Micro-melting and sputtering pressure sensor integrated bonding wire plate

Abstract

The utility model discloses a micro-melting and sputtering pressure sensor integrated bonding wire plate which comprises three interface holes, the three interface holes are arranged on a circuit board, a pressure sensor bonding pad is attached to the circuit board, the pressure sensor bonding pad is provided with a pressure sensor bonding wire area, and the pressure sensor bonding wire area is provided with a pressure sensor bonding wire. The pressure sensor bonding wire area comprises a sputtering film pressure sensor bonding wire area, a glass micro-melting pressure sensor bonding wire area and a middle lead hole; the middle lead hole is arranged between the sputtering film pressure sensor bonding wire area and the glass micro-melting pressure sensor bonding wire area, and a lead bonding point is arranged in the pressure sensor bonding wire area. According to the utility model, the bonding wire plates of two types of sensors are combined and designed to one universal platform, so that the complexity of product design is remarkably simplified, the material cost is reduced, the production cost is also reduced because only one type of bonding wire plate needs to be manufactured and stored, and the same production line can be used for the two types of sensors, so that the production efficiency is improved. And the time for replacing tools and adjusting equipment is shortened, so that the overall production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic information, and in particular relates to an integrated wire bonding plate for a micro-melting and sputtering pressure sensor. Background Art

[0002] Accurate pressure monitoring is crucial in modern industrial and scientific applications. To achieve this goal, engineers and scientists have developed a variety of pressure sensors, including sensors based on different principles and technologies, such as glass micro-melting pressure sensors and sputtered thin film pressure sensors.

[0003] Glass micro-melting pressure sensor uses glass micro-melting technology to combine silicon strain gauges with stainless steel diaphragms through high-temperature sintering. The four equivalent resistors on the silicon strain gauges form a Wheatstone bridge. When the stainless steel diaphragm is subjected to gas or liquid pressure, the diaphragm produces a slight deformation, causing the resistance of the four strain gauges sintered on the diaphragm to change. When the bridge is powered by voltage, a voltage output proportional to the pressure is generated to measure the pressure.

[0004] The sputtered thin film pressure sensor adopts MEMS technology to directly manufacture strain resistors on a stainless steel substrate. Through the elastic deformation of the substrate under force, the chip outputs an mV voltage signal that is linearly related to the measured pressure, thereby achieving accurate and rapid measurement of the measured pressure.

[0005] Glass micro-melted pressure sensors and sputtered thin film pressure sensors each have unique performance advantages over different measurement ranges. As thick film technology products, glass micro-melted pressure sensors exhibit stronger overload capabilities when subjected to larger pressure ranges; while pressure sensors based on sputtered thin film technology provide higher measurement accuracy in low-range applications. When these sensors are used for pressure detection or built into pressure transmitters, it is usually necessary to connect the strain gauges on the sensor to the circuit board through a gold or aluminum wire bonding process. Due to the differences in the layout and number of strain gauges on the stainless steel base of the two sensors, industry practice is to use specifically designed circuit boards to adapt to the respective strain gauge configurations.

[0006] However, modern pressure monitoring environments are becoming increasingly complex, and multiple different pressure range requirements are often encountered in the same environment, which requires the deployment of micro-melted pressure sensors and sputtered thin film pressure sensors at the same time. This approach not only increases the complexity of system management, but also increases material costs. In order to improve system integration efficiency and monitoring accuracy, it is necessary to integrate these two sensors onto a unified printed circuit board (PCB). This integrated solution can provide a more compact and efficient design while reducing system complexity and cost. In pressure sensing technology, there are significant differences in the strain resistor configurations of glass micro-melted pressure sensors and sputtered thin film pressure sensors, resulting in differences in their respective wire bonding board structures. Given that the wire bonding process has specific requirements for the strength of the metal wires, and the tooling equipment needs to adapt to the vertical distance between the gage (strain resistor on the sensor surface), the corresponding tooling equipment must be adjusted when using wire bonding boards with different structures. Utility Model Content

[0007] The purpose of the utility model is to overcome the problems of complex system structure, high cost and complex material management caused by two bonding boards when micro-melt sensors and sputtered thin film sensors need to be shared under complex pressure conditions. An integrated bonding board for micro-melt and sputtered pressure sensors is provided. By designing an integrated bonding board, micro-melt pressure sensors and sputtered thin film pressure sensors can share bonding wires.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] A micro-melting and sputtering pressure sensor integrated bonding board comprises an interface hole, wherein three interface holes are arranged on a circuit board, a pressure sensor pad is attached to the circuit board, a pressure sensor bonding area is arranged on the pressure sensor pad, and the pressure sensor bonding area comprises a sputtering film pressure sensor bonding area, a glass micro-melting pressure sensor bonding area and an intermediate lead hole; the intermediate lead hole is arranged between the sputtering film pressure sensor bonding area and the glass micro-melting pressure sensor bonding area, and a lead bonding point is arranged in the pressure sensor bonding area.

