Edge washing device for silicon wafer and silicon wafer processing equipment

Abstract

The utility model discloses a silicon wafer edge washing device and silicon wafer processing equipment, and belongs to the technical field of silicon wafer processing, the silicon wafer edge washing device comprises a base, the top end of the base is fixedly provided with a driving column, the top end of the driving column is rotatably connected with a spin-coating workbench, the top end of the base is fixedly provided with a collecting flow guide assembly, and the collecting flow guide assembly is rotatably connected with the spin-coating workbench. The collecting and flow guiding assembly comprises telescopic columns, a collecting plate, a fixing plate and a fixing box, the two telescopic columns used for supporting are symmetrically and fixedly connected to the top end of the base, and the collecting plate is fixedly connected to the top ends of the four telescopic columns. Water generated in the silicon wafer edge washing process can be collected and prevented from falling to the ground to affect the environment of a workshop, the silicon wafer edge washing machining efficiency is improved, meanwhile, the threaded rod is driven by the driving motor to rotate so as to adjust the height of the collecting plate, the collecting effect is further guaranteed, and workers can use the device conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer edge washing device and silicon wafer processing equipment. Background Art

[0002] In the production process of silicon wafers, during photolithography, photoresist material needs to be coated on the silicon wafer first. After spin-coating the photoresist material, if no other treatment is performed, the excess photoresist will be pushed to the edge of the silicon wafer by centrifugal force, and most of it will be thrown off the silicon wafer, and a part will remain on the edge of the silicon wafer. Since the relative speed of the airflow at the edge of the silicon wafer is very high, the remaining photoresist will solidify quickly to form a raised edge. Under the action of surface tension, a small amount of photoresist will even flow along the edge to the back of the silicon wafer, causing contamination on the back of the silicon wafer. The photoresist adhering to the edge and back of the silicon wafer will contaminate the robot, hot plate and other equipment used in subsequent processes.

[0003] To this end, the China Patent Network discloses a silicon wafer edge cleaning device and silicon wafer processing equipment with application number 202123382690.6. The second nozzle is used to spray the second solvent to remove the silicon-containing anti-reflection layer on the edge of the silicon wafer, and the back flushing device is used to prevent the back side of the silicon wafer from being contaminated by the edge cleaning operation, thereby achieving complete cleaning of the silicon wafer; the silicon wafer coated with a silicon-containing anti-reflection layer can be cleaned, and multiple nozzles can spray a variety of different solvents to remove different photolithography materials on the edge of the silicon wafer, thereby improving the applicability of the silicon wafer edge cleaning device and expanding the application. Scope; the silicon-containing anti-reflection layer on the silicon wafer can be completely removed, and the stacking of the silicon-containing anti-reflection layer can be prevented to avoid the formation of bulges, which solves the problem that the organic solvent used in the prior art is difficult to dissolve the silicon-containing anti-reflection layer and affects the product yield. At the same time, since the generation of bulges and silicon-containing anti-reflection layer debris is avoided, the pollution and influence of the silicon-containing anti-reflection layer debris on the product and equipment are avoided, thereby saving the subsequent cleaning steps of the equipment and the product, improving the subsequent processing efficiency of the silicon wafer, ensuring the processing quality of the equipment and the production quality of the silicon wafer, and improving the product yield of the silicon wafer production.

[0004] Although the above application meets the user's needs to a certain extent, there are still certain defects in the use process. The specific problems are as follows: during the silicon wafer edge washing process, a large amount of water will fall from the spin coating workbench to the ground, affecting the environment of the work workshop. The staff is required to clean the ground after the silicon wafer edge washing work is completed, which increases the labor intensity of the staff and reduces the work efficiency. Based on this, the utility model designs a silicon wafer edge washing device and silicon wafer processing equipment to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a silicon wafer edge washing device and silicon wafer processing equipment to solve the problem raised in the above-mentioned background technology that a large amount of water will fall from the spin coating workbench to the ground during the silicon wafer edge washing process, affecting the environment of the work workshop, requiring workers to clean the ground after the silicon wafer edge washing work is completed, increasing the labor intensity of the workers and reducing work efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer edge washing device and silicon wafer processing equipment, comprising a base, a driving column is fixedly installed on the top of the base, a spin coating workbench is rotatably connected to the top of the driving column, a collecting and guiding assembly is fixedly installed on the top of the base, and the collecting and guiding assembly includes a telescopic column, a collecting plate, a fixing plate and a fixing box;

