Front opening type wafer conveying box

Abstract

The utility model relates to the technical field of wafer accommodation or transportation, in particular to a front open type wafer conveying box. The conveying box comprises a conveying box body, a top flange, a carrying handle, a door frame, a door plate and a supporting assembly. The top flange comprises a clamping part, a supporting part and a lock catch part, the clamping part and the lock catch part are connected through the supporting part, a gap is formed between the clamping part and the lock catch part, and the gap is used for clamping of the aerial carrying system. The lock catch part is clamped to the top of the conveying box body through a clamping groove assembly; and the maximum length of the lock catch part in the horizontal direction is 50-90mm. Through the arrangement of the wafer conveying box, the risk of breakage of a connecting structure between the top flange and the wafer box is reduced, and the service life of the wafer conveying box is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer accommodation or transportation, in particular to a front-opening wafer transfer box. Background Art

[0002] Existing semiconductor wafers need to go through multiple processes during the production and manufacturing process. In different processes, the wafers need to be transported to different equipment. Various handling systems and wafer transfer boxes also play a relatively important role.

[0003] Different production processes involve transportation, storage, and cooling. When using the overhead transport system OHT to transport a transport box containing wafers, the overhead transport system is connected to the flange on the top of the wafer box. Since the wafer box has a large load-bearing capacity, there is a risk of breakage in the connection structure between the top flange and the wafer box. Utility Model Content

[0004] In order to optimize the above-mentioned existing wafer transfer box, the present application proposes a front-opening wafer transfer box for transporting wafers in an aerial transport system, comprising:

[0005] A transmission box body, wherein a first opening is provided on one side of the transmission box body;

[0006] A top flange, wherein the top flange comprises a clamping portion, a supporting portion and a locking portion, wherein the clamping portion and the locking portion are connected via the supporting portion, wherein the clamping portion extends along the circumference of the supporting portion in a direction away from the center of the supporting portion, wherein a gap is provided between the clamping portion and the locking portion, wherein the gap is used for clamping by the aerial handling system, and the locking portion is clamped to the top of the conveying box body via a card slot assembly; wherein the maximum length of the locking portion in the target direction is 50-90 mm, and the target direction refers to a direction on a horizontal plane where the locking portion is located that is parallel to a plane where the first opening is located.

[0007] Specifically, the above-mentioned front-opening wafer conveying box also includes a door frame, which is arranged on the first opening; a door panel, which is locked or unlocked with the door frame through a switch structure; and a support assembly, which is arranged inside the conveying box body and is used to support the wafer.

[0008] Optionally, the front-opening wafer transport box further includes a carrying handle, which is clamped on the side of the transport box body, and there are two carrying handles, which are symmetrically arranged on both sides of the transport box body.

[0009] Optionally, in the above-mentioned front-opening wafer transfer box, there are two locking parts, and the two locking parts are symmetrically arranged on both sides of the lower end of the support part; the maximum width of the locking part in the direction perpendicular to the target direction is 80-100mm.

[0010] Optionally, in the above-mentioned front-opening wafer transport box, the slot assembly matches the locking portion, and the slot assembly includes three slots, and gaps are set between the three slots and the transport box body.

[0011] Optionally, in the above-mentioned front-opening wafer conveying box, the three card slots include a first card slot, a second card slot and a third card slot, the locking portion is an overall wedge-shaped block structure, the locking portion is provided with a protrusion at its first end close to the first opening, the thickness of the locking portion gradually increases from the first end to the second end away from the protrusion, the first card slot and the third card slot match the locking portion, and the second card slot is used to clamp the protrusion.

[0012] Optionally, in the above-mentioned front-opening wafer conveying box, the support part is provided with a second opening on its first side close to the first opening, and the support part moves along the direction from the second side away from the second opening to the first side to clamp the locking part to the top of the conveying box body.

[0013] Optionally, in the above-mentioned front-opening wafer transfer box, the angle between the first card slot and the third card slot in the horizontal plane is an acute angle.

