Powder forming heat treatment device

By setting up upper and lower cooling pipelines in the powder forming heat treatment device, the heat conduction of the mold is taken away by using cooling water, the heat conduction problem caused by the mold heat treatment is solved and the processing accuracy is improved.

CN222569291UActive Publication Date: 2025-03-07GUANGDONG PEIMIN INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202420625936.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-28
Publication Date
2025-03-07
Estimated Expiration
2034-03-28

AI Technical Summary

Technical Problem

In the existing powder forming technology, mold heat treatment can easily transfer heat to the surrounding mold frames and guide rods, resulting in problems such as poor movement and errors.

Method used

A powder forming heat treatment device is designed, using an upper cooling pipeline and a lower cooling pipeline to be arranged around the outer side of the upper mold and the lower mold respectively. The cooling water is brought to these pipes through the cooling water input pipe. The cooling water takes away the heat transmitted by the mold and prevents the heat from being transmitted to the periphery of the mold seat.

Benefits of technology

It effectively prevents heat from being transmitted to the periphery of the mold seat, avoids thermal expansion and contraction problems, thereby ensuring processing accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a powder forming heat treatment device. The powder forming heat treatment device comprises a middle die holder, an upper die holder and a lower die holder, an upper guide column is arranged on the top of the middle die holder, and the upper die holder is movably arranged on the upper guide column. A lower guide column is arranged at the bottom of the middle die holder, and the lower die holder is movably arranged on the lower guide column. A middle die is arranged on the middle die holder; the upper die holder is provided with an upper die; the lower die holder is provided with a lower die, an upper die and a middle die, and a heating element is arranged in the lower die; the upper die holder is provided with an upper cooling pipeline surrounding the outer side of the upper die; the lower die holder is provided with a lower cooling pipeline surrounding the outer side of the lower die; the cooling system further comprises a cooling water input pipe and a cooling water discharge pipe, and the upper cooling pipeline and the lower cooling pipeline are connected with the cooling water input pipe and the cooling water discharge pipe respectively. And heat dissipated by the plug can be completely surrounded and prevented from being conducted to the peripheries of the upper die base and the lower die base, the upper guide column and the lower guide column cannot expand with heat and contract with cold due to heat conduction, and therefore the machining precision is guaranteed.
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Description

Technical Field

[0001] The utility model relates to the field of additive manufacturing metal forming, in particular to a powder forming heat treatment device. Background Art

[0002] At present, some powder molding parts need preliminary heat treatment after pressing and molding to maintain a stable shape and be transported to the next processing step. Therefore, after the powder is pressed and molded in the mold, the mold itself needs to be heated to heat the powder. However, after the mold is heated, it is easy to transfer heat to the surrounding mold frame and the guide rod that guides the mold frame up and down, and the movement is not smooth and errors are generated due to thermal expansion and contraction.

[0003] Therefore, a powder forming heat treatment device is needed to prevent the heat treatment of the mold from affecting other peripheral mechanical structures such as the mold frame. Utility Model Content

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a powder molding heat treatment device that prevents the heat treatment of the mold from affecting other peripheral mechanical structures such as the mold frame.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A powder molding heat treatment device comprises a middle die base, an upper die base and a lower die base; an upper guide column is arranged on the top of the middle die base, and the upper die base is movably arranged on the upper guide column; a lower guide column is arranged on the bottom of the middle die base, and the lower die base is movably arranged on the lower guide column;

[0007] The middle mold base is provided with a middle mold; the upper mold base is provided with an upper mold; the lower mold base is provided with a lower mold, and heating elements are provided in the upper mold, the middle mold and the lower mold;

[0008] The upper mold base is provided with an upper cooling pipeline surrounding the outer side of the upper mold; the lower mold base is provided with a lower cooling pipeline surrounding the outer side of the lower mold; it also includes a cooling water inlet pipe and a cooling water outlet pipe, and the upper cooling pipeline and the lower cooling pipeline are respectively connected to the cooling water inlet pipe and the cooling water outlet pipe.

