Heating substrate for thermal printing head

Abstract

The utility model relates to the technical field of thermal printing head manufacturing, in particular to a heating substrate for a thermal printing head, which is reasonable in structure, capable of reducing adverse effects caused by electrode wire voltage drop, low in process difficulty and low in production cost and is provided with an insulating substrate, and a heat-resistant glaze coating is arranged on the insulating substrate. A heat-resistant glaze coating is arranged on the insulating substrate, a heating resistor and an electrode wire are arranged on the heat-resistant glaze coating, a reinforcing common electrode is further arranged on the insulating substrate and comprises an X-direction section and a Y-direction section, the X-direction section is parallel to the heating resistor, one end of the Y-direction section is connected with the end of the X-direction section, and a bonding pattern part is arranged at the other end of the Y-direction section. A protective layer is arranged above the heating resistor body, the reinforcing common electrode and part of the electrode wire, and the heating resistor body is characterized in that the heating resistor body is connected with the reinforcing common electrode through an auxiliary common electrode, and the auxiliary common electrode covers the upper side of the reinforcing common electrode and is partially located below the heating resistor body.

Description

Technical field:

[0001] The utility model relates to the technical field of thermal print head manufacturing, in particular to a heating substrate for a thermal print head with a reasonable structure, capable of reducing adverse effects caused by voltage drop of electrode wires, and having low process difficulty and production cost. Background technology:

[0002] A heating resistor and an electrode wire connected to the heating resistor are provided on a conventional heating substrate for a thermal print head. The electrode wire includes a common electrode portion connected to the heating resistor, an individual electrode portion, and a bonding pattern portion connected to the end of the individual electrode. As mentioned in patent document CN210680115U, in order to reduce the voltage deviation on the heating resistor caused by the difference in the access position of the common electrode wire, a common wire portion with a relatively larger cross-sectional area is provided on the heating substrate for a thermal print head. This portion of the common wire can be called a reinforced common electrode. The reinforced common electrode includes an X-direction segment provided in parallel with the heating resistor. The heating resistor is connected to the common electrode and is connected to the reinforced common electrode of the X-direction segment through a lead-out electrode. The lead-out electrode here is provided between the common electrode and the X-direction segment of the reinforced common electrode. In this document, in order to overcome the problem of poor bonding between the reinforced common electrode and the heating resistor layer, and the problem of the surface protective layer being easily damaged, resulting in corrosion of the electrode, an underlay glaze coating is added, that is, the reinforced common electrode, part of the lead-out electrode surface, and part of the heat-resistant glaze coating surface are covered by the underlay glaze coating to eliminate the problem of poor bonding between the heating resistor layer and the overlapping part of the silver reinforced common electrode, and the problem of the protective layer on the silver reinforced common electrode being easily damaged, resulting in corrosion of the electrode. However, in the existing literature, the setting area of ​​the lead-out electrode is close to the heat-resistant glaze coating, which makes the operation difficult. In addition, since the lead-out electrode is not covered with the underlay glaze coating so that the area connected to the heating resistor layer is close to the heating resistor, the strength of the protective layer above it may be relatively low, and it is easy to be worn out due to repeated contact and friction of the printing medium during the printing process. The electrode will be corroded after long-term use, affecting the service life of the product. Summary of the invention:

[0003] In view of the shortcomings and deficiencies in the prior art, the utility model proposes a heating substrate for a thermal print head which has a reasonable structure and a simple process and can effectively improve the working reliability of the product.

[0004] The utility model achieves this through the following measures:

[0005] A heating substrate for a thermal print head is provided with an insulating substrate, a heat-resistant glaze coating is provided on the insulating substrate, a heating resistor and an electrode wire are provided on the heat-resistant glaze coating, a reinforcing common electrode is also provided on the insulating substrate, the reinforcing common electrode includes an X-direction segment and a Y-direction segment, the X-direction segment is arranged in parallel with the heating resistor, one end of the Y-direction segment is connected to the end of the X-direction segment, and the other end is provided with a bonding pattern portion, a protective layer is provided above the heating resistor, the reinforcing common electrode and part of the electrode wire, and the characteristic is that the heating resistor is connected to the reinforcing common electrode via an auxiliary common electrode, the auxiliary common electrode covers the upper side of the reinforcing common electrode and is partially located below the heating resistor.

