Loop type two-phase flow radiator

Abstract

The utility model discloses a loop type two-phase flow radiator, which comprises a substrate and a capillary structure assembly, and the capillary structure assembly is arranged on the substrate. The capillary structure assembly comprises a copper shell which is installed on a substrate and is at least partially buried in the substrate; the capillary sintered block is arranged in the copper shell, and a high-density area and a low-density area are formed on the capillary sintered block; the first end and the second end of the backflow pipe are connected to the copper shell, the first end corresponds to the high-density area of the capillary sintered block, and the second end corresponds to the low-density area of the capillary sintered block; the capillary sintering block absorbs heat of a heat source; a fluid medium is arranged in the backflow pipe, the fluid medium is vaporized from a liquid state to a gas state in the process of flowing from a high-density area to a low-density area of the capillary sintered block, the fluid medium is liquefied from the gas state to the liquid state in the process of flowing from the second end to the first end in the backflow pipe, and heat of a heat source is evenly distributed to the base plate in the fluid medium circulating flowing process. And the heat dissipation effect is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and more specifically to a loop-type two-phase flow radiator. Background Art

[0002] Due to the rapid development and application of communication equipment, the requirements for equipment heat dissipation have become increasingly stringent, and traditional fin-type radiators can no longer meet the heat dissipation needs in a limited space. To solve this type of heat dissipation problem, fan forced convection is often used, or water cooling is used, or heat pipe-assisted heat transfer is used to heat the evaporation section of the heat pipe, and the working fluid in the tube core evaporates and takes away heat. This heat is the latent heat of evaporation of the working fluid. The steam flows from the central channel to the condensation section of the heat pipe, condenses into liquid, and releases latent heat at the same time. Under the action of capillary force, the liquid flows back to the evaporation section. In this way, a closed cycle is completed, thereby transferring a large amount of heat from the heating section to the heat dissipation section. However, fan-forced convection requires sufficient heat dissipation space to install the fan and consumes electricity. Although water cooling has a better heat dissipation effect, it requires a larger space for cooling equipment and has a higher cost. Due to its structure, the heat pipe has a linear temperature uniformity and can pass through a limited area, so the temperature uniformity is not high. For small-area heat sources and space constraints, the heat pipe temperature uniformity is not ideal. As the product gradually develops towards high power and high integration, the heat pipe can no longer meet the demand. In order to effectively improve the heat dissipation efficiency, the applicant has filed the following patent application: CN117202598A loop-type two-phase flow radiator, which also includes a heat dissipation base and a capillary evaporation component. A capillary structure is sintered in the cavity, and a first partition step and a second partition step are also provided in the base, a first reflux hole is provided in the first partition step, and a second reflux hole is provided in the second partition step. When the liquid medium flows into the reflux cavity and vaporizes when flowing through the capillary structure, the steam flows to the buffer cavity and then flows from the buffer cavity into the cooling pipe. However, in fact, with this existing technology, when the liquid enters the capillary evaporation cavity from the reflux cavity and is then evaporated into steam, the difference between the high pressure and the low pressure generated is not enough to push the steam to flow toward the buffer cavity. The steam may be retained in the capillary evaporation cavity or even reflux into the reflux cavity. The fluid medium can no longer circulate in the entire capillary evaporation component, and the heat dissipation effect will be greatly reduced.

[0003] Therefore, the applicant once again filed the following patent application. Utility Model Content

[0004] In view of this, the utility model provides a loop-type two-phase flow radiator.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a loop-type two-phase flow radiator, comprising: a substrate and a capillary structure component, wherein the capillary structure component is mounted on the substrate;

[0006] The capillary structure component comprises:

[0007] A copper housing is mounted on the substrate and is at least partially buried in the substrate;

[0008] The capillary sintered block is arranged inside the copper shell, and the capillary sintered block forms a high-density area and a low-density area;

[0009] A reflux pipe, wherein the first end and the second end are both connected to the copper housing, and the first end corresponds to the high-density area of ​​the capillary sintered block, and the second end corresponds to the low-density area of ​​the capillary sintered block;

[0010] The capillary sintered blocks absorb heat from the heat source;

[0011] A fluid medium is arranged in the reflux pipe. The fluid medium vaporizes from liquid to gas during the flow from the high-density area to the low-density area of ​​the capillary sintered block. The fluid medium liquefies from gas to liquid during the flow from the second end to the first end in the reflux pipe. The heat of the heat source is evenly distributed to the substrate during the circulation of the fluid medium.

