Wafer placing box matched with jacking

Abstract

The utility model discloses a wafer placing box cooperating with jacking, comprising a rotating device, a plurality of wafer placing mechanisms arranged on the rotating device, and a jacking mechanism arranged below the wafer placing mechanisms, the wafer placing mechanisms are fixedly installed on the rotating device, and the jacking mechanism is installed on a platform. The wafer box has the advantages that the problem that an existing wafer box cannot contain stacked wafers can be solved, the wafers can be ejected out of the wafer box when needed, operation is convenient, and the using effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer placement, in particular to a wafer placement box with jacking function. Background Art

[0002] In the semiconductor silicon wafer manufacturing process, cylindrical silicon ingots are cut into countless stacked thin slices, namely wafers. The appearance and thickness of the wafers affect the subsequent wafer production. Before production, each wafer needs to be inspected for appearance and defective wafers are removed. Then, the thickness of each wafer is classified according to different intervals, and each wafer is inserted into a wafer box before it can flow into the subsequent wafer production.

[0003] In the wafer production process, a box for loading wafers is needed, which is called a wafer box. However, this type of box has one hole to hold one wafer. For wafers stacked together after being cut from silicon ingots, the wafer box cannot directly hold them, and the stacked silicon wafers need to be separated manually.

[0004] In view of the above situation, it is necessary to improve the existing wafer placement box so that it can adapt to the current needs of wafer placement. Utility Model Content

[0005] The utility model aims to solve the above problems and designs a wafer placing box with jacking.

[0006] To achieve the above-mentioned purpose, the technical solution of the utility model is a wafer placement box with lifting function, including a rotating device, a plurality of wafer placement mechanisms arranged on the rotating device, and a lifting mechanism arranged below the wafer placement mechanism, wherein the wafer placement mechanism is fixedly installed on the rotating device, and the lifting mechanism is installed on the platform.

[0007] As a further supplement to the technical solution, the rotating device includes a servo motor, a rotating platform connected to the servo motor, and a turntable connected to the rotating platform. Multiple wafer placement mechanisms are installed on the turntable, and the lifting mechanism is arranged under the turntable.

[0008] To further supplement the present technical solution, the wafer placement mechanism includes a fixed base plate, a lifting plate arranged above the fixed base plate, multiple limiting mechanisms arranged on the lifting plate and the fixed base plate, a pad arranged on the lifting plate, multiple support rods arranged on the fixed base plate, and arc-shaped support plates symmetrically arranged on the left and right sides of the lifting plate. The fixed base plate is fixedly installed on the turntable, one end of the limiting mechanism is fixedly connected to the fixed base plate, the pad is fixedly installed on the lifting plate, the lower end of the arc-shaped support plate is connected to the support rod and the limiting mechanism, one end of the support rod is fixedly connected to the arc-shaped support plate, and the other end of the support rod is fixedly connected to the fixed base plate.

[0009] As a further supplement to the technical solution, the support rods and the limiting mechanism array are arranged on a fixed base plate.

[0010] To further supplement the present technical solution, the limiting mechanism includes a connecting rod and a downward pressure spring sleeved on the connecting rod, one end of the connecting rod is fixedly connected to the fixed base plate, the other end of the connecting rod is fixedly connected to the arc-shaped support plate, one end of the downward pressure spring is fixedly connected to the lifting plate, the other end of the downward pressure spring is fixedly connected to the arc-shaped support plate, and the connecting rod passes through the upper and lower surfaces of the lifting plate and is connected to it through a bearing.

[0011] As a further supplement to the technical solution, a plurality of wafer placement mechanism arrays are arranged on the turntable.

[0012] As a further supplement to the present technical solution, the lifting mechanism includes a mounting plate, a control cylinder arranged below the mounting plate, a lifting shaft connected to the control cylinder, and a push plate arranged at the upper end of the lifting shaft and fixedly connected thereto, and the control cylinder is fixedly installed below the mounting plate.

[0013] To further supplement the present technical solution, a limit moving mechanism is also provided on the mounting plate located on the outer side of the lifting shaft, and the limit moving mechanism includes a limit shaft arranged around the lifting shaft, a first limit plate arranged on the limit shaft, and a second limit plate arranged on the limit shaft. The lower end of the limit shaft passes through the upper and lower surfaces of the mounting plate and is connected thereto by a bearing, the lifting shaft passes through the upper and lower surfaces of the first limit plate and is connected thereto by a bearing, the upper end of the limit shaft is fixedly connected to the lower surface of the second limit plate, and the push plate is arranged below the second limit plate.

