Cascade boost circuit and photovoltaic power generation and air energy heat pump integrated system

Abstract

The utility model provides a cascade boost circuit and a photovoltaic power generation and air energy heat pump integrated system, and relates to the technical field of photovoltaic power generation. The cascade boost circuit comprises a Boost circuit and a synchronous Boost circuit, the Boost circuit and the synchronous Boost circuit are connected through a common first protection module, the Boost circuit is used for converting input low voltage into medium voltage and outputting the medium voltage to the synchronous Boost circuit, and the synchronous Boost circuit is used for outputting the medium voltage to the synchronous Boost circuit. The first protection module is used for stabilizing the medium voltage output by the Boost circuit and improving the stability of the Boost circuit and the synchronous Boost circuit; and the synchronous Boost circuit is used for boosting the medium voltage to a high voltage so as to transmit the high voltage to an electric component to provide the required voltage. Through the circuit, the duty ratio of the circuit is reduced, and the condition that the service life of the circuit is shortened due to temperature rise and excessive loss of the IGBT is prevented.

Description

Technical Field

[0001] The present application belongs to the technical field of photovoltaic power generation, and specifically relates to a cascade boost circuit and an integrated system of photovoltaic power generation and air energy heat pump. Background Art

[0002] Solar photovoltaic power generation, as a green renewable energy source, is gaining more and more attention. Before the low voltage output by the photovoltaic power generation component is transmitted to the required electrical devices, it needs to be boosted by other modules before being transmitted.

[0003] In the prior art, boost circuits are often used in the above environment. The low voltage output by the photovoltaic power generation component is boosted by the boost circuit and then output to the required electrical devices or systems. However, the duty cycle of the boost circuit is relatively large, which causes the temperature rise and loss of the IGBT device to be relatively large. Utility Model Content

[0004] In order to solve the above problems in the prior art, the present application provides a cascade boost circuit and an integrated system of photovoltaic power generation and air energy heat pump.

[0005] In a first aspect, the present application provides a cascade boost circuit, the circuit comprising: a Boost boost circuit and a synchronous Boost boost circuit, wherein:

[0006] The Boost circuit and the synchronous Boost circuit are connected via a common first protection module;

[0007] The Boost circuit is used to convert the input low voltage into a medium voltage and output it to the synchronous Boost circuit;

[0008] The first protection module is used to stabilize the medium voltage output by the Boost circuit and improve the stability of the Boost circuit and the synchronous Boost circuit;

[0009] The synchronous Boost circuit is used to increase the medium voltage to a high voltage so as to provide the required voltage to the power-consuming components.

[0010] In a possible implementation manner, the Boost circuit further includes a preprocessing module and a first boost module, wherein:

[0011] The pre-processing module is used to stabilize the input low voltage and monitor the input current to prevent the input current from being too large and damaging the circuit;

[0012] The first boost module is used to boost the stabilized low voltage to the medium voltage.

[0013] In a possible implementation manner, the pre-processing module comprises a fuse (1), a first current sensor (2) and a first supporting capacitor (3), wherein:

[0014] The input end of the fuse (1) is connected to the low-voltage terminal DC+, the output end is connected to the input end of the first current sensor (2), and the output end of the first current sensor (2) is connected to the first end of the first supporting capacitor (3) via a first node a;

[0015] The pre-processing module and the first protection module are connected via the first node a, and the second end of the first supporting capacitor (3) is connected to the low-voltage terminal DC-.

[0016] In a possible implementation manner, the first boost module comprises: a first reactor (4), a first IGBT (5), a diode (6) and a first absorption capacitor (7), wherein:

[0017] The first end of the first reactor (4) is connected to the pre-processing module via the first node a, and the second end of the first reactor (4) is connected to the collector of the first IGBT (5) via the second node b and the anode of the diode (6);

[0018] The cathode of the diode (6) is connected to the first end of the first absorption capacitor (7) via a third node c, and the first boost module is connected to the first protection module via the third node c;

[0019] The second end of the first absorption capacitor (7) and the emitter of the first IGBT (5) are both connected to the low-voltage terminal DC-.

