Silicon wafer guide device

Abstract

The utility model relates to a silicon wafer guiding device which comprises a bottom plate, a lifting mechanism, a guiding mechanism and a conveying mechanism, the lifting mechanism and the conveying mechanism are both installed on the bottom plate, the guiding mechanism is installed on the lifting mechanism, and the conveying mechanism penetrates through the guiding mechanism. According to the utility model, the utilization rate is higher, the silicon wafers are contacted with the guide belts with different horizontal heights through the lifting mechanism, the utilization rate of the guide belts is improved, the replacement frequency of guide belt consumables is reduced, and the cost is effectively saved; the compatibility is higher, the distance between the two guide belts can be adjusted, silicon wafers of different sizes can be guided, and the compatibility of the device is improved; the material blocking risk is lower, trumpet-shaped feeding is formed through the two guide belts, the silicon wafers enter the guide station more smoothly, and the material blocking risk caused by the fact that the edges of the silicon wafers collide with the guide belts is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer sorting machines, in particular to a silicon wafer guiding device. Background Art

[0002] The silicon wafer sorting machine generally consists of three parts: loading, testing and unloading sorting. The testing machine tests various indicators of silicon wafers. The silicon wafers quickly flow through the various testing stations of the testing machine through the water conveyor line to complete the testing of various indicators. For the testing factors such as silicon wafer thickness and edge collapse, the silicon wafer needs to enter the testing station stably, and the posture of the subsequent silicon wafer sorting into the material box is affected. Therefore, the silicon wafer needs to be corrected on the conveyor line before entering the testing station. In the existing correction device, when the silicon wafer deviates at a large angle on the conveyor line, the corner of the silicon wafer will hit the guide wheel, thereby causing the risk of material blockage. Moreover, each guide wheel is an unpowered idle wheel. When the silicon wafer contacts quickly, friction and other factors will cause the risk of slowing down the transmission speed of the silicon wafer. It is not suitable for the silicon wafer correction function during the operation of the high-speed silicon wafer sorting machine. In addition, when the silicon wafer is quickly transmitted on the conveyor line, the edge of the silicon wafer only rubs against one position of the guide belt, so the guide belt wears quickly and needs to be replaced frequently, thereby increasing production costs. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a silicon wafer guiding device which has high guiding efficiency, is not easy to be blocked, has a longer guiding belt service life and is convenient to maintain.

[0004] The technical solution of the utility model is: a silicon wafer guiding device, comprising a base plate, a lifting mechanism, a guiding mechanism and a conveying mechanism, the lifting mechanism and the conveying mechanism are both installed on the base plate, the guiding mechanism is installed on the lifting mechanism, and the conveying mechanism passes through the guiding mechanism.

[0005] Furthermore, the lifting mechanism includes a lifting motor, a lifting screw, a lifting nut, a lifting plate and a guide structure. The lifting motor is installed on the base plate, the lifting screw is rotatably connected to the base plate, the output end of the lifting motor is transmission connected to the lifting screw, the lifting screw is transmission connected to the lifting nut, the lifting plate is installed on the lifting nut, the lifting plate is connected to the base plate through the guide structure, and the guide mechanism is installed on the lifting plate.

[0006] Furthermore, the output end of the lifting motor is connected to the lifting screw through a lifting belt transmission.

[0007] Furthermore, the guide structure includes a guide column and a guide hole, the guide column is installed on the base plate, the guide hole is located on the lifting plate, and the guide column is slidably connected to the guide hole.

[0008] Furthermore, a height limiting plate is provided at the upper end of the guide column, and the lifting nut is located between the bottom plate and the height limiting plate.

[0009] Furthermore, a position sensor is provided on the bottom plate, and the lifting plate is located on the side of the position sensor.

[0010] Furthermore, the lifting plate is provided with a sensing sheet, and the sensing sheet can pass through and trigger a position sensor.

[0011] Furthermore, the guide mechanism includes a guide plate, a guide motor, a driving wheel, a driven wheel and a guide belt symmetrically arranged on both sides of the conveying mechanism, the guide plate is installed on the lifting plate, the guide motor and the driven wheel are both installed on the guide plate, the output end of the guide motor is connected to the driving wheel, the driven wheel is rotatably connected to the guide plate, and the driving wheel and the driven wheel are connected through a guide belt transmission.

[0012] Furthermore, a tensioning wheel is rotatably connected to the guide plate, and the driving wheel, the driven wheel and the tensioning wheel are connected through a guide belt transmission.

[0013] Furthermore, the driving wheel, the driven wheel and the tensioning wheel are distributed in a triangle, with one long side of the triangle located outside the guiding mechanism, and two short sides located inside the guiding mechanism, and one short side is parallel to the conveying direction of the conveying mechanism.