[0012] As a preferred solution of the utility model, the copper shell includes: a main body shell, an upper end cover and a lower end cover, and the upper end cover and the lower end cover are symmetrically installed at the front end and the rear end of the main body shell;

[0013] A liquid medium buffer cavity is formed between the high-density area of ​​the capillary sintered block and the upper end cover; and a gaseous medium buffer cavity is formed between the low-density area of ​​the capillary sintered block and the lower end cover.

[0014] As a preferred solution of the utility model, the first end of the reflux pipe is connected to the liquid medium buffer cavity, the second end of the reflux pipe is connected to the gaseous medium buffer cavity, and the reflux pipe is arranged circuitously on the substrate.

[0015] As a preferred solution of the utility model, the capillary sintered block is in the shape of a powder cake formed by sintering copper powder, and capillary pores are formed in the capillary sintered block.

[0016] As a preferred solution of the utility model, a plurality of cavities are formed in the low-density area of ​​the capillary sintered block, and the plurality of cavities are opened along the flow direction of the fluid medium in the capillary sintered block.

[0017] As a preferred solution of the utility model, the cavity is connected to the gaseous medium buffer chamber.

[0018] As a preferred solution of the utility model, the reflux pipe includes: a thick gas phase pipe and a thin reflux pipe, and the diameter of the thick gas phase pipe is larger than the diameter of the thin reflux pipe;

[0019] One end of the gas phase thick tube is connected to the copper shell and corresponds to the low-density area of ​​the capillary sintered block, and the other end is connected to the reflux thin tube; the other end of the reflux thin tube is connected to the copper shell and corresponds to the high-density area of ​​the capillary sintered block.

[0020] As a preferred solution of the utility model, the connection between the thick gas phase tube and the thin reflux tube is arranged with a diameter gradually decreasing along the flow direction of the fluid medium.

[0021] As a preferred solution of the utility model, the capillary structure component is installed on the lower surface of the substrate, and the upper surface of the substrate is provided with heat dissipation scraper teeth.

[0022] It can be seen from the above technical scheme that compared with the prior art, the utility model has the following beneficial technical effects: the utility model manufactures the capillary sintered block to form a low-density area and a high-density area. After the liquid fluid medium enters the copper shell, it flows from the high-density area to the low-density area. In this process, a large amount of heat is absorbed and vaporized to generate steam. Due to the different densities of the high-density area and the low-density area, the flow of the fluid medium is effectively promoted, especially the fluid medium is effectively promoted to flow from the high-density area to the low-density area; after the fluid medium vaporizes to generate steam and flows to the low-density area, the rear side of the copper shell (i.e., the side where the gaseous medium buffer cavity is formed) forms a high pressure, and the opposite front side (i.e., the side where the liquid medium buffer cavity is formed) forms a low pressure. In addition, the fluid medium flows from the high-density area to the low-density area inside the copper shell. Under the action of the pressure difference, the steam is effectively promoted to flow back from the second end to the first end in the reflux pipe, effectively completing the continuous circulation of the fluid medium, effectively distributing the heat of the heat source evenly on the substrate, and greatly improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of the loop-type two-phase flow radiator of the utility model;

[0025] Figure 2 This is a schematic structural diagram of the loop-type two-phase flow radiator of the utility model from another angle;

[0026] Figure 3 It is an exploded diagram of the loop-type two-phase flow radiator of the utility model;

[0027] Figure 4 for Figure 3 The enlarged view of point A in the middle;

[0028] Figure 5 It is a schematic diagram of a capillary structure component in a loop-type two-phase flow radiator of the utility model;

[0029] Figure 6It is a cross-sectional view of the capillary sintered block installed in the copper shell in the loop-type two-phase flow radiator of the utility model;

[0030] Figure 7 It is a cross-sectional view of the capillary sintered block in the loop-type two-phase flow radiator of the utility model.

[0031] Description of Reference Numerals

[0032] Substrate 100; mounting groove 101; heat dissipation shovel teeth 110; capillary structure component 200; liquid medium buffer cavity 201; gaseous medium buffer cavity 202; copper shell 210; main body shell 211; upper end cover 212; lower end cover 213; capillary sintered block 220; high-density area 221; low-density area 222; cavity 2221; reflux pipe 230; gas phase thick pipe 231; reflux thin pipe 232. DETAILED DESCRIPTION

[0033] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0034] Loop type two-phase flow radiator, please refer to Figure 1-7 As shown, it includes: a substrate 100 and a capillary structure component 200 , and the capillary structure component 200 is installed on the substrate 100 .