[0006] The auxiliary common electrode of the utility model is made of at least one metal material whose main conductive component is gold, silver, platinum, palladium, copper and aluminum, and its thickness is less than that of the reinforcing common electrode. The lower surface of the auxiliary common electrode is connected to the reinforcing common electrode, and the upper surface can achieve a firm connection with the heating resistor, thereby solving the problem of insufficient adhesion between the reinforcing common electrode and the heating resistor. Furthermore, the auxiliary common electrode completely covers the upper surface of the reinforcing common electrode, and an organic resin protective layer is further provided on the upper surface of the auxiliary common electrode to improve the reliability of the reinforcing common electrode and the auxiliary common electrode.

[0007] In order to improve the density of the surface film layer of the reinforced common electrode, the utility model is also provided with an underlayer glaze coating layer. The auxiliary common electrode is arranged on the upper surface of the reinforced common electrode, and the auxiliary common electrode has an extension portion along the Y direction and away from the heat-resistant glaze coating layer. The extension portion is connected to the heating resistor layer used to form the heating resistor. The underlayer glaze coating layer fills the non-connected space between the heating resistor layer and the auxiliary common electrode. Therefore, under the premise of not affecting the electrical connection between the reinforced common electrode, the auxiliary common electrode and the heating resistor, the underlayer glaze coating layer is used to overcome the adhesion problem between the film layers above the reinforced common electrode. Furthermore, at this time, an organic resin protective layer is arranged above the auxiliary common electrode. The setting area of ​​the organic resin protective layer is away from the position of the heating resistor and is not easily damaged by wear.

[0008] The auxiliary common electrode of the utility model partially covers the upper surface of the reinforcing common electrode. Specifically, the auxiliary common electrode only covers the side of the upper surface of the reinforcing common electrode in the X direction section away from the heat-resistant glaze coating. The auxiliary common electrode has an extension along the Y direction and away from the heat-resistant glaze coating. The heating resistor layer used to form the heating resistor is connected to the extension along the top of the reinforcing common electrode. The substrate glaze layer is filled between the heating resistor layer and the auxiliary common electrode and the reinforcing common electrode. An organic resin protective layer is partially arranged on the upper surface of the auxiliary common electrode. At this time, the organic resin protective layer is mainly located on the side of the reinforcing common electrode away from the heat-resistant glaze coating to avoid damage due to wear. On the premise of ensuring reliable electrical connection, the auxiliary common electrode coverage area can be reduced to reduce production costs.

[0009] The utility model further comprises that the auxiliary common electrode only intermittently covers the side of the upper surface of the reinforcing common electrode in the X direction section away from the heat-resistant glaze coating, and the auxiliary common electrode has an intermittent extension portion along the Y direction and away from the heat-resistant glaze coating.

[0010] Compared with the prior art, the utility model realizes the electrical connection between the heating resistor and the reinforcing common electrode part by adding an auxiliary common electrode. Since the auxiliary common electrode adopts a conductor material or structure different from that of the reinforcing common electrode, the problem of poor bonding between the reinforcing common electrode and the film layer thereon due to material reasons can be overcome. Furthermore, by arranging the auxiliary common electrode at a side away from the heat-resistant glaze coating so as to be in contact with the film layer of the heating resistor, the film layer structure on the upper side of the auxiliary common electrode will not be affected by the unevenness of the heat-resistant glaze coating during the preparation process, the process is simpler and the yield rate is higher. At the same time, the position of the organic resin protective layer used to protect the auxiliary common electrode is also made away from the heat-resistant glaze coating. During the printing process, the height of the organic resin protective layer is lower than the height of the heating resistor on the heat-resistant glaze coating and will not be damaged due to friction with the printing medium, thereby extending the service life of the coating and improving product quality.

[0011] Compared with the prior art, the utility model has the remarkable advantages of reasonable structure, simple process, and can effectively improve product quality and service life. Description of the drawings:

[0012] Attached Figure 1 It is a schematic diagram of the structure of Example 1 of the utility model, wherein Figure 1 (a) is a top view of Example 1, Figure 1 (b) is a schematic diagram of the cross-sectional structure of Example 1.

[0013] Attached Figure 2 It is a schematic diagram of the structure of the second embodiment of the present utility model, wherein Figure 2 (a) is a top view of instantiation 2. Figure 2(b) is a cross-sectional view of the middle section of the reinforced common electrode in Example 2, Figure 2 (c) is a cross-sectional structural diagram of the end surface of the reinforced common electrode in Example 2.

[0014] Attached Figure 3 It is a schematic diagram of the structure of Embodiment 3 of the present utility model. Figure 3 (a) is a top view of Example 3, Figure 3 (b) is a cross-sectional view of the middle section of the reinforced common electrode in Example 3, Figure 3 (c) is a cross-sectional structural diagram of the end surface of the reinforced common electrode in Example 3.

