

[0050] The power supply 10 of this embodiment includes a circuit board 11, a heat dissipation housing 12 and a plurality of heating elements 13. The circuit board 11 is provided with electronic components (not shown) such as capacitors, inductors and transformers, but is not limited thereto.

[0051] The heat dissipation housing 12 dissipates heat, for example, by an external fan (not shown), and includes a bottom plate 121, a plurality of side plates 122, and a top plate 123. The side plates 122 are connected, and the bottom plate 121 and the top plate 123 are respectively connected to opposite sides of the side plates 122. Each of the side plates 122 includes a first base 1221 and a first fin portion 1222. The first fin portion 1222 is disposed on the first base 1221. The top plate 123 includes a second base 1231 and a second fin portion 1232. The second fin portion 1232 is disposed on the second base 1231. The heat dissipation housing 12 is, for example, made of an aluminum alloy, and the first fin portion 1222 and the second fin portion 1232 are, for example, made by aluminum extrusion. By providing the first fin portion 1222 and the second fin portion 1232, the heat dissipation efficiency of the power supply 10 can be improved.

[0052] Please also read Figures 4 to 8 . Figure 4 for Figure 1 Schematic diagram of the exploded view of the heat generating components of the power supply. Figure 5 for Figure 1 A schematic cross-sectional view of a power supply with the circuit board omitted. Figure 6 for Figure 1 A schematic cross-sectional view of a heat generating component of a power supply. Figure 7 for Figure 1 A schematic plan view of a magnetic coil of a power supply. Figure 8for Figure 1 A schematic side view of a magnetic coil of a power supply.

[0053] These heating components 13 have, for example, the function of a power factor correction (PFC) circuit. The so-called power factor correction circuit refers to improving the utilization rate of power by correcting the power factor of the circuit. The closer the power factor is to 1, the higher the utilization rate of power.

[0054] Each of these heat-generating components 13 is used to supply power to the circuit board 11, and includes a heat-conducting core 131 and a magnetic coil 132. These heat-conducting cores 131 and these magnetic coils 132 are disposed in the heat-dissipating housing 12, and these heat-conducting cores 131 are in thermal contact with the heat-dissipating housing 12. Each of these heat-conducting cores 131 includes a first heat-conducting portion 1311, a second heat-conducting portion 1312, a first column 1313 and a second column 1314. The first heat-conducting portion 1311 is connected to the second heat-conducting portion 1312. The first column 1313 is disposed on the first heat-conducting portion 1311. The second column 1314 is disposed on the second heat-conducting portion 1312. The first column 1313 is connected to the second column 1314. Among them, the thickness T1 of the first heat-conducting portion 1311 and the thickness T2 of the second heat-conducting portion 1312 are different, for example.

[0055] The magnetic coils 132 are disposed on the first column 1313 and the second column 1314 of the heat-conducting core 131, and are located between the first heat-conducting portion 1311 and the second heat-conducting portion 1312. These magnetic coils 132 are electrically connected to the circuit board 11. These magnetic coils 132 are, for example, arranged coaxially and connected in series through the circuit board 11. Among them, these magnetic coils 132 are, for example, composed of flat copper wires. In addition, the thickness T3 of one turn of these magnetic coils 132 is, for example, 0.3 mm, the line width W of these magnetic coils 132 is, for example, 6 mm, and the number of turns of each of these magnetic coils 132 is, for example, 47 turns, so as to achieve the inductance required by the heating element 13. For example, the inductance of a single heating element 13 is about 350 microhenry (μH), and the inductance of two heating elements 13 including two magnetic coils 132 connected in series is about 700 μH, and so on.

[0056] In this embodiment, since the magnetic coils 132 of the heating elements 13 are arranged coaxially so that the magnetic coils 132 are connected in series, the power supply 10 can store more electric energy and distribute the current through the circuit board, so the accuracy of the power supply 10 in controlling the inductance can be improved, so that the current output by the power supply 10 is more stable. In this way, the heat dissipation efficiency of the power supply 10 can be improved to extend the service life of the power supply 10.

[0057] In addition, since these magnetic coils 132 are composed of flat copper wires, the skin effect can be reduced to reduce copper loss and reduce the temperature increase of these heating components 13 in thermal contact with the heat dissipation housing 12, so that the heat dissipation element, such as an external fan, does not need to dissipate heat from these heat dissipation housings 12 at a high speed. In this way, the heat dissipation efficiency of the power supply 10 can be further improved. Among them, the so-called skin effect is a phenomenon in which the current inside the conductor is unevenly distributed when there is alternating current or alternating electromagnetic field in the conductor, so that the current in the conductor is concentrated on the surface of the conductor, and almost no current flows through the center part of the conductor. The skin effect causes the current to produce a thermal effect only on the surface of the conductor and produce higher copper loss. In addition, the so-called copper loss refers to the heat generated by the current flowing through the wire, such as in a transformer or other electronic device, that is, a kind of energy loss.

[0058] In this embodiment, the power supply 10 may further include a plurality of first fasteners 14, a plurality of second fasteners 15, and a plurality of third fasteners 16. The first fasteners 14, the second fasteners 15, and the third fasteners 16 are, for example, screws. The side panels 122 are fixed by the first fasteners 14. The side panels 122 are fixed to the bottom panel 121 by the second fasteners 15. The top panel 123 is fixed to the side panels 122 by the third fasteners 16.