[0035] The substrate 100 is generally made of aluminum profiles. Aluminum has good thermal conductivity and can absorb heat from a heat source very well, thus achieving good heat dissipation effect.

[0036] The capillary structure component 200 comprises:

[0037] The copper housing 210 is mounted on the substrate 100 and at least partially buried in the substrate 100;

[0038] The capillary sintered block 220 is disposed inside the copper housing 210 , and the capillary sintered block 220 is formed with a high-density area 221 and a low-density area 222 ;

[0039] A return pipe 230, the first end and the second end are both connected to the copper housing 210, and the first end corresponds to the high-density area 221 of the capillary sintered block 220, and the second end corresponds to the low-density area 222 of the capillary sintered block 220;

[0040] The capillary sintered block 220 absorbs heat from the heat source;

[0041] A fluid medium is arranged in the reflux pipe 230. The fluid medium vaporizes from liquid to gas during the flow from the high-density area 221 to the low-density area 222 of the capillary sintered block 220. The fluid medium liquefies from gas to liquid during the flow from the second end to the first end in the reflux pipe 230. During the circulation of the fluid medium, the heat from the heat source is evenly distributed to the substrate 100.

[0042] Specifically, the copper shell 210 is made of copper material, and a chamber is formed inside the copper shell 210. The capillary sintered block 220 is arranged in the chamber. Since the fluid medium evaporates from liquid to gas in the process of flowing from the high-density area 221 to the low-density area 222 of the capillary sintered block 220, the chamber should be closed to prevent the fluid medium from overflowing and causing the fluid medium in the circulation path to become less and less or even dry up; so as to keep the quality of the gas-liquid two-phase fluid medium in the entire loop-type two-phase flow radiator unchanged.

[0043] During the manufacturing process, copper powder is sintered in the copper shell 210 to form a capillary sintered block 220. A large number of capillary pores are formed in the capillary sintered block 220. When the liquid fluid medium flows through the capillary sintered block 220, it passes through the capillary pores in the capillary sintered block 220 and absorbs heat, and evaporates into steam.

[0044] The return pipe 230 is fixedly connected to the copper shell 210 , and the return pipe 230 is in communication with the chamber of the copper shell 210 ; the return pipe 230 may also be made of copper, which has good thermal conductivity and better heat exchange.

[0045] like Figure 2-3 As shown, since the substrate 100 in this embodiment is arranged in a plate shape, the copper shell 210 is correspondingly arranged in a rectangular plate shape, and the capillary sintered block 220 is arranged in the copper shell 210 and is in close contact with the inner wall surface of the copper shell 210;

[0046] Furthermore, if Figure 1 and Figure 3 As shown, the capillary structure component 200 is buried in the substrate 100, which can increase the contact between the copper shell 210 and the return pipe 230 in the capillary structure component 200 and the substrate 100, and better transfer heat to the substrate 100;

[0047] The capillary structure component 200 can be installed in the substrate 100 in two ways. The first is to reserve an installation groove 101 when manufacturing the substrate 100, and the capillary structure component 200 is embedded and assembled in the installation groove 101; the second is to assemble the capillary structure component 200 and then cast the capillary structure component 200 and the substrate 100 into one body when manufacturing the substrate 100.

[0048] Further, continue as Figure 1As shown, after the capillary structure component 200 is installed on the substrate 100, the entire capillary structure component 200 is completely embedded in the substrate 100, and the surface of the copper shell 210 is flush with the lower surface of the substrate 100, which is convenient for the heat source to contact with the surface of the copper shell 210 during assembly. The copper material has good thermal conductivity and can well absorb the heat from the heat source and transfer it to the capillary sintered block 220;

[0049] Optionally, the capillary structure component 200 may also be partially embedded in the substrate 100, that is, after the copper shell 210 is assembled in the mounting groove 101, it can partially protrude from the lower surface of the substrate 100, and the return pipe 230 can be completely embedded in the mounting groove 101; or after the copper shell 210 is assembled in the mounting groove 101, it can partially protrude from the lower surface of the substrate 100, and the return pipe 230 can also partially protrude from the mounting groove 101; this method can also facilitate contact with the heat source.

[0050] Here, the heat source has not been drawn in the figure. The heat source can be a high-power chip, etc. The specific type and structure of the heat source are different depending on the application scenario.

[0051] Furthermore, after the capillary structure component 200 is assembled in the mounting groove 101 , it can be filled with glue and fixed by soldering, so that the assembly is more stable.

