Power strip with active heat dissipation function

Abstract

The utility model provides a power strip with an active heat dissipation function, and relates to the technical field of power strips. The power strip comprises a shell, a cooling fan and a circuit board module, wherein the cooling fan and the circuit board module are arranged in the shell; an air inlet part and an air outlet part are arranged on the shell, and the cooling fan comprises an air inlet side and an air outlet side; the distance between the air inlet side and the air inlet part is larger than the distance between the air outlet side and the air outlet part, and the air outlet side is attached to the air outlet part. The circuit board module comprises a plurality of circuit boards, and each circuit board is arranged on one side of the thickness direction of the circuit board and faces a hollow part. The cooling fan extracts air in the shell, so that the air in the shell including corners and cracks is extracted out of the shell from the air outlet part, meanwhile, the air near the air inlet part continuously flows into the shell due to the change of the air pressure in the shell, and along with the continuous flowing-in and flowing-out of the air, the air in the shell is discharged out of the shell. And uniform heat dissipation of the interior of the shell is realized.

Description

Technical Field

[0001] The present application relates to the technical field of socket strips, and in particular to a socket strip with an active heat dissipation function. Background Art

[0002] When a power strip is connected to multiple electrical devices, the internal electronic components will generate heat. If the heat is not dissipated, the stability and service life of the electronic components may be affected. Therefore, the power strip needs to be heat-dissipated.

[0003] Existing power strips mostly use heat-conducting materials to dissipate heat for the power strips, for example, a heat sink made of copper or aluminum is installed inside the power strip. Since the space inside the power strip is limited and the metal heat sink has a certain weight, the heat sink can only be installed on some electronic devices, so only local heat dissipation can be achieved, resulting in unsatisfactory heat dissipation effect and heat dissipation efficiency. Utility Model Content

[0004] The purpose of the present application is to overcome the defects of the prior art and provide a socket strip with active heat dissipation function to solve the problems in the prior art.

[0005] To solve the above problems, an embodiment of the present application provides a socket strip with active heat dissipation function, comprising a housing, a heat dissipation fan and a circuit board module, wherein the heat dissipation fan and the circuit board module are both arranged inside the housing;

[0006] The shell is provided with an air inlet and an air outlet, and the heat dissipation fan includes an air inlet side and an air outlet side; the distance between the air inlet side and the air inlet is greater than the distance between the air outlet side and the air outlet, and the air outlet side is attached to the air outlet; wherein the air inlet is used for supplying air outside the shell to enter the shell, and the air outlet is used for supplying air inside the shell to be discharged outside the shell;

[0007] The circuit board module includes a plurality of circuit boards, each of which is disposed on one side of its thickness direction facing a hollow portion, and the air inlet portion and the air inlet side also face the hollow portion.

[0008] In a possible implementation manner, the housing includes a first component, and the air inlet is disposed on the first component;

[0009] The first component is detachably provided with a cover body, the cover body is spaced apart from the first component body, and the cover body is located outside the shell;

[0010] A plurality of support pads are arranged on one side of the cover body facing the first component; the support pads are arranged in sequence along the circumference of the cover body, and adjacent support pads are arranged at intervals.

[0011] In a possible implementation manner, a convex edge is arranged around the outer periphery of the first component, and the convex edge is raised in a direction opposite to the side where the hollow portion is located;

[0012] A concave cavity is formed inside the convex edge, and a partition is arranged in the concave cavity; the partition is located between the cover body and the first component, and the cover body and the partition are arranged at a distance, wherein the support pad is supported on the partition;

[0013] The partition is provided with a first vent portion, the first vent portion is communicated with the air inlet portion, wherein the first vent portion is used for allowing air to pass through.

[0014] In a possible implementation manner, a plurality of convex ribs are arranged in the concave cavity, and the convex ribs are arranged in sequence along the circumference of the concave cavity; the convex ribs are partially connected to the first component part, and partially connected to the convex edge;

[0015] A surrounding portion is arranged around the outer periphery of the partition; the cover body is located inside the surrounding portion and the cover body and the surrounding portion are spaced apart; the surrounding portion includes a first outer side surface and a second outer side surface, and the angle between the first outer side surface and the second outer side surface is an advantageous angle; wherein the first outer side surface is in contact with the inner wall of the convex edge, and the second outer side surface is in contact with the convex rib.