[0010] Furthermore, the pressure sensor pad includes a sputtered thin film pressure sensor pad and a glass micro-melted pressure sensor pad, and the sputtered thin film pressure sensor pad and the glass micro-melted pressure sensor pad are connected in series.

[0011] Furthermore, the bonding area of ​​the sputtered thin film pressure sensor and the bonding area of ​​the glass micro-melting pressure sensor are independently arranged.

[0012] Furthermore, a safety distance is set between the bonding area of ​​the sputtered thin film pressure sensor and the bonding area of ​​the glass micro-melting pressure sensor and the middle lead hole.

[0013] Furthermore, the bonding area of ​​the sputtered thin film pressure sensor is semi-annular.

[0014] Furthermore, the bonding area of ​​the glass micro-melting pressure sensor is rectangular.

[0015] Furthermore, the middle lead hole is a combination shape of a semicircle at one end and a rectangle at the other end.

[0016] Furthermore, the interface hole comprises a first interface hole, a second interface hole and a third interface hole, and the first interface hole, the second interface hole and the third interface hole are asymmetrically arranged.

[0017] Furthermore, a resistor is arranged on the circuit board, and the interface hole is connected to the resistor.

[0018] Furthermore, four resistors are provided, and the four resistors are connected to the bonding area of ​​the pressure sensor.

[0019] Compared with the prior art, the utility model has the following beneficial technical effects:

[0020] The utility model significantly simplifies the complexity of product design by combining the wire bonding board design of the two sensors into a common platform. This integrated approach reduces material costs because only one type of wire bonding board needs to be manufactured and stored. In addition, it also reduces production costs because the same production line can be used for both sensors, reducing the time for tooling replacement and equipment adjustment, thereby improving overall production efficiency.

[0021] The utility model ensures that the wire bonding from the gold or aluminum wire to the sensor strain resistor has sufficient strength and reliability through the carefully designed intermediate lead hole and pad layout. This design optimization allows the sensor to maintain stable performance under different operating conditions while reducing the risk of signal interference and connection failure, thereby providing higher stability and reliability throughout the service life of the system.

[0022] The utility model connects the pads of two types of sensors in series, and connects the sensors to their corresponding pads according to different pressure sensing requirements. Since the unconnected pads are in an open circuit state, they will not interfere with the circuit signals currently in use. This integration method not only simplifies the production process, but also improves the overall performance and reliability of the system.

[0023] The utility model is suitable for complex pressure monitoring environments, allowing the deployment of micro-melting sensors and sputtered thin film sensors in a compact space without the need to configure a separate wire bonding board for each sensor. This simplifies the system integration process, making it easier to seamlessly connect with existing measurement and control technologies, while providing greater flexibility to adapt to different application requirements, ensuring accurate pressure monitoring and data analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings in the specification are used to provide further understanding of the present invention and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0025] Figure 1 The utility model is a schematic diagram of an integrated wire bonding board for a micro-melting and sputtering pressure sensor.

[0026] Among them, 1 is the bonding area of ​​the sputtered thin film pressure sensor, 2 is the bonding area of ​​the glass micro-melting pressure sensor, 3 is the middle lead hole, J1 is the first interface hole, J2 is the second interface hole, J3 is the third interface hole, R1 is the first resistor, R2 is the second resistor, R3 is the third resistor, and R4 is the fourth resistor. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0028] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0029] Embodiment 1

[0030] See also Figure 1A micro-melting and sputtering pressure sensor integrated bonding board includes an interface hole, three interface holes are arranged, and the three interface holes are arranged on a circuit board. A pressure sensor pad is attached to the circuit board. The pressure sensor pad is provided with a pressure sensor bonding area. The pressure sensor bonding area includes a sputtering film pressure sensor bonding area 1, a glass micro-melting pressure sensor bonding area 2 and an intermediate lead hole 3; the intermediate lead hole 3 is arranged between the sputtering film pressure sensor bonding area 1 and the glass micro-melting pressure sensor bonding area 2, and a lead bonding point is arranged in the pressure sensor bonding area.

[0031] Preferably, the pressure sensor pads include sputtered thin film pressure sensor pads and glass micro-melted pressure sensor pads, and the sputtered thin film pressure sensor pads and the glass micro-melted pressure sensor pads are connected in series.

[0032] Preferably, the sputtered thin film pressure sensor bonding area 1 and the glass micro-melting pressure sensor bonding area 2 are arranged independently of each other.

[0033] Preferably, a safety distance is set between the sputtered thin film pressure sensor bonding area 1 and the glass micro-melting pressure sensor bonding area 2 and the middle lead hole 3.

[0034] Preferably, the bonding area 1 of the sputtered thin film pressure sensor is semi-annular.

[0035] Preferably, the bonding area 2 of the glass micro-melting pressure sensor is rectangular.