[0007] The top of the base is symmetrically fixedly connected with two telescopic columns for support, and the tops of the four telescopic columns are fixedly connected with a collecting plate. One side of the base is fixedly connected with a fixing plate for adjusting the height of the collecting plate, and one side of the base is fixedly connected with a fixed box for collecting sewage, which can collect the water generated during the silicon wafer edge washing process to prevent it from falling to the ground and affecting the environment of the workshop, thereby improving the efficiency of silicon wafer edge washing processing;

[0008] A dry drainage assembly is fixedly installed on one side of the base, and the dry drainage assembly includes a drying plate, a filter plate, a liquid level box and a float;

[0009] The interior of the fixed box is fixedly connected with a drying plate for drying the fixed impurities, the interior of the fixed box is fixedly connected with a filter plate for filtering the fixed impurities, one side of the fixed box is fixedly connected with a liquid level box made of transparent material, and the interior of the liquid level box is movably connected with a float, which can dry the solid impurities in the sewage and realize the solid-liquid separation of the sewage, making it convenient to clean it up later.

[0010] Preferably, the collecting and guiding assembly further comprises a guide plate, a through groove, a threaded rod and a drain pipe;

[0011] The collecting plate is fixedly connected to the interior of the collecting plate to guide the sewage, a drainage groove is provided inside the collecting plate, a threaded rod is rotatably connected inside the fixing plate, and a drainage pipe communicating with the interior of the fixing box is provided at the bottom of the collecting plate.

[0012] Preferably, the dry drainage assembly further comprises a connecting rod, a square plate and a movable door;

[0013] The top of the floating ball is fixedly connected with a connecting rod, one end of the connecting rod is fixedly connected with a square plate, and a movable door is hinged inside the fixed box.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The collection and guide components can collect the moisture generated during the silicon wafer edge washing process to prevent it from falling to the ground and affecting the environment of the workshop, thereby improving the efficiency of the silicon wafer edge washing process. At the same time, the driving motor drives the threaded rod to rotate and then adjust the height of the collection plate to further ensure the collection effect and facilitate the use of the staff.

[0016] 2. Through the dry drainage component, the solid impurities in the sewage can be dried to achieve solid-liquid separation of the sewage, which is convenient for later cleaning. At the same time, the buoyancy of the water drives the float, connecting rod and square plate to touch the switch, which can issue an alarm to remind the staff to drain the water in time, thereby improving the practicality of the fixed box. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the structure of a silicon wafer edge washing device and silicon wafer processing equipment of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the collection and diversion component of the utility model;

[0020] Figure 3 It is a schematic structural diagram of the dry drainage component of the utility model.

[0021] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0022] 1. Base;

[0023] 2. Collection and diversion assembly; 201. Telescopic column; 202. Collection plate; 203. Diversion plate; 204. Through slot; 205. Fixing plate; 206. Threaded rod; 207. Fixing box; 208. Drain pipe;

[0024] 3. Drying drainage assembly; 301. Drying plate; 302. Filter plate; 303. Liquid level box; 304. Float; 305. Connecting rod; 306. Square plate; 307. Movable door;

[0025] 4. Driving column; 5. Spin coating workbench. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-3 The utility model provides a technical solution: a silicon wafer edge washing device and silicon wafer processing equipment, comprising a base 1, a driving column 4 is fixedly installed on the top of the base 1, a spin coating workbench 5 is rotatably connected to the top of the driving column 4, a collecting and guiding assembly 2 is fixedly installed on the top of the base 1, and the collecting and guiding assembly 2 includes a telescopic column 201, a collecting plate 202, a fixing plate 205 and a fixing box 207;