[0016] In a possible implementation, the circuit board module includes a first circuit board provided with a second vent, the second vent is used for allowing air to pass through; wherein one side of the first circuit board faces the first component, and the other side faces the hollow portion, and the first circuit board is spaced apart from the first component;

[0017] A switch module is arranged on the first circuit board, and a button for controlling the switch module is arranged on the cover.

[0018] In a possible implementation manner, the circuit board module further includes a second circuit board; wherein, along the first preset direction, the first circuit board and the second circuit board are disposed on two sides of the hollow portion;

[0019] One side of the second circuit board faces the hollow portion, and the other side is provided with a socket module for transmitting AC power, wherein the second circuit board is electrically connected to the socket module;

[0020] A transformer and a rectifier are disposed on the second circuit board, wherein the transformer and the rectifier are both located on a side of the second circuit board facing the hollow portion.

[0021] In a possible implementation manner, the circuit board module further includes a third circuit board, wherein the third circuit board is arranged between the first circuit board and the second circuit board, and the air intake side faces the third circuit board;

[0022] A screen and an interface module are arranged on a side of the third circuit board facing away from the hollow portion, wherein the interface module is used to transmit signals and electric energy.

[0023] In a possible implementation manner, the housing is detachably provided with a first cover plate and a second cover plate;

[0024] The first cover plate includes a transparent portion and a through hole, wherein the screen faces the transparent portion, and the through holes correspond to the interface modules one by one, wherein the through holes are directly opposite to the corresponding interface modules;

[0025] The air outlet is arranged on the second cover plate, wherein the heat dissipation fan is installed on the second cover plate.

[0026] In a possible embodiment, a first connecting plate and a second connecting plate are arranged between the first circuit board and the second circuit board, and the first circuit board, the second circuit board and the third circuit board are all detachably connected to the first connecting plate and the second connecting plate; wherein, along the second preset direction, the first connecting plate and the second connecting plate are disposed on both sides of the hollow portion; and the first preset direction and the second preset direction are perpendicular to each other.

[0027] In a possible embodiment, a temperature detection module is provided inside the shell, and the temperature detection module and the cooling fan are both electrically connected to a control module, wherein the temperature detection module is used to detect the internal temperature of the shell and generate a temperature signal, and the control module is used to control the start and stop and the speed of the cooling fan according to the received temperature signal.

[0028] The beneficial effects of this application include:

[0029] The plug strip with active heat dissipation function proposed in the present application includes a shell, a heat dissipation fan and a circuit board module, and the heat dissipation fan and the circuit board module are both arranged inside the shell. An air inlet and an air outlet are arranged on the shell, and the heat dissipation fan includes an air inlet side and an air outlet side, wherein, since the distance between the air inlet side and the air inlet is greater than the distance between the air outlet side and the air outlet, and the air outlet side is attached to the air outlet, when the heat dissipation fan is started and performs heat dissipation work, the heat dissipation fan will extract the air inside the shell, so that the air inside the shell including the corners and the gaps is extracted from the air outlet to the outside of the shell, and at the same time, the air near the air inlet will continuously flow into the shell due to the change of the air pressure inside the shell, wherein, with the continuous inflow and outflow of air, uniform heat dissipation of the inside of the shell is achieved.

[0030] The circuit board module includes a plurality of circuit boards, each of which is arranged with one side in the thickness direction thereof facing a hollow portion, so that the surface area of ​​each circuit board facing the hollow portion is larger, thereby facilitating the heat dissipation of the circuit board. The air inlet and the air inlet side are also facing the hollow portion, and such an arrangement is conducive to the flow of air, so that the flowing air can fully flow through each circuit board, thereby improving the heat dissipation efficiency and achieving uniform heat dissipation of each circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of a socket strip with active heat dissipation function is shown;

[0033] Figure 2 Shows Figure 1 Exploded diagram of the middle socket strip;

[0034] Figure 3 A schematic diagram of a housing is shown;