[0020] In a possible implementation, the synchronous Boost circuit further includes a collection module, a second boost module and a second protection module, wherein:

[0021] The acquisition module is used to acquire the current flowing through the synchronous Boost circuit;

[0022] The second boost module is used to increase the medium voltage output by the Boost circuit to a high voltage;

[0023] The second protection module is used to stabilize the high voltage output by the second boost module and protect the circuit safety of the synchronous Boost circuit.

[0024] In a possible implementation manner, the acquisition module comprises a second current sensor (10) and a sampling resistor (17), wherein:

[0025] The input end of the second current sensor (10) is connected to the first protection module, and the output end of the second current sensor (10) is connected to the second boost module;

[0026] The first end of the sampling resistor (17) is connected to the low-voltage terminal DC- via a fourth node d, and the second end of the sampling resistor (17) is connected to the high-voltage terminal DC-.

[0027] In a possible implementation manner, the second boost module comprises a second reactor (11), a second IGBT (12) and a third IGBT (13), wherein:

[0028] The first end of the second reactor (11) is connected to the output end of the second current sensor (10), and the second end of the second reactor (11), the collector of the second IGBT (12) and the emitter of the third IGBT (13) are connected via a fifth node e;

[0029] The emitter of the second IGBT (12) is connected to the low-voltage terminal DC-, and the collector of the third IGBT (13) is connected to the second protection module.

[0030] In a possible implementation, the second protection module comprises a second absorption capacitor (14), a second support capacitor (15) and a first support resistor (16), wherein:

[0031] The first end of the second absorption capacitor (14) and the collector of the third IGBT (13) are connected to the high-voltage terminal DC+ through a sixth node f, and the first end of the second support capacitor (15) and the first end of the first support resistor (16) are both connected to the high-voltage terminal DC+;

[0032] The second end of the second absorption capacitor (14) is connected to the low-voltage terminal DC-, and the second end of the second support capacitor (15) and the second end of the first support resistor (16) are both connected to the low-voltage terminal DC- via the fourth node d.

[0033] In a possible implementation manner, the first protection module comprises a third supporting capacitor (8) and a second supporting resistor (9), wherein:

[0034] The first end of the third supporting capacitor (8) is connected to the first boost module via the third node c, and the first end of the second supporting resistor (9) is connected to the input end of the second current sensor (10);

[0035] The second end of the third supporting capacitor (8) and the second end of the second supporting resistor (9) are both connected to the low-voltage terminal DC-.

[0036] In a second aspect, the present application further provides an integrated system of photovoltaic power generation and air energy heat pump, the system comprising an air energy heat pump system, a photovoltaic power generation component and a cascade boost circuit as described in the first aspect, wherein:

[0037] The photovoltaic power generation component is used to provide supplementary electric energy to the air energy heat pump system, and the cascade boost circuit is used to convert the low voltage output by the photovoltaic power generation component into a high voltage and output it to the air energy heat pump system. The air energy heat pump system converts indoor low-temperature heat energy into high-temperature heat energy through the heat pump cycle principle to increase the indoor temperature.

[0038] The present application provides a cascade boost circuit and an integrated system of photovoltaic power generation and air energy heat pump. The low input voltage of the cascade boost circuit is boosted by the Boost boost circuit, and a stable medium voltage is output through the first protection module. The medium voltage is boosted again by the synchronous Boost boost circuit, and a high voltage is output to the power-consuming component. Through the above circuit, the duty cycle of the circuit is reduced, and the temperature rise and loss of the IGBT are prevented from being too large, which shortens the service life of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0040] Figure 1 A schematic diagram of the structure of a cascade boost circuit provided in an embodiment of the present application;

[0041] Figure 2 A circuit diagram of a Boost circuit provided in an embodiment of the present application;

[0042] Figure 3 A circuit diagram of a synchronous Boost circuit provided in an embodiment of the present application;

[0043] Figure 4 A schematic structural diagram of an integrated system of photovoltaic power generation and air-source heat pump provided in an embodiment of the present application.