[0014] The beneficial effect is that the problem that the existing wafer box cannot accommodate stacked wafers can be solved, and the wafer can be ejected from the wafer box when needed, which is easy to operate and has a good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of the utility model from a first angle;

[0016] Figure 2 This is a second angle overall structural diagram of the utility model;

[0017] Figure 3 This is a schematic diagram of the overall structure of the utility model from a third angle;

[0018] In the figure, 1. rotating device; 11. servo motor; 12. rotating platform; 13. turntable; 2. wafer placement mechanism; 21. fixed bottom plate; 22. lifting plate; 23. limiting mechanism; 231. connecting rod; 232. downward pressure spring; 24. pad; 25. support rod; 26. arc-shaped support plate; 3. lifting mechanism; 31. mounting plate; 32. control cylinder; 33. lifting shaft; 34. push plate; 4. limiting moving mechanism; 41. limiting shaft; 42. first limiting plate; 43. second limiting plate. DETAILED DESCRIPTION

[0019] In order to make the technical solution more clear to those skilled in the art, Figure 1-3 The technical solution of the utility model is described in detail:

[0020] A wafer placement box with jacking, comprising a rotating device 1, a plurality of wafer placement mechanisms 2 arranged on the rotating device 1, and a jacking mechanism 3 arranged below the wafer placement mechanism 2, wherein the wafer placement mechanism 2 is fixedly mounted on the rotating device 1, and the jacking mechanism 3 is mounted on a platform, and wafers and stacked wafers can be mounted in the wafer placement mechanism 2, and due to the number of wafers, various types of wafers can be placed, the rotating device 1 is designed to facilitate the installation of wafers in the wafer placement mechanism 2, and the jacking mechanism 3 can eject the wafer from the wafer placement mechanism 2 when the wafer is needed, so as to facilitate subsequent removal.

[0021] The structure of the rotating device 1 will be described in detail below. The rotating device 1 includes a servo motor 11, a rotating platform 12 connected to the servo motor 11, and a turntable 13 connected to the rotating platform 12. Multiple wafer placement mechanisms 2 are installed on the turntable 13, and the lifting mechanism 3 is arranged below the turntable 13. The servo motor 11 can control the rotation of the rotating platform 12. The rotation of the rotating platform 12 can drive the turntable 13 to rotate, thereby driving the wafer placement mechanism 2 thereon to rotate, which is convenient for better installation of wafers therein and also convenient for the lifting mechanism 3 to eject the wafers in the multiple wafer placement mechanisms 2.

[0022] The structure of the wafer placement mechanism 2 will be described in detail below. The wafer placement mechanism 2 includes a fixed base plate 21, a lifting plate 22 arranged above the fixed base plate 21, a plurality of limiting mechanisms 23 arranged on the lifting plate 22 and the fixed base plate 21, a pad 24 arranged on the lifting plate 22, a plurality of support rods 25 arranged on the fixed base plate 21, and arc-shaped supporting plates 26 symmetrically arranged on the left and right sides of the lifting plate 22. The fixed base plate 21 is fixedly mounted on the turntable 13, one end of the limiting mechanism 23 is fixedly connected to the fixed base plate 21, and the pad 24 is fixedly mounted on the lifting plate 2 2, the lower end of the arc-shaped support plate 26 is connected to the support rod 25 and the limiting mechanism 23, one end of the support rod 25 is fixedly connected to the arc-shaped support plate 26, and the other end of the support rod 25 is fixedly connected to the fixed bottom plate 21, the limiting mechanism 23, the support rod 25, and the arc-shaped support plate 26 can limit the wafer, and the lifting plate 22 and the pad 24 can support the wafer. When working, the lifting mechanism 3 controls the lifting plate 22 to move up and down, thereby lifting the wafer on the pad 24; preferably, the support rod 25 and the limiting mechanism 23 are arranged in an array on the fixed bottom plate 21.

[0023] The structure of the limiting mechanism 23 is described in detail below. The limiting mechanism 23 includes a connecting rod 231 and a downward pressure spring 232 mounted on the connecting rod 231. One end of the connecting rod 231 is fixedly connected to the fixed bottom plate 21, and the other end of the connecting rod 231 is fixedly connected to the arc-shaped support plate 26. One end of the downward pressure spring 232 is fixedly connected to the jacking plate 22, and the other end of the downward pressure spring 232 is fixedly connected to the arc-shaped support plate 26. The connecting rod 231 passes through the upper and lower surfaces of the jacking plate 22 and is connected to the jacking plate 22 through a bearing. When the jacking plate 22 moves up and down, the downward pressure spring 232 can be compressed or extended to ensure that the jacking plate 22 has a downward thrust all the time, and to ensure that the lower surface of the jacking plate 22 fits with the upper surface of the jacking mechanism 3.

[0024] Among them, a plurality of wafer placement mechanisms 2 are arranged in an array on the turntable 13 , so that the lifting mechanism 3 can be used to eject the wafers in the wafer placement mechanisms 2 .

[0025] The structure of the lifting mechanism 3 is described in detail below. The lifting mechanism 3 includes a mounting plate 31, a control cylinder 32 disposed below the mounting plate 31, a lifting shaft 33 connected to the control cylinder 32, and a push plate 34 disposed at the upper end of the lifting shaft 33 and fixedly connected thereto. The control cylinder 32 is fixedly mounted below the mounting plate 31. The control cylinder 32 can control the lifting shaft 33 to move up and down, and the lifting shaft 33 can drive the push plate 34 to move up and down, thereby facilitating contact with the lifting plate 22, driving the lifting plate 22 to move up and down, so that the wafer thereon moves up and down accordingly.