[0035] Figure 4 A schematic diagram showing a housing, a cover and a partition after assembly;

[0036] Figure 5 Shows Figure 4 Explosion diagram of

[0037] Figure 6 Shows Figure 4 A top view of

[0038] Figure 7 Shows Figure 6 Sectional view along the NN axis;

[0039] Figure 8 Shows Figure 7 A partial enlarged view of the

[0040] Fig. 9 A view of a cover is shown;

[0041] Fig.10 A schematic diagram of a baffle is shown;

[0042] Fig.11 Shows Fig.10 Front view of the middle partition;

[0043] Fig.12 A first schematic diagram of a circuit board module is shown;

[0044] Fig.13 Shows Fig.12 A second schematic diagram of the circuit board module;

[0045] Fig.14 A schematic diagram of a first cover plate is shown;

[0046] Fig.15 A first schematic diagram of a second cover plate is shown;

[0047] Fig.16 Shows Fig.15 a second schematic diagram of a second cover plate;

[0048] Fig.17 A connection block diagram of a cooling fan, a temperature detection module and a control module is shown.

[0049] Description of main component symbols:

[0050] 100-shell; 101-air inlet; 102-air outlet; 103-hollow portion; 110-first component; 1101-clamping hole; 1102-first positioning hole; 1103-second positioning hole; 1104-convex edge; 1105-concave cavity; 11051-convex rib; 111-cover; 1111-buckle; 1112-support pad; 1113-positioning column; 11131-first column; 11132-second column; 1114-positioning foot; 1115-button; 112-partition; 1121-first ventilation portion; 1122-surrounding portion; 11221-first outer side surface; 11222-second outer side surface; 1123-first perforation; 1124-second Perforation; 1125-third perforation; 120-second component; 130-third component; 140-base; 150-first cover; 151-transparent part; 152-through hole; 160-second cover; 161-groove; 200-cooling fan; 300-circuit board module; 301-socket module; 302-power supply line; 310-first circuit board; 311-second ventilation part; 312-switch module; 320-second circuit board; 321-transformer; 322-rectifier; 330-third circuit board; 331-screen; 332-interface module; 340-first connecting board; 350-second connecting board; 410-temperature detection module; 420-control module. DETAILED DESCRIPTION

[0051] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0052] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0053] Example

[0054] See also Figure 1 In this embodiment, a socket strip with active heat dissipation function is proposed.

[0055] like Figure 2 As shown, the power strip includes a housing 100, a cooling fan 200 and a circuit board module 300, and the cooling fan 200 and the circuit board module 300 are both arranged inside the housing 100. The frame and blades of the cooling fan 200 can be made of lightweight materials such as plastic, thereby reducing the weight of the cooling fan 200.

[0056] The housing 100 is provided with an air inlet 101 and an air outlet 102, and the heat dissipation fan 200 includes an air inlet side and an air outlet side. In the figure, the side indicated by arrow a is the air inlet side, and the side indicated by arrow b is the air outlet side.

[0057] The distance between the air inlet side and the air inlet portion 101 is greater than the distance between the air outlet side and the air outlet portion 102, and the air outlet side is attached to the air outlet portion 102. The distance between the air inlet side and the air inlet portion 101 is greater than the distance between the air outlet side and the air outlet portion 102, which can be understood as the distance between the geometric centers of the air inlet side and the air inlet portion 101 is greater than the distance between the geometric centers of the air outlet side and the air outlet portion.

[0058] The air inlet 101 is used to allow air outside the housing 100 to enter the housing 100 , and the air outlet 102 is used to allow air inside the housing 100 to be discharged outside the housing 100 .

[0059] When the heat dissipation fan 200 is started and performs heat dissipation work, air will flow, wherein the air will flow through the air inlet 101, the inside of the housing 100, the air inlet side, the air outlet side and the air outlet 102 in sequence. Specifically, the heat dissipation fan 200 will extract the air inside the housing 100, so that the air inside the housing 100 including the corners and the gaps will be extracted from the air outlet 102 to the outside of the housing 100. At the same time, the air near the air inlet 101 will continuously flow into the inside of the housing 100 due to the change of the air pressure inside the housing 100. With the continuous inflow and outflow of air, uniform heat dissipation inside the housing 100 is achieved.

