Plastic package material rack suitable for leads with different lengths

Abstract

The utility model provides a plastic package material rack suitable for leads with different lengths, which relates to the technical field of semiconductor processing tools and comprises a frame body and a plurality of material placing pieces arranged in the frame body. The discharging part comprises a material plate and a stop block; a mounting groove is formed in the material plate; the two check blocks are installed in the corresponding installation grooves, and the discharging pieces are arranged in an axial symmetry mode. A plurality of discharging grooves in one-to-one correspondence are formed in the sides, close to each other, of every two adjacent discharging pieces; the multiple discharging grooves in the same material plate are communicated with the corresponding mounting grooves. The baffle block is movably connected with the material plate; when materials are placed, the check blocks move to the positions abutting against the semiconductor pins and are fixed to the material plate, and the problems that in the prior art, plastic packaging material frames of special specifications of products need to be used for epoxy plastic packaging of products of different models, when workers use wrong plastic packaging material frames, the products subjected to plastic packaging have the phenomena of body dislocation and long and short pins, and the product quality is affected are solved.

Description

Technical Field

[0001] The utility model relates to semiconductor processing tool technology, in particular to a plastic packaging material frame suitable for leads of different lengths. Background Art

[0002] During the processing of diodes, plastic material racks are needed to realize the plastic sealing operation of diodes.

[0003] In the prior art, in the plastic encapsulation process of diode axial products, for epoxy molding of different product models, it is necessary to use plastic encapsulation racks with product-specific specifications. When employees use the wrong plastic encapsulation racks, the molded products will have body misalignment and long and short legs, affecting product quality.

[0004] Therefore, a plastic packaging material frame suitable for leads of different lengths is proposed. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies of the prior art, the utility model provides a plastic packaging material rack suitable for leads of different lengths, solving the problem in the prior art that for epoxy packaging of products of different models, plastic packaging material racks of product-specific specifications need to be used.

[0007] (II) Technical solution

[0008] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] In the utility model, the plastic packaging material rack is used for placing diodes, and comprises a frame body and a plurality of material placing parts arranged inside the frame body;

[0010] The material placing member comprises a material plate and a stopper;

[0011] The material plate is provided with a mounting groove;

[0012] The two stoppers are installed in corresponding installation grooves, and the material discharge parts are arranged symmetrically with respect to each other.

[0013] A plurality of corresponding material discharging grooves are provided on the sides of two adjacent material discharging members close to each other;

[0014] A plurality of material discharge grooves on the same material plate are connected with corresponding installation grooves;

[0015] The stopper is movably connected to the material plate;

[0016] When the material is swung, the stopper moves to the position where it contacts the semiconductor pin and is fixed to the material plate.

[0017] Furthermore, racks are provided on the sides of the two blocks on the same material plate that are close to each other. The racks are slidably connected to the material plate through corresponding sliding grooves. A rotating part is rotatably connected to the material plate. A gear is fixedly sleeved on the rotating part, and the gear is meshed with the two racks.

[0018] Furthermore, a corresponding limiting hole is provided on one side of the stopper close to the material discharge trough.

[0019] Furthermore, a handle is provided on the side of the frame, and the movement of the frame is controlled by the handle.

[0020] Furthermore, when the material is swung, after the stopper moves to a position abutting against the semiconductor pin, the stopper is fixed to the material plate by a fixing bolt.

[0021] (III) Beneficial effects

[0022] The utility model provides a plastic packaging material frame suitable for leads of different lengths. Compared with the prior art, it has the following beneficial effects:

[0023] By setting up installation grooves and blocks and controlling the movement of the blocks inside the installation grooves, the placement of semiconductor leads of different lengths can be achieved. This solves the problem in the prior art that for epoxy molding of different types of products, it is necessary to use molding racks of product-specific specifications. When employees use the wrong molding racks, the molded products will have body misalignment and long and short legs, affecting product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A structural schematic diagram of a plastic packaging material frame suitable for leads of different lengths;

[0026] Figure 2 for Figure 1 A schematic diagram of the structure when two adjacent material plates limit the position of the diode;

[0027] Figure 3 for Figure 1 A schematic diagram of a further improved structure;

[0028] Figure 4 for Figure 3 The enlarged view of point A in the middle;

[0029] Figure 5 for Figure 3 Schematic diagram of the state structure after the two stoppers are adjusted;

[0030] Figure 6 for Figure 5 The enlarged view of point B in the middle;

[0031] Figure 7 This is a partial stereoscopic image of the stopper after improvement.