[0044] Explanation of the numbers in the figure: 1-fuse, 2-first current sensor, 3-first supporting capacitor, 4-first reactor, 5-first IGBT, 6-diode, 7-first absorption capacitor, 8-third supporting capacitor, 9-second supporting resistor, 10-second current sensor, 11-second reactor, 12-second IGBT, 13-third IGBT, 14-second absorption capacitor, 15-second supporting capacitor, 16-first supporting resistor and 17-sampling resistor.

[0045] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here, for example.

[0048] In the embodiments of the present application, the words "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0049] Before the low voltage output by the photovoltaic power generation component is transmitted to the required electrical device, it needs to be boosted by other modules before being transmitted. In the prior art, the Boost boost circuit is often used in the above environment. The low voltage output by the photovoltaic power generation component is boosted by the Boost boost circuit and then output to the required electrical device or system. However, the duty cycle of the Boost boost circuit is relatively large, which makes the temperature rise and loss of the IGBT device larger.

[0050] The present application provides a cascade boost circuit, wherein the low input voltage of the cascade boost circuit is boosted by the Boost boost circuit, and a stable medium voltage is output through a first protection module, and the medium voltage is boosted again by a synchronous Boost boost circuit, and a high voltage is output to the power-consuming component. Through the above circuit, the duty cycle of the circuit is reduced, and the temperature rise and excessive loss of the IGBT are prevented, which shortens the service life of the circuit.

[0051] Next, the technical solution shown in the present application is described in detail through specific embodiments. It should be noted that the following embodiments can exist independently or in combination with each other, and the same or similar contents will not be described repeatedly in different embodiments.

[0052] Figure 1 This is a schematic diagram of the structure of a cascade boost circuit provided in an embodiment of the present application. Figure 1 As shown, the circuit includes: a Boost circuit and a synchronous Boost circuit, wherein:

[0053] The Boost circuit and the synchronous Boost circuit are connected via a common first protection module;

[0054] The Boost circuit is used to convert the input low voltage into a medium voltage and output it to the synchronous Boost circuit;

[0055] The first protection module is used to stabilize the medium voltage output by the Boost circuit and improve the stability of the Boost circuit and the synchronous Boost circuit;

[0056] The synchronous Boost circuit is used to increase the medium voltage to a high voltage so as to provide the required voltage to the power-consuming components.

[0057] In the original total circuit or system that relies on a single Boost circuit to boost the voltage, the circuit duty cycle is relatively large in order to make the boosted output voltage meet the needs of the electrical components. Therefore, if used for a long time, the IGBT (Insulated Gate Bipolar Transistor) in the circuit, a composite fully controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), will have a large temperature rise and loss, which greatly reduces the service life of the circuit.

[0058] This embodiment adopts a cascade boost circuit composed of a Boost boost circuit and a synchronous Boost boost circuit.

[0059] Specifically, the Boost circuit further includes a preprocessing module and a first boost module, wherein:

[0060] The pre-processing module is used to stabilize the input low voltage and monitor the input current to prevent the input current from being too large and damaging the circuit;

[0061] The first boost module is used to boost the stabilized low voltage to the medium voltage.

[0062] The synchronous Boost circuit further comprises a collection module, a second boost module, and a second protection module, wherein:

[0063] The acquisition module is used to acquire the current flowing through the synchronous Boost circuit;

[0064] The second boost module is used to increase the medium voltage output by the Boost circuit to a high voltage;

[0065] The second protection module is used to stabilize the high voltage output by the second boost module and protect the circuit safety of the synchronous Boost circuit.

[0066] The present application provides a cascade boost circuit, wherein the low input voltage of the cascade boost circuit is boosted by the Boost boost circuit, and a stable medium voltage is output through a first protection module, and the medium voltage is boosted again by a synchronous Boost boost circuit, and a high voltage is output to the power-consuming component. Through the above circuit, the duty cycle of the circuit is reduced, and the temperature rise and excessive loss of the IGBT are prevented, which shortens the service life of the circuit.

[0067] Figure 2 A circuit diagram of a Boost circuit provided in an embodiment of the present application. Figure 2 As shown, the Boost circuit comprises: a pre-processing module, a first boost module and a first protection module, wherein:

[0068] The preprocessing module includes a fuse 1, a first current sensor 2 and a first supporting capacitor 3, and the connection between the three is as follows:

[0069] The input end of the fuse 1 is connected to the low voltage terminal DC+, the output end is connected to the input end of the first current sensor 2, and the output end of the first current sensor 2 is connected to the first end of the first supporting capacitor 3 through the first node a;

[0070] The preprocessing module and the first protection module are connected via the first node a, and the second end of the first supporting capacitor 3 is connected to the low-voltage terminal DC-.