[0060] Reference Figure 2 In the present embodiment, the circuit board module 300 includes a plurality of circuit boards, each of which is disposed on one side in its thickness direction facing a hollow portion 103, so that the surface area of ​​each circuit board facing the hollow portion 103 is larger. Thus, when the cooling fan 200 is working, the flowing air is conducive to taking away the heat on the circuit board, thereby improving the heat dissipation effect and efficiency of the circuit board.

[0061] In order to facilitate the flow of air, the air inlet 101 and the air inlet side are also oriented toward the hollow part 103. Such an arrangement is conducive to the flow of air, thereby further improving the efficiency of heat dissipation. The air flowing in from the air inlet 101 will directly flow into the hollow part 103 and flow to the air inlet side. In this process, the air fully flows through each circuit board, thereby taking away the heat on each circuit board, thereby achieving the purpose of improving the efficiency of heat dissipation and realizing uniform heat dissipation of each circuit board.

[0062] like Figure 3 As shown, in this embodiment, the housing 100 includes a first component 110, and the air inlet 101 is disposed on the first component 110. The air inlet 101 includes a plurality of hole structures, wherein the number and shape of the hole structures can be set as required, for example, the air inlet hole can be in the shape of a strip, a circle, an ellipse, a waist or other regular or irregular shapes. In this embodiment, the hole structure of the air inlet 101 is in the shape of a strip.

[0063] like Figures 4 to 8 As shown, a cover 111 is detachably provided on the first component 110, the cover 111 is spaced apart from the first component 110, and the cover 111 is located outside the housing 100. The cover 111 is spaced apart from the first component 110, so that air can flow to the air inlet 101 through the space between the cover 111 and the first component 110.

[0064] The cover 111 and the first component 110 can be detachably connected by snapping, the cover 111 is provided with a snap 1111, the first component 110 is provided with a snap hole 1101 corresponding to the snap 1111, and the snap 1111 is inserted into the corresponding snap hole 1101 to achieve snap connection. In some other embodiments, the cover 111 and the first component 110 can also be connected by screw connection, magnetic connection, etc.

[0065] like Fig. 9 As shown, a plurality of support pads 1112 are disposed on one side of the cover body 111 facing the first component 110 . The support pads 1112 are sequentially disposed along the circumference of the cover body 111 , and adjacent support pads 1112 are disposed at intervals.

[0066] The support pads 1112 support the cover 111 and also allow the cover 111 to maintain a gap with the first component 110, thereby preventing the air inlet 101 from being blocked and affecting the inflow of air. The gaps between adjacent support pads 1112 are used for air flow, thereby allowing the air outside the housing 100 to flow to the air inlet 101 through the gaps between the support pads 1112.

[0067] In this embodiment, a positioning structure is provided on the cover 111. When the cover 111 is assembled with the housing 100, the positioning structure can realize the positioning between the cover 111 and the first component 110. The positioning structure includes a positioning column 1113 and a positioning foot 1114 with an arc. The number and position of the positioning column 1113 and the positioning foot 1114 can be set as needed. Figures 3 to 9 As shown, in order to cooperate with the cover body 111, a matching structure is provided on the first component 110, wherein the matching structure includes a first positioning hole 1102 and a second positioning hole 1103, the first positioning hole 1102 corresponds one-to-one with the positioning column 1113, and the second positioning hole 1103 corresponds one-to-one with the positioning foot 1114, wherein the first positioning hole 1102 is used for inserting the positioning column 1113, and the second positioning hole 1103 is used for inserting the positioning foot 1114.

[0068] Reference Figures 3 to 8 As shown, a convex edge 1104 is arranged around the outer periphery of the first component 110, wherein the convex direction of the convex edge 1104 is opposite to the side where the hollow portion 103 is located. A concave cavity 1105 is formed inside the convex edge 1104, and a partition 112 is arranged inside the concave cavity 1105. The partition 112 is located between the cover body 111 and the first component 110, and the cover body 111 and the partition 112 are arranged at intervals, wherein the support pad 1112 is supported on the partition 112. Under the action of the support pad 1112, the cover body 111 is supported on the partition 112, and the cover body 111 and the partition 112 are kept at an interval, thereby ensuring that air can flow smoothly between the cover body 111 and the partition 112.