[0009] By adopting the above technical solution, the upper mold base is provided with an upper cooling pipeline surrounding the outer side of the upper mold; the lower mold base is provided with a lower cooling pipeline surrounding the outer side of the lower mold, so that water is used to cool the upper mold and the lower mold through the cooling water inlet pipe, and the heat conducted to the outside by the upper mold and the lower mold is taken away by the cooling water. Since the upper cooling pipeline is arranged around the upper mold and the lower cooling pipeline is arranged around the lower mold, the dissipated heat can be completely surrounded and blocked to prevent the heat from being conducted to the periphery of the upper mold base and the lower mold base, and the upper guide column and the lower guide column will not expand or contract due to the conducted heat, thereby ensuring the processing accuracy.

[0010] As an improved solution, the upper cooling pipeline and the lower cooling pipeline include a plurality of straight cooling pipes in a straight line, and the straight cooling pipes are arranged on both sides of the upper mold base and the lower mold base; the upper mold base and the lower mold base are detachably provided with cover plates covering both ends of the straight cooling pipes.

[0011] By adopting the above technical solution, since the cooling straight pipe is straight, the inside of the cooling straight pipe is easy to clean. It can be quickly cleaned by simply brushing off the scale on the inner wall with a straight brush. After cleaning, it can continue to be used normally by simply reinstalling the cover plate, which is easy to maintain.

[0012] As an improved solution, the upper cooling pipeline and the lower cooling pipeline include a plurality of branch cooling pipes, both ends of the branch cooling pipes are connected to the sides of the upper mold base and the lower mold base, and the sides of the upper mold base and the lower mold base are detachably provided with cover plates covering the two ends of the branch cooling pipes; the cover plate facing the branch cooling pipes is provided with a transfer cooling pipe matching the positions of the two ends of the plurality of branch cooling pipes.

[0013] By adopting the above technical solution, it is possible to change the connection relationship between the cooling pipes and modify the different transfer cooling pipes by replacing different cover plates, and modify the flow direction and sequence of the cooling water. For example, the cooling water can be set to enter from the cover plate, be diverted to each cooling branch pipe, flow in parallel for cooling, and the cooling water of each cooling branch pipe is connected in parallel. It is also possible to set the cooling water to enter from the cover plate, flow into one of the cooling branches, and then flow into the next cooling branch pipe through the transfer cooling pipe, so that each cooling branch pipe is in series. It is possible to change a more suitable cooling water flow sequence scheme according to the actual needs of the production site.

[0014] As an improved solution, turbulent protrusions are provided on the inner wall of the branch cooling pipe.

[0015] By adopting the above technical solution, the turbulent protrusions in the cooling pipes can, on the one hand, generate turbulence in the cooling water flow process, so that the hotter cooling water at the edge of the branch cooling pipe and the cooler cooling water in the center of the branch cooling pipe can be mixed, so as to fully utilize the heat dissipation potential of the cooling water. On the other hand, it also increases the contact area between the cooling water and the upper mold frame / lower mold frame, further improving the heat dissipation efficiency.

[0016] As an improved solution, the cover plate is provided with an interface matching the cooling water inlet pipe and the cooling water outlet pipe. The interface is in the shape of a hollow cylinder protruding from the side of the cover plate. The side of the interface is provided with several circles of sealing protrusions, and the diameter of the sealing protrusion is not less than the inner diameter of the cooling water inlet pipe or the cooling water outlet pipe.

[0017] By adopting the above technical solution, the cooling water inlet pipe and the cooling water outlet pipe can directly insert the interface into the pipeline, and the sealing protrusion with a diameter not less than the inner diameter of the pipe completes the fixing and sealing function. The installation is quick and time-saving, and the sealing effect is stable and reliable.

