Material strip tool suitable for die bonder
By designing a material strip tooling suitable for the chip loader, including vacuum plates and carrier plates, the vacuum loss problem caused by the separation design between the vacuum plate and the stage during the material transfer of the chip loading equipment is solved, and the stable adsorption and efficient transmission of the material strips are achieved, and the efficiency of the chip loading and equipment stability are improved.
Patent Information
- Application Number
- CN202420234532.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-01-31
AI Technical Summary
The existing sheet loading equipment material strip transmission fixed tool design has defects in the separation design between the vacuum plate and the stage, resulting in vacuum loss and the inability to stabilize the adsorbent strips, affecting production efficiency.
Design a material strip tooling suitable for chip loaders, including vacuum plates and carrier plates. A hollow window and step are set up in the center of the carrier plate, a boss and vacuum hole are set on the vacuum plate, and corresponding air-exhaust holes are set on the back to ensure stable vacuum adaptation and avoid leakage.
Through continuous operation of multiple carrier plates, the efficiency of sheet loading is improved, the problems of vacuum adapter leakage and poor adsorption of material strips are solved, the quality and accuracy of dot glue and patches are improved, the difficulty of equipment debugging is reduced, and the stability of equipment operation is improved.
Smart Images
Figure CN222562669U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging manufacturing, and in particular relates to a material strip tooling suitable for a chip loading machine. Background Art
[0002] Plastic packaging is superior to airtight packaging in terms of size, weight, performance and cost. There are design defects in the material strip transmission and fixing tooling of the loading equipment. The vacuum plate and the carrier are generally designed to be separated. Any deformation or presence of foreign matter at the interface between the vacuum plate or the carrier will cause the loss of vacuum, resulting in the inability to stably adsorb the material strip, which is not conducive to the operational stability of the operation process, increases the difficulty of equipment debugging, and reduces production efficiency. Summary of the invention
[0003] The utility model provides a material strip tooling suitable for a film loading machine to solve the technical problems existing in the prior art.
[0004] The technical solution of the utility model is as follows: a material strip tooling suitable for a loader, comprising: a vacuum plate and a carrier plate, both sides of the carrier plate are connected to the transmission device of the loader, a hollow window is arranged in the center of the carrier plate, a step is arranged above the hollow window, the material strip is mounted on the step, the vacuum plate is mounted on the carrier of the loader, a boss is arranged on the vacuum plate, a first vacuum hole is opened on the boss, the length and width of the boss are matched with the length and width of the hollow window, and the height of the boss is greater than the height of the hollow window.
[0005] Further, the number and positions of the first vacuum holes match the number and positions of the base islands of the material strip.
[0006] Furthermore, a second vacuum hole is provided on the back side of the vacuum plate, and the second vacuum hole corresponds to the exhaust hole on the carrier of the loader.
[0007] Furthermore, two sides of the carrier are connected to the transmission device of the loader via carrier strips.
[0008] Furthermore, both sides of the carrier plate are provided with snap-in openings for the carrier plate pressure strips to snap into.
[0009] Furthermore, vacuum plate screw holes are arranged on both sides of the vacuum plate, and platform screw holes are arranged on the platform, and the vacuum plate screw holes correspond to the platform screw holes.
[0010] The beneficial effects of the utility model: the utility model can use multiple sets of carrier plates for continuous operation, effectively improving the loading efficiency. The utility model can effectively solve the problem of poor adsorption of leaking material strips in vacuum transfer by setting the vacuum plate on the carrier, effectively improving the quality and accuracy of glue dotting and patching. The utility model can reduce the difficulty of equipment debugging and improve the stability of the equipment operation process. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the structure of the vacuum plate of the utility model.
[0012] Figure 2 It is a schematic diagram of the structure of the carrier plate of the utility model.
[0013] Figure 3 It is a schematic diagram of the back side of the vacuum plate of the utility model.
[0014] Figure 4 This is a schematic diagram of the loader guide rail.
[0015] Figure 5 It is a schematic diagram of the material strip. DETAILED DESCRIPTION
[0016] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. The described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0017] In an embodiment of the present utility model, Figure 1 and Figure 2 It is a structural schematic diagram provided according to the specific structure of a material strip tooling suitable for a film loading machine of the utility model, such as Figure 1 , Figure 2 As shown, the utility model comprises: a vacuum plate and a carrier plate, both sides of which are connected to the transmission device of the wafer loading machine, as shown in FIG. Figure 4 As shown, the transmission device includes conveyor belts 1 on both sides, and the two sides of the carrier are connected to the transmission device of the loader through carrier strips 2. Specifically, the carrier strips 2 fix the carrier on the conveyor belt 1, and the two sides of the carrier are provided with slots for the carrier strips 2 to be inserted, so that the carrier strips 2 can fix the carrier on the conveyor belt, and the carrier platform 3 of the loader is located between the two conveyor belts 1.