[0014] Furthermore, the tensioning wheel is movably mounted on the guide plate.

[0015] Furthermore, a guide rail is provided on the upper end of the lifting plate, a guide screw is rotatably connected to the side of the lifting plate, a slider is provided at the lower end of the guide plate, the guide screw is threadedly connected to the slider, and the slider is slidably connected to the slide rail.

[0016] Furthermore, a knob is provided at one end of the guide screw.

[0017] Furthermore, a locking screw is threadedly connected to the upper end of the lifting plate, and the locking screw can be pressed against the side of the guide screw.

[0018] Furthermore, a cursor is provided at the lower end of the guide plate, and a scale line is provided on the side of the lifting plate, and the cursor is located on the side of the scale line.

[0019] Furthermore, the conveying mechanism includes two conveying lines symmetrically arranged on the bottom plate, and the two conveying lines pass through the guiding mechanism.

[0020] Furthermore, the conveyor line is connected to the base plate via a distance adjustment structure.

[0021] Furthermore, the conveyor line is provided with a guide wheel set.

[0022] Furthermore, the speeds of the guide belt and the conveyor line are consistent.

[0023] Compared with the prior art, the advantages of the utility model are: higher utilization rate, the silicon wafer is brought into contact with the guide belts at different levels through the lifting mechanism, which improves the utilization rate of the guide belts, while reducing the replacement frequency of the guide belt consumables, effectively saving costs; higher compatibility, the two guide belts can adjust the spacing, and silicon wafers of different sizes can be guided, improving the compatibility of the device; lower risk of blockage, the trumpet-shaped feed is formed by the two guide belts, allowing the silicon wafer to enter the guide station more smoothly, reducing the risk of blockage caused by the silicon wafer edge hitting the guide belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a structural schematic diagram of the front side of the utility model;

[0026] Figure 2 It is a structural schematic diagram of the back side of the utility model;

[0027] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0028] Figure 4 for Figure 2 The enlarged view of point B in the middle;

[0029] Figure 5 It is a top view of the utility model;

[0030] Figure 6 It is a structural schematic diagram of the lifting mechanism and the guiding mechanism of the utility model;

[0031] Figure 7 It is a front view of the lifting mechanism and the guiding mechanism of the utility model.

[0032] Among them: 1. Base plate; 2. Lifting motor; 3. Lifting belt; 4. Lifting screw; 5. Lifting nut; 6. Lifting plate; 7. Guide hole; 8. Guide column; 9. Height limit plate; 10. Knob; 11. Locking screw; 12. Guide screw; 13. Scale line; 14. Guide motor; 15. Vernier; 16. Guide belt; 17. Driving wheel; 18. Driven wheel; 19. Tensioning wheel; 20. Conveyor line; 21. Guide wheel group; 22. Position sensor; 23. Induction sheet; 24. Distance adjustment structure; 25. Guide rail; 26. Slider; 27. Silicon wafer. DETAILED DESCRIPTION

[0033] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0034] like Figure 1-7 As shown, a silicon wafer guiding device comprises a base plate 1, a lifting mechanism, a guiding mechanism and a conveying mechanism, wherein the lifting mechanism and the conveying mechanism are both mounted on the base plate 1, the guiding mechanism is mounted on the lifting mechanism, and the height of the guiding mechanism can be adjusted, the conveying mechanism transports the silicon wafer 27 through the guiding mechanism, and the direction is corrected by the guiding mechanism; the conveying mechanism comprises two conveying lines 20 symmetrically arranged on the base plate 1, the two conveying lines 20 pass through the guiding mechanism, and the two conveying lines 20 jointly hold the silicon wafer 27, which has sufficient friction to carry the silicon wafer 27 and prevents the silicon wafer 27 from being damaged. The friction of the conveyor line 20 is too large, which affects the guiding effect of the guiding mechanism; the conveyor line 20 is connected to the base plate 1 through a distance adjustment structure 24, and the distance adjustment structure 24 is in the form of a screw nut, which can adjust the distance between the two conveyor lines 20 to adapt to silicon wafers 27 of different sizes; the conveyor line 20 is provided with a receiving guide wheel group 21 to prevent the belt of the conveyor line 20 from being too long and causing it to be loose and easy to damage; the speed of the guiding belt 16 and the conveyor line 20 is consistent, ensuring that the silicon wafer 27 is subjected to stable force when passing through the guiding mechanism, avoiding damage to the silicon wafer 27 due to speed differences.

