Local thick copper circuit board

Abstract

The utility model is suitable for the technical field of circuit boards, and provides a local thick copper circuit board which comprises a circuit board main body, a heat dissipation structure is installed in the circuit board main body, and the heat dissipation structure is composed of a metal heat conduction rod, an anti-falling plate, a metal base rod, a metal fixing shaft, a metal installation rod and a metal cooling fin. The two metal heat conduction rods are symmetrically arranged, and the four anti-falling plates are installed at the two ends of the two metal base rods respectively. According to the local thick copper circuit board, the heat dissipation structure is arranged, the metal heat conduction rod on the heat dissipation structure can transmit heat in the circuit board main body to the metal heat dissipation sheet through the metal base rod, the metal fixing shaft and the metal mounting rod, and the metal heat dissipation sheet is fully contacted with air, so that the heat can be quickly dissipated into the air, and the heat dissipation efficiency is improved. And therefore, the heat dissipation efficiency of the circuit board main body is improved, and finally, the circuit board main body is not easy to damage and has a relatively long service life.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a locally thick copper circuit board. Background Art

[0002] Locally thick copper PCB is a printed circuit board with thickened copper layer in specific areas. The design of this PCB is to increase the current carrying capacity, reduce thermal strain, and optimize heat dissipation performance in specific areas.

[0003] Partially thick copper circuit boards are often used to handle high current and high power application scenarios. In these cases, electronic devices will generate a lot of heat when working. If this heat cannot be effectively dissipated, it will cause the internal temperature of the electronic equipment to rise, thereby affecting the performance of the electronic equipment. At the same time, it will also cause thermal aging of components and materials on the circuit board, cracking of low-melting-point welds, falling off or brittleness of solder joints, and reduced mechanical strength. Therefore, a locally thick copper circuit board with high heat dissipation efficiency is needed. Utility Model Content

[0004] The embodiment of the utility model provides a partially thick copper circuit board, aiming to improve the heat dissipation efficiency and service life of the partially thick copper circuit board and reduce the probability of damage to the partially thick copper circuit board.

[0005] The utility model embodiment provides a partially thick copper circuit board, including a circuit board body, a heat dissipation structure installed in the circuit board body, the heat dissipation structure is composed of a metal heat-conducting rod, an anti-slip plate, a metal base rod, a metal fixed shaft, a metal mounting rod and a metal heat sink, the metal heat-conducting rods are two and symmetrically arranged, the anti-slip plates are four and are respectively installed at the two ends of the two metal base rods, the metal base rods are two and are both slidably installed on the two metal heat-conducting rods, the metal fixed shafts are several and are respectively installed on the outer ends of the two metal base rods, the metal mounting rods are several and are respectively rotatably installed on the several metal fixed shafts, and the metal heat sinks are several and are respectively installed on the outer walls of the several metal mounting rods.

[0006] Furthermore, two receiving cavities are symmetrically provided at two ends of the circuit board body.

[0007] Furthermore, the metal heat-conducting rod on the heat dissipation structure is fixedly installed in the circuit board body, the anti-dropping plate is fixedly connected to the metal heat-conducting rod, and the anti-dropping plate is also located in a storage cavity opened at the end of the circuit board body.

[0008] Furthermore, two receiving grooves are symmetrically formed at the outer end of the metal base rod on the heat dissipation structure, and two through holes are symmetrically formed at the inner end of the metal base rod.

[0009] Furthermore, the receiving groove and the through hole are communicated with each other.

[0010] Furthermore, the metal base rod is movably installed in a receiving cavity opened at the end of the circuit board body, and the metal base rod is slidably installed on the metal heat-conducting rod through the receiving groove and the through hole.

[0011] Furthermore, the metal fixing shaft is fixedly connected to the metal base rod, and the metal mounting rod is fixedly connected to the metal heat sink.

[0012] Furthermore, a mounting shaft hole is provided on the metal mounting rod, and the metal mounting rod is rotatably mounted on the metal fixed shaft through the mounting shaft hole.

[0013] Compared with the prior art, the partially thick copper circuit board in the utility model is provided with a heat dissipation structure. The metal heat-conducting rod on the heat dissipation structure can transfer the heat in the circuit board body to the metal heat sink through the metal base rod, the metal fixed shaft, and the metal mounting rod. The metal heat sink is fully in contact with the air, so that the heat can be quickly dissipated into the air, thereby improving the heat dissipation efficiency of the circuit board body, and ultimately making the circuit board body less prone to damage and having a better service life; at the same time, the metal heat sink can be folded and retracted into the circuit board body when not in use, so as to facilitate storage and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the structure of the circuit board body of the utility model after being cut;

[0016] Figure 3 This is a disassembled diagram of the heat dissipation structure of the utility model;

[0017] Figure 4 For the utility model Figure 3 A magnified view of point A.

[0018] Among them, 1. Circuit board body; 2. Heat dissipation structure; 3. Storage cavity; 4. Metal heat-conducting rod; 5. Anti-slip plate; 6. Metal base rod; 7. Metal fixed shaft; 8. Metal mounting rod; 9. Metal heat sink; 10. Storage groove; 11. Through hole; 12. Mounting shaft hole. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0021] When used herein, it should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the relevant listed items.

[0022] The utility model embodiment provides a local thick copper circuit board, combined with Figure 1 , Figure 2 , Figure 3 as well as Figure 4 As shown, it includes a circuit board body 1, and two storage cavities 3 are symmetrically opened at both ends of the circuit board body 1. A heat dissipation structure 2 is installed in the circuit board body 1. The existence of the storage cavity 3 can facilitate the storage of some structures on the heat dissipation structure 2.