[0015] Attached Figure 4 It is a structural schematic diagram of Embodiment 4 of the present utility model, Figure 4 (a) is a top view of Example 4, Figure 4 (b) is a cross-sectional view of the middle section of the reinforced common electrode in Example 4, Figure 4 (c) is a cross-sectional structural diagram of the end surface of the reinforced common electrode in Example 4.

[0016] Attached Figure 5 It is a structural schematic diagram of Embodiment 5 of the present utility model, Figure 5 (a) is a top view of Example 5.

[0017] Figure numerals: heating substrate 01 for thermal print head, insulating substrate 10, heat-resistant glaze coating 20, heating resistor 30, reinforcing common electrode 40, X-direction segment 41, Y-direction segment 42, protective layer 50, base glaze coating 60, auxiliary common electrode 70, extension portion 71. Specific implementation method:

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] Embodiment 1:

[0020] As attached Figure 1 As shown, this example provides a heating substrate for a thermal print head, which is provided with an insulating substrate 10, a heat-resistant glaze coating 20 is provided on the insulating substrate 10, a heating resistor 30 and an electrode wire are provided on the heat-resistant glaze coating 20, and a reinforcing common electrode 40 is further provided on the insulating substrate 10, and the reinforcing common electrode 40 includes an X-direction segment 41 and a Y-direction segment 42, the X-direction segment 41 is arranged parallel to the heating resistor 30, one end of the Y-direction segment 42 is connected to the end of the X-direction segment 41, and the other end is provided with a bonding pattern portion, a protective layer is provided above the heating resistor 30, the reinforcing common electrode 40 and part of the electrode wire, the heating resistor 30 is connected to the reinforcing common electrode 40 via an auxiliary common electrode 70, and the auxiliary common electrode 70 covers the upper side of the reinforcing common electrode 40 and is partially located below the heating resistor 30;

[0021] The auxiliary common electrode 70 in this example is made of at least one metal material whose main conductive component is gold, silver, platinum, palladium, copper, aluminum, etc., and its thickness is smaller than that of the reinforcing common electrode. The lower surface of the auxiliary common electrode 70 is in contact with the reinforcing common electrode 40, and the upper surface can be firmly connected with the heating resistor 30, thereby solving the problem of insufficient adhesion between the reinforcing common electrode 40 and the heating resistor 30.

[0022] Furthermore, the auxiliary common electrode 70 in this example completely covers the upper surface of the reinforcing common electrode 40 , and an organic resin protective layer is further provided on the upper surface of the auxiliary common electrode to improve the reliability of the reinforcing common electrode 40 and the auxiliary common electrode 70 .

[0023] Embodiment 2:

[0024] As attached Figure 2 As shown, this example provides a heating substrate for a thermal print head, which is provided with an insulating substrate 10, a heat-resistant glaze coating 20 is provided on the insulating substrate 10, a heating resistor 30 and an electrode wire are provided on the heat-resistant glaze coating 20, and a reinforcing common electrode 40 is further provided on the insulating substrate 10, and the reinforcing common electrode 40 includes an X-direction segment 41 and a Y-direction segment 42, the X-direction segment 41 is arranged parallel to the heating resistor 30, one end of the Y-direction segment 42 is connected to the end of the X-direction segment 41, and the other end is provided with a bonding pattern portion, a protective layer is provided above the heating resistor 30, the reinforcing common electrode 40 and part of the electrode wire, the heating resistor 30 is connected to the reinforcing common electrode 40 via an auxiliary common electrode 70, and the auxiliary common electrode 70 covers the upper side of the reinforcing common electrode 40 and is partially located below the heating resistor 30;

[0025] The auxiliary common electrode 70 in this example is made of at least one metal material whose main conductive component is gold, silver, platinum, palladium, copper, aluminum, etc., and its thickness is smaller than that of the reinforcing common electrode 40;

[0026] In order to improve the compactness of the film layer on the surface of the reinforcing common electrode 40, this example further provides an underlayer glaze coating 60, the auxiliary common electrode is arranged on the upper surface of the reinforcing common electrode 40, and the auxiliary common electrode 70 has an extension portion 71 along the Y direction and away from the heat-resistant glaze coating 20, the extension portion 71 is connected to the heating resistor layer used to form the heating resistor 30, and the underlayer glaze coating 60 fills the non-connected space between the heating resistor layer and the auxiliary common electrode 70, so that the underlayer glaze coating is used to overcome the adhesion problem between the film layers above the reinforcing common electrode 40 without affecting the electrical connection of the reinforcing common electrode 40, the auxiliary common electrode 70, and the heating resistor 30;

[0027] In this example, an organic resin protective layer is disposed above the auxiliary common electrode 70 . The region where the organic resin protective layer is disposed is far away from the heating resistor 30 and is not easily damaged by wear.

