Heat dissipation device for solid state disk

Abstract

The utility model relates to the technical field of solid state disks, and provides a solid state disk heat dissipation device which comprises a heat conduction pad, a fan cover plate and a heat dissipation fan. The heat conduction pad abuts against the side portion of the solid state disk. The fan cover plate covers the solid state disk and abuts against the side, back to the solid state disk, of the heat conduction pad. The cooling fan is arranged on the lower side of the fan cover plate and used for blowing to the fan cover plate for cooling; the fan cover plate is made of heat-conducting wave-absorbing materials. According to the solid state disk cooling device, the cooling effect of the fan cover plate on the high-power-consumption and high-heating conditions of the solid state disk can be improved in the mode that the cooling fan blows the fan cover plate for cooling, and it is ensured that the solid state disk can still be in the rated temperature interval of normal work under the high-power-consumption and high-heating conditions.

Description

Technical Field

[0001] The present disclosure relates to the technical field of solid state hard disks, and in particular to a solid state hard disk heat dissipation device. Background Art

[0002] With the continuous development of computer technology, the performance requirements of solid-state drives are also constantly improving, which leads to the continuous increase in the thermal design power consumption of solid-state drives. Most of the heat dissipation solutions for solid-state drives in the current existing technology are to first set thermal pads on the upper and lower sides of the solid-state drive, and then set a heat sink and a heat pipe on the other side of the thermal pad, so as to achieve heat dissipation and cooling of the solid-state drive through the fixed heat dissipation effect of the heat sink and the heat pipe.

[0003] However, this cooling solution for SSDs also has certain drawbacks. For example, when the short-term power consumption of the SSD suddenly increases during a certain period of time, the radiator and heat pipe cannot quickly and sensitively cool down the SSD that heats up faster, causing the SSD to have high temperature problems under short-term high power consumption conditions.

[0004] Therefore, there is an urgent need for a solid-state hard disk heat dissipation device with a new structure on the market to solve the problem that the heat dissipation method of the solid-state hard disk in the prior art cannot quickly cool down the high power consumption working condition. Utility Model Content

[0005] The disclosed embodiment provides a solid state drive heat dissipation device to solve the problem that the solid state drive heat dissipation method in the prior art cannot quickly cool down the high power consumption condition.

[0006] The solid state hard disk heat dissipation device provided in the embodiment of the present disclosure includes a thermal pad, a fan cover and a heat dissipation fan;

[0007] The thermal pad is disposed against the top side or the bottom side of the solid state drive;

[0008] The fan cover is disposed on the solid state hard disk and abuts against a side of the thermal pad facing away from the solid state hard disk;

[0009] The heat dissipation fan is arranged at the lower side of the fan cover plate, and is used to blow cooling air toward the fan cover plate;

[0010] The fan cover is made of heat-conducting and wave-absorbing material, or the fan cover is heat-conducting and wave-absorbing through a grounding device, or a heat-dissipating pad with wave-absorbing performance is arranged on the side of the fan cover facing away from the solid-state hard disk.

[0011] In one possible implementation manner, a hollow air inlet window is provided in the fan cover;

[0012] The heat dissipation fan can blow air through the air inlet window to cool down the side of the fan cover plate facing away from the thermal pad.

[0013] In one possible implementation, the solid state hard disk heat dissipation device further includes a base plate;

[0014] The base plate is arranged below the solid state hard disk and forms a heat dissipation gap between the solid state hard disks.

[0015] In one possible implementation manner, the fan cover plate further includes a mounting support portion;

[0016] The fan cover is supported and connected to a side of the base plate facing the solid state hard disk through the mounting support portion.

[0017] In one possible implementation manner, the thermal pad is disposed against a side of the solid state drive facing away from the base plate;

[0018] The thermal pad forms a partial contact with the storage chip in the solid state hard disk.

[0019] In one possible implementation manner, the heat dissipation fan further includes a fan support plate and a fan baffle;

[0020] The fan cover plate, the fan support plate and the fan baffle plate together form a housing space for the heat dissipation fan.

[0021] In one possible implementation manner, the fan support plate has an extended plate portion extending and inserted into the heat dissipation gap;

[0022] And the extension plate portion is connected to the bottom side of the solid state hard disk through the thermal pad.