[0036] Preferably, the middle lead hole 3 is a combination of a semicircular end and a rectangular end.

[0037] Preferably, the interface hole comprises a first interface hole J1, a second interface hole J2 and a third interface hole J3, and the first interface hole J1, the second interface hole J2 and the third interface hole J3 are asymmetrically arranged.

[0038] Preferably, a resistor is provided on the circuit board, and the interface hole is connected to the resistor.

[0039] Preferably, four resistors are provided, and the four resistors are connected to the bonding area of ​​the pressure sensor.

[0040] Embodiment 2

[0041] This embodiment proposes an integrated bonding board for micro-melting and sputtering pressure sensors, which integrates the pads of the two sensors into a single circuit board. By optimizing the design of the middle lead hole and considering the strength of the gold wire or aluminum wire and the length of the bonding wire, it is ensured that the two sensors can be effectively wire-bonded on the same circuit board while meeting the strength standards. In addition, in order to enable the two sensors to use the same circuit board and output electrical signals normally, a circuit integration design was performed based on the original independent circuit diagram. The specific method is to connect the pads of the two types of sensors in series, and connect the sensors to their corresponding pads according to different pressure sensing requirements. Since the unconnected pads are in an open circuit state, they will not interfere with the circuit signals currently in use. This integration method not only simplifies the production process, but also improves the overall performance and reliability of the system.

[0042] In such Figure 1 In the described circuit board layout, the first interface hole J1, the second interface hole J2, and the third interface hole J3 are interface holes for connecting the upper and lower layers of the circuit board. The interface holes are not only responsible for signal transmission, but also provide structural support for the upper circuit board. Its asymmetric distribution design helps to prevent assembly errors and plays a role in positioning and foolproofing. The sputtered thin film pressure sensor and the glass micro-melting pressure sensor each have an independent wire bonding area, which is dedicated to their respective wire bonding processes. The middle lead hole is specially designed to adapt to the layout of strain resistors on different sensors, and the shape of the middle lead hole is optimized to reduce the possible contact between the gold or aluminum lead and the edge of the hole during the bonding process. Considering the strength of the lead, such a design is also intended to prevent breakage during the wire bonding (wire bonding) process. The first resistor R1, the second resistor R2, the third resistor R3, and the fourth resistor R4 in the circuit board are four precision resistors. Precision resistors play the role of compensating or adjusting the resistance value in the Wheatstone bridge circuit and are key components for achieving accurate measurement. In actual operation, after completing wire bonding according to the designated areas of the two sensors, the first resistor R1, the second resistor R2, the third resistor R3, and the fourth resistor R4 are connected according to the wiring definition to ensure that the sensors can accurately output signals.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit its protection scope. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that after reading the utility model, those skilled in the art can still make various changes, modifications or equivalent substitutions to the specific implementation methods of the utility model, but these changes, modifications or equivalent substitutions are all within the protection scope of the pending claims of the utility model.

Claims

1. A micro-melting and sputtering pressure sensor integrated wire bonding plate, characterized in that: The invention comprises an interface hole, three of which are arranged on a circuit board, a pressure sensor pad is attached to the circuit board, a pressure sensor bonding area is arranged on the pressure sensor pad, and the pressure sensor bonding area comprises a sputtered thin film pressure sensor bonding area (1), a glass micro-melting pressure sensor bonding area (2) and an intermediate lead hole (3); the intermediate lead hole (3) is arranged between the sputtered thin film pressure sensor bonding area (1) and the glass micro-melting pressure sensor bonding area (2), and a lead bonding point is arranged in the pressure sensor bonding area.

2. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The pressure sensor pads include sputtered thin film pressure sensor pads and glass micro-melting pressure sensor pads, and the sputtered thin film pressure sensor pads are connected in series with the glass micro-melting pressure sensor pads.

3. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The sputtering thin film pressure sensor wire bonding area (1) and the glass micro-melting pressure sensor wire bonding area (2) are independently arranged.

4. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: A safety distance is set between the sputtering thin film pressure sensor bonding area (1) and the glass micro-melting pressure sensor bonding area (2) and the middle lead hole (3).

5. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The bonding area (1) of the sputtered thin film pressure sensor is semi-annular.

6. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The bonding area (2) of the glass micro-melting pressure sensor is rectangular.

7. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The middle lead hole (3) is in a combined shape with one end being semicircular and the other end being rectangular.

8. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: The interface holes include a first interface hole (J1), a second interface hole (J2) and a third interface hole (J3), and the first interface hole (J1), the second interface hole (J2) and the third interface hole (J3) are asymmetrically arranged.

9. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 1, characterized in that: A resistor is arranged on the circuit board, and the interface hole is connected to the resistor.

10. The integrated wire bonding plate for micro melting and sputtering pressure sensor according to claim 9, characterized in that: Four resistors are provided, and the four resistors are connected to the bonding area of ​​the pressure sensor.

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