[0069] In order to allow air to flow into the air inlet 101, a first vent 1121 is provided on the partition 112, and the first vent 1121 is connected to the air inlet 101, wherein the first vent 1121 is used to allow air to pass through. The first vent 1121 includes a plurality of hole structures, and the hole structures of the first vent 1121 can correspond to the hole structures of the air inlet 101 one by one and are connected to each other. It should be noted that after the cover 111 and the partition 112 are assembled, the support pad 1112 on the cover 111 and the first vent 1121 on the partition 112 are staggered with each other, thereby preventing the support pad 1112 from being inserted into or covering the first vent 1121. In this way, on the one hand, the support effect of the support pad 1112 on the cover 111 can be ensured, and on the other hand, the first vent 1121 can be prevented from being blocked and affecting the circulation of air.

[0070] like Figure 3As shown, in order to support and position the partition 112, a plurality of convex ribs 11051 are provided in the cavity 1105, and the convex ribs 11051 are sequentially arranged along the circumference of the cavity 1105, wherein the convex ribs 11051 are partially connected to the first component 110, and partially connected to the convex edge 1104. In this embodiment, the first component 110, the convex edge 1104 and the convex ribs 11051 can be an integrated structure, for example, plastic can be used and the three can be integrally formed by a process such as injection molding.

[0071] like Fig.10 and Fig.11 As shown, a surrounding portion 1122 is arranged around the outer periphery of the partition 112, the cover body 111 is located inside the surrounding portion 1122, and the cover body 111 and the surrounding portion 1122 are arranged at intervals. The surrounding portion 1122 includes a first outer side surface 11221 and a second outer side surface 11222, and the angle between the first outer side surface 11221 and the second outer side surface 11222 is a reflex angle. Among them, the first outer side surface 11221 is in contact with the inner wall of the convex edge 1104, and the second outer side surface 11222 is in contact with the convex rib 11051, thereby achieving the positioning and support of the partition 112. The reflex angle refers to an angle greater than 180° and less than 360°.

[0072] In this embodiment, a first perforation 1123, a second perforation 1124 and a third perforation 1125 are provided on the partition 112. When the partition 112 and the shell 100 are assembled, the first perforation 1123 is opposite to the first positioning hole 1102, the second perforation 1124 is opposite to the second positioning hole 1103, and the third perforation 1125 is opposite to the snap-fit ​​hole 1101, wherein the first perforation 1123 is used for the positioning column 1113 to pass through, the second perforation 1124 is used for the positioning foot 1114 to pass through, and the third perforation 1125 is used for the buckle 1111 to pass through.

[0073] like Fig. 9 As shown, the positioning column 1113 includes a first column 11131 and a second column 11132 which are coaxially arranged, wherein the first column 11131 is connected to the cover 111, and the outer diameter of the first column 11131 is larger than the outer diameter of the second column 11132. In order to achieve position limiting, the inner diameter of the first through hole 1123 is larger than the outer diameter of the second column 11132, and smaller than the outer diameter of the first column 11131, so that when assembling, the second column 11132 passes through the first through hole 1123 and is inserted into the first positioning hole 1102, and the lower end surface of the second column 11132 will be attached to the partition 112 to play a role of position limiting, and realize the support of the cover 111 to ensure that the cover 111 and the partition 112 are kept apart.

[0074] Most of the electronic components inside the housing 100 are mounted on the circuit board module 300. The circuit board module 300 is described below. The circuit boards of the circuit board module 300 can be electrically connected in sequence to achieve signal and power transmission. Connectors can be provided on the circuit boards, and the two connectors can be connected by structures such as cables, so that electrical connection between the circuit boards can be achieved.

[0075] like Fig.12 and Fig.13 As shown, the circuit board module 300 includes a first circuit board 310 provided with a second vent 311, and the second vent 311 is used for air to pass through. One side of the first circuit board 310 faces the first component 110, and the other side faces the hollow portion 103, and the first circuit board 310 is spaced apart from the first component 110. The second vent 311 includes a plurality of hole structures. It should be noted that the hole structure of the second vent 311 needs to avoid the circuits and electronic components of the first circuit board 310.