[0052] In one embodiment, the copper shell 210 includes: a main shell 211, an upper end cover 212 and a lower end cover 213, wherein the upper end cover 212 and the lower end cover 213 are symmetrically mounted at the front end and the rear end of the main shell 211;

[0053] A liquid medium buffer chamber 201 is formed between the high-density region 221 of the capillary sintered block 220 and the upper end cover 212 ; a gaseous medium buffer chamber 202 is formed between the low-density region 222 of the capillary sintered block 220 and the lower end cover 213 .

[0054] Specifically, the length of the capillary sintered block 220 is less than the length of the chamber of the copper shell 210 , and the width of the capillary sintered block 220 is equal to the width of the chamber of the copper shell 210 , so that a liquid medium buffer chamber 201 and a gaseous medium buffer chamber 202 are formed in the copper shell 210 .

[0055] like Figure 6-7 As shown, the copper shell 210 is defined as a front side and a rear side along its length direction, and the capillary sintered block 220 is set as a high-density area 221 near the front side inside the copper shell 210, and is set as a low-density area 222 near the rear side;

[0056] Continue as Figure 7 As shown, the high density area 221 and the low density area 222 in the capillary sintered block 220 are Figure 7 The A-A' line in the middle is the division. Obviously, the volume of the high-density area 221 is smaller than that of the low-density area 222; Figure 7The volume of the medium-high density area 221 is approximately one-third of the volume of the low-density area 222. Of course, the volume ratio of the high-density area 221 and the low-density area 222 can be changed.

[0057] Furthermore, a plurality of cavities 2221 are formed in the low-density region 222 of the capillary sintered block 220, and the plurality of cavities 2221 are opened along the flow direction of the fluid medium in the capillary sintered block 220, that is, Figure 6-7 In the embodiment, the cavity 2221 extends along the length direction of the capillary sintered block 220;

[0058] from Figure 7 There are no capillary pores on the capillary sintered block 220 shown in the figure, but in fact many irregular capillary pores are formed on the capillary sintered block 220. When the liquid fluid medium flows through the capillary pores, it will quickly absorb the heat of the capillary sintered block 220 and quickly evaporate into steam.

[0059] Specifically, Figure 7 As shown, the cavities 2221 are in the shape of long strips and are arranged in multiple groups, which is equivalent to having a larger flow space in the low-density area 222, so that the fluid medium flows from the high-density area 221 to the low-density area 222;

[0060] The steam flows to the low-density area 222 and accumulates on the rear side of the copper shell 210, i.e., the gaseous medium buffer chamber 202, so that high pressure is formed on the rear side of the copper shell 210 and low pressure is formed on the front side of the copper shell 210. The gaseous pressure difference pushes the fluid medium to flow from the second end to the first end in the return pipe 230.

[0061] Optionally, without setting the cavity 2221, the capillary sintered block 220 is formed with a high-density zone 221 and a low-density zone 222. It can be understood that the diameter of the capillary pores in the high-density zone 221 of the capillary sintered block 220 is smaller than the diameter of the capillary pores in the low-density zone 222 of the capillary sintered block 220, that is, there is a larger flow space in the low-density zone 222, which prompts the fluid medium to flow from the high-density zone 221 to the low-density zone 222; or the overall volume of the capillary pores in the high-density zone 221 is smaller than the overall volume of the capillary pores in the low-density zone 222, that is, there is a larger flow space in the low-density zone 222, which prompts the fluid medium to flow from the high-density zone 221 to the low-density zone 222.

[0062] In one embodiment, the first end of the reflux pipe 230 is connected to the liquid medium buffer chamber 201, and the second end of the reflux pipe 230 is connected to the gaseous medium buffer chamber 202. The reflux pipe 230 is disposed on the substrate 100 in a circuitous manner.

[0063] The first end of the return pipe 230 passes through the fluid hole of the upper end cover 212 and communicates with the liquid medium buffer chamber 201. The first end of the return pipe 230 and the upper end cover 212 can be welded and fixed;

[0064] The second end of the return pipe 230 passes through the fluid hole of the lower end cover 213 and communicates with the gaseous medium buffer chamber 202 . The second end of the return pipe 230 and the lower end cover 213 can be welded and fixed.

[0065] In addition, an injection pipe can be connected to the upper end cover 212 or the lower end cover 213, and a fluid medium can be injected through the injection pipe. The fluid medium can be a coolant or water. After the fluid medium is injected, the injection pipe can be removed and the injection port can be sealed.

