Cooling water inlet and outlet rotary joint fixing device of semiconductor substrate precision polishing machine
By designing a cooling water inlet and outlet rotary joint fixing device including a rectangular groove anti-rotation baffle, the problems of loosening the rotary joint and twisting the upper plate return pipe in the prior art are solved, and the sealing of the cooling water pipeline is significantly improved.
Patent Information
- Application Number
- CN202420399012.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-01
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-01
AI Technical Summary
The cooling water inlet and outlet rotary joint fixing device of the existing semiconductor substrate precision polisher is prone to loosening when the equipment is running, resulting in twisting of the upper plate return pipe and affecting the sealing of the cooling water pipeline.
A fixing device including a rotary joint, an upper disk return pipe, a water distribution sleeve, a hollow central shaft, an anti-rotation rod and an anti-rotation baffle are designed. One end of the anti-rotation baffle is a rectangular groove, which is installed on the flat upper part of the rotary joint, with obvious anti-rotation effect and avoiding the twisting of the upper disk return pipe.
It significantly improves the sealing of the cooling water pipe, prevents loosening of the rotary joint and twisting of the upper return pipe, and ensures that the equipment operates stably during long-term operation.
Smart Images
Figure CN222570403U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of polishing equipment, in particular to a cooling water inlet and outlet rotary joint fixing device of a semiconductor substrate precision polishing machine. Background Art
[0002] Figure 1 The cooling water inlet and outlet fixing method in the upper plate system of the semiconductor substrate precision polishing machine of the prior art is shown. The upper plate return pipe 2 is built into the rotary joint 1, and the rotary joint 1 is connected to the outer port of the water dividing sleeve 3 by threading. The upper plate return pipe 2 is threadedly connected to the inner port of the water dividing sleeve 3, and the water dividing sleeve 3 is fixed on the hollow central axis 4. The anti-rotation rod 5 is fixed to the lower bracket with a nut 7. One end of the anti-rotation baffle 6 is installed at the lower end of the rotary joint, and the other end is a U-shaped groove, which is stuck on the anti-rotation rod. However, this cooling water inlet and outlet rotary joint fixing device has defects. When the equipment is running, as the number of rotations of the hollow central axis increases, it is easy to loosen at the threaded connection, and relative rotation occurs at the matching parts. The upper plate return pipe of the hose may be twisted, and the sealing of the cooling water pipeline is greatly affected. Summary of the invention
[0003] In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to provide a cooling water inlet and outlet rotary joint fixing device for a semiconductor substrate precision polishing machine, which has obvious anti-rotation effect, can avoid the twisting of the internal upper plate return pipe, and greatly improve the sealing of the cooling water pipeline.
[0004] The technical scheme of the utility model is: a cooling water inlet and outlet rotary joint fixing device of a semiconductor substrate precision polishing machine, which comprises: a rotary joint, an upper plate return pipe, a water distribution jacket, a hollow central shaft, an anti-rotation rod, an anti-rotation baffle, and a nut;
[0005] The rotary joint has a built-in upper plate return pipe, the cross-section of the upper part of the rotary joint is flat and the cross-section of the lower part is circular, the lower part of the rotary joint is connected to the outer port of the water distribution sleeve by a thread, the upper plate return pipe and the inner port of the water distribution sleeve are connected by a thread, the water distribution sleeve is fixed on the hollow central axis, the anti-rotation rod is fixed to the lower bracket by a nut, one end of the anti-rotation baffle is a rectangular groove to be installed on the upper part of the rotary joint, and the other end of the anti-rotation baffle is a U-shaped groove, which is stuck on the anti-rotation rod.
[0006] One end of the anti-rotation baffle of the utility model is a rectangular groove, and the cross-section of the upper part of the rotary joint is flat. The rectangular groove is clamped in the flat upper part of the rotary joint. Compared with the anti-rotation baffle of the prior art, one end is installed at the circular lower end of the rotary joint, which can prevent the rotary joint from rotating. Therefore, the anti-rotation effect is obvious, and the twisting of the internal upper plate return water pipe can be avoided, thereby greatly improving the sealing of the cooling water pipeline. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 The present invention shows a schematic structural diagram of a cooling water inlet and outlet rotary joint fixing device of a semiconductor substrate precision polishing machine in the prior art.