[0076] In order to control the switch of the power strip, a switch module 312 is disposed on the first circuit board 310 , wherein a button 1115 for controlling the switch module 312 is disposed on the cover body 111 .

[0077] like Fig.12 and Fig.13 As shown, the circuit board module 300 further includes a second circuit board 320. In the first preset direction, the first circuit board 310 and the second circuit board 320 are disposed on both sides of the hollow portion 103. The direction indicated by the arrow x in the figure is the first preset direction.

[0078] One side of the second circuit board 320 faces the hollow portion 103, and the other side is provided with a socket module 301 for transmitting AC power, wherein the second circuit board 320 is electrically connected to the socket module 301. The socket module 301 is connected to a power supply line 302. The structure of the socket module 301 can refer to the existing design and will not be described in detail herein.

[0079] The second circuit board 320 is provided with a transformer 321 and a rectifier 322, wherein the transformer 321 and the rectifier 322 are both located on the side of the second circuit board 320 facing the hollow portion 103. The second circuit board 320 is electrically connected to the socket module 301, and the socket module 301 transmits the mains power to the circuit board, and a direct current of a corresponding voltage can be obtained through the transformer 321 and the rectifier 322, wherein the direct current is transmitted to other circuit boards in the circuit board module 300 through the second circuit board 320 to realize power supply to the corresponding electronic components.

[0080] like Fig.12 and Fig.13As shown, the circuit board module 300 further includes a third circuit board 330 , wherein the third circuit board 330 is disposed between the first circuit board 310 and the second circuit board 320 , and the air intake side faces the third circuit board 330 .

[0081] The third circuit board 330 is provided with a screen 331 and an interface module 332 on one side facing away from the hollow portion 103, wherein the interface module 332 is used to transmit signals and electric energy. The screen 331 can display information such as the output power of the power strip and the speed of the cooling fan 200. The interface module 332 includes a USB2.0 interface and a USB3.0 interface, thereby enabling charging of electronic devices such as mobile phones, computers, and tablets.

[0082] Reference Figure 2 In this embodiment, the housing 100 is detachably provided with a first cover plate 150 and a second cover plate 160. The first cover plate 150 and the second cover plate 160 can be connected to the housing 100 by means of snap connection, screw connection, magnetic connection, etc.

[0083] like Fig.14 As shown, the first cover plate 150 includes a transparent portion 151 and a through hole 152, wherein the screen 331 faces the transparent portion 151, and the through hole 152 corresponds to the interface module 332 one by one, wherein the through hole 152 is directly opposite to the corresponding interface module 332. The first cover plate 150 can be made of a transparent material as a whole, such as transparent glass or transparent plastic. The third circuit board 330 can be fixedly connected to the first cover plate 150 by screw connection or the like.

[0084] like Fig.15 and Fig.16 As shown, the air outlet portion 102 is disposed on the second cover plate 160, wherein the heat dissipation fan 200 is installed on the second cover plate 160. The air outlet portion 102 includes a plurality of hole structures.

[0085] A groove 161 may be provided on one side of the second cover plate 160 facing the heat dissipation fan 200, wherein the air outlet side of the heat dissipation fan 200 is inserted into the groove 161. The heat dissipation fan 200 is positioned between the second cover plate 160 by the cooperation between the groove 161 and the heat dissipation fan 200. In order to fix the heat dissipation fan 200, the heat dissipation fan 200 and the second cover plate 160 may be fixedly connected by screw connection. A circuit board in the circuit board module 300 is electrically connected to the heat dissipation fan 200, thereby realizing power supply to the heat dissipation fan 200.

[0086] Reference Figure 2 and Figure 3, the housing 100 further includes a second component 120, a third component 130 and a base 140. In the direction shown in the figure, the first component 110 is located at the top of the housing 100, the second component 120 and the third component 130 are both connected to the first component 110 and are disposed on the same side of the first component 110, and the first component 110 and the base 140 are disposed on both sides of the height direction of the housing 100, wherein the first component 110, the second component 120, the third component 130 and the base 140 may be integrated. In the circumferential direction along the first component 110, the first cover 111, the second component 120, the second cover 111 and the third component 130 are disposed in sequence.