[0071] It should be noted that the low-voltage terminal DC+ and the low-voltage terminal DC- here and the high-voltage terminal DC+ and the high-voltage terminal DC- that appear in subsequent embodiments are all electrical connection implementation methods, which are used to complete electrical connections with power generation components and power consumption components that provide input low voltage.

[0072] Furthermore, the functions of each electrical component in the preprocessing module are as follows:

[0073] Fuse 1 provides short-circuit protection for the Boost circuit to prevent the Boost circuit from being damaged by excessive current when the Boost circuit is short-circuited. The first current sensor 2 is used to collect input current, that is, to provide the output current of the power generation device with input low voltage. The first supporting capacitor 3 is used to make the input low voltage more stable. For the convenience of explanation, the subsequent power generation device is directly replaced by a photovoltaic power generation component.

[0074] After the low voltage is processed by the pre-processing module, the stable low voltage is boosted by the first step through the first boost module. The first boost module includes: a first reactor 4, a first IGBT 5, a diode 6 and a first absorption capacitor 7, and the connection between the four is as follows:

[0075] The first end of the first reactor 4 is connected to the pre-processing module through the first node a, and the second end of the first reactor 4 and the collector of the first IGBT 5 are connected to the anode of the diode 6 through the second node b;

[0076] The cathode of the diode 6 is connected to the first end of the first absorption capacitor 7 via a third node c, and the first boost module is connected to the first protection module via the third node c;

[0077] The second end of the first absorption capacitor 7 and the emitter of the first IGBT 5 are both connected to the low-voltage terminal DC-.

[0078] Furthermore, the function of each electrical component in the first boost module is specifically as follows:

[0079] The first inductor 4 is used to store and release electric energy, that is, to complete the initial boost of the low voltage. The first IGBT5 is used to assist the first inductor 4 in completing the storage and release of electric energy. When the first IGBT5 is in the on state, the energy output by the photovoltaic power generation component is stored in the first inductor 4. When it is in the off state, the first inductor 4 releases the previously stored energy. The diode 6 is used for freewheeling. The first absorption capacitor 7 is used to protect the first IGBT5. The specific process is: when the first IGBT5 switch is in action, the loss is reduced by absorbing the peak voltage.

[0080] It should be noted that the diode 6 of this embodiment refers to a structure composed of at least one diode, the number of diodes is selected according to actual conditions, and if there are multiple diodes, the diodes are connected in parallel. The diode 6 of this embodiment is composed of two diodes connected in parallel.

[0081] Furthermore, after the low voltage is boosted to obtain the medium voltage in the first step, in order to further ensure the stability of the circuit, this embodiment transmits the medium voltage to the first protection module. Considering that the synchronous Boost circuit also includes the first protection module, this embodiment does not explain the first protection module in detail.

[0082] The present application provides a cascade boost circuit, wherein the input low voltage is processed by a preprocessing module to obtain a stable low voltage, and then the input low voltage is boosted to a medium voltage by a first boost module, and the first boost module outputs the medium voltage to a first protection circuit to obtain a stable medium voltage. Through the above circuit, the first boost of the low voltage is completed under the condition of a relatively low duty cycle, so that the obtained medium voltage and the entire circuit are more stable.

[0083] Figure 3 A circuit diagram of a synchronous Boost circuit provided in an embodiment of the present application. Figure 3 As shown, the synchronous Boost circuit includes a collection module, a second boost module, a second protection module and a first protection module, wherein:

[0084] The acquisition module includes a second current sensor 10 and a sampling resistor 17, and the connection between the two in the synchronous Boost circuit is specifically as follows:

[0085] The input end of the second current sensor 10 is connected to the first protection module, and the output end of the second current sensor 10 is connected to the second boost module;

[0086] A first end of the sampling resistor 17 is connected to the low voltage terminal DC- through a fourth node d, and a second end of the sampling resistor 17 is connected to the high voltage terminal DC-.

