Etching equipment

Abstract

The utility model provides an etching device. The etching equipment comprises a wafer loading cavity; the environment chamber with the fan comprises the fan and is used for feeding gas into the environment chamber with the fan; the conveying mechanism is used for conveying the wafer to be etched into the process cavity for etching; the first electric connection loop comprises a first power supply, a first switch, a fan and a relay which are connected in series; the second electric connection loop comprises a second power supply, a relay and an electromagnetic valve which are connected in series; wherein the relay comprises an electrified coil and a normally open contact, two ends of the electrified coil are arranged in the first electric connection loop, and two ends of the normally open contact are arranged in the second electric connection loop; the electromagnetic valve is used for controlling the conveying mechanism to perform first action when being switched on; when the electrified coil is electrified, the first electric connection loop and the second electric connection loop are conducted. According to the utility model, through the arrangement of the first electric connection loop and the second electric connection loop, the abnormal condition that the fan is not opened can be found in time, and the etching abnormity caused by the fan not opened can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an etching device. Background Art

[0002] In semiconductor manufacturing, etching is the process of removing unnecessary materials attached to the surface of the wafer by chemical or physical methods. Etching is divided into dry etching and wet etching. Among them, dry etching occupies a dominant position in semiconductor wafer manufacturing because it can achieve anisotropic etching. Dry etching is completed using etching equipment. The main working principle is to use plasma to react with the surface film to form volatile substances, or directly bombard the film surface to remove excess materials.

[0003] Figure 1 FIG. 2 shows a schematic diagram of the structure of the etching equipment. Figure 1 As shown, the existing etching machine includes a wafer loading chamber 1, a blower environment chamber 2, a vacuum transfer chamber 3 and a process chamber 4. When the etching process is performed, the wafer is transferred from the wafer box to the blower environment chamber 2 for edge correction, and then the wafer enters the vacuum transfer chamber 3 in sequence, and then enters the process chamber 4 for etching. Among them, a blower 5 is arranged in the blower environment chamber 2, which is used to send air into the blower environment chamber 2 with a filter, and form a positive pressure in the blower environment chamber 2 to drive away dust or other particulate impurities on the wafer surface from the wafer surface, ensure the cleanliness of the wafer surface, and prevent etching from blocking etching defects. In actual production, engineers often perform maintenance or repair on the conveying mechanism 6 under the environmental chamber with a fan 2. During maintenance or repair, the fan 5 is often turned off. After the maintenance or repair is completed, the fan may be forgotten to be turned on, which will cause the particle size in the environmental chamber with a fan 2 to exceed the standard, causing dust and other particles to fall onto the surface of the wafer to be etched, causing the surface of the wafer to be contaminated. When etching a wafer contaminated by particles, it will cause abnormal barrier etching, reduce the yield of the wafer, and in severe cases, may even cause the wafer to be scrapped. Utility Model Content

[0004] In view of the problems in the prior art, the purpose of the utility model is to provide an etching device so as to timely detect the abnormality of the fan not being turned on, reduce the blocking etching defects during etching, and improve the product yield.

[0005] The utility model embodiment provides an etching device, comprising:

[0006] A wafer loading chamber, used to accommodate wafers to be etched;

[0007] A blower environment chamber, comprising a blower for delivering gas into the blower environment chamber to form a positive pressure in the blower environment chamber;

[0008] A conveying mechanism, used for conveying the wafer to be etched to the process chamber for etching;

[0009] A first electrical connection circuit includes a first power source, a first switch, the fan and a relay connected in series;

[0010] A second electrical connection circuit, comprising a second power supply, the relay and the solenoid valve connected in series; wherein the relay comprises an energized coil and a normally open contact, two ends of the energized coil are placed in the first electrical connection circuit, and two ends of the normally open contact are placed in the second electrical connection circuit;

[0011] When the solenoid valve is turned on, it is used to control the transmission mechanism to perform a first action; when the energized coil is energized, both the first electrical connection circuit and the second electrical connection circuit are in a conducting state.

[0012] In some embodiments, the relay also includes a moving iron core, a spring and a normally closed contact; when the energized coil is energized, the moving iron core is connected to both ends of the normally open contact under the action of electromagnetic force; when the energized coil is de-energized, the moving iron core is connected to both ends of the normally closed contact under the action of the spring.

[0013] In some embodiments, a cylinder is further included to control the transmission mechanism to perform the first action; the cylinder includes a cylinder body, a piston and a connecting rod, and the piston drives the connecting rod to move toward or away from the cylinder body.

[0014] In some embodiments, a vacuum transfer chamber is further included, and the transfer mechanism is placed in the vacuum transfer chamber.

[0015] In some embodiments, the transfer mechanism is a vacuum arm.

[0016] In some embodiments, the environmental chamber with a fan further includes a pressure measurement and control unit, which is used to detect the air pressure in the environmental chamber with a fan and control the rotation speed of the fan according to the air pressure to adjust the gas delivery rate.

[0017] In some embodiments, the fan is placed on top of the environmental chamber with the fan.