[0028] Two telescopic columns 201 for support are symmetrically fixedly connected to the top of the base 1, and a collecting plate 202 is fixedly connected to the top of the four telescopic columns 201. The collecting plate 202 is slidably connected to the inside of the fixing plate 205, which is convenient for adjusting the height of the collecting plate 202, further ensuring the collection effect and facilitating the use of the staff. A fixing plate 205 for adjusting the height of the collecting plate 202 is fixedly connected to one side of the base 1, and a fixed box 207 for collecting sewage is fixedly connected to one side of the base 1;

[0029] A dry drainage assembly 3 is fixedly installed on one side of the base 1, and the dry drainage assembly 3 includes a drying plate 301, a filter plate 302, a liquid level box 303 and a float 304;

[0030] A drying plate 301 for drying the fixed impurities is fixedly connected inside the fixed box 207, a filter plate 302 for filtering the fixed impurities is fixedly connected inside the fixed box 207, a liquid level box 303 made of transparent material is fixedly connected to one side of the fixed box 207, and a float 304 is movably connected inside the liquid level box 303.

[0031] The collecting and guiding assembly 2 further includes a guiding plate 203, a through slot 204, a threaded rod 206 and a drain pipe 208;

[0032] The interior of the collecting plate 202 is fixedly connected with a guide plate 203 for guiding sewage, the interior of the collecting plate 202 is provided with a drainage groove 204, the interior of the fixed plate 205 is rotatably connected with a threaded rod 206, the bottom end of the threaded rod 206 is fixedly installed with a driving motor, the driving motor is electrically connected to the output end of an external power supply, the threaded rod 206 is threadedly connected to the collecting plate 202, and the bottom end of the collecting plate 202 is provided with a drainage pipe 208 that communicates with the interior of the fixed box 207.

[0033] By controlling the first nozzle to move to the edge washing position and adjusting the edge washing angle of the first nozzle, the second nozzle and the third nozzle are both in a closed state, and the first nozzle is opened so that the first nozzle sprays a solvent for removing the photoresist, the width of the edge washing can be adjusted according to demand, when the first nozzle sprays the solvent for removing the photoresist, the position of the first nozzle remains unchanged, and the silicon wafer rotates under the drive of the silicon wafer coating workbench, thereby realizing the removal of the organic anti-reflection layer film on the silicon wafer, while the first nozzle sprays the solvent for removing the photoresist, the fourth nozzle sprays the solvent for removing the photoresist toward the back edge of the silicon wafer, thereby preventing the edge washing impurities from contaminating the back side of the silicon wafer, and controlling the third nozzle to move to the edge washing position, and adjusting the edge washing angle of the third nozzle, so that the first nozzle and the second nozzle are in a closed state, and the third nozzle is opened so that The third nozzle sprays deionized water to the edge of the silicon wafer to remove impurities generated during the edge washing process. The fourth nozzle remains open to spray the back of the silicon wafer to prevent impurities from contaminating the back of the silicon wafer. During the edge washing process of the silicon wafer, the drive motor is started, and the drive motor drives the threaded rod 206 to rotate. The threaded rod 206 drives the collecting plate 202 to slide on the outside of the drive column 4 and gradually approaches the spin coating workbench 5. At this time, the telescopic column 201 is retracted, and the water after cleaning the silicon wafer above the spin coating workbench 5 flows to the inside of the collecting plate 202. The sewage is collected through the guide plate 203 to the side close to the through groove 204, and flows to the inside of the fixed box 207 through the drain pipe 208. The sewage is collected in the fixed box 207 to avoid falling to the ground and affecting the environment of the work workshop, thereby improving the efficiency of the silicon wafer edge washing process.