[0026] Among them, a limit movement mechanism 4 is also provided on the mounting plate 31 on the outer side of the lifting shaft 33, and the limit movement mechanism 4 includes a limit shaft 41 arranged around the lifting shaft 33, a first limit plate 42 arranged on the limit shaft 41, and a second limit plate 43 arranged on the limit shaft 41. The lower end of the limit shaft 41 passes through the upper and lower surfaces of the mounting plate 31 and is connected thereto by a bearing, the lifting shaft 33 passes through the upper and lower surfaces of the first limit plate 42 and is connected thereto by a bearing, the upper end of the limit shaft 41 is fixedly connected to the lower surface of the second limit plate 43, and the push plate 34 is arranged below the second limit plate 43. When the lifting shaft 33 moves up and down, it can drive the push plate 34 to move up and down. When the push plate 34 moves upward, it can contact the second limit plate 43 until it drives the second limit plate 43 to move upward, and then passes through the through hole on the turntable 13 to contact the lower surface of the lifting plate 22, thereby pushing the lifting plate 22 to move upward, and the wafer is ejected accordingly.

[0027] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the utility model and fall within the protection scope of the utility model.

Claims

1. A wafer placement box with jacking, characterized in that: It comprises a rotating device (1), a plurality of wafer placement mechanisms (2) arranged on the rotating device (1), and a lifting mechanism (3) arranged below the wafer placement mechanisms (2), wherein the wafer placement mechanisms (2) are fixedly mounted on the rotating device (1), and the lifting mechanism (3) is mounted on a platform; The rotating device (1) comprises a servo motor (11), a rotating platform (12) connected to the servo motor (11), and a turntable (13) connected to the rotating platform (12); a plurality of wafer placement mechanisms (2) are mounted on the turntable (13); and the lifting mechanism (3) is arranged below the turntable (13); The wafer placement mechanism (2) comprises a fixed base plate (21), a lifting plate (22) arranged above the fixed base plate (21), a plurality of limiting mechanisms (23) arranged on the lifting plate (22) and the fixed base plate (21), a pad (24) arranged on the lifting plate (22), a plurality of support rods (25) arranged on the fixed base plate (21), and an arc-shaped support plate (26) symmetrically arranged on the left and right sides of the lifting plate (22); the fixed base plate (21) is fixedly mounted on the turntable (13); one end of the limiting mechanism (23) is fixedly connected to the fixed base plate (21); the pad (24) is fixedly mounted on the lifting plate (22); the lower end of the arc-shaped support plate (26) is connected to the support rod (25) and the limiting mechanism (23); one end of the support rod (25) is fixedly connected to the arc-shaped support plate (26); and the other end of the support rod (25) is fixedly connected to the fixed base plate (21); The support rods (25) and the limiting mechanisms (23) are arranged in an array on a fixed bottom plate (21); The lifting mechanism (3) comprises a mounting plate (31), a control cylinder (32) arranged below the mounting plate (31), a lifting shaft (33) connected to the control cylinder (32), and a push plate (34) arranged at the upper end of the lifting shaft (33) and fixedly connected thereto, wherein the control cylinder (32) is fixedly mounted below the mounting plate (31).

2. A wafer placement box with jacking according to claim 1, characterized in that: The limiting mechanism (23) comprises a connecting rod (231) and a downward pressure spring (232) sleeved on the connecting rod (231); one end of the connecting rod (231) is fixedly connected to the fixed bottom plate (21); the other end of the connecting rod (231) is fixedly connected to the arc-shaped supporting plate (26); one end of the downward pressure spring (232) is fixedly connected to the lifting plate (22); the other end of the downward pressure spring (232) is fixedly connected to the arc-shaped supporting plate (26); the connecting rod (231) passes through the upper and lower surfaces of the lifting plate (22) and is connected to the lifting plate (22) via a bearing.

3. The wafer placement box with jacking according to claim 1, characterized in that: A plurality of wafer placement mechanisms (2) are arranged in an array on a turntable (13).

4. The wafer placement box with jacking according to claim 1, characterized in that: A limit moving mechanism (4) is also provided on the mounting plate (31) on the outer side of the lifting shaft (33), and the limit moving mechanism (4) comprises a limit shaft (41) arranged around the lifting shaft (33), a first limit plate (42) arranged on the limit shaft (41), and a second limit plate (43) arranged on the limit shaft (41). The lower end of the limit shaft (41) passes through the upper and lower surfaces of the mounting plate (31) and is connected thereto via a bearing. The lifting shaft (33) passes through the upper and lower surfaces of the first limit plate (42) and is connected thereto via a bearing. The upper end of the limit shaft (41) is fixedly connected to the lower surface of the second limit plate (43), and the push plate (34) is arranged below the second limit plate (43).

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