[0035] In the above embodiment, the lifting mechanism includes a lifting motor 2, a lifting screw 4, a lifting nut 5, a lifting plate 6 and a guide structure. The lifting motor 2 is installed on the base plate 1, the lifting screw 4 is rotatably connected to the base plate 1, the output end of the lifting motor 2 is transmission-connected to the lifting screw 4, the lifting screw 4 is transmission-connected to the lifting nut 5, the lifting plate 6 is installed on the lifting nut 5, the lifting plate 6 is connected to the base plate 1 through a guide structure, and the guide mechanism is installed on the lifting plate 6. The lifting motor 2 rotates and controls the lifting plate 6 to rise or fall through the lifting screw 4 and the lifting nut 5, so as to adjust the height of the guide mechanism; the output end of the lifting motor 2 is transmission-connected to the lifting screw 4 through the lifting belt 3, and the lifting motor 2 can be inverted and installed on the side of the lifting screw 4, saving installation space; the guide structure includes a guide column 8 and a guide hole 7, the guide column 8 is installed on the base plate 1, the guide hole 7 is located on the lifting plate 6, the guide column 8 is slidably connected to the guide hole 7, which provides both guidance and auxiliary force; a height limiting plate 9 is provided at the upper end of the guide column 8, and the lifting nut 5 is located between the base plate 1 and the height limiting plate 9 to prevent the lifting nut 5 from falling out of the lifting screw 4, or the guide column 8 from falling out of the guide hole 7; a position sensor 22 is provided on the base plate 1, and the lifting plate 6 is located on the side of the position sensor 22, which is used to monitor and feedback the position of the lifting plate 6 to prevent the lifting plate 6 from colliding with the conveying mechanism above it; a sensor sheet 23 is provided on the lifting plate 6, and the position sensor 22 is arranged one up and one down, and the sensor sheet 23 can move up and down and trigger the position sensor 22.

[0036] In the above embodiment, the guide mechanism includes a guide plate, a guide motor 14, a driving wheel 17, a driven wheel 18 and a guide belt 16 symmetrically arranged on both sides of the conveying mechanism. The guide plate is installed on the lifting plate 6, and the guide motor 14 and the driven wheel 18 are both installed on the guide plate. The output end of the guide motor 14 is connected to the driving wheel 17, and the driven wheel 18 is rotatably connected to the guide plate. The driving wheel 17 and the driven wheel 18 are connected by the guide belt 16. The silicon wafer 27 moves on the conveying mechanism and enters the guide mechanism, and the guide motor 14 and the driven wheel 18 are connected by the guide belt 16. The guide belts 16 on both sides of the mechanism are used for receiving and guiding; the guide plate is rotatably connected with a tensioning wheel 19, and the driving wheel 17, the driven wheel 18 and the tensioning wheel 19 are connected through the guide belt 16 to ensure the tension of the guide belt 16, thereby ensuring the guiding effect; the driving wheel 17, the driven wheel 18 and the tensioning wheel 19 are distributed in a triangle, one long side of the triangle is located outside the guide mechanism, and the two short sides are located inside the guide mechanism, one of the short sides is parallel to the conveying direction of the conveying mechanism, and the two symmetrical guide belts are connected to each other through the guide belt 16. The belt 16 is in a trumpet-shaped open arrangement, so that the silicon wafer 27 on the conveying mechanism can more easily enter between the two guide belts 16, preventing the silicon wafer 27 from getting stuck or falling off due to impact; the tensioning wheel 19 can be movably mounted on the guide plate, and the tensioning amplitude can be adjusted; a guide rail 25 is provided at the upper end of the lifting plate 6, and a guide screw rod 12 is rotatably connected to the side of the lifting plate 6, and a slider 26 is provided at the lower end of the guide plate, and the guide screw rod 12 is threadedly connected to the slider 26, and the slider 26 is slidably connected to the slide rail, so that the distance between the two guide belts 16 can be adjusted, so as to adapt Silicon wafers 27 of different models and sizes should be used; a knob 10 is provided at one end of the guide screw 12 to facilitate manual operation; a locking screw 11 is threadedly connected to the upper end of the lifting plate 6, and the locking screw 11 can be pressed against the side of the guide screw 12. After adjusting the position of the slider 26, the locking screw 11 can be used to press the guide screw 12 to prevent it from loosening; a cursor 15 is provided at the lower end of the guide plate, and a scale line 13 is provided on the side of the lifting plate 6. The cursor 15 is located on the side of the scale line 13, and the distance between the two guide belts 16 can be observed.