[0034] The dry drainage assembly 3 further includes a connecting rod 305, a square plate 306 and a movable door 307;

[0035] The top of the float 304 is fixedly connected to a connecting rod 305, and the outer side of the connecting rod 305 is slidably connected to the inside of the liquid level box 303. The buoyancy of the water drives the float 304, the connecting rod 305 and the square plate 306 to touch the switch, which can emit an alarm to remind the staff to drain the water in time, thereby improving the practicality of the fixed box 207. One end of the connecting rod 305 is fixedly connected to the square plate 306, and the interior of the fixed box 207 is hinged with a movable door 307. A switch is fixedly installed on one side of the fixed box 207, which can warn the staff to drain the water in time.

[0036] When the sewage flows into the fixed box 207, the filter plate 302 filters the solid impurities in the sewage, and the fixed impurities remain above the filter plate 302. The drying plate 301 is connected to the external fan, and the surface moisture of the fixed impurities above the filter plate 302 can be air-dried through the drying plate 301. The moisture flows to the bottom of the fixed box 207. The fixed box 207 is connected to the inside of the liquid level box 303, and the liquid level height is the same. The water height inside the liquid level box 303 will drive the float 304, the connecting rod 305 and the square plate 306 to move. When the square plate 306 touches the switch, an alarm will be triggered to remind the staff to discharge the sewage inside the fixed box 207 in time, thereby improving the practicality of the fixed box 207.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon wafer edge cleaning device, comprising a base (1), a driving column (4) fixedly mounted on the top of the base (1), a spin coating workbench (5) rotatably connected to the top of the driving column (4), characterized in that: A collecting and guiding assembly (2) is fixedly mounted on the top of the base (1), and the collecting and guiding assembly (2) comprises a telescopic column (201), a collecting plate (202), a fixing plate (205) and a fixing box (207); Two telescopic columns (201) for support are symmetrically fixedly connected to the top of the base (1); a collecting plate (202) is fixedly connected to the tops of the four telescopic columns (201); a fixing plate (205) for adjusting the height of the collecting plate (202) is fixedly connected to one side of the base (1); and a fixing box (207) for collecting sewage is fixedly connected to one side of the base (1); A dry drainage assembly (3) is fixedly mounted on one side of the base (1), and the dry drainage assembly (3) comprises a drying plate (301), a filter plate (302), a liquid level box (303) and a float (304); A drying plate (301) for drying the fixed impurities is fixedly connected to the interior of the fixed box (207), a filter plate (302) for filtering the fixed impurities is fixedly connected to the interior of the fixed box (207), a liquid level box (303) made of a transparent material is fixedly connected to one side of the fixed box (207), and a float (304) is movably connected to the interior of the liquid level box (303).

2. The silicon wafer edge cleaning device according to claim 1, characterized in that: The collecting and guiding assembly (2) further comprises a guiding plate (203), a through groove (204), a threaded rod (206) and a drainage pipe (208); A guide plate (203) for guiding sewage is fixedly connected inside the collecting plate (202), a drainage groove (204) is provided inside the collecting plate (202), a threaded rod (206) is rotatably connected inside the fixing plate (205), and a drainage pipe (208) communicating with the inside of the fixing box (207) is provided at the bottom end of the collecting plate (202).

3. The silicon wafer edge cleaning device according to claim 1, characterized in that: The collecting plate (202) is slidably connected to the interior of the fixing plate (205).

4. The silicon wafer edge cleaning device according to claim 2, characterized in that: A driving motor is fixedly mounted on the bottom end of the threaded rod (206).

5. The silicon wafer edge cleaning device according to claim 1, characterized in that: The dry drainage assembly (3) further comprises a connecting rod (305), a square plate (306) and a movable door (307); The top of the floating ball (304) is fixedly connected to a connecting rod (305), one end of the connecting rod (305) is fixedly connected to a square plate (306), and a movable door (307) is hinged inside the fixed box (207).

6. The silicon wafer edge cleaning device according to claim 5, characterized in that: The outer side of the connecting rod (305) is slidably connected to the inside of the liquid level box (303).

7. A silicon wafer processing equipment, characterized in that: A silicon wafer edge washing device comprising the device as described in any one of claims 1 to 6.

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