[0018] In some embodiments, an exhaust unit is further included to exhaust the gas in the environmental chamber with a fan.

[0019] In some embodiments, the first power source is an AC power source.

[0020] The etching equipment provided by the utility model has the following advantages:

[0021] The utility model sets a first electrical connection circuit to control the operation of the fan, sets a second electrical connection circuit to control the transmission mechanism to transmit the action signal, and uses a relay to control the on and off state of the second electrical connection circuit. When the first electrical connection circuit is disconnected, the fan is not turned on, and the second electrical connection circuit is also disconnected under the influence of the relay, then the transmission mechanism cannot perform the first action, and the transmission mechanism abnormal alarm prompts. Through the abnormal alarm prompt of the transmission mechanism, the abnormality of the fan not being turned on can be monitored in time, thereby reducing the abnormality of wafer etching caused by the fan not running, and reducing the abnormality rate of wafer etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objectives and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0023] Figure 1 It is a structural schematic diagram of an etching device provided by an embodiment of the utility model;

[0024] Figure 2 It is a connection diagram of a first electrical connection circuit and a second electrical connection circuit of an etching device provided by an embodiment of the utility model;

[0025] Figure 3 It is a structural schematic diagram of a relay provided in an embodiment of the utility model.

[0026] Reference numerals:

[0027] 1 Wafer loading chamber 9 Relay

[0028] 2 Environmental chamber with fan 91 Energized coil

[0029] 3 Vacuum transfer chamber 92 Normally open contact

[0030] 4 Process chamber 93 Spring

[0031] 5 Fan 94 Moving iron core

[0032] 6 Conveyor mechanism 95 Normally closed contact

[0033] 7 First power supply 10 Solenoid valve

[0034] 8 First switch 11 Second power supply DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. In the figures, the same reference numerals represent the same or similar structures, and thus their repeated description will be omitted. "or" and "or" in the specification may both mean "and" or "or".

[0036] In the representations of the present application, the representations with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the represented specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples, unless they contradict each other.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] As described in the background technology, since the fan in the environmental chamber 2 is not turned on after repair or maintenance, the particle size in the environmental chamber 2 exceeds the standard, causing particles to fall from the surface of the wafer when passing through the environmental chamber 2, thereby causing blocking etching abnormalities after the wafer is etched. In response to this abnormality, an embodiment of the utility model provides an etching device to reduce the wafer etching abnormality caused by the fan not being turned on.

[0039] like Figures 1 to 3 As shown, the etching equipment includes a wafer loading chamber 1 for accommodating wafers to be etched; a blower environment chamber 2, including a blower 5, for delivering gas into the blower environment chamber 2, and forming a positive pressure in the blower environment chamber 2, so as to drive away the particle area on the surface of the wafer to be etched, and ensure the cleanliness of the wafer surface; a conveying mechanism 6, for transferring the wafer to be etched from the wafer loading chamber 1 to the process chamber for etching;

[0040] The first electrical connection circuit includes a first power source 7, a first switch 8, a fan 5 and a relay 9 connected in series;

[0041] A second electrical connection circuit includes a second power supply 11, a relay 9 and a solenoid valve 10 connected in series; wherein the relay 9 includes an energized coil 91 and a normally open contact 92, two ends (a and b) of the energized coil 91 are placed in the first electrical connection circuit, and two ends (c and d) of the normally open contact 92 are placed in the second electrical connection circuit;

[0042] When the solenoid valve 10 is turned on, it is used to control the transmission mechanism 6 to perform the first action; when the energized coil 91 is energized, the first electrical connection circuit and the second electrical connection circuit are both in the conducting state.

[0043] In this embodiment, the first action refers to the up and down lifting action. When the conveying mechanism 6 takes a wafer from the wafer loading chamber 1, it will first suck the back of the wafer, and then perform a lifting action to separate the wafer from the wafer box. Each time the conveying mechanism 6 takes a wafer, it will perform a corresponding lifting action. In other embodiments, the first action can also be an action such as rotation.

[0044] In the present application, the operation of the fan 5 is controlled by the first electrical connection circuit. As long as the power-on coil is energized, the fan 5 can be operated; the conduction of the second electrical connection circuit is affected by the relay 9 in the first electrical connection circuit. When the power-on coil 91 of the relay 9 is energized, the normally open contact 92 in the second electrical connection circuit is turned on, and the second electrical connection circuit is turned on; and when the power-on coil 91 of the relay 9 is not energized, the first electrical connection circuit is in a disconnected state, and the fan 5 is not turned on; the normally open contact 92 is in a disconnected state, and the second electrical connection circuit is in a disconnected state. When the second electrical connection circuit is disconnected, the solenoid valve 10 is in a closed state, and the transmission mechanism 6 cannot be controlled to perform the first action (up and down lifting action). When the transmission mechanism 6 cannot perform the up and down lifting action, an alarm prompt will be issued. Through the alarm prompt of the transmission mechanism 6, it can be detected whether it is caused by the abnormality of the fan 5 not being turned on, so as to timely monitor the abnormality of the fan 5 not being turned on, and reduce the etching abnormality caused by the influence of the fan 5.