[0023] In one possible implementation manner, the fan support plate is made of heat-conducting and wave-absorbing material.

[0024] In one possible implementation manner, the fan baffle is further provided with an air supply window;

[0025] The air supply window is at least partially flush with the heat dissipation gap.

[0026] In one possible implementation, the solid state drive heat dissipation device further includes a temperature sensor for detecting the temperature of the solid state drive;

[0027] The temperature sensor is electrically connected to the cooling fan and can adjust the working state of the cooling fan according to temperature detection information.

[0028] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0029] The solid-state hard disk heat dissipation device provided in the embodiment of the present disclosure can improve the cooling effect of the fan cover on the solid-state hard disk when the power consumption and heat generation are high by blowing cooling air to the fan cover through the cooling fan, thereby ensuring that the solid-state hard disk can still be in the rated temperature range for normal operation under the high power consumption and high heat generation conditions, and has the beneficial effect of good heat dissipation and cooling effect and can ensure the long-term normal operation of the solid-state hard disk under high power consumption conditions.

[0030] In addition, the fan cover is set to be a heat-conducting and wave-absorbing material. While ensuring the heat-conducting and heat-dissipating functions of the fan cover, its electromagnetic wave-absorbing characteristics can also be utilized to use the fan cover as an additional electromagnetic shielding shell for the solid-state hard drive, thus killing two birds with one stone.

[0031] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0033] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0034] Figure 1 A first structural schematic diagram of a solid state hard disk heat dissipation device provided by an embodiment of the present disclosure is shown;

[0035] Figure 2 A second structural schematic diagram of a solid state hard disk heat dissipation device provided by an embodiment of the present disclosure is shown;

[0036] Figure 3 A third structural schematic diagram of the solid state drive heat dissipation device provided in an embodiment of the present disclosure is shown.

[0037] Explanation of the numbers in the figure: 1. Thermal pad; 2. Fan cover; 21. Air inlet window; 3. Cooling fan; 31. Fan support plate; 32. Fan baffle; 4. Base plate; 5. Solid-state hard disk. DETAILED DESCRIPTION

[0038] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0039] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0040] Combination Figure 1 As shown, an embodiment of the present disclosure provides a solid-state hard disk heat dissipation device, which includes a thermal pad 1, a fan cover 2 and a heat dissipation fan 3; the thermal pad 1 is arranged to abut against the top side or the bottom side of the solid-state hard disk 5; the fan cover 2 is arranged to cover the solid-state hard disk 5 and abut against the side of the thermal pad 1 facing away from the solid-state hard disk 5; the heat dissipation fan 3 is arranged on the lower side of the fan cover 2, and is used to blow cooling air to the fan cover 2; the fan cover 2 is a heat-conducting and wave-absorbing material, or the fan cover 2 is heat-conducting and wave-absorbing through a grounding device, or a heat dissipation pad with wave-absorbing performance is arranged on the side of the fan cover 2 facing away from the solid-state hard disk.

[0041] When the solid-state hard disk heat dissipation device is used in practice, when the solid-state hard disk 5 is in a normal power consumption working state, the thermal pad 1 can conduct the heat generated by the solid-state hard disk 5 to the fan cover 2, and radiate the heat to the external environment through the thermal conductivity of the fan cover 2; when the solid-state hard disk 5 is in a high power consumption and high heat generation working state, at this time, only the heat conduction of the thermal pad 1 and the radiation heat dissipation of the fan cover 2 are not enough to timely and effectively control the temperature of the solid-state hard disk 5. At this time, the cooling fan 3 can enter the working state, blow air to the fan cover 2, so that the fan cover 2 can quickly dissipate heat to the external environment, thereby improving the cooling effect of the fan cover 2 on the solid-state hard disk 5 in the high power consumption and high heat generation state, ensuring that the working temperature of the solid-state hard disk 5 is always within the rated range.

[0042] In addition, the fan cover 2 is set to a heat-conducting and wave-absorbing material, or the fan cover 2 is grounded to conduct heat and absorb waves, or a heat dissipation pad with wave-absorbing performance is provided on the side of the fan cover 2 facing away from the solid-state hard disk. In this way, while ensuring the heat conduction and heat dissipation function of the fan cover 2, its direct or indirect absorption of electromagnetic waves can also be utilized, and the fan cover 2 can be used additionally as an electromagnetic shielding shell of the solid-state hard disk 5, thereby killing two birds with one stone.