[0018] As an improved solution, the upper mold base is provided with an upper insulation sleeve, which is slidably arranged on the outside of the upper guide column; the lower mold base is provided with a lower insulation sleeve, which is slidably arranged on the outside of the lower guide column.

[0019] By adopting the above technical solution, the heat insulation sleeve blocks between the upper mold base and the upper guide pillar to prevent heat exchange between the two, thereby preventing the heat of the upper mold base from being transferred to the upper guide pillar, and preventing the upper guide pillar from thermal expansion and contraction processing precision from decreasing. The heat insulation sleeve blocks between the lower mold base and the lower guide pillar to prevent heat exchange between the two, thereby preventing the heat of the lower mold base from being transferred to the lower guide pillar, and preventing the lower guide pillar from thermal expansion and contraction processing precision from decreasing.

[0020] As an improved solution, a temperature sensor is provided on the upper mold base and / or the lower mold base, and the middle mold base is also provided with a temperature control module for controlling the flow rate of cooling water, and the temperature control module is connected to the temperature sensor signal.

[0021] By adopting the above technical solution, when the temperature sensor of the upper mold base or the lower mold base shows that the temperature is too high, the temperature control module automatically adjusts to increase the flow of cooling water and automatically controls the temperature within a preset range.

[0022] As an improved solution, the middle mold base is further provided with a heating module, and the heating module is respectively connected to the heating element and the temperature control module by signal.

[0023] By adopting the above technical solution, the heating module can monitor the power and temperature of the heating element in real time. When the power / temperature of the heating element rises, the heating module sends a signal to inform the temperature control module, and the temperature control module increases the flow of cooling water accordingly to ensure that the heat dissipation capacity is improved synchronously.

[0024] Compared with the prior art, the beneficial effects of the utility model are:

[0025] The upper mold base is provided with an upper cooling pipeline surrounding the outer side of the upper mold; the lower mold base is provided with a lower cooling pipeline surrounding the outer side of the lower mold, so that water is used to cool the upper mold and the lower mold through the cooling water inlet pipe, and the heat conducted to the outside by the upper mold and the lower mold is taken away by the cooling water. Since the upper cooling pipeline is arranged around the upper mold and the lower cooling pipeline is arranged around the lower mold, the dissipated heat can be completely surrounded and blocked to prevent the heat from being conducted to the periphery of the upper mold base and the lower mold base, and the upper guide column and the lower guide column will not expand or contract due to the conducted heat, thereby ensuring the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an overall structural diagram of a powder forming heat treatment device of the utility model.

[0027] Figure 2 It is a side cross-sectional view of a powder forming heat treatment device of the utility model.

[0028] Figure 3 The present invention is a top view cross-sectional view showing the upper cooling pipeline of a powder forming heat treatment device.

[0029] Figure 4 The utility model is a top view of a cross-sectional view showing a lower cooling pipeline of a powder forming heat treatment device.

[0030] Figure 5 The utility model is a schematic diagram of the connection relationship between a first cover plate and a branch cooling pipe of a powder forming heat treatment device.

[0031] Figure 6 It is a schematic diagram of the connection relationship between the second cover plate and the branch cooling pipe of a powder molding heat treatment device of the utility model.

[0032] Among them, 1: middle mold base; 2: upper mold base; 3: lower mold base; 4: upper guide pillar; 5: lower guide pillar; 6: middle mold; 7: upper mold; 8: lower mold; 9: heating element; 10: upper cooling pipeline; 11: lower cooling pipeline; 12: cooling water inlet pipe; 13: cooling water outlet pipe; 14: cover plate; 15: branch cooling pipe; 17: interface; 19: upper insulation sleeve; 20: lower insulation sleeve; 21: transfer cooling pipe. DETAILED DESCRIPTION

[0033] The present invention is further described with reference to the accompanying drawings and embodiments:

[0034] The present invention is further described below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0035] It should be noted that when a component / part is referred to as being "set on" another component / part, it may be directly set on the other component / part or there may also be an intermediate component / part. When a component / part is referred to as being "connected / coupled" to another component / part, it may be directly connected / coupled to the other component / part or there may be an intermediate component / part at the same time. The term "connection / coupling" as used herein may include electrical and / or mechanical physical connections / couplings. The term "includes / comprising" as used herein refers to the presence of a feature, step or component / part, but does not exclude the presence or addition of one or more other features, steps or components / parts. The term "and / or" as used herein includes any and all combinations of one or more relevant listed items.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application. In addition, in the description of the present application, the terms "first", "second", etc. are only used to describe the purpose and distinguish similar objects, and there is no sequential order between the two, nor can they be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise stated, the meaning of "plurality" is two or more.

[0037] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0038] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0039] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprise" and "have" list the stated features, quantities, operations, components, elements and / or their combinations that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0040] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0041] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0042] Implementation case 1:

[0043] As attached Figure 1-6 As shown, a powder molding heat treatment device comprises a middle die base 1, an upper die base 2, and a lower die base 3; an upper guide pillar 4 is arranged on the top of the middle die base 1, and the upper die base 2 is movably arranged on the upper guide pillar 4; a lower guide pillar 5 is arranged on the bottom of the middle die base 1, and the lower die base 3 is movably arranged on the lower guide pillar 5;

[0044] The middle mold base 1 is provided with a middle mold 6; the upper mold base 2 is provided with an upper mold 7; the lower mold base 3 is provided with a lower mold 8, and heating elements 9 are provided in the upper mold 7, the middle mold 6, and the lower mold 8;

[0045] The upper mold base 2 is provided with an upper cooling pipeline 10 surrounding the outer side of the upper mold 7; the lower mold base 3 is provided with a lower cooling pipeline 11 surrounding the outer side of the lower mold 8; it also includes a cooling water inlet pipe 12 and a cooling water outlet pipe 13, and the upper cooling pipeline 10 and the lower cooling pipeline 11 are respectively connected to the cooling water inlet pipe 12 and the cooling water outlet pipe 13.

[0046] The upper mold base 2 is provided with an upper cooling pipeline 10 surrounding the outer side of the upper mold 7; the lower mold base 3 is provided with a lower cooling pipeline 11 surrounding the outer side of the lower mold 8, so that water is used to cool the upper mold 7 and the lower mold 8 through the cooling water inlet pipe 12, and the heat conducted to the outside by the upper mold 7 and the lower mold 8 is taken away by the cooling water. Since the upper cooling pipeline 10 is arranged around the upper mold 7 and the lower cooling pipeline 11 is arranged around the lower mold 8, the dissipated heat can be completely surrounded and blocked to prevent the heat from being conducted to the periphery of the upper mold base 2 and the lower mold base 3, and the upper guide column 4 and the lower guide column 5 will not expand or contract due to the conducted heat, thereby ensuring the processing accuracy.

[0047] The upper cooling pipeline 10 and the lower cooling pipeline 11 include a plurality of straight cooling pipes which are straight and linear and are arranged on both sides of the upper mold base 2 and the lower mold base 3; both sides of the upper mold base 2 and the lower mold base 3 are detachably provided with cover plates 14 which cover both ends of the straight cooling pipes.

[0048] Since the cooling straight pipe is in a straight line, the inside of the cooling straight pipe is easy to clean. The cleaning can be quickly completed by brushing off the scale on the inner wall with a straight brush. After cleaning, the cover plate 14 can be reinstalled to continue normal use, which is easy to maintain.

[0049] The upper cooling pipeline 10 and the lower cooling pipeline 11 include a plurality of branch cooling pipes 15, both ends of which are connected to the sides of the upper mold base 2 and the lower mold base 3. The sides of the upper mold base 2 and the lower mold base 3 are detachably provided with cover plates 14 covering the two ends of the branch cooling pipes 15; the cover plate 14 is provided with a transfer cooling pipe 21 matching the positions of the two ends of the plurality of branch cooling pipes 15 on the side facing the branch cooling pipes 15.