[0028] Embodiment 3:

[0029] As attached Figure 3 As shown, this example provides a heating substrate for a thermal print head, which is provided with an insulating substrate 10, a heat-resistant glaze coating 20 is provided on the insulating substrate 10, a heating resistor 30 and an electrode wire are provided on the heat-resistant glaze coating 20, and a reinforcing common electrode 40 is further provided on the insulating substrate 10, and the reinforcing common electrode 40 includes an X-direction segment 41 and a Y-direction segment 42, the X-direction segment 41 is arranged parallel to the heating resistor 30, one end of the Y-direction segment 42 is connected to the end of the X-direction segment 41, and the other end is provided with a bonding pattern portion, a protective layer is provided above the heating resistor 30, the reinforcing common electrode 40 and part of the electrode wire, the heating resistor 30 is connected to the reinforcing common electrode 40 via an auxiliary common electrode 70, and the auxiliary common electrode 70 covers the upper side of the reinforcing common electrode 70 and is partially located below the heating resistor 30;

[0030] The auxiliary common electrode 70 in this example is made of at least one metal material whose main conductive component is gold, silver, platinum, palladium, copper, aluminum, etc., and its thickness is less than that of the reinforcing common electrode 40; Figure 3 As shown in (b) and 3(c), the auxiliary common electrode 70 partially covers the upper surface of the reinforcing common electrode 40. Specifically, the auxiliary common electrode only covers the upper surface of the reinforcing common electrode X-direction segment 41 on the side away from the heat-resistant glaze coating 20. The auxiliary common electrode 70 has an extension portion 71 along the Y direction and away from the heat-resistant glaze coating 20. The heating resistor layer used to form the heating resistor 30 is connected to the extension portion 71 along the top of the reinforcing common electrode 40. The substrate glaze layer 60 is filled between the heating resistor layer and the auxiliary common electrode 70 and the reinforcing common electrode 40. An organic resin protective layer is partially provided on the upper surface of the auxiliary common electrode 70. At this time, the organic resin protective layer is mainly located on the side of the reinforcing common electrode 40 away from the heat-resistant glaze coating to avoid damage due to wear. Under the premise of ensuring reliable electrical connection, the auxiliary common electrode coverage area can be reduced to reduce production costs.

[0031] Embodiment 4:

[0032] As attached Figure 4As shown, this example provides a heating substrate for a thermal print head, which is provided with an insulating substrate, a heat-resistant glaze coating is provided on the insulating substrate, a heating resistor and an electrode wire are provided on the heat-resistant glaze coating, and a reinforcing common electrode is further provided on the insulating substrate, the reinforcing common electrode includes an X-direction segment and a Y-direction segment, the X-direction segment is arranged parallel to the heating resistor, one end of the Y-direction segment is connected to the end of the X-direction segment, and the other end is provided with a bonding pattern portion, a protective layer is provided above the heating resistor, the reinforcing common electrode and part of the electrode wire, the heating resistor is connected to the reinforcing common electrode via an auxiliary common electrode, the auxiliary common electrode covers the upper side of the reinforcing common electrode, and is partially located below the heating resistor;

[0033] The auxiliary common electrode in this example is made of at least one metal material whose main conductive component is gold, silver, platinum, palladium, copper, aluminum, etc., and its thickness is smaller than that of the reinforcing common electrode; Figure 4 (b) and 3(c), the auxiliary common electrode only partially covers the upper surface of the reinforcing common electrode in the X direction section on the side away from the heat-resistant glaze coating, and the auxiliary common electrode has a discontinuous extension along the Y direction and away from the heat-resistant glaze coating;

[0034] The heating resistor layer used to form the heating resistor is connected to the extension portion along the top of the reinforced common electrode, and the substrate glaze layer is filled between the heating resistor layer and the auxiliary common electrode and the reinforced common electrode. An organic resin protective layer is partially arranged on the upper surface of the auxiliary common electrode. At this time, the organic resin protective layer is mainly located on the side of the reinforced common electrode away from the heat-resistant glaze coating to avoid damage due to wear. It can also reduce the coverage area of ​​the auxiliary common electrode and reduce production costs while ensuring reliable electrical connection.