[0087] Furthermore, the function of each electrical component in the acquisition module is:

[0088] The second current sensor 10 is used to collect the output current of the first protection circuit, and the sampling resistor 17 is used to collect the current flowing through the sampling resistor 17 on the high-voltage side.

[0089] Furthermore, the second boost module comprises a second reactor 11, a second IGBT 12 and a third IGBT 13, and the connection between the three is as follows:

[0090] A first end of the second reactor 11 is connected to the output end of the second current sensor 10, and a second end of the second reactor 11, a collector of the second IGBT 12, and an emitter of the third IGBT 13 are connected via a fifth node e;

[0091] The emitter of the second IGBT 12 is connected to the low-voltage terminal DC-, and the collector of the third IGBT 13 is connected to the second protection module.

[0092] The function of each electrical component in the second boost module is:

[0093] The second inductor 11 is used to store and release energy, that is, to boost the medium voltage output by the Boost circuit. The second IGBT 12 is used to assist the second inductor 11 in storing and releasing electric energy. When the second IGBT 12 is in the on state, the energy output by the photovoltaic power generation component is stored in the second inductor 11. When it is in the off state, the second inductor 11 releases the previously stored energy. The third IGBT 13 is used for freewheeling.

[0094] Compared with the first boost module, the second boost module uses the third IGBT13 to replace the diode 6. When the IGBT is in the on state, the resistance is lower and lower than the diode. Therefore, replacing the diode with the third IGBT13 can reduce the energy loss of the synchronous Boost circuit.

[0095] The second protection module includes a second absorption capacitor 14, a second support capacitor 15 and a first support resistor 16, and the connection between the three is as follows:

[0096] The first end of the second absorption capacitor 14 and the collector of the third IGBT 13 are connected to the high-voltage terminal DC+ through the sixth node f, and the first end of the second support capacitor 15 and the first end of the first support resistor 16 are both connected to the high-voltage terminal DC+;

[0097] The second end of the second absorption capacitor 14 is connected to the low-voltage terminal DC-, and the second end of the second support capacitor 15 and the second end of the first support resistor 16 are both connected to the low-voltage terminal DC- through the fourth node d.

[0098] Furthermore, the functions of the electrical components included in the second protection module are:

[0099] The second absorption capacitor 14 is used to absorb the peak voltage when the second IGBT 12 and the third IGBT 13 switch, thereby reducing circuit losses and protecting the second IGBT 12 and the third IGBT 13. The second support capacitor 15 is used to make the high voltage output by the second boost circuit more stable through charging and discharging. The first support resistor is used to reduce the total impedance of the circuit, extend the service life of the second support capacitor 15, and improve the stability performance of the synchronous Boost circuit.

[0100] The first protection module, which is a common part of the Boost circuit and the synchronous Boost circuit, includes a third support capacitor 8 and a second support resistor 9. The third support capacitor 8 and the second support resistor 9 are connected in the Boost circuit and the synchronous Boost circuit as follows:

[0101] The first end of the third supporting capacitor 8 is connected to the first boost module through the third node c, and the first end of the second supporting resistor 9 is connected to the input end of the second current sensor 10;

[0102] The second end of the third supporting capacitor 8 and the second end of the second supporting resistor 9 are both connected to the low-voltage terminal DC-.

[0103] Furthermore, the functions of the electrical components in the first protection module are:

[0104] The third supporting capacitor 8 is used to make the medium voltage output by the first boost module more stable through charging and discharging, and the second supporting resistor 9 is used to reduce the total impedance in the circuit, extend the service life of the third supporting capacitor 8, and improve the stability of the circuit.

[0105] The present application provides a cascade boost circuit, wherein the medium voltage output by the Boost boost circuit is boosted to a high voltage by a second boost module, and then the second protection circuit is used to reduce the stable voltage to reduce circuit loss, and the output current of the Boost boost circuit and the current on the high-voltage side are collected by a collection module. Through the above circuit, the medium voltage is further boosted to the required high voltage, while reducing circuit loss, enhancing circuit stability, and increasing the service life of the circuit.

