COB structure device packaged by novel material

Abstract

The utility model discloses a COB structure device packaged by a novel material. The COB structure device comprises a circuit board, an LED wafer and a packaging layer. The LED wafer sequentially comprises a substrate, a semiconductor layer, two welding pads and a first insulating layer from top to bottom, the substrate adopts a cuprous iodide substrate, the semiconductor layer comprises a P-type semiconductor layer and an N-type semiconductor layer, the two welding pads are arranged on the first insulating layer at intervals, and the first insulating layer is arranged between the two welding pads. The P-type semiconductor layer and the N-type semiconductor layer are respectively connected with the corresponding welding pads, and the two welding pads are respectively connected with a conductive layer on the circuit board; the substrate is a cuprous iodide substrate, and the packaging layer is coated outside the LED chip and the substrate; the substrate adopts the cuprous iodide substrate, so that good ohmic contact with a metal motor can be better formed, and the reliability of a COB structure device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a COB structure device packaged with a new material. Background Art

[0002] COB (Chip On Board), also known as chip direct mounting technology, fixes the bare chip directly on the printed circuit board, then performs wire bonding, and then uses organic glue to encapsulate and protect the chip and wires, thereby achieving electrical and mechanical connection between the chip and the circuit board electrodes.

[0003] The COB structure devices in the prior art usually use gallium nitride single crystal substrate or silicon-based gallium nitride substrate. Gallium nitride is a compound of nitrogen and gallium and is a direct bandgap semiconductor. Since the bandgap of gallium nitride is very wide and the polarity is too large, it can only use high doping to achieve ohmic contact, which is more complicated in process and has poor reliability. Utility Model Content

[0004] In view of the defects in the prior art, the purpose of the utility model is to provide a COB structure device packaged with a new material, which has high reliability.

[0005] The technical solution adopted by the utility model is:

[0006] A COB structure device packaged with a new material comprises a circuit board, an LED chip and a packaging layer; the LED chip comprises a substrate, a semiconductor layer, a welding pad and a first insulating layer from top to bottom, the substrate adopts a cuprous iodide substrate, the semiconductor layer comprises a P-type semiconductor layer and an N-type semiconductor layer, the welding pads are two arranged on the first insulating layer at intervals, the P-type semiconductor layer and the N-type semiconductor layer are respectively connected to the corresponding welding pads, and the two welding pads are respectively connected to the conductive layer on the circuit board; the substrate adopts a cuprous iodide substrate, and the packaging layer is coated on the outside of the LED chip and the substrate.

[0007] Furthermore, the LED chip further includes a reflective layer, and the reflective layer is arranged on the lower side of the substrate.

[0008] Furthermore, the LED chip also includes a P pole and an N pole, the two ends of the P pole are respectively connected to the P-type semiconductor layer and the conductive layer of the circuit board, and the two ends of the N pole are respectively connected to the N-type semiconductor layer and the conductive layer of the circuit board.

[0009] Furthermore, it also includes a solder paste layer, which is arranged between the first insulating layer and the conductive layer of the circuit board and is connected to the corresponding P pole or N pole respectively.

[0010] Furthermore, the P-type semiconductor layer and the N-type semiconductor layer are respectively connected to the corresponding bonding pads through solder balls.

[0011] Furthermore, a cavity is formed below the first insulating layer and between the two conductive layers, and the cavity is filled with a high thermal conductivity insulating material.

[0012] Furthermore, the encapsulation layer is made of epoxy resin or silicone material.

[0013] Furthermore, the outer surface of the packaging layer is also provided with a nano-coating.

[0014] Furthermore, the circuit board includes a substrate and a second insulating layer on the substrate, and the conductive layer is arranged on the second insulating layer.

[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0017] Figure 1 A schematic diagram of the structure of a COB structure device packaged with a new material provided in an embodiment of the present application.

[0018] Among them, there are substrate 1, reflective layer 2, P-type semiconductor layer 3, solder pad 4, P pole 5, solder paste layer 6, packaging layer 7, nano-coating 8, solder ball 9, N-type semiconductor layer 10, N pole 11, first insulating layer 12, hole 13, substrate 14, second insulating layer 15, and conductive layer 16. DETAILED DESCRIPTION

[0019] Here, it should be noted that the functions and methods involved in the present invention are merely conventional adaptive applications of the prior art. Therefore, the improvement of the present invention on the prior art is essentially the connection relationship between the hardware, rather than the functions and methods themselves. That is, although the present invention involves some functions and methods, it does not include improvements to the functions and methods themselves. The description of the functions and methods in the present invention is to better illustrate the present invention so as to better understand the present invention.

[0020] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0021] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0022] See also Figure 1 The present application discloses a COB structure device packaged with a new material, comprising a circuit board, an LED chip and a packaging layer 7; the LED chip comprises a substrate 1, a semiconductor layer, a welding pad 4 and a first insulating layer 12 from top to bottom, the substrate 1 adopts a cuprous iodide substrate 1, the semiconductor layer comprises a P-type semiconductor layer 3 and an N-type semiconductor layer 10, the welding pad 4 is two spaced apart on the first insulating layer 12, the P-type semiconductor layer 3 and the N-type semiconductor layer 10 are respectively connected to the corresponding welding pads 4, and the two welding pads 4 are respectively connected to the conductive layer 16 on the circuit board; the substrate 1 adopts a cuprous iodide substrate 1, and the packaging layer 7 is coated on the outside of the LED chip and the substrate 1.