[0043] To sum up, the solid-state hard disk heat dissipation device provided in the embodiment of the present disclosure can improve the cooling effect of the fan cover 2 on the solid-state hard disk 5 when the power consumption and heat generation are high by blowing cooling air from the cooling fan 3 to the fan cover 2, thereby ensuring that the solid-state hard disk 5 can still be in the rated temperature range for normal operation under the high power consumption and high heat generation conditions, and has the beneficial effect of good heat dissipation and cooling effect and can ensure the long-term normal operation of the solid-state hard disk under high power consumption conditions.

[0044] In one embodiment, a hollow air inlet window 21 is provided in the fan cover 2 ; the heat dissipation fan 3 can blow air through the air inlet window 21 to cool down the side of the fan cover 2 facing away from the thermal pad 1 .

[0045] Specific, combined Figure 1 To further explain in detail, a hollow air inlet window 21 is opened in the fan cover 2, and the cooling fan 3 can blow and cool down the side of the fan cover 2 facing away from the thermal pad 1 through the air inlet window 21, so that the air after heat exchange with the fan cover 2 will flow away quickly and promptly along the side of the fan cover 2 facing away from the thermal pad 1, and will not be retained inside the solid state hard disk cooling device, thereby improving the fluidity of the air blown by the cooling fan 3 and the cooling effect of the fan cover 2.

[0046] In addition, the above-mentioned air inlet windows 21 can be hollowed out in multiple directions along the thickness direction of the fan cover 2, and the shape of the air inlet windows 21 can be specifically an oblique opening, a straight opening, a grid shape, a threaded opening, etc., so as to realize the function of the cooling fan 3 blowing the airflow through and to the side of the fan cover 2 facing away from the thermal pad 1.

[0047] In one possible implementation, the SSD heat dissipation device further includes a base plate 4 ; the base plate 4 is disposed below the SSD 5 and forms a heat dissipation gap between the SSD 5 .

[0048] Specific, combined Figure 1 To further explain in detail, the solid-state hard disk heat dissipation device can be used to install a carrier for fixing the fan cover 2 by setting a base plate 4, and the base plate 4 is set below the solid-state hard disk 5, and a heat dissipation gap is formed between the solid-state hard disks, so that when the air below the solid-state hard disk 5 is heated and escapes from the heat dissipation gap, the ambient air with a relatively low temperature can be replenished in time, thereby improving the air flow below the solid-state hard disk 5, so that the bottom of the solid-state hard disk 5 can also have better heat exchange with the external environment.

[0049] Of course, some heat dissipation exhaust holes may also be added in the portion of the base plate 4 corresponding to the heat dissipation gap to further improve the fluidity of the air there.

[0050] The specific arrangement of the base plate 4 has the beneficial effects of simple structure, being able to provide a heat dissipation gap with the solid state drive 5 , and improving the air flowability at the lower side of the solid state drive 5 .

[0051] In one possible implementation manner, the fan cover 2 further includes a mounting support portion; and the fan cover 2 is supported and connected to a side of the base plate 4 facing the solid state hard disk through the mounting support portion.

[0052] Specific, combined Figure 1 To further explain in detail, the above-mentioned mounting support portion can be specifically vertically arranged on one side of the fan cover 2, and the mounting support portion can be fixedly installed with the base plate 4 by means of screws, so that the fan cover 2 can be supported by the mounting support portion and the base plate 4 toward one side of the solid state drive 5, and the fan cover 2 and the solid state drive 5 can be installed in a parallel posture to each other.

[0053] The above-mentioned mounting support part can be specifically configured to be integrally connected with the fan cover plate 2, that is, the mounting support part is configured to be made of the same material as the fan cover plate 2, so that the mounting support part also has the characteristics of heat conduction and electromagnetic wave absorption.

[0054] The specific arrangement of the above-mentioned mounting support portion has the beneficial effect of being simple in structure and being able to achieve the fan cover 2 being installed above the solid state hard disk 5 in parallel and at intervals.

[0055] In one possible implementation manner, the thermal pad 1 is disposed in contact with the side of the solid state drive 5 facing away from the base plate 4 ; the thermal pad 1 forms a partial contact with the storage chip in the solid state drive 5 .