[0032] Reference numerals:

[0033] 10. Frame; 11. Handle; 20. Material discharge part; 21. Material plate; 211. Mounting groove; 212. Material discharge groove; 22. Stopper; 221. Displacement groove; 222. Limiting hole; 23. Rotating part; 231. Gear; 24. Rack; 241. Slide groove; 30. Diode. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] The embodiments of the present application provide a molding material rack suitable for leads of different lengths, thereby solving the problem in the prior art that molding material racks of product-specific specifications are required for epoxy molding of different product models. This effectively solves the problem that when employees use the wrong molding material rack, the molded products will have body misalignment and long and short leads.

[0036] The technical solution in the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0037] like Figure 1-Figure 7 As shown, by setting the installation groove and the stopper, the movement of the stopper inside the installation groove is controlled, so as to realize the placement of semiconductor leads of different lengths, thereby solving the problem in the prior art that for epoxy molding of different types of products, it is necessary to use a molding rack of product-specific specifications. When employees use the wrong molding rack, the molded products will have the problem of body misalignment and long and short legs, affecting product quality.

[0038] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] Example:

[0040] like Figure 1-Figure 2As shown, a plastic packaging material frame suitable for different length leads is used for placing diodes 30, including a frame 10 and a plurality of material placing parts 20 arranged inside the frame 10;

[0041] The material discharging member 20 includes a material plate 21 and a stopper 22;

[0042] The material plate 21 is provided with a mounting groove 211;

[0043] The two stoppers 22 are both installed in the corresponding installation grooves 211, and the material discharging member 20 is axially symmetrically arranged;

[0044] A plurality of discharge grooves 212 corresponding to each other are provided on the sides of two adjacent discharge members 20 that are close to each other;

[0045] The plurality of discharge slots 212 on the same material plate 21 are connected to the corresponding installation slots 211;

[0046] The stopper 22 is movably connected to the material plate 21;

[0047] When the material is swung, the stopper 22 moves to a position abutting against the semiconductor pins and is fixed to the material plate 21 .

[0048] Specifically, when the material is swung, after the stopper 22 moves to a position abutting against the semiconductor pin, the stopper 22 is fixed to the material plate 21 by fixing bolts.

[0049] By providing the mounting groove 211 and the stopper 22 and controlling the movement of the stopper 22 inside the mounting groove 211, the placement of semiconductor leads of different lengths can be achieved, thereby solving the problem in the prior art that for epoxy molding of different types of products, it is necessary to use molding racks of product-specific specifications. When employees use the wrong molding racks, the molded products will have body misalignment and long and short legs, affecting product quality.

[0050] A handle 11 is disposed on the side of the frame 10 , and the movement of the frame 10 is controlled by the handle 11 .

[0051] like Figure 3-Figure 6 As shown, a rack 24 is provided on the side where two blocks 22 on the same material plate 21 are close to each other. The rack 24 is slidably connected to the material plate 21 through a corresponding slide groove 241. A rotating member 23 is rotatably connected to the material plate 21. A gear 231 is fixedly sleeved on the rotating member 23, and the gear 231 is meshed with the two racks 24.

[0052] By setting a rotating part 23, a gear 231 and a rack 24, the gear 231 is rotated to drive the rack 24 to drive the two blocks 22 to move in opposite directions, thereby adjusting the length of the clearance groove 221 formed between the block 22 and the corresponding material discharge groove 212, so that the material plate 21 can be placed to meet the needs of the placement of leads of different lengths, and the material rack can be controlled to only place the same specification and the same length of leads at a time, so as to facilitate the axial plastic packaging operation of the semiconductor.