[0023] In this embodiment, the heat dissipation structure 2 is composed of a metal heat-conducting rod 4, an anti-slip plate 5, a metal base rod 6, a metal fixed shaft 7, a metal mounting rod 8 and a metal heat sink 9. There are two metal heat-conducting rods 4 and they are symmetrically arranged. There are four anti-slip plates 5 and they are respectively installed at the two ends of the two metal base rods 6. There are two metal base rods 6 and they are both slidably installed on the two metal heat-conducting rods 4. There are several metal fixed shafts 7 and they are respectively installed on the outer ends of the two metal base rods 6. There are several metal mounting rods 8 and they are respectively rotatably installed on several metal fixed shafts 7. There are several metal heat sinks 9 and they are respectively installed on the outer walls of several metal mounting rods 8. The metal heat-conducting rods 4 on the heat dissipation structure 2 are fixedly installed In the circuit board body 1, the anti-slip plate 5 is fixedly connected to the metal heat-conducting rod 4, and the anti-slip plate 5 is also located in the storage cavity 3 opened at the end of the circuit board body 1. The metal heat-conducting rod 4 on the heat dissipation structure 2 can transfer the heat in the circuit board body 1 to the metal heat sink 9 through the metal base rod 6, the metal fixed shaft 7, and the metal mounting rod 8. The metal heat sink 9 is in full contact with the air, so that the heat can be quickly dissipated into the air, thereby improving the heat dissipation efficiency of the circuit board body 1, and finally making the circuit board body 1 not easy to be damaged and having a good service life. At the same time, the metal heat sink 9 can be folded and retracted into the circuit board body 1 when not in use, so as to facilitate storage and transportation.

[0024] Specifically, two receiving grooves 10 are symmetrically provided at the outer end of the metal base rod 6 on the heat dissipation structure 2, and two through holes 11 are symmetrically provided at the inner end of the metal base rod 6. The receiving grooves 10 and the through holes 11 are interconnected. The metal base rod 6 is movably installed in the receiving cavity 3 provided at the end of the circuit board body 1, and at the same time, the metal base rod 6 is slidably installed on the metal heat conducting rod 4 through the receiving grooves 10 and the through holes 11.

[0025] Among them, the metal fixing shaft 7 is fixedly connected to the metal base rod 6, and the metal mounting rod 8 is fixedly connected to the metal heat sink 9. A mounting shaft hole 12 is opened on the metal mounting rod 8, and the metal mounting rod 8 is rotatably mounted on the metal fixing shaft 7 through the mounting shaft hole 12. When the circuit board body 1 is stored and transported, in order to facilitate the storage and transportation of the circuit board body 1, the metal mounting rod 8 and the metal heat sink 9 can be rotated ninety degrees with the metal fixing shaft 7 as the axis, so that the metal heat sink 9 is in a horizontal state, and then the metal base rod 6, the metal mounting rod 8 and the metal heat sink 9 can be pushed into the storage groove 10. Conversely, when the circuit board body 1 is installed and used, the metal base rod 6, the metal mounting rod 8 and the metal heat sink 9 can be pulled out of the storage groove 10, and then the metal mounting rod 8 and the metal heat sink 9 can be rotated ninety degrees with the metal fixing shaft 7 as the axis, so that the metal heat sink 9 is in an upright state. In this state, the metal heat sink 9 can better contact with the air, thereby better dissipating heat.

[0026] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0027] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0028] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A partially thick copper circuit board, comprising a circuit board body, characterized in that: A heat dissipation structure is installed in the circuit board body, and the heat dissipation structure consists of a metal heat-conducting rod, an anti-slip plate, a metal base rod, a metal fixed shaft, a metal mounting rod and a metal heat sink. There are two metal heat-conducting rods and they are symmetrically arranged, there are four anti-slip plates and they are respectively installed at the two ends of the two metal base rods, there are two metal base rods and they are both slidably installed on the two metal heat-conducting rods, there are several metal fixed shafts and they are respectively installed on the outer ends of the two metal base rods, there are several metal mounting rods and they are respectively rotatably installed on several metal fixed shafts, and there are several metal heat sinks and they are respectively installed on the outer walls of several metal mounting rods.

2. A partially thick copper circuit board according to claim 1, characterized in that: Two receiving cavities are symmetrically arranged at two ends of the circuit board body.

3. A partially thick copper circuit board according to claim 2, characterized in that: The metal heat-conducting rod on the heat dissipation structure is fixedly installed in the circuit board body, the anti-slip plate is fixedly connected to the metal heat-conducting rod, and the anti-slip plate is also located in a storage cavity opened at the end of the circuit board body.

4. A locally thick copper circuit board according to claim 3, characterized in that: The outer end of the metal base rod on the heat dissipation structure is symmetrically provided with two receiving grooves, and the inner end of the metal base rod is symmetrically provided with two through holes.

5. A partially thick copper circuit board according to claim 4, characterized in that: The receiving groove and the through hole are communicated with each other.

6. A locally thick copper circuit board according to claim 5, characterized in that: The metal base rod is movably installed in a receiving cavity opened at the end of the circuit board body, and the metal base rod is slidably installed on the metal heat-conducting rod through the receiving groove and the through hole.

7. A partially thick copper circuit board according to claim 6, characterized in that: The metal fixing shaft is fixedly connected to the metal base rod, and the metal mounting rod is fixedly connected to the metal heat sink.

8. The locally thick copper circuit board according to claim 7, characterized in that: The metal mounting rod is provided with a mounting shaft hole, and the metal mounting rod is rotatably mounted on the metal fixed shaft through the mounting shaft hole.

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