[0087] In order to support and fix the first circuit board 310, the second circuit board 320 and the third circuit board 330, a first connecting plate 340 and a second connecting plate 350 are arranged between the first circuit board 310 and the second circuit board 320, and the first circuit board 310, the second circuit board 320 and the third circuit board 330 are all detachably connected to the first connecting plate 340 and the second connecting plate 350. For example, a plurality of plug holes are arranged on the first circuit board 310, and plug parts are arranged on the first connecting plate 340 and the second connecting plate 350, wherein the plug parts on the first connecting plate 340 and the second connecting plate 350 are respectively inserted into the corresponding plug holes on the first circuit board 310, and the plug parts are interference fit with the plug holes, thereby realizing the connection between the first circuit board 310 and the first connecting plate 340 and the second connecting plate 350.

[0088] In addition, the housing 100 may be provided with protruding structures such as ribs to position and support the first circuit board 310, the second circuit board 320, and / or the third circuit board 330. Furthermore, the first circuit board 310, the second circuit board 320, and / or the third circuit board 330 may be connected to the housing 100 by means of screw connection or the like.

[0089] Reference Fig.13 In this embodiment, along the second preset direction, the first connecting plate 340 and the second connecting plate 350 are disposed on both sides of the hollow portion 103. The first preset direction and the second preset direction are perpendicular to each other. The direction indicated by the arrow y in the figure is the second preset direction.

[0090] In some embodiments, the first connecting board 340 and the second connecting board 350 are also circuit boards and belong to the circuit board module 300 .

[0091] In order to detect the temperature inside the housing 100, a temperature detection module 410 is provided inside the housing 100. The temperature detection module 410 can detect the temperature of electronic devices with high heat generation or temperature sensitivity inside the housing 100, or detect the temperature of the hollow part 103. Specifically, the temperature of a specific device or position can be detected as needed.

[0092] The temperature detection module 410 may adopt a temperature sensor.

[0093] like Fig.17 As shown, the temperature detection module 410 and the cooling fan 200 are both electrically connected to a control module 420, and the control module 420 can be a microprocessor or a single-chip microcomputer. Among them, the temperature detection module 410 is used to detect the internal temperature of the housing 100 and generate a temperature signal, and the control module 420 is used to control the start and stop and speed of the cooling fan 200 according to the received temperature signal. For example, when the temperature detected by the temperature detection module 410 is higher than 50°C, the control module 420 controls the cooling fan 200 to start; when the detected temperature exceeds 60°C, the control module 420 controls the cooling fan 200 to increase the speed so that the detected temperature does not exceed 60°C. The above is only an example, and how the control module 420 controls the cooling fan 200 can be set according to actual needs.

[0094] The socket strip with active heat dissipation function proposed in the present application extracts air from the housing 100 through the heat dissipation fan 200, so that the air inside the housing 100, including the corners and gaps, is extracted from the air outlet 102 to the outside of the housing 100, thereby achieving uniform heat dissipation inside the housing 100. In addition, by setting the positions of each circuit board in the circuit board module 300 accordingly, the surface area of ​​each circuit board facing the hollow part 103 is larger, which is beneficial to the heat dissipation of the circuit board. The socket strip has the advantages of strong heat dissipation effect and high heat dissipation efficiency.

[0095] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0096] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A socket strip with active heat dissipation function, characterized in that: It comprises a housing, a heat dissipation fan and a circuit board module, wherein the heat dissipation fan and the circuit board module are both arranged inside the housing; The shell is provided with an air inlet and an air outlet, and the heat dissipation fan includes an air inlet side and an air outlet side; the distance between the air inlet side and the air inlet is greater than the distance between the air outlet side and the air outlet, and the air outlet side is attached to the air outlet; wherein the air inlet is used for supplying air outside the shell to enter the shell, and the air outlet is used for supplying air inside the shell to be discharged outside the shell; The circuit board module includes a plurality of circuit boards, each of which is disposed on one side of its thickness direction facing a hollow portion, and the air inlet portion and the air inlet side also face the hollow portion.