[0008] Figure 2 The schematic diagram of the structure of the cooling water inlet and outlet rotary joint fixing device of the semiconductor substrate precision polishing machine according to the utility model is shown.
[0009] Figure 3 A comparative stereoscopic schematic diagram of a cooling water inlet and outlet rotary joint fixing device of a semiconductor substrate precision polishing machine of the prior art and the utility model is shown. DETAILED DESCRIPTION
[0010] like Figure 2-3 As shown, a cooling water inlet and outlet rotary joint fixing device of a semiconductor substrate precision polishing machine comprises: a rotary joint 1, an upper plate return pipe 2, a water distribution jacket 3, a hollow central shaft 4, an anti-rotation rod 5, an anti-rotation baffle 6a, and a nut 7;
[0011] The rotary joint has a built-in upper plate return pipe, the cross-section of the upper part of the rotary joint is flat and the cross-section of the lower part is circular, the lower part of the rotary joint is connected to the outer port of the water distribution sleeve by a thread, the upper plate return pipe and the inner port of the water distribution sleeve are connected by a thread, the water distribution sleeve is fixed on the hollow central axis, the anti-rotation rod is fixed to the lower bracket by a nut, one end of the anti-rotation baffle is a rectangular groove to be installed on the upper part of the rotary joint, and the other end of the anti-rotation baffle is a U-shaped groove, which is stuck on the anti-rotation rod.
[0012] One end of the anti-rotation baffle of the utility model is a rectangular groove, and the cross-section of the upper part of the rotary joint is flat. The rectangular groove is clamped in the flat upper part of the rotary joint. Compared with the anti-rotation baffle of the prior art, one end is installed at the circular lower end of the rotary joint, which can prevent the rotary joint from rotating. Therefore, the anti-rotation effect is obvious, and the twisting of the internal upper plate return water pipe can be avoided, thereby greatly improving the sealing of the cooling water pipeline.
[0013] Preferably, if Figure 3 As shown, two circular holes 8 are arranged on the side wall of one end of the anti-rotation baffle with the rectangular groove. Such a structure can more clearly identify the end of the anti-rotation baffle with the rectangular groove, which is convenient for installation.
[0014] Preferably, if Figure 2 As shown, a rotating fixing ring 9 is provided at the joint of the hollow central shaft and the water-distributing sleeve, which is clamped by screws. This can firmly prevent the hollow central shaft and the water-distributing sleeve from rotating relative to each other, thereby further avoiding the torsion of the internal upper plate return water pipe and further improving the sealing of the cooling water pipeline.
[0015] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the protection scope of the technical solution of the present invention.
Claims
1. A cooling water inlet and outlet rotary joint fixing device for a semiconductor substrate precision polishing machine, characterized in that: It comprises: a rotary joint (1), an upper plate water return pipe (2), a water distribution sleeve (3), a hollow central shaft (4), an anti-rotation rod (5), an anti-rotation baffle (6a), and a nut (7); The rotary joint has a built-in upper plate return pipe, the cross-section of the upper part of the rotary joint is flat and the cross-section of the lower part is circular, the lower part of the rotary joint is connected to the outer port of the water distribution sleeve by a thread, the upper plate return pipe and the inner port of the water distribution sleeve are connected by a thread, the water distribution sleeve is fixed on the hollow central axis, the anti-rotation rod is fixed to the lower bracket by a nut, one end of the anti-rotation baffle is a rectangular groove to be installed on the upper part of the rotary joint, and the other end of the anti-rotation baffle is a U-shaped groove, which is stuck on the anti-rotation rod.
2. The cooling water inlet and outlet rotary joint fixing device of the semiconductor substrate precision polishing machine according to claim 1 is characterized in that: Two circular holes (8) are arranged on the side wall of one end of the anti-rotation baffle with the rectangular groove.
3. The cooling water inlet and outlet rotary joint fixing device of the semiconductor substrate precision polishing machine according to claim 2 is characterized in that: A rotating fixing ring (9) is provided at the matching position of the hollow central shaft and the water dividing sleeve and is clamped by screws.