[0035] Embodiment 5:

[0036] As attached Figure 5 As shown, this example provides a heating substrate for a thermal print head. The structure of this example is similar to that of Example 4, that is, the auxiliary common electrode only intermittently partially covers the upper surface of the reinforcing common electrode in the X direction section away from the heat-resistant glaze coating, and the auxiliary common electrode has an intermittent extension along the Y direction and away from the heat-resistant glaze coating;

[0037] The heating resistor layer used to form the heating resistor is connected to the extension portion along the top of the reinforcing common electrode, the substrate glaze layer is filled between the heating resistor layer and the auxiliary common electrode and the reinforcing common electrode, and an organic resin protective layer is partially provided on the upper surface of the auxiliary common electrode. At this time, the organic resin protective layer is mainly located on the side of the reinforcing common electrode away from the heat-resistant glaze coating layer to avoid being damaged by wear and tear, and can reduce the auxiliary common electrode coverage area and reduce production costs while ensuring reliable electrical connection;

[0038] Compared with Example 4, the auxiliary common electrode in this example is composed of two or more strip-shaped auxiliary common electrode monomers of equal specifications and equal spacing, and the central axis of the strip-shaped auxiliary common electrode monomer intersects with the Y-axis, thereby forming an inclined strip-shaped auxiliary common electrode monomer. While occupying a smaller substrate space, the length of each strip-shaped auxiliary common electrode monomer is significantly extended to improve the reliability of the electrical connection with the heating resistor.

[0039] Compared with the prior art, the utility model has the remarkable advantages of reasonable structure, simple process, and can effectively improve product quality and service life.

[0040] In the specific implementation process of the utility model, several changes can be made. For example, the auxiliary common electrode is at least partially arranged below the reinforcing common electrode, a substrate glaze coating is arranged above the reinforcing common electrode, and the heating resistor is connected to the reinforcing common electrode via the auxiliary common electrode, which does not affect the beneficial effects of the utility model.

Claims

1. A heating substrate for a thermal print head, comprising an insulating substrate, a heat-resistant glaze coating on the insulating substrate, a heating resistor and an electrode wire on the heat-resistant glaze coating, a reinforcing common electrode on the insulating substrate, the reinforcing common electrode comprising an X-direction segment and a Y-direction segment, the X-direction segment being arranged parallel to the heating resistor, one end of the Y-direction segment being connected to the end of the X-direction segment, and the other end being provided with a bonding pattern portion, a protective layer being arranged above the heating resistor, the reinforcing common electrode and part of the electrode wire, wherein: The heating resistor is connected to the reinforcing common electrode via an auxiliary common electrode. The auxiliary common electrode covers the upper side of the reinforcing common electrode and is partially located below the heating resistor.

2. A heating substrate for a thermal print head according to claim 1, characterized in that: The auxiliary common electrode is made of a material whose main conductive component is at least one of gold, silver, platinum, palladium, copper and aluminum, and its thickness is smaller than that of the reinforcing common electrode. The lower surface of the auxiliary common electrode is connected to the reinforcing common electrode, and the upper surface can achieve a firm connection with the heating resistor. An organic resin protective layer is arranged on the upper surface of the auxiliary common electrode.

3. A heating substrate for a thermal print head according to claim 2, characterized in that: The auxiliary common electrode completely covers the upper surface of the reinforcing common electrode.

4. A heating substrate for a thermal print head according to claim 2, characterized in that: A substrate glaze coating is also provided, and the auxiliary common electrode is arranged on the upper surface of the reinforcing common electrode, and the auxiliary common electrode has an extension portion along the Y direction and away from the heat-resistant glaze coating, and the extension portion is connected to the heating resistor layer used to form the heating resistor. The substrate glaze coating fills the non-connected space between the heating resistor layer and the auxiliary common electrode. At this time, the setting area of ​​the organic resin protective layer above the auxiliary common electrode is away from the position of the heating resistor.

5. The heating substrate for a thermal print head according to claim 2, characterized in that: The auxiliary common electrode partially covers the upper surface of the reinforcing common electrode. Specifically, the auxiliary common electrode only covers the side of the upper surface of the reinforcing common electrode in the X direction segment away from the heat-resistant glaze coating. The auxiliary common electrode has an extension along the Y direction and away from the heat-resistant glaze coating. The heating resistor layer used to form a heating resistor is connected to the extension along the top of the reinforcing common electrode. The substrate glaze layer is filled between the heating resistor layer and the auxiliary common electrode and the reinforcing common electrode. An organic resin protective layer is partially provided on the upper surface of the auxiliary common electrode.

6. A heating substrate for a thermal print head according to claim 5, characterized in that: The auxiliary common electrode only intermittently covers the side of the upper surface of the reinforcing common electrode in the X direction section away from the heat-resistant glaze coating, and the auxiliary common electrode has an intermittent extension along the Y direction and away from the heat-resistant glaze coating.

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