Wafer load locking device and chemical vapor deposition equipment

Abstract

The utility model provides a wafer load locking device and chemical vapor deposition equipment, and the wafer load locking device comprises a load locking cavity which is internally provided with a separator, and the separator divides the load locking cavity into a first chamber and a second chamber; the heater assembly is arranged in the first chamber and is used for heating the wafer in the first chamber; the first vacuum pump is communicated with the first chamber; the cooling device is arranged in the second chamber and is used for cooling the wafer in the second chamber. According to the wafer load locking device provided by the embodiment of the invention, the heater assembly is arranged in the first chamber, so that the wafer can be heated to reach a temperature required by a process reaction, and evaporation of water vapor on the surface of the wafer can be accelerated during heating; at the moment, when the first vacuum pump vacuumizes the first cavity, water vapor in the first cavity is pumped away, so that the water vapor on the wafer is effectively removed, the water vapor on the wafer is removed in the mode, a water vapor module does not need to be additionally arranged independently, and the occupied area of equipment is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer load locking device and chemical vapor deposition equipment. Background Art

[0002] Chemical Vapor Deposition (CVD) equipment consists of several major parts: semiconductor equipment front end module (Equipment Front End Module, EFEM), load lock chamber (Load lock chamber, LLC), transfer chamber (transfer module, TM), and reaction chamber (Process module, PM).

[0003] At present, some chemical vapor deposition equipment needs to have the function of removing water vapor (dagas), so it is necessary to add a water vapor removal module to these equipment, but the addition of a water vapor module will occupy the position of a reaction chamber alone, resulting in a reduction in the number of reaction chambers that can be connected to the transmission chamber. In addition, since the semiconductor manufacturing plant is a clean workshop, the floor space of each equipment is very important, and the average floor space of the reaction chamber is used as a measurement standard, that is, the floor space of a complete device is divided by the number of reaction chambers of the device to obtain the average floor space of the reaction chamber. The smaller the floor space, the better, but the addition of a water vapor module will increase the floor space. Utility Model Content

[0004] The utility model aims to provide a wafer load locking device and chemical vapor deposition equipment, which can remove water vapor on the wafer when the wafer is heated, thereby eliminating the need to separately add a water vapor module and reducing the floor space of the equipment.

[0005] To achieve the above objectives, in a first aspect, the utility model provides a wafer load locking device, comprising:

[0006] A load lock cavity, wherein an isolating member is disposed therein, wherein the isolating member separates the load lock cavity into a first chamber and a second chamber;

[0007] a heater assembly, disposed in the first chamber, and used to heat the wafer in the first chamber;

[0008] a first vacuum pump, connected to the first chamber;

[0009] A cooling device is disposed in the second chamber and is used to cool the wafer in the second chamber.

[0010] The beneficial effect of the wafer load locking device provided by the utility model is that by arranging a heater assembly in the first chamber, the wafer can be heated so that the wafer reaches the temperature required for the process reaction, and the heating will accelerate the evaporation of water vapor on the surface of the wafer. At this time, the first vacuum pump will draw away the water vapor in the first chamber when evacuating the first chamber, thereby effectively removing the water vapor on the wafer. By removing the water vapor on the wafer in this way, there is no need to separately add a water vapor module, thereby reducing the footprint of the equipment.

[0011] In some embodiments, the wafer load lock device further comprises a first support member disposed in the first chamber, the first support member being used to support the wafer;

[0012] The heater assembly includes a first heater, which is located in the first chamber and connected to the isolation member. The first heater is close to the first support member and is used to heat the wafer.

[0013] In some embodiments, the heater assembly further comprises a second heater;

[0014] A receiving cavity is provided at the top of the first chamber;

[0015] The second heater is arranged in the accommodating cavity, and the second heater and the first heater are respectively located on two sides of the first supporting member, and the second heater is used to heat the wafer.

[0016] In some embodiments, the first heater is a heating disk, and a heating wire is disposed in the heating disk;

[0017] And / or, the second heater is an infrared heating lamp, and an irradiation port is provided at the bottom of the accommodating cavity, and the irradiation port faces the first supporting member.