[0066] like Figure 1 As shown, the circuitous arrangement of the return pipe 230 can increase the length of the flow path of the fluid medium and perform better heat exchange;

[0067] The gaseous fluid medium releases heat during the flow in the return pipe 230, and transfers the heat to the substrate 100 through the return pipe 230. The longer the return pipe 230 is distributed in the substrate 100, the wider the distribution area, the better the heat can be transferred to the substrate 100, and the heat can be transferred to the substrate 100 more evenly.

[0068] When the gaseous fluid medium releases heat in the return pipe 230 , the gaseous fluid medium gradually liquefies into a liquid fluid medium and flows back to the first end of the return pipe 230 .

[0069] In one embodiment, the reflux pipe 230 includes: a thick gas phase pipe 231 and a thin reflux pipe 232. The diameter of the thick gas phase pipe 231 is larger than the diameter of the thin reflux pipe 232, and the length of the thick gas phase pipe 231 is larger than the length of the thin reflux pipe 232, so that the gaseous fluid medium can release heat better.

[0070] One end of the gas phase thick tube 231 is connected to the copper shell 210 and corresponds to the low density area 222 of the capillary sintered block 220, and the other end is connected to the reflux thin tube 232; the other end of the reflux thin tube 232 is connected to the copper shell 210 and corresponds to the high density area 221 of the capillary sintered block 220;

[0071] Furthermore, if Figure 4 As shown, the connection between the gas phase thick tube 231 and the return thin tube 232 is arranged with a gradually decreasing diameter along the flow direction of the fluid medium, which helps to promote the unidirectional flow of the fluid medium through capillary force, and also prevents the sudden change of the pipe diameter of the return tube 230 from causing a reverse impact force and interfering with the flow of the fluid medium.

[0072] In one embodiment, the capillary structure component 200 is mounted on the lower surface of the substrate 100 , and the upper surface of the substrate 100 is provided with heat dissipation scraper teeth 110 .

[0073] The shape of the substrate 100 can be as follows: Figure 2The plate-shaped substrate 100 is shown in FIG. 1 , and heat dissipation shovel teeth 110 are arranged on the upper surface of the plate-shaped substrate 100 to form a heat dissipation base; heat dissipation gaps are formed between the heat dissipation shovel teeth 110, and the substrate 100 and the heat dissipation shovel teeth 110 are made of aluminum material, which has good thermal conductivity, and the heat dissipation base has a large contact area with the airflow when the airflow blows through the heat dissipation base, so as to achieve the purpose of rapid heat dissipation;

[0074] Optionally, the heat dissipation scraper teeth 110 may be formed on the upper surface of the substrate 100, may be welded on the upper surface of the substrate 100, or may be riveted on the upper surface of the substrate 100, etc., as long as effective and good contact can be achieved;

[0075] In addition, the shape of the substrate 100 can be changed according to the actual application scenario of the loop-type two-phase flow heat sink, and its size and shape can be changed.

[0076] Furthermore, according to the different number of heat sources and the different area of ​​the substrate 100, the wiring path and length of the return pipe 230 can be changed, and the number of the capillary structure components 200 can be changed, such as Figure 1 As shown, in this embodiment, two groups of capillary structure components 200 are arranged on the substrate 100. The two groups of capillary structure components 200 are independent of each other. The number of capillary structure components 200 can be increased according to actual needs.

[0077] The specific use principle of the utility model is further described below:

[0078] The loop-type two-phase flow radiator of the utility model is connected to a heat source, and the heat source is preferably in direct contact with the copper shell 210, so that the heat of the heat source is transferred to the copper shell 210 and absorbed by the capillary sintered block 220;

[0079] The liquid fluid medium flows into the liquid medium buffer cavity 201 and flows to the high-density area 221 of the capillary sintered block 220. The liquid fluid medium continuously penetrates into the capillary sintered block 220 and absorbs heat. Since the low-density area 222 of the capillary sintered block 220 is provided with a cavity 2221, the gas-liquid two-phase flow medium flows to the low-density area 222. Steam continuously gathers in the gaseous medium buffer cavity 202, so that a low pressure is formed on the front side of the copper shell 210 and a high pressure is formed on the rear side, that is, the side provided with the liquid medium buffer cavity 201 is low pressure, and the side provided with the gaseous fluid medium buffer cavity 202 is high pressure. Then, the gaseous fluid medium enters the reflux pipe 230 from the second end and flows from the second end to the first end under the condition of pressure difference.