[0037] Description of the working method of this utility model:

[0038] When the silicon wafer 27 enters the device from the outside, it is held and conveyed forward by two conveyor lines 20. When it reaches the guiding mechanism, the two sides of the silicon wafer 27 first contact the guiding belts 16 on both sides of the guiding mechanism, and as the silicon wafer 27 continues to move forward, the silicon wafer 27 enters the middle of the guiding mechanism from between the two trumpet-shaped guiding belts 16, and realizes the direction correction under the correction of the two guiding belts 16. Since the speed of the guiding motor 14 is consistent with that of the two conveyor lines 20, the silicon wafer 27 is clamped stably after entering the guiding mechanism, and the efficient guiding effect of fast passage is maintained. After the guiding mechanism has been used for a period of time, the two guiding belts 16 will be worn to a certain extent. At this time, the height of the two guiding belts 16 can be adjusted by the lifting mechanism to avoid the worn position, so that the guiding mechanism still maintains the original guiding effect, and the utilization rate of the guiding belts 16 is also improved. The guiding belts 16 can be replaced after they are fully utilized, which effectively saves costs.

[0039] The above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A silicon wafer guiding device, comprising a base plate, a lifting mechanism, a guiding mechanism and a conveying mechanism, characterized in that: The lifting mechanism and the conveying mechanism are both installed on the bottom plate, the guide mechanism is installed on the lifting mechanism, the conveying mechanism passes through the guide mechanism, the guide mechanism includes a guide plate, a guide motor, a driving wheel, a driven wheel and a guide belt symmetrically arranged on both sides of the conveying mechanism, the guide plate is installed on the lifting mechanism, the guide motor and the driven wheel are both installed on the guide plate, the output end of the guide motor is connected to the driving wheel, the driven wheel is rotatably connected to the guide plate, and the driving wheel and the driven wheel are connected through the guide belt transmission.

2. The silicon wafer guiding device according to claim 1, characterized in that: The lifting mechanism includes a lifting motor, a lifting screw, a lifting nut, a lifting plate and a guide structure. The lifting motor is installed on the base plate, the lifting screw is rotatably connected to the base plate, the output end of the lifting motor is transmission-connected to the lifting screw, the lifting screw is transmission-connected to the lifting nut, the lifting plate is installed on the lifting nut, the lifting plate is connected to the base plate through the guide structure, the guide mechanism is installed on the lifting plate, and the output end of the lifting motor is transmission-connected to the lifting screw through a lifting belt.

3. The silicon wafer guiding device according to claim 2, characterized in that: The guide structure includes a guide column and a guide hole. The guide column is installed on the base plate. The guide hole is located on the lifting plate. The guide column is slidably connected to the guide hole. A height limiting plate is provided at the upper end of the guide column. The lifting nut is located between the base plate and the height limiting plate.

4. The silicon wafer guiding device according to claim 2, characterized in that: A position sensor is arranged on the bottom plate, the lifting plate is located at the side of the position sensor, and a sensing sheet is arranged on the lifting plate, and the sensing sheet can pass through and trigger the position sensor.

5. The silicon wafer guiding device according to claim 1, characterized in that: A tensioning wheel is rotatably connected to the guide plate, and the driving wheel, the driven wheel and the tensioning wheel are connected by a guide belt transmission. The driving wheel, the driven wheel and the tensioning wheel are distributed in a triangle, and one long side of the triangle is located on the outside of the guide mechanism, and two short sides are located on the inside of the guide mechanism, one of the short sides is parallel to the conveying direction of the conveying mechanism, and the tensioning wheel is movably mounted on the guide plate.

6. The silicon wafer guiding device according to claim 1, characterized in that: A guide rail is provided at the upper end of the lifting mechanism, a guide screw is rotatably connected to the side of the lifting mechanism, a slider is provided at the lower end of the guide plate, the guide screw is threadedly connected to the slider, the slider is slidably connected to the slide rail, a knob is provided at one end of the guide screw, a locking screw is threadedly connected to the upper end of the lifting mechanism, and the locking screw can be against the side of the guide screw.

7. The silicon wafer guiding device according to claim 1, characterized in that: A cursor is arranged at the lower end of the guide plate, and a scale line is arranged on the side of the lifting mechanism, and the cursor is located on the side of the scale line.

8. The silicon wafer guiding device according to claim 1, characterized in that: The conveying mechanism comprises two conveying lines symmetrically arranged on the bottom plate, the two conveying lines pass through the guiding mechanism, the conveying lines are connected to the bottom plate through a distance adjustment structure, and the conveying lines are provided with a receiving guide wheel group.

9. The silicon wafer guiding device according to claim 8, characterized in that: The speed of the guide belt is consistent with that of the conveyor line.

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