[0018] In some embodiments, the heater assembly further comprises a first temperature sensor and a controller;

[0019] The first temperature sensor is disposed in the first chamber and is used to detect the temperature heated by the second heater;

[0020] The controller is electrically connected to the first temperature sensor and the second heater. The controller is used to receive first temperature information detected by the first temperature sensor and control the second heater to heat the wafer according to the first temperature information so that the temperature of the wafer reaches a target temperature.

[0021] In some embodiments, the heater assembly further comprises a second temperature sensor;

[0022] The second temperature sensor is disposed in the first heater and is used to detect the temperature heated by the first heater;

[0023] The controller is electrically connected to the second temperature sensor and the first heater, and is used to receive second temperature information detected by the second temperature sensor, and control the first heater to heat according to the second temperature information so that the temperature of the wafer reaches the target temperature.

[0024] In some embodiments, the wafer load lock device further includes a first lifting mechanism disposed in the load lock chamber, wherein a telescopic end of the first lifting mechanism is located in the first chamber and connected to the first support member for driving the first support member to rise and fall.

[0025] In some embodiments, the wafer load lock device further includes a second support member and a cooling plate disposed in the second chamber;

[0026] The second support member is used to support the wafer;

[0027] The cooling plate is arranged at the bottom of the second chamber, and is close to the second supporting member for cooling the wafer.

[0028] In some embodiments, a cooling channel is formed inside the cooling disk, and a liquid inlet hole and a liquid outlet hole are provided at intervals on the side wall of the cooling disk. Both the liquid inlet hole and the liquid outlet hole are connected to the cooling channel, and both the liquid inlet hole and the liquid outlet hole are used to connect with an external cooling device, and the cooling device is used to transport coolant to the cooling channel.

[0029] The second invention, the utility model provides a chemical vapor deposition device, including a front-end module, a transmission chamber and a wafer load locking device as described above, wherein the front-end module, the wafer load locking device and the transmission chamber are connected in sequence.

[0030] The beneficial effect of the chemical vapor deposition equipment provided by the utility model is that by setting the wafer load locking device provided by the utility model in the chemical vapor deposition equipment, there is no need to add a water vapor module to the chemical vapor deposition equipment to remove water vapor on the wafer, thereby reducing the footprint of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic structural diagram of a wafer load lock device according to an embodiment of the utility model;

[0032] Figure 2 A cross-sectional view of a cooling device according to an embodiment of the present invention along its radial direction;

[0033] Figure 3 This is a schematic structural diagram of a chemical vapor deposition device according to an embodiment of the present invention.

[0034] Reference numerals:

[0035] A load lock chamber 1, an isolation member 11, a first chamber 12, a second chamber 13, a accommodating chamber 14, a heater assembly 2, a first heater 21, a second heater 22, a first temperature sensor 23, a second temperature sensor 24, a first vacuum pump 31, a second vacuum pump 32, a cooling device 4, a cooling channel 41, a liquid inlet 42, a liquid outlet 43, a first support member 5, a first lifting mechanism 61, a second lifting mechanism 62, a second support member 7, a front-end module 10, a wafer load lock device 20, and a transfer chamber 30. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0037] In view of the problems existing in the prior art, the embodiment of the utility model provides a wafer load locking device, referring to Figure 1 As shown, it includes a load lock chamber 1, a heater assembly 2, a first vacuum pump 31 and a cooling device 4. Among them, an isolation member 11 is provided in the load lock chamber 1, and the isolation member 11 divides the load lock chamber 1 into a first chamber 12 and a second chamber 13. The heater assembly 2 is arranged in the first chamber 12, and is used to heat the wafer in the first chamber 12 so that the wafer reaches the temperature required for the process reaction. The first vacuum pump 31 is connected to the first chamber 12 through a vacuum tube, and is used to vacuum the first chamber 12, and the water vapor on the surface of the wafer will be removed during the vacuum treatment. The cooling device 4 is arranged in the second chamber 13, and is used to cool the wafer in the second chamber 13, so that the temperature of the wafer is cooled to a normal temperature.