[0080] The gaseous fluid medium releases heat during the flow in the return pipe 230, and the heat is transferred to the substrate 100 through the return pipe 230. Since the return pipe 230 is arranged in a circuitous manner, the heat can be transferred to the substrate 100 as evenly as possible, and the heat dissipation effect is better;

[0081] When the fluid medium flows to the connection between the gas phase thick tube 231 and the reflux thin tube 232 , the capillary force pushes the fluid medium to flow better into the reflux thin tube 232 and then into the liquid medium buffer chamber 201 .

[0082] During the entire flow process, the fluid medium flowing into the liquid medium buffer cavity 201 is basically liquid, and the liquid fluid medium vaporizes into steam in the copper shell 210, then the fluid medium flowing into the second end of the return pipe 230 is gaseous fluid medium, and the gaseous fluid medium releases heat during the flow in the return pipe 230, and gradually forms a liquid fluid medium. However, it is worth noting that there is a gas-liquid two-phase flow state in the process of the fluid medium flowing in the return pipe 230.

[0083] Then, during the circulation of the fluid medium, the heat absorption and heat release process is completed through the transformation between the gas phase and the liquid phase, effectively absorbing the heat from the heat source and transferring it to the substrate 100. The circulation of the liquid medium in the loop-type two-phase flow radiator is driven by the capillary force generated by the capillary structure and the gas pressure difference, and no external power is required.

[0084] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. Loop type two-phase flow radiator, characterized by: include: A substrate and a capillary structure component, wherein the capillary structure component is mounted on the substrate; The capillary structure component comprises: A copper housing is mounted on the substrate and is at least partially buried in the substrate; The capillary sintered block is arranged inside the copper shell, and the capillary sintered block forms a high-density area and a low-density area; A reflux pipe, wherein the first end and the second end are both connected to the copper housing, and the first end corresponds to the high-density area of ​​the capillary sintered block, and the second end corresponds to the low-density area of ​​the capillary sintered block; The capillary sintered blocks absorb heat from the heat source; A fluid medium is arranged in the reflux pipe. The fluid medium vaporizes from liquid to gas during the flow from the high-density area to the low-density area of ​​the capillary sintered block. The fluid medium liquefies from gas to liquid during the flow from the second end to the first end in the reflux pipe. The heat of the heat source is evenly distributed to the substrate during the circulation of the fluid medium.

2. The loop type two-phase flow radiator according to claim 1, characterized in that: The copper shell comprises: a main body shell, an upper end cover and a lower end cover, wherein the upper end cover and the lower end cover are symmetrically mounted at the front end and the rear end of the main body shell; A liquid medium buffer cavity is formed between the high-density area of ​​the capillary sintered block and the upper end cover; and a gaseous medium buffer cavity is formed between the low-density area of ​​the capillary sintered block and the lower end cover.

3. The loop-type two-phase flow radiator according to claim 2, characterized in that: The first end of the reflux pipe is connected to the liquid medium buffer cavity, the second end of the reflux pipe is connected to the gaseous medium buffer cavity, and the reflux pipe is arranged on the substrate in a circuitous manner.

4. The loop-type two-phase flow radiator according to claim 1, characterized in that: The capillary sintered block is in the form of a powder cake formed by sintering copper powder, and capillary pores are formed in the capillary sintered block.

5. The loop-type two-phase flow radiator according to claim 4, characterized in that: A plurality of cavities are formed in the low-density area of ​​the capillary sintered block, and the plurality of cavities are opened along the flow direction of the fluid medium in the capillary sintered block.

6. The loop-type two-phase flow radiator according to claim 5, characterized in that: The cavity is communicated with the gaseous medium buffer cavity.

7. The loop-type two-phase flow radiator according to any one of claims 1 to 6, characterized in that: The reflux pipe comprises: a thick gas phase pipe and a thin reflux pipe, wherein the diameter of the thick gas phase pipe is larger than the diameter of the thin reflux pipe; One end of the gas phase thick tube is connected to the copper shell and corresponds to the low-density area of ​​the capillary sintered block, and the other end is connected to the reflux thin tube; the other end of the reflux thin tube is connected to the copper shell and corresponds to the high-density area of ​​the capillary sintered block.

8. The loop-type two-phase flow radiator according to claim 7, characterized in that: The connection between the gas phase thick tube and the reflux thin tube is arranged with a diameter gradually decreasing along the flow direction of the fluid medium.

9. The loop type two-phase flow radiator according to claim 8, characterized in that: The capillary structure component is installed on the lower surface of the substrate, and the upper surface of the substrate is provided with heat dissipation shovel teeth.

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