[0018] A hollow window 14 is provided at the center of the carrier plate, a step 13 is provided above the hollow window 14 , and the material strip is mounted on the step 13 .
[0019] The vacuum plate is installed on the carrier 3 of the loader. Specifically, vacuum plate screw holes 12 are provided on both sides of the vacuum plate, and carrier screw holes 4 are provided on the carrier 3. The vacuum plate screw holes 12 correspond to the carrier screw holes 4. The vacuum plate is fixed on the carrier 3 by inserting the screws into the vacuum plate screw holes 12 and the carrier screw holes 4 in turn.
[0020] The vacuum plate is provided with a boss 10, and the boss 10 is provided with a first vacuum hole 11, which is used to absorb the material strip. To this end, the number and position of the first vacuum holes 11 match the number and position of the base island 7 of the material strip. Figure 5 shown.
[0021] like Figure 3 As shown, the back of the vacuum plate is provided with a second vacuum hole 8, which corresponds to the exhaust hole 5 on the carrier 3 of the wafer loader. By docking the exhaust hole 5 with the second vacuum hole 8, the vacuum transfer will not leak, thereby improving the adsorption effect.
[0022] The length and width of the boss are matched with the length and width of the hollow window 14. Specifically, the length and width of the boss are slightly smaller than the length and width of the hollow window 14, so that the boss 10 can move in the hollow window. The height of the boss 10 is greater than the height of the hollow window 14, ensuring that when the vacuum plate absorbs the material strip, the material strip will not be concave and cause deformation of the material strip.
[0023] When using the utility model, two vacuum plates are respectively installed on the carriers of the glue dotting station 6 and the patch station, and the carriers can move up and down under the control of the chip loading machine. The carrier strips 2 are arranged at intervals on the transmission device, and the interval between adjacent carrier strips 2 is equal to the interval between the glue dotting station 6 and the patch station. The carrier is fixed on the carrier strip 2, and the material strip is placed on the carrier, so that the material strip can be transported and moved on the transmission device. When the transmission device transmits the material strip to the glue dotting station 6, the sensor of the glue dotting station 6 senses and positions the carrier, and the carrier rises at this time. Since the carrier is fixed on the transmission device, the boss of the vacuum plate on the carrier lifts the material strip and adsorbs the material strip through the vacuum hole on the vacuum plate. The glue dotting device of the glue dotting station 6 works and performs glue dotting operation on the material strip on the current station. After the glue dispensing operation is completed, the carrier descends and returns to its initial position. The material strip is separated from the adsorption and returns to the step of the carrier. The transmission device moves the material strip to the patch station and repeats the same operation as the glue dispensing station 6 to complete the patch operation.
[0024] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to examples, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.
Claims
1. A strip tooling suitable for a wafer loading machine, characterized in that: include: A vacuum plate and a carrier plate, wherein both sides of the carrier plate are connected to a transmission device of a loader, a hollow window (14) is arranged at the center of the carrier plate, a step (13) is arranged above the hollow window (14), a material strip is mounted on the step (13), the vacuum plate is mounted on a carrier (3) of the loader, a boss (10) is arranged on the vacuum plate, a first vacuum hole (11) is opened on the boss (10), the length and width of the boss are matched with the length and width of the hollow window (14), and the height of the boss (10) is greater than the height of the hollow window (14).
2. The strip tooling for a wafer loading machine as claimed in claim 1, characterized in that: The number and position of the first vacuum holes (11) match the number and position of the base islands (7) of the material strip.
3. The strip tooling for a wafer loading machine as claimed in claim 1, characterized in that: A second vacuum hole (8) is provided on the back side of the vacuum plate, and the second vacuum hole (8) corresponds to the exhaust hole (5) on the carrier (3) of the wafer loader.
4. The strip tooling for a wafer loading machine as claimed in claim 1, characterized in that: The two sides of the carrier are connected to the transmission device of the wafer loading machine via carrier strips (2).
5. The strip tooling for a wafer loading machine as claimed in claim 4, characterized in that: Snap-in openings for the carrier strips (2) to snap into are provided on both sides of the carrier.
6. The strip tooling for a wafer loading machine as claimed in claim 1, characterized in that: Vacuum plate screw holes (12) are provided on both sides of the vacuum plate, and a carrier screw hole (4) is provided on the carrier (3), and the vacuum plate screw hole (12) corresponds to the carrier screw hole (4).