[0050] By replacing different cover plates 14 and modifying different transfer cooling pipes 21, the connection relationship between the cooling pipes can be changed, and the flow direction and order of the cooling water can be modified. For example, the cooling water can be set to enter from the cover plate 14, be diverted to each cooling branch, flow in parallel for cooling, and the cooling water of each cooling branch is connected in parallel. The cooling water can also be set to enter from the cover plate 14, flow into one of the cooling branches, and then flow into the next cooling branch through the transfer cooling pipe 21, so that each cooling branch is in series. A more suitable cooling water flow sequence can be changed according to the actual needs of the production site.

[0051] The inner wall of the branch cooling pipe 15 is provided with turbulent protrusions.

[0052] The turbulent protrusions distributed to the cooling pipes, on the one hand, cause turbulence in the cooling water flow process, so that the hotter cooling water at the edge of the branch cooling pipe 15 and the cooler cooling water in the center of the branch cooling pipe 15 are mixed, and the heat dissipation potential of the cooling water is fully utilized. On the other hand, the contact area between the cooling water and the upper mold frame / lower mold frame is increased, and the heat dissipation efficiency is further improved.

[0053] The cover plate 14 is provided with an interface 17 matching the cooling water inlet pipe 12 and the cooling water outlet pipe 13. The interface 17 is in the shape of a hollow cylinder protruding from the side of the cover plate 14. The side of the interface 17 is provided with a plurality of circles of sealing protrusions, and the diameter of the sealing protrusions is not less than the inner diameter of the cooling water inlet pipe 12 or the cooling water outlet pipe 13.

[0054] The cooling water inlet pipe 12 and the cooling water outlet pipe 13 can directly insert the interface 17 into the pipeline, and the sealing protrusion with a diameter not less than the inner diameter of the pipe completes the fixing and sealing function. The installation is quick and time-saving, and the sealing effect is stable and reliable.

[0055] The upper mold base 2 is provided with an upper insulation sleeve 19 slidably disposed on the outer side of the upper guide column 4 ; the lower mold base 3 is provided with a lower insulation sleeve 20 slidably disposed on the outer side of the lower guide column 5 .

[0056] The heat-insulating sleeve blocks between the upper mold base 2 and the upper guide pillar 4 to prevent heat exchange between the two, thereby preventing the heat of the upper mold base 2 from being transferred to the upper guide pillar 4, and preventing the upper guide pillar 4 from thermal expansion and contraction and reducing the processing precision. The heat-insulating sleeve blocks between the lower mold base 3 and the lower guide pillar 5 to prevent heat exchange between the two, thereby preventing the heat of the lower mold base 3 from being transferred to the lower guide pillar 5, and preventing the lower guide pillar 5 from thermal expansion and contraction and reducing the processing precision.

[0057] The upper mold base 2 and / or the lower mold base 3 are provided with temperature sensors, and the middle mold base 1 is also provided with a temperature control module for controlling the flow rate of cooling water, and the temperature control module is connected to the temperature sensor signal.

[0058] When the temperature sensor of the upper mold base 2 or the lower mold base 3 indicates that the temperature is too high, the temperature control module automatically adjusts to increase the flow of cooling water and automatically controls the temperature within a preset range.

[0059] The middle mold base 1 is also provided with a heating module, and the heating module is respectively connected to the heating element 9 and the temperature control module by signal.

[0060] The heating module can monitor the power and temperature of the heating element 9 in real time. When the power / temperature of the heating element 9 rises, the heating module sends a signal to inform the temperature control module, and the temperature control module increases the flow of cooling water accordingly to ensure that the heat dissipation capacity is improved synchronously.