[0045] See also Figure 3 , the relay 9 further includes a moving iron core 94, a spring 93 and a normally closed contact 95; when the power coil 91 is energized, the moving iron core 94 is connected to both ends of the normally open contact 92 under the action of electromagnetic force; when the power coil 91 is de-energized, the moving iron core 94 is connected to both ends (e and f) of the normally closed contact 95 under the action of the spring 93. The relay 9 in this embodiment is only an example and is not limited thereto.

[0046] Furthermore, the etching device further includes a cylinder (not shown in the figure) to control the conveying mechanism 6 to perform the first action. The cylinder can be a cylinder disclosed in the prior art, for example, the cylinder includes a cylinder body, a piston and a connecting rod, and the piston drives the connecting rod to move toward or away from the cylinder body. The transport mechanism is connected to the connecting rod, so that the ascending and descending actions can be realized.

[0047] The electromagnetic valve 10 is turned on to control the conveying mechanism 6 to perform the first action. When the electromagnetic valve 10 is not turned on, the conveying mechanism 6 cannot perform the ascending and descending actions, and the machine will alarm abnormally, indicating that the conveying mechanism is abnormal.

[0048] Please continue to refer to Figure 1 The etching device further comprises a vacuum transfer chamber 3, in which a transfer mechanism 6 is placed. The vacuum transfer chamber 3 is a negative pressure environment. In some embodiments, the transfer mechanism is a vacuum arm.

[0049] In some embodiments, the environmental chamber 2 with a fan further includes a pressure measurement and control unit, which is used to detect the air pressure in the environmental chamber 2 with a fan and control the fan speed according to the air pressure to adjust the gas delivery rate.

[0050] In this embodiment, the fan 5 is placed on the top of the environmental chamber 2. It should be noted that the position of the fan 5 is not limited to the top of the environmental chamber 2. For example, the fan can also be located at the bottom of the environmental chamber 2.

[0051] In some embodiments, the etching equipment also includes an exhaust unit (not shown in the figure) for exhausting the gas in the fan environment chamber 2, which can take away dust and other particles in the cavity and ensure the pressure balance in the wafer transfer chamber.

[0052] In this embodiment, the first power source 7 is an AC power source, and the second power source 11 is a DC power source.

[0053] The etching equipment provided by the utility model has the following advantages:

[0054] The utility model sets a first electrical connection circuit to control the operation of the fan, sets a second electrical connection circuit to control the transmission mechanism to transmit the first action signal, and uses a relay to enable the first electrical connection circuit to control the on and off states of the second electrical connection circuit. Therefore, when the movement of the transmission mechanism is abnormal, the abnormal condition of the fan can be monitored, thereby reducing the wafer etching abnormality caused by the failure of the fan to operate and reducing the wafer etching abnormality rate.

[0055] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An etching device, characterized in that: include: A wafer loading chamber, used to accommodate wafers to be etched; A blower environment chamber, comprising a blower for delivering gas into the blower environment chamber to form a positive pressure in the blower environment chamber; A conveying mechanism, used for conveying the wafer to be etched to the process chamber for etching; A first electrical connection circuit includes a first power source, a first switch, the fan and a relay connected in series; A second electrical connection circuit, comprising a second power supply, the relay and the solenoid valve connected in series; wherein the relay comprises an energized coil and a normally open contact, two ends of the energized coil are placed in the first electrical connection circuit, and two ends of the normally open contact are placed in the second electrical connection circuit; When the solenoid valve is turned on, it is used to control the transmission mechanism to perform a first action; when the energized coil is energized, both the first electrical connection circuit and the second electrical connection circuit are in a conducting state.

2. The etching device according to claim 1, characterized in that: The relay also includes a moving iron core, a spring and a normally closed contact; when the energized coil is energized, the moving iron core is connected to the two ends of the normally open contact under the action of electromagnetic force; when the energized coil is de-energized, the moving iron core is connected to the two ends of the normally closed contact under the action of the spring.

3. The etching device according to claim 2, characterized in that: It also includes a cylinder to control the transmission mechanism to perform the first action; the cylinder includes a cylinder body, a piston and a connecting rod, and the piston drives the connecting rod to move toward or away from the cylinder body.

4. The etching device according to claim 1, characterized in that: It also includes a vacuum transfer chamber, in which the transfer mechanism is placed.

5. The etching device according to claim 4, characterized in that: The conveying mechanism is a vacuum arm.

6. The etching device according to claim 1, characterized in that: The environmental chamber with a fan also includes a pressure measurement and control unit, which is used to detect the air pressure in the environmental chamber with a fan and control the rotation speed of the fan according to the air pressure to adjust the gas delivery rate.

7. The etching device according to claim 1, characterized in that: The fan is placed on the top of the environmental chamber with the fan.

8. The etching device according to claim 1, characterized in that: It also includes an exhaust unit for exhausting the gas in the environmental room with a fan.

9. The etching device according to claim 1, characterized in that: The first power source is an alternating current power source.

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