[0056] Specific, combined Figure 1 To further explain in detail, the thermal pad 1 is set against the side of the solid state drive 5 facing away from the base plate 4, and the thermal pad 1 is only partially in contact with the storage chip in the solid state drive 5. This is because the storage chip in the solid state drive 5 is the main heat source of the solid state drive 5. The thermal pad 1 forms a partial contact with the storage chip, which can ensure the thermal conductivity of the thermal pad 1 to the solid state drive 5. The thermal pad 1 and the remaining parts of the solid state drive 5 can form an installation gap to facilitate the air in the external environment to circulate between the thermal pad 1 and the solid state drive 5, so that the top of the solid state drive 5 can also have better heat exchange with the external environment air.

[0057] The specific configuration of the thermal pad 1 can not only conduct the core heat source in the solid state drive 5 , but also form an installation gap to allow the external ambient air to exchange heat with the solid state drive 5 .

[0058] In one possible implementation manner, the heat dissipation fan 3 further includes a fan support plate 31 and a fan baffle 32 ; the fan cover plate 2 , the fan support plate 31 and the fan baffle 32 together form a housing space for the heat dissipation fan 3 .

[0059] Specific, combined Figure 1 To further explain in detail, the fan support plate 31 can be specifically arranged at the bottom of the cooling fan 3 to support the installation of the cooling fan 3, and the fan baffles 32 can be respectively arranged on the vertical sides of the cooling fan 3, so that the fan cover 2, the fan support plate 31 and the fan baffle 32 together form a housing space for the cooling fan 3, ensuring that the cooling fan 3 can be stably installed and stably blow wind to the air inlet window 21 in the fan cover 2.

[0060] In one possible implementation, the fan support plate 31 has an extension plate portion 311 extending and inserted into the heat dissipation gap; and the extension plate portion 311 is connected to the bottom side of the solid state drive through the thermal pad 1 .

[0061] Specific, combined Figure 2 To further explain in detail, an extension plate portion 311 is provided in the fan support plate 31 and is extended and inserted into the heat dissipation gap formed by the base plate 4 and the solid state drive 5. In this way, the extension plate portion 311 can improve the support and installation stability of the solid state drive 5 on the one hand, and on the other hand, the extension plate portion 311 can also abut against the lower side of the solid state drive 5 to conduct heat, thereby further improving the heat dissipation and cooling efficiency of the solid state drive 5.

[0062] Of course, some penetrating heat dissipation gaps may also be opened in the extension plate portion 311 along its thickness direction to ensure air flow in the heat dissipation gap.

[0063] In one embodiment, the fan support plate 31 is made of heat-conducting and wave-absorbing material.

[0064] The fan support plate 31 is also configured to be a material that conducts heat and absorbs electromagnetic waves, that is, the extension plate portion 311 is configured to have the functions of conducting heat and absorbing electromagnetic waves. In this way, on the one hand, the heat dissipation and cooling efficiency of the solid state drive 5 can be further improved through the extension plate portion 311, and on the other hand, the extension plate portion 311 and the fan cover plate 2 can fully electromagnetically shield the solid state drive 5 from the upper and lower sides thereof, without the need to additionally provide a related electromagnetic shielding shell for the solid state drive 5, thereby simplifying the electromagnetic shielding structure of the solid state drive 5.

[0065] The specific arrangement of the fan support plate 31 has the beneficial effect of improving the heat dissipation and cooling efficiency of the solid state hard disk 5 and achieving sufficient electromagnetic shielding for the solid state hard disk 5 .

[0066] In one possible implementation manner, an air supply window 322 is further provided in the fan baffle 32; the air supply window 322 is at least partially flush with the heat dissipation gap.

[0067] Specific, combined Figure 3To further explain in detail, an air supply window 322 is opened in the fan baffle 32, and the air supply window 322 is at least partially flush with the heat dissipation gap, so that the airflow blown by the cooling fan 3 can pass through the air supply window 322 through the fan baffle 32 and enter the heat dissipation gap, thereby greatly improving the air flow in the heat dissipation gap and greatly improving the heat dissipation effect on the lower side of the solid state drive 5.