2. The socket strip with active heat dissipation function according to claim 1, characterized in that: The housing includes a first component, and the air inlet is arranged on the first component; The first component is detachably provided with a cover body, the cover body is spaced apart from the first component body, and the cover body is located outside the shell; A plurality of support pads are arranged on one side of the cover body facing the first component; the support pads are arranged in sequence along the circumference of the cover body, and adjacent support pads are arranged at intervals.

3. The socket strip with active heat dissipation function according to claim 2, characterized in that: A convex edge is arranged around the outer periphery of the first component, and the convex edge is convexly directed away from the side where the hollow portion is located; A concave cavity is formed inside the convex edge, and a partition is arranged in the concave cavity; the partition is located between the cover body and the first component, and the cover body and the partition are arranged at a distance, wherein the support pad is supported on the partition; The partition is provided with a first vent portion, the first vent portion is communicated with the air inlet portion, wherein the first vent portion is used for allowing air to pass through.

4. The socket strip with active heat dissipation function according to claim 3, characterized in that: A plurality of convex ribs are arranged in the concave cavity, and the convex ribs are arranged in sequence along the circumference of the concave cavity; the convex ribs are partially connected to the first component part, and partially connected to the convex edge; A surrounding portion is arranged around the outer periphery of the partition; the cover body is located inside the surrounding portion and the cover body and the surrounding portion are spaced apart; the surrounding portion includes a first outer side surface and a second outer side surface, and the angle between the first outer side surface and the second outer side surface is an advantageous angle; wherein the first outer side surface is in contact with the inner wall of the convex edge, and the second outer side surface is in contact with the convex rib.

5. The socket strip with active heat dissipation function according to claim 2, characterized in that: The circuit board module comprises a first circuit board provided with a second vent, the second vent is used for air to pass through; wherein one side of the first circuit board faces the first component, the other side faces the hollow part, and the first circuit board is spaced apart from the first component; A switch module is arranged on the first circuit board, and a button for controlling the switch module is arranged on the cover.

6. The socket strip with active heat dissipation function according to claim 5, characterized in that: The circuit board module further includes a second circuit board; wherein, along a first preset direction, the first circuit board and the second circuit board are disposed on two sides of the hollow portion; One side of the second circuit board faces the hollow portion, and the other side is provided with a socket module for transmitting AC power, wherein the second circuit board is electrically connected to the socket module; A transformer and a rectifier are disposed on the second circuit board, wherein the transformer and the rectifier are both located on a side of the second circuit board facing the hollow portion.

7. The socket strip with active heat dissipation function according to claim 6, characterized in that: The circuit board module further includes a third circuit board, wherein the third circuit board is arranged between the first circuit board and the second circuit board, and the air intake side faces the third circuit board; A screen and an interface module are arranged on a side of the third circuit board facing away from the hollow portion, wherein the interface module is used to transmit signals and electric energy.

8. The socket strip with active heat dissipation function according to claim 7, characterized in that: The housing is detachably provided with a first cover plate and a second cover plate; The first cover plate includes a transparent portion and a through hole, wherein the screen faces the transparent portion, and the through holes correspond to the interface modules one by one, wherein the through holes are directly opposite to the corresponding interface modules; The air outlet is arranged on the second cover plate, wherein the heat dissipation fan is installed on the second cover plate.

9. The socket strip with active heat dissipation function according to claim 7, characterized in that: A first connecting plate and a second connecting plate are arranged between the first circuit board and the second circuit board, and the first circuit board, the second circuit board and the third circuit board are all detachably connected to the first connecting plate and the second connecting plate; wherein, along the second preset direction, the first connecting plate and the second connecting plate are arranged on both sides of the hollow portion; and the first preset direction and the second preset direction are perpendicular to each other.

10. The socket strip with active heat dissipation function according to claim 1, characterized in that: A temperature detection module is provided inside the shell, and the temperature detection module and the cooling fan are both electrically connected to a control module, wherein the temperature detection module is used to detect the internal temperature of the shell and generate a temperature signal, and the control module is used to control the start and stop and the speed of the cooling fan according to the received temperature signal.

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