[0059] In this embodiment, the power supply 10 may further include a heat-conducting fluid 17. The heat-conducting fluid 17 is, for example, FS198BL1 heat-conducting silicone or wax, and the thermal conductivity of the heat-conducting fluid 17 is, for example, 2 W·m-1·K-1. In addition, the heat-conducting fluid 17 is, for example, in a black liquid state.

[0060] When the user wants to fill the heat-conducting fluid 17 into the heat-dissipating housing 12, first, the top plate 123 is fixed to the side plates 122 through the third fasteners 16. At this time, since the side plates 122 are not fixed to the bottom plate 121, the bottom of the heat-dissipating housing 12 is not closed. Then, the heat-conducting fluid 17 is injected into the heat-dissipating housing 12 from the bottom of the heat-dissipating housing 12. The injection amount of the heat-conducting fluid 17 is, for example, about 7 grams. Then, the side plates 122 with the top plate 123 locked are fixed to the bottom plate 121 through the second fasteners 15 to close the bottom of the heat-dissipating housing 12 without leaking the heat-conducting fluid 17 from the heat-dissipating housing 12. In this way, the setting of the heat-conducting fluid 17 can be completed. By providing the heat-conducting fluid 17, the heat generated by the heating component 13 can be further transferred to the heat-dissipating housing 12, and the heat-conducting iron core 131 and the magnetic coil 132 of the heating component 13 can be further thermally balanced, thereby improving the heat dissipation efficiency of the heating components 13.

[0061] In this embodiment, the number of the heating components 13 is multiple, but not limited thereto. In other implementations, the number of the heating components may also be only one.

[0062] In this embodiment, the thickness T1 of the first heat conducting portion 1311 is different from the thickness T2 of the second heat conducting portion 1312, but the present invention is not limited thereto. In other embodiments, the thickness of the first heat conducting portion and the thickness of the second heat conducting portion may also be the same.

[0063] In this embodiment, the power supply 10 fixes the bottom plate 121, the side plates 122 and the top plate 123 by the first fasteners 14, the second fasteners 15 and the third fasteners 16, but the present invention is not limited thereto. In other embodiments, the power supply may also fix the bottom plate, the side plates and the top plate by other fixing methods.

[0064] According to the power supply of the above embodiment, since the magnetic coils of the heating components are arranged coaxially so that the magnetic coils are connected in series, the power supply can store more electric energy and distribute the current through the circuit board, so the accuracy of the power supply in controlling the inductance can be improved, making the current output by the power supply more stable. In this way, the heat dissipation efficiency of the power supply can be improved to extend the service life of the power supply.

[0065] In addition, since these magnetic coils are made of flat copper wires, the skin effect can be reduced to reduce copper loss and reduce the temperature increase of these heat-generating components in thermal contact with the heat dissipation housing, so that heat dissipation elements such as external fans do not need to dissipate heat from these heat dissipation housings at high speeds. In this way, the heat dissipation efficiency of the power supply can be further improved.

[0066] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the protection scope of the claims attached to the present invention.

Claims

1. A power supply, characterized in that: Include: a circuit board; a heat dissipation housing; and A plurality of heat generating components, each of which comprises: a heat-conducting iron core in thermal contact with the heat-dissipating housing; and A magnetic coil is arranged on the heat-conducting iron core and electrically connected to the circuit board. The magnetic coils of the heating components are coaxially arranged and connected in series through the circuit board.

2. The power supply according to claim 1, wherein: The heat-conducting iron cores and the magnetic coils are arranged in the heat-dissipating shell.

3. The power supply device according to claim 1, wherein: The heat dissipation housing comprises a bottom plate, a plurality of side plates and a top plate. The side plates are connected to each other, and the bottom plate and the top plate are respectively connected to opposite sides of the side plates.

4. The power supply as claimed in claim 3, wherein: Each of the side plates includes a first base and a first fin portion, and the first fin portion is arranged on the first base. The top plate includes a second base and a second fin portion, and the second fin portion is arranged on the second base.

5. The power supply as claimed in claim 3, wherein: It further comprises a plurality of first fasteners, a plurality of second fasteners and a plurality of third fasteners, the side panels are fixed to each other through the first fasteners, the side panels are fixed to the bottom panel through the second fasteners, and the top panel is fixed to the side panels through the third fasteners.

6. The power supply device as claimed in claim 1, wherein: Each of the heat-conducting cores includes a first heat-conducting portion, a second heat-conducting portion, a first column and a second column. The first heat-conducting portion is connected to the second heat-conducting portion, the first column is arranged on the first heat-conducting portion, the second column is arranged on the second heat-conducting portion, and the first column is connected to the second column. Each of the magnetic coils is arranged on the first column and the second column and is located between the first heat-conducting portion and the second heat-conducting portion.

7. The power supply device according to claim 6, wherein: The thickness of each of the first heat conducting parts is different from the thickness of each of the second heat conducting parts.

8. The power supply device as claimed in claim 1, wherein: The magnetic coils are made of flat copper wires.

9. The power supply device as claimed in claim 1, wherein: The thickness of one turn of the magnetic coils is 0.3 mm, and the line width of the magnetic coils is 6 mm.

10. The power supply as claimed in claim 1, wherein: Each of the magnetic coils has 47 turns.

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