[0106] Figure 4 This is a schematic diagram of the structure of an integrated system of photovoltaic power generation and air energy heat pump provided in an embodiment of the present application. Figure 4 As shown, the integrated system comprises an air energy heat pump system, a photovoltaic power generation component and a cascade boost circuit as described in any of the above items, wherein:

[0107] The photovoltaic power generation component is used to provide supplementary electric energy to the air energy heat pump system, and the cascade boost circuit is used to convert the low voltage output by the photovoltaic power generation component into a high voltage and output it to the air energy heat pump system. The air energy heat pump system converts indoor low-temperature heat energy into high-temperature heat energy through the heat pump cycle principle to increase the indoor temperature.

[0108] It should be noted that the integrated system of this embodiment is applied to low voltage environments such as household voltage, so the photovoltaic power generation assembly of this embodiment is a single photovoltaic power generation component or an assembly composed of multiple photovoltaic power generation components in parallel.

[0109] This embodiment does not impose any limitation on the structure of the air energy heat pump system, and it can be set according to the actual usage scenario.

[0110] In a possible implementation, the air energy heat pump system includes a unidirectional PFC circuit, a first DSP controller, a heat pump drive circuit, a first embedded controller and a compressor, and the connection between the above five is as follows:

[0111] The input end of the unidirectional PFC circuit is connected to the AC access end, and the output end is connected to the input end of the heat pump drive circuit through the DC bus, that is, the high-voltage terminal DC+ and the high-voltage terminal DC-, and the output end of the heat pump drive circuit is connected to the compressor;

[0112] The first DSP controller is electrically connected to the unidirectional PFC circuit and the heat pump driving circuit. Meanwhile, the first DSP controller, the first embedded controller and the cascade boost circuit are connected via a 485 bus, and the output end of the cascade boost circuit is connected to the DC bus.

[0113] It should be understood that the above-mentioned device embodiments are only illustrative, and the device of the present application can also be implemented in other ways. For example, the division of units / modules in the above-mentioned embodiments is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units, modules or components can be combined, or can be integrated into another system, or some features can be ignored or not executed.

[0114] In addition, unless otherwise specified, each functional unit / module in each embodiment of the present application may be integrated into one unit / module, each unit / module may exist physically separately, or two or more units / modules may be integrated together. The above-mentioned integrated unit / module may be implemented in the form of hardware or in the form of a software program module.

[0115] If the integrated unit / module is implemented in the form of hardware, the hardware may be a digital circuit, an analog circuit, etc. The physical implementation of the hardware structure includes but is not limited to transistors, memristors, etc. Unless otherwise specified, the processor may be any appropriate hardware processor, such as a CPU, a GPU, an FPGA, a DSP, an ASIC, etc. Unless otherwise specified, the storage unit may be any appropriate magnetic storage medium or magneto-optical storage medium, such as a resistive random access memory (RRAM), a dynamic random access memory (DRAM), a static random access memory (SRAM), an enhanced dynamic random access memory (EDRAM), a high-bandwidth memory (HBM), a hybrid memory cube (HMC), etc.

[0116] If the integrated unit / module is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk and other media that can store program codes.

[0117] In the above embodiments, the description of each embodiment has its own emphasis. For the part not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0118] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0119] So far, the technical solution of the present application has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments, and the above embodiments are only used to illustrate the technical solution of the present application rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cascade boost circuit, characterized in that: The circuit comprises: a Boost circuit and a synchronous Boost circuit, wherein: The Boost circuit and the synchronous Boost circuit are connected via a common first protection module; The Boost circuit is used to convert the input low voltage into a medium voltage and output it to the synchronous Boost circuit; The first protection module is used to stabilize the medium voltage output by the Boost circuit and improve the stability of the Boost circuit and the synchronous Boost circuit; The synchronous Boost circuit is used to increase the medium voltage to a high voltage so as to provide the required voltage to the power-consuming components.

2. The circuit according to claim 1, characterized in that The Boost circuit further comprises a preprocessing module and a first boost module, wherein: The pre-processing module is used to stabilize the input low voltage and monitor the input current to prevent the input current from being too large and damaging the circuit; The first boost module is used to boost the stabilized low voltage to the medium voltage.