[0023] The present application arranges the LED chip as a substrate 1, a P-type semiconductor layer 3, an N-type semiconductor layer 10, a pad 4 and a first insulating layer 12, wherein the P-type semiconductor layer 3 and the N-type semiconductor layer 10 are respectively connected to the corresponding pads 4, so that the LED chip has a flip-chip structure and better heat dissipation; the substrate 1 adopts a cuprous iodide substrate 1, which can better form a good ohmic contact with the metal motor, thereby improving the reliability of the COB structure device.

[0024] The substrate 1 of the LED chip is located at the uppermost side, and a light-emitting layer and a reflective layer 2 are also provided on the lower side of the substrate 1. The reflective layer 2 is a step-like structure, and the P-type semiconductor layer 3 and the N-type semiconductor layer 10 are respectively arranged above and below the step of the reflective layer 2; the P-type semiconductor layer 3 and the N-type semiconductor layer 10 are respectively connected to the corresponding solder pads 4 through solder balls 9.

[0025] In order to achieve connection with the circuit board, the LED chip also includes a P pole 5 and an N pole 11, the two ends of the P pole 5 are respectively connected to the P-type semiconductor layer 3 and the conductive layer 16 of the circuit board, and the two ends of the N pole 11 are respectively connected to the N-type semiconductor layer 10 and the conductive layer 16 of the circuit board.

[0026] Specifically, it also includes a solder paste layer 6, which is arranged between the first insulating layer 12 and the conductive layer 16 of the circuit board and is connected to the corresponding P pole 5 or N pole 11 respectively.

[0027] In order to achieve better heat dissipation, a cavity 13 is formed below the first insulating layer 12 and between the two conductive layers 16 , and the cavity 13 is filled with a high thermal conductivity insulating material.

[0028] The circuit board includes a substrate 14 and a second insulating layer 15 on the substrate 14 , and the conductive layer 16 is disposed on the second insulating layer 15 .

[0029] The encapsulation layer 7 is made of epoxy resin or silicone material, which is encapsulated on the outside of the LED chip and the solder paste layer 6 after curing; the outer surface of the encapsulation layer 7 is also provided with a nano-coating 8 to further improve the reliability of the device of the present application.

[0030] In this application, unless otherwise clearly specified and limited, the terms "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0031] In the specification of the present utility model, a lot of specific details are described. However, it is understood that the embodiments of the present utility model can be practiced without these specific details. In some examples, well-known methods, systems and techniques are not shown in detail so as not to obscure the understanding of this specification.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, systems, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, systems, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.

Claims

1. A COB structure device packaged with a new material, characterized in that: It comprises a circuit board, an LED chip and a packaging layer; the LED chip comprises a substrate, a semiconductor layer, a welding pad and a first insulating layer from top to bottom, the substrate adopts a cuprous iodide substrate, the semiconductor layer comprises a P-type semiconductor layer and an N-type semiconductor layer, two welding pads are arranged on the first insulating layer at intervals, the P-type semiconductor layer and the N-type semiconductor layer are respectively connected to the corresponding welding pads, and the two welding pads are respectively connected to the conductive layer on the circuit board; the substrate adopts a cuprous iodide substrate, and the packaging layer is coated on the outside of the LED chip and the substrate.

2. The COB structure device packaged with a new material according to claim 1, characterized in that: The LED chip further includes a light reflecting layer, and the light reflecting layer is arranged on the lower side of the substrate.

3. The COB structure device packaged with a new material according to claim 1, characterized in that: The LED chip also includes a P pole and an N pole, wherein two ends of the P pole are respectively connected to the P-type semiconductor layer and the conductive layer of the circuit board, and two ends of the N pole are respectively connected to the N-type semiconductor layer and the conductive layer of the circuit board.

4. The COB structure device packaged with a new material according to claim 3, characterized in that: It also includes a solder paste layer, which is arranged between the first insulating layer and the conductive layer of the circuit board and is connected to the corresponding P pole or N pole respectively.

5. The COB structure device packaged with a new material according to claim 1, characterized in that: The P-type semiconductor layer and the N-type semiconductor layer are respectively connected to the corresponding bonding pads through solder balls.

6. The COB structure device packaged with a new material according to claim 1, characterized in that: A cavity is formed below the first insulating layer and between the two conductive layers, and the cavity is filled with a high thermal conductivity insulating material.

7. The COB structure device packaged with a new material according to claim 1, characterized in that: The packaging layer is made of epoxy resin or silicone material.

8. The COB structure device packaged with a new material according to claim 1, characterized in that: The outer surface of the packaging layer is also provided with a nano-coating film.

9. The COB structure device packaged with a new material according to claim 1, characterized in that: The circuit board includes a substrate and a second insulating layer on the substrate, and the conductive layer is arranged on the second insulating layer.

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