[0053] like Figure 7 As shown, a corresponding limiting hole 222 is formed on one side of the stopper 22 close to the material discharge trough 212 .

[0054] By providing the limiting hole 222, the lead wire on the diode 30 can be further limited when the material is swinging.

[0055] When in use, the diode 30 is placed in the discharge groove 212 of the adjacent material plate 21, and then the rotating member 23 is controlled to rotate. Since the gear 231 is fixedly sleeved on the rotating member 23, the rotation of the rotating member 23 can further drive the rotation of the gear 231. Since the gear 231 is engaged with the two racks 24, the rotation of the gear 231 can control the two racks 24 to slide synchronously in opposite directions, thereby adjusting the length of the give way groove 221 formed between the stop block 22 and the discharge groove 212, thereby realizing the plastic sealing operation of leads of different lengths.

[0056] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0057] 1. By setting the mounting groove 211 and the stopper 22, the stopper 22 is controlled to move inside the mounting groove 211, so as to realize the placement of semiconductor leads of different lengths, thereby solving the problem in the prior art that for epoxy molding of different types of products, it is necessary to use a molding material rack of product-specific specifications. When employees use the wrong molding material rack, the molded products will have body dislocation and long and short legs, which affects product quality.

[0058] 2. By setting a rotating part 23, a gear 231 and a rack 24, the gear 231 is rotated to drive the rack 24 to drive the two blocks 22 to move in opposite directions, thereby adjusting the length of the clearance groove 221 formed between the block 22 and the corresponding material discharge groove 212, so that the material plate 21 can be placed to meet the requirements of the placement of leads of different lengths, and the material rack can be controlled to only place the same specification and the same length of leads at a time, so as to facilitate the axial plastic sealing operation of semiconductors.

[0059] 3. By setting the limiting hole 222, the lead wire on the diode 30 can be further limited when the material is swinging.

[0060] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0061] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A plastic packaging material frame suitable for different length leads, used for placing diodes (30), characterized in that: It comprises a frame (10) and a plurality of material placing members (20) arranged inside the frame (10); The material discharging member (20) comprises a material plate (21) and a stopper (22); The material plate (21) is provided with a mounting groove (211); The two stoppers (22) are both installed in corresponding installation grooves (211), and the material discharging member (20) is axially symmetrically arranged; A plurality of material discharging grooves (212) corresponding to each other are provided on the sides of two adjacent material discharging members (20) close to each other; A plurality of material discharge grooves (212) on the same material plate (21) are connected to corresponding installation grooves (211); The stopper (22) is movably connected to the material plate (21); When the material is swinging, the stopper (22) moves to a position where it contacts the semiconductor pins and is fixed to the material plate (21).

2. A plastic packaging material frame suitable for leads of different lengths as claimed in claim 1, characterized in that: A rack (24) is provided on each side of the two stoppers (22) on the same material plate (21) that are close to each other. The rack (24) is slidably connected to the material plate (21) through a corresponding slide groove (241). A rotating member (23) is rotatably connected to the material plate (21). A gear (231) is fixedly sleeved on the rotating member (23). The gear (231) is meshed with the two racks (24).

3. A plastic packaging material frame suitable for leads of different lengths as claimed in claim 1 or 2, characterized in that: The stopper (22) is provided with corresponding limiting holes (222) on one side close to the material discharge trough (212).

4. A plastic packaging material frame suitable for leads of different lengths as claimed in claim 1, characterized in that: A handle (11) is provided on the side of the frame (10), and the movement of the frame (10) is controlled by using the handle (11).

5. A plastic packaging material frame suitable for leads of different lengths as claimed in claim 1, characterized in that: When the material is swung, after the stopper (22) moves to a position abutting against the semiconductor pin, the stopper (22) is fixed to the material plate (21) by means of a fixing bolt.

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