[0014] Optionally, in the above-mentioned front-opening wafer transport box, the clamping portion is fixedly connected to the top of the transport box body, a threaded column is provided on the top of the transport box body, and a screw hole corresponding to and matching the threaded column is provided on the clamping portion.

[0015] Optionally, in the above-mentioned front-opening wafer conveying box, the support assembly includes multiple groups of support grooves, and the multiple groups of support grooves are used to support the wafers; a raised buckle is provided on the side of the conveying box body for clamping the carrying handle.

[0016] One or more technical solutions provided by the utility model produce at least the following beneficial effects:

[0017] The present application proposes a front-opening wafer transfer box, comprising: a transfer box body, a top flange, a handling handle, a door frame, a door panel, and a support assembly; a first opening is provided on one side of the transfer box body; the top flange comprises a clamping portion, a supporting portion, and a locking portion, the clamping portion and the locking portion are connected via the supporting portion, a gap is provided between the clamping portion and the locking portion, the gap is used for the aerial handling system to clamp, the locking portion is clamped to the top of the transfer box body via a card slot assembly; the maximum length of the locking portion in the horizontal direction is 50-90mm. Through the setting of the front-opening wafer transfer box, the force-bearing area of ​​the locking portion is increased, the maximum force threshold of the top flange is increased, the risk of fracture of the connection structure between the top flange and the wafer box is reduced, and the service life of the wafer transfer box is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Further details, features and advantages of the present application are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 This is a schematic diagram of the overall structure of a front-opening wafer transfer box according to an embodiment of the present application;

[0020] Figure 2 Another overall structural schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application;

[0021] Figure 3 A top schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application;

[0022] Figure 4 A schematic diagram of a top flange of a front-opening wafer transfer box according to an embodiment of the present application;

[0023] Figure 5 A schematic side view of a front-opening wafer transfer box according to an embodiment of the present application;

[0024] Figure 6 Another schematic diagram of a top flange of a front-opening wafer transfer box according to an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 1-transport box body; 11-slot assembly; 111-first slot; 112-second slot; 113-third slot; 12-protruding buckle; 13-threaded column; 14-first opening; 2-top flange; 21-clamping part; 211-screw hole; 22-supporting part; 23-locking part; 231-protrusion; 24-second opening; 3-carrying handle; 4-door frame; 5-door panel. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0028] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0029] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0030] It should be noted that the modifications of "one" and "plurality" mentioned in the present application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0031] The names of the messages or information exchanged between multiple devices in the embodiments of the present application are only used for illustrative purposes and are not used to limit the scope of these messages or information. Specific embodiments

[0032] The utility model relates to the technical field of wafer accommodation or transportation, and specifically to a front-opening wafer transfer box used for transporting wafers in an aerial transport system, comprising: a transfer box body 1, a top flange 2, a transport handle 3, a door frame 4, a door panel 5, and a support assembly.

[0033] Figure 1 This is a schematic diagram of the overall structure of a front-opening wafer transfer box according to an embodiment of the present application; Figure 2 This is another overall structural schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application; Figure 3 A top schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application; Figure 4This is a schematic diagram of the top flange of a front-opening wafer transfer box according to an embodiment of the present application.

[0034] like Figure 1-4 As shown, a first opening 14 is provided on one side of the wafer conveying box body 1, and a top flange 2 is provided on the top of the wafer conveying box body 1, wherein the top flange 2 includes a clamping portion 21, a supporting portion 22 and a locking portion 23, the clamping portion 21 and the locking portion 23 are connected via the supporting portion 22, the clamping portion 21 extends along the circumference of the supporting portion 22 in a direction away from the center of the supporting portion 22, the clamping portion 21 is square as a whole, a gap is provided between the clamping portion 21 and the locking portion 23, the gap is used for clamping by the aerial handling system, the locking portion 23 is clamped to the top of the conveying box body 1 through the slot assembly 11; the maximum length L of the locking portion 23 in the horizontal direction is 50mm-90mm.