[0068] In one possible implementation, the SSD cooling device further includes a temperature sensor for detecting the temperature of the SSD; the temperature sensor is electrically connected to the cooling fan 3 and can regulate the working state of the cooling fan 3 according to the temperature detection information.

[0069] The solid-state hard disk cooling device is also provided with a temperature sensor for detecting the temperature of the solid-state hard disk, and the temperature sensor is electrically connected to the cooling fan 3, so that when the temperature sensor detects that the temperature of the solid-state hard disk 5 is higher than the threshold temperature, the cooling fan 3 can be controlled to turn on the power and blow the fan cover 2, thereby enhancing the heat dissipation and cooling effect of the fan cover 2 on the solid-state hard disk 5.

[0070] Of course, in addition to using the temperature sensor to regulate its own working state, the heat dissipation fan 3 can also use a thermistor switch to achieve the function of regulating its own working state, but its regulation sensitivity is slightly worse than that of the above-mentioned temperature sensor.

[0071] The above-mentioned temperature sensor is provided to improve the automation and intelligence of the solid state hard disk heat dissipation device, and can timely and sensitively control the power-on working timing of the heat dissipation fan 3.

[0072] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0073] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A solid state hard disk heat dissipation device, characterized in that: It comprises a heat-conducting pad (1), a fan cover (2) and a heat-dissipating fan (3); The thermal pad (1) is disposed against the top side or the bottom side of the solid state hard disk; The fan cover (2) is arranged to cover the solid state hard disk and abuts against a side of the thermal pad (1) facing away from the solid state hard disk; The heat dissipation fan (3) is arranged on the lower side of the fan cover plate (2) and is used to blow air toward the fan cover plate (2) to cool it down; The fan cover (2) is made of a heat-conducting and wave-absorbing material, or the fan cover (2) performs heat-conducting and wave-absorbing via a grounding device, or a heat-dissipating pad with wave-absorbing performance is provided on the side of the fan cover (2) facing away from the solid-state hard disk.

2. The solid state hard disk heat dissipation device according to claim 1, characterized in that: The fan cover plate (2) is provided with a hollow air inlet window (21); The heat dissipation fan (3) can blow air through the air inlet window (21) to cool down the side of the fan cover plate (2) facing away from the thermal pad (1).

3. The solid state hard disk heat dissipation device according to claim 1, characterized in that: The solid state hard disk heat dissipation device also includes a base plate (4); The base plate (4) is arranged below the solid state hard disk and forms a heat dissipation gap between the solid state hard disks.

4. The solid state hard disk heat dissipation device according to claim 3, characterized in that: The fan cover plate (2) also includes a mounting support portion; Furthermore, the fan cover plate (2) is supported and connected to a side of the base plate (4) facing the solid state hard disk via the mounting support portion.

5. The solid state hard disk heat dissipation device according to claim 3, characterized in that: The thermal pad (1) is disposed against a side of the solid state hard disk facing away from the base plate (4); The thermal conductive pad (1) forms a local contact with the storage chip in the solid state hard disk.

6. The solid state hard disk heat dissipation device according to claim 3, characterized in that: The heat dissipation fan (3) further comprises a fan support plate (31) and a fan baffle (32); The fan cover plate (2), the fan support plate (31) and the fan baffle plate (32) together form a housing space for the heat dissipation fan (3).

7. The solid state hard disk heat dissipation device according to claim 6, characterized in that: The fan support plate (31) has an extension plate portion (311) extending and inserted into the heat dissipation gap; Furthermore, the extension plate portion (311) is connected to the bottom side of the solid state hard disk via the thermal pad (1).

8. The solid state hard disk heat dissipation device according to claim 7, characterized in that: The fan support plate (31) is made of heat-conducting and wave-absorbing material.

9. The solid state hard disk heat dissipation device according to claim 6, characterized in that: The fan baffle (32) is also provided with an air supply window (322); The air supply window (322) is at least partially flush with the heat dissipation gap.

10. The solid state hard disk heat dissipation device according to any one of claims 1 to 9, characterized in that: The solid state hard disk heat dissipation device also includes a temperature sensor for detecting the temperature of the solid state hard disk; The temperature sensor is electrically connected to the cooling fan (3) and is capable of regulating the working state of the cooling fan (3) according to temperature detection information.

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