[0061] In summary, after reading the utility model document, ordinary technicians in this field can make various other corresponding transformation schemes based on the technical scheme and technical concept of the utility model without creative mental labor, and different application scenarios all fall within the scope of protection of the utility model.

Claims

1. A powder molding heat treatment device, characterized in that: The mold base comprises a middle mold base (1), an upper mold base (2), and a lower mold base (3); an upper guide column (4) is arranged at the top of the middle mold base (1), and the upper mold base (2) is movably arranged on the upper guide column (4); a lower guide column (5) is arranged at the bottom of the middle mold base (1), and the lower mold base (3) is movably arranged on the lower guide column (5); The middle mold base (1) is provided with a middle mold (6); the upper mold base (2) is provided with an upper mold (7); the lower mold base (3) is provided with a lower mold (8); and heating elements (9) are provided in the upper mold (7), the middle mold (6) and the lower mold (8); The upper mold base (2) is provided with an upper cooling pipeline (10) surrounding the outer side of the upper mold (7); the lower mold base (3) is provided with a lower cooling pipeline (11) surrounding the outer side of the lower mold (8); and also includes a cooling water inlet pipe (12) and a cooling water outlet pipe (13), wherein the upper cooling pipeline (10) and the lower cooling pipeline (11) are respectively connected to the cooling water inlet pipe (12) and the cooling water outlet pipe (13).

2. The powder molding heat treatment device according to claim 1, characterized in that: The upper cooling pipeline (10) and the lower cooling pipeline (11) include a plurality of straight cooling pipes which are linear and pass through both sides of the upper mold base (2) and the lower mold base (3); both sides of the upper mold base (2) and the lower mold base (3) are detachably provided with cover plates (14) which cover both ends of the straight cooling pipes.

3. The powder molding heat treatment device according to claim 1, characterized in that: The upper cooling pipeline (10) and the lower cooling pipeline (11) comprise a plurality of branch cooling pipes (15), both ends of the branch cooling pipes (15) being connected to the side surfaces of the upper mold base (2) and the lower mold base (3), and the side surfaces of the upper mold base (2) and the lower mold base (3) are detachably provided with cover plates (14) covering the two ends of the branch cooling pipes (15); and the cover plate (14) is provided with a transfer cooling pipe (21) matching the positions of the two ends of the plurality of branch cooling pipes (15) on the side facing the branch cooling pipes (15).

4. The powder molding heat treatment device according to claim 3, characterized in that: Turbulent protrusions are provided on the inner wall of the branch cooling pipe (15).

5. The powder molding heat treatment device according to claim 3, characterized in that: The cover plate (14) is provided with an interface (17) matching the cooling water inlet pipe (12) and the cooling water outlet pipe (13); the interface (17) is in the shape of a hollow cylinder protruding from the side of the cover plate (14); a plurality of circles of sealing protrusions are provided on the side of the interface (17); the diameter of the sealing protrusions is not less than the inner diameter of the cooling water inlet pipe (12) or the cooling water outlet pipe (13).

6. The powder molding heat treatment device according to claim 3, characterized in that: The upper mold base (2) is provided with an upper heat-insulating sleeve (19), and the upper heat-insulating sleeve (19) is slidably arranged on the outside of the upper guide column (4); the lower mold base (3) is provided with a lower heat-insulating sleeve (20), and the lower heat-insulating sleeve (20) is slidably arranged on the outside of the lower guide column (5).

7. The powder molding heat treatment device according to claim 3, characterized in that: The upper mold base (2) and / or the lower mold base (3) are provided with temperature sensors, and the middle mold base (1) is also provided with a temperature control module for controlling the flow rate of cooling water, and the temperature control module is connected to the temperature sensor signal.

8. The powder molding heat treatment device according to claim 7, characterized in that: The middle mold base (1) is also provided with a heating module, and the heating module is respectively connected to the heating element (9) and the temperature control module by signal.