[0035] In some exemplary embodiments, a threaded column 13 may be further provided on the top of the above-mentioned transmission box body 1, and a screw hole 211 corresponding to the above-mentioned threaded column 13 is provided on the above-mentioned clamping portion 21. The above-mentioned clamping portion 21 is fixedly connected to the above-mentioned threaded column 13 through the above-mentioned screw hole 211, thereby further increasing the connection strength.

[0036] Through the setting of the above-mentioned front-opening wafer transfer box, compared with the locking part of the existing top flange, the size of the locking part is increased, thereby increasing the force-bearing area of ​​the locking part, increasing the maximum force threshold of the top flange, reducing the risk of breakage of the connection structure between the top flange and the wafer box, and improving the service life of the wafer transfer box.

[0037] In some embodiments, in the above-mentioned front-opening wafer conveying box, the carrying handle 3 is clamped on the side of the above-mentioned conveying box body 1, and the door frame 4 is arranged on the first opening 14 of the above-mentioned conveying box body 1; the above-mentioned door panel 5 and the above-mentioned door frame 4 are locked or unlocked by a switch structure; the above-mentioned support assembly is arranged inside the above-mentioned conveying box body 1, for supporting the above-mentioned wafer.

[0038] In some embodiments, in the front-opening wafer pod, there are two locking parts 23, which are symmetrically arranged on both sides of the lower end of the support part 22; the maximum width of the locking part in the direction perpendicular to the target direction is 80-100 mm. The clamping force of the aerial handling system is dispersed to the two locking parts through the symmetrically arranged locking parts, reducing the risk of the top flange breaking.

[0039] In some embodiments, in the above-mentioned front-opening wafer conveying box, the above-mentioned slot assembly 11 matches the above-mentioned locking portion 23, and the above-mentioned slot assembly includes three slots; a gap is set between the above-mentioned three slots and the above-mentioned conveying box body 1, which is used to accommodate the locking portion when the top flange is clamped to the top of the conveying box body.

[0040] In some embodiments, in the above-mentioned front-opening wafer transfer box, the above-mentioned three card slots are the first card slot 111, the second card slot 112 and the third card slot 113, and the above-mentioned three card slots abut the locking part in three directions respectively; the above-mentioned locking part 23 is a wedge-shaped block structure as a whole, and the above-mentioned locking part is provided with a protrusion 231 at its first end close to the above-mentioned first opening 14, and the thickness of the above-mentioned locking part gradually increases from the above-mentioned first end to the second end away from the above-mentioned protrusion 231, the above-mentioned first card slot 111 and the above-mentioned third card slot 113 match the above-mentioned locking part 23, and the above-mentioned second card slot 112 is used to clamp the protrusion structure at the front end of the above-mentioned locking part 23.

[0041] Figure 5 A schematic side view of a front-opening wafer transfer box according to an embodiment of the present application; Figure 6 Another schematic diagram of a top flange of a front-opening wafer transfer box according to an embodiment of the present application.

[0042] The support portion 22 is provided with a second opening 24 on a first side thereof close to the first opening 14, and the locking portion 23 is clamped to the top of the transport box body 1 along a direction from the second side away from the second opening 24 to the first side (the moving direction is as shown in FIG. Figure 6 (the direction of arrow A in the figure). Figure 6 As shown, the first side and the second side where the second opening 24 is located are two side surfaces opposite to the support part. The part of the wedge block structure away from the protrusion 231 is wider than the part close to the protrusion; the setting of the wedge block structure can better guide the locking part to insert into the slot assembly, and the second slot 112 abuts and locks the protrusion at the front end of the locking part. After the wedge block structure is locked by force, the overall force on the top flange is greater, which increases the service life of the transmission box.