[0038] In this embodiment, by arranging the heater assembly 2 in the first chamber 12, the wafer can be heated so that the wafer reaches the temperature required for the process reaction, and the heating will accelerate the evaporation of water vapor on the surface of the wafer. At this time, the first vacuum pump 31 will draw away the water vapor in the first chamber 12 when evacuating the first chamber 12, thereby effectively removing the water vapor on the wafer. By removing the water vapor on the wafer in this way, there is no need to separately add a water vapor module for removing the water vapor on the wafer, thereby reducing the floor space occupied by the equipment.

[0039] Continue to refer Figure 1 As shown, in some embodiments, the wafer load lock device further includes a first support member 5 disposed in the first chamber 12, and the first support member 5 is used to support the wafer. The heater assembly 2 includes a first heater 21, which is located in the first chamber 12 and connected to the isolation member 11. The first heater 21 is close to the first support member 5 and is used to heat the bottom surface of the wafer.

[0040] In this embodiment, the first heater 21 may be a heating plate, wherein a heating wire is disposed in the heating plate, and the heating wire is electrically connected to an external power source through a wire. The heating wire heats the heating plate to heat the bottom surface of the wafer.

[0041] Furthermore, a receiving cavity 14 is opened at the top of the first chamber 12, and the heater assembly 2 also includes a second heater 22, which is arranged in the receiving cavity 14, and the second heater 22 and the first heater 21 are respectively located on both sides of the first support member 5, and the second heater 22 is used to heat the top surface of the wafer.

[0042] In this embodiment, a receiving cavity 14 is provided at the top of the first chamber 12 for arranging the second heater 22, so that the front side of the wafer is heated to improve the heating efficiency of the wafer. The second heater 22 is arranged in the receiving cavity 14 to provide a space for the robot to move, so as to avoid affecting the robot to take and place the wafer.

[0043] The second heater 22 may be an infrared heating lamp. In this case, an irradiation port is provided at the bottom of the accommodating cavity 14 and the irradiation port faces the first supporting member 5 , so as to irradiate and heat the front side of the wafer.

[0044] It should be noted that, in some embodiments, both the first heater 21 and the second heater 22 may be heating plates.

[0045] refer to Figure 1As shown, in some embodiments, the heater assembly 2 further includes a first temperature sensor 23 and a controller. The first temperature sensor 23 is disposed in the first chamber 12, and is used to detect the temperature heated by the second heater 22. The controller is electrically connected to both the first temperature sensor 23 and the second heater 22, and is used to receive the first temperature information detected by the first temperature sensor 23, and control the second heater 22 to heat according to the first temperature information, so that the temperature of the wafer reaches the target temperature.

[0046] In this embodiment, the first temperature sensor 23 is arranged in the first chamber 12 to detect the temperature heated by the second heater 22, so that the controller can adjust the temperature in the first chamber 12 in real time according to the first temperature information detected by the first temperature sensor 23, so that the wafer reaches the temperature required for the process reaction as soon as possible.

[0047] Furthermore, the heater assembly 2 further includes a second temperature sensor 24, which is disposed in the first heater 21 and is used to detect the temperature heated by the first heater 21. The controller is electrically connected to both the second temperature sensor 24 and the first heater 21, and is used to receive second temperature information detected by the second temperature sensor 24, and control the first heater 21 to heat according to the second temperature information, so that the temperature of the wafer reaches the target temperature as soon as possible.

[0048] In this embodiment, the second temperature sensor 24 can be a TC temperature sensor. In this case, the first heater 21 is a heating disk. The TC temperature sensor is buried in the heating disk to detect the actual heating temperature of the heating wire, so that the controller can adjust the temperature of the surface of the heating disk in real time according to the second temperature information detected by the second temperature sensor 24, so that the wafer reaches the temperature required for the process reaction as soon as possible, thereby improving the heating efficiency of the wafer.

[0049] refer to Figure 1 As shown, in some embodiments, the wafer load locking device further includes a first lifting mechanism 61 disposed in the load locking chamber 1, and the telescopic end of the first lifting mechanism 61 is located in the first chamber 12 and connected to the first support member 5, for driving the first support member 5 to rise and fall.