3. The circuit according to claim 2, characterized in that The pre-processing module comprises a fuse (1), a first current sensor (2) and a first supporting capacitor (3), wherein: The input end of the fuse (1) is connected to the low-voltage terminal DC+, the output end is connected to the input end of the first current sensor (2), and the output end of the first current sensor (2) is connected to the first end of the first supporting capacitor (3) via a first node a; The pre-processing module and the first protection module are connected via the first node a, and the second end of the first supporting capacitor (3) is connected to the low-voltage terminal DC-.

4. The circuit according to claim 3, characterized in that The first boost module comprises: a first reactor (4), a first IGBT (5), a diode (6) and a first absorption capacitor (7), wherein: The first end of the first reactor (4) is connected to the pre-processing module via the first node a, and the second end of the first reactor (4) is connected to the collector of the first IGBT (5) and the anode of the diode (6) via the second node b; The cathode of the diode (6) is connected to the first end of the first absorption capacitor (7) via a third node c, and the first boost module is connected to the first protection module via the third node c; The second end of the first absorption capacitor (7) and the emitter of the first IGBT (5) are both connected to the low-voltage terminal DC-.

5. The circuit according to claim 4, characterized in that The synchronous Boost circuit further comprises a collection module, a second boost module, and a second protection module, wherein: The acquisition module is used to acquire the current flowing through the synchronous Boost circuit; The second boost module is used to increase the medium voltage output by the Boost circuit to a high voltage; The second protection module is used to stabilize the high voltage output by the second boost module and protect the circuit safety of the synchronous Boost circuit.

6. The circuit according to claim 5, characterized in that The acquisition module comprises a second current sensor (10) and a sampling resistor (17), wherein: The input end of the second current sensor (10) is connected to the first protection module, and the output end of the second current sensor (10) is connected to the second boost module; The first end of the sampling resistor (17) is connected to the low-voltage terminal DC- via a fourth node d, and the second end of the sampling resistor (17) is connected to the high-voltage terminal DC-.

7. The circuit according to claim 6, characterized in that The second boost module comprises a second reactor (11), a second IGBT (12) and a third IGBT (13), wherein: The first end of the second reactor (11) is connected to the output end of the second current sensor (10), and the second end of the second reactor (11), the collector of the second IGBT (12) and the emitter of the third IGBT (13) are connected via a fifth node e; The emitter of the second IGBT (12) is connected to the low-voltage terminal DC-, and the collector of the third IGBT (13) is connected to the second protection module.

8. The circuit according to claim 7, characterized in that The second protection module comprises a second absorption capacitor (14), a second support capacitor (15) and a first support resistor (16), wherein: The first end of the second absorption capacitor (14) and the collector of the third IGBT (13) are connected to the high-voltage terminal DC+ through a sixth node f, and the first end of the second support capacitor (15) and the first end of the first support resistor (16) are both connected to the high-voltage terminal DC+; The second end of the second absorption capacitor (14) is connected to the low-voltage terminal DC-, and the second end of the second support capacitor (15) and the second end of the first support resistor (16) are both connected to the low-voltage terminal DC- via the fourth node d.

9. The circuit according to claim 8, characterized in that The first protection module comprises a third supporting capacitor (8) and a second supporting resistor (9), wherein: The first end of the third supporting capacitor (8) is connected to the first boost module via the third node c, and the first end of the second supporting resistor (9) is connected to the input end of the second current sensor (10); The second end of the third supporting capacitor (8) and the second end of the second supporting resistor (9) are both connected to the low-voltage terminal DC-.

10. An integrated system of photovoltaic power generation and air energy heat pump, characterized in that: The invention comprises an air energy heat pump system, a photovoltaic power generation component and a cascade boost circuit as claimed in any one of claims 1 to 9, wherein: The photovoltaic power generation component is used to provide supplementary electric energy to the air energy heat pump system, and the cascade boost circuit is used to convert the low voltage output by the photovoltaic power generation component into a high voltage and output it to the air energy heat pump system. The air energy heat pump system converts indoor low-temperature heat energy into high-temperature heat energy through the heat pump cycle principle to increase the indoor temperature.

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