[0043] In some embodiments, in the front-opening wafer pod, the angle between the first slot 111 and the third slot 113 on the horizontal plane is an acute angle. The angle between the first slot 111 and the third slot 113 is set to an acute angle, so that the slot assembly and the contact surface of the locking part are not easily disengaged, and the locking is tighter, reducing the risk of the top flange falling off.

[0044] In some embodiments, in the front-opening wafer pod, the support assembly includes a plurality of support grooves, and the plurality of support grooves are used to support the wafers. The support assembly (not marked in the figure) is disposed inside the wafer pod.

[0045] In some embodiments, Figure 5 As shown, in the front-opening wafer transfer box, a protruding buckle 12 is provided on the side of the transfer box body 1 for snapping the carrying handle 3 .

[0046] The above descriptions are only some embodiments of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solutions formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concepts. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

[0047] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A front-opening wafer transfer box, used for transporting wafers in an aerial transport system, characterized in that: include: A transmission box body, wherein a first opening is provided on one side of the transmission box body; A top flange, wherein the top flange comprises a clamping portion, a supporting portion and a locking portion, wherein the clamping portion and the locking portion are connected via the supporting portion, wherein the clamping portion extends along the circumference of the supporting portion in a direction away from the center of the supporting portion, wherein a gap is provided between the clamping portion and the locking portion, wherein the gap is used for clamping by the aerial handling system, and the locking portion is clamped to the top of the conveying box body via a card slot assembly; wherein the maximum length of the locking portion in the target direction is 50-90 mm, and the target direction refers to a direction on a horizontal plane where the locking portion is located that is parallel to a plane where the first opening is located.

2. The front-opening wafer transfer box according to claim 1, characterized in that: It also includes a door frame, the door frame is arranged on the first opening; a door panel, the door panel and the door frame are locked or unlocked by a switch structure; And a supporting component, wherein the supporting component is arranged inside the conveying box body and is used for supporting the wafer.

3. The front-opening wafer transfer box according to claim 2, characterized in that: It also includes a carrying handle, which is clamped on the side of the conveying box body. There are two carrying handles, and the two carrying handles are symmetrically arranged on both sides of the conveying box body.

4. The front-opening wafer transfer box according to claim 3, characterized in that: There are two locking parts, and the two locking parts are symmetrically arranged on both sides of the lower end of the support part; the maximum width of the locking part in the direction perpendicular to the target direction is 80-100mm.

5. The front-opening wafer transfer box according to claim 4, characterized in that: The card slot assembly matches the locking portion, and the card slot assembly includes three card slots, and gaps are arranged between the three card slots and the transmission box body.

6. The front-opening wafer transfer box according to claim 5, characterized in that: The three card slots are the first card slot, the second card slot and the third card slot. The locking portion is a wedge-shaped block structure as a whole. The locking portion is provided with a protrusion at its first end close to the first opening. The thickness of the locking portion gradually increases from the first end to the second end away from the protrusion. The first card slot and the third card slot match the locking portion, and the second card slot is used to clamp the protrusion.

7. The front-opening wafer transfer box according to claim 5, characterized in that: The support portion is provided with a second opening on a first side thereof close to the first opening, and the support portion moves along a direction from the second side away from the second opening to the first side to clamp the locking portion to the top of the transport box body.

8. The front-opening wafer transfer box according to claim 6, characterized in that: The included angle between the first card slot and the third card slot on the horizontal plane is an acute angle.

9. The front-opening wafer transfer box according to any one of claims 1 to 8, characterized in that: The clamping portion is fixedly connected to the top of the transmission box body, a threaded column is arranged on the top of the transmission box body, and a screw hole corresponding to and matching the threaded column is arranged on the clamping portion.

10. The front-opening wafer transfer box according to any one of claims 3 to 8, characterized in that: The support assembly includes multiple groups of support grooves, and the multiple groups of support grooves are used to support the wafers; a raised buckle is provided on the side of the conveying box body for clamping the carrying handle.

Images