[0050] In this embodiment, the first lifting mechanism 61 may be a telescopic cylinder. The first lifting mechanism 61 is provided to drive the first supporting member 5 to move up and down, so as to facilitate the robot to take and place the wafer.

[0051] In some embodiments, the wafer load lock device further includes a second support member 7 and a cooling plate disposed in the second chamber 13. The second support member 7 is movably disposed in the second chamber 13 for supporting the wafer, and the cooling plate is disposed at the bottom of the second chamber 13, and the cooling plate is close to the second support member 7 for cooling the wafer.

[0052] In this embodiment, after the wafer undergoes a process reaction, it is placed in the second chamber 13 for cooling so that the temperature of the wafer reaches a normal temperature.

[0053] Further, refer to Figure 2 As shown, a cooling channel 41 is provided in the cooling plate, and a liquid inlet hole 42 and a liquid outlet hole 43 are provided at intervals on the side wall of the cooling plate, and the liquid inlet hole 42 and the liquid outlet hole 43 are both connected to the cooling channel 41, and the liquid inlet hole 42 and the liquid outlet hole 43 are both connected to an external cooling device through a delivery pipe, and the cooling device stores coolant, and the cooling device is used to deliver the coolant to the cooling channel 41, thereby achieving cooling of the wafer.

[0054] refer to Figure 1 As shown, in some embodiments, the wafer load locking device also includes a second lifting mechanism 62 disposed at the bottom of the load locking chamber 1, and the telescopic end of the second lifting mechanism 62 is located in the second chamber 13 and connected to the second support member 7, for driving the second support member 7 to rise and fall.

[0055] In this embodiment, the second lifting mechanism 62 may also be a telescopic cylinder. The second lifting mechanism 62 is provided to drive the second support member 7 to move up and down, so that the robot can take and place the wafer in the second chamber 13 .

[0056] In some embodiments, the wafer load locking device further includes a second vacuum pump 32, which is connected to the second chamber 13 via a vacuum tube. The second vacuum pump 32 is used to evacuate the first chamber 12, and also removes any water vapor that may exist on the wafer surface during the evacuation process.

[0057] In another embodiment of the present invention, a chemical vapor deposition device is disclosed, referring to Figure 3As shown, the chemical vapor deposition equipment includes a front-end module 10, a transfer chamber 30 and a wafer load lock device 20 as provided in the above embodiment. The front-end module 10, the wafer load lock device 20 and the transfer chamber 30 are connected in sequence. The front-end module 10 is used to carry wafers to be processed and wafers after process treatment, the wafer load lock device 20 is used to switch the wafer from an atmospheric state to a vacuum state, and the transfer chamber 30 is used to transfer the wafer in the wafer load lock device 20 to the process treatment module for processing.

[0058] The chemical vapor deposition equipment provided in this embodiment, by providing the wafer load lock device 20 provided in this embodiment, does not need to add a water vapor module to the chemical vapor deposition equipment to remove water vapor on the wafer, thereby reducing the footprint of the equipment.

[0059] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A wafer load lock device, characterized in that: include: A load lock cavity, wherein an isolating member is disposed therein, wherein the isolating member separates the load lock cavity into a first chamber and a second chamber; a heater assembly, disposed in the first chamber, and used to heat the wafer in the first chamber; a first vacuum pump, connected to the first chamber; A cooling device is disposed in the second chamber and is used to cool the wafer in the second chamber.

2. The wafer load lock device according to claim 1, characterized in that: Also included is a first support member disposed in the first chamber, the first support member being used to support the wafer; The heater assembly includes a first heater, which is located in the first chamber and connected to the isolation member. The first heater is close to the first support member and is used to heat the wafer.

3. The wafer load lock device according to claim 2, characterized in that: The heater assembly also includes a second heater; A receiving cavity is provided at the top of the first chamber; The second heater is arranged in the accommodating cavity, and the second heater and the first heater are respectively located on two sides of the first supporting member, and the second heater is used to heat the wafer.

4. The wafer load lock device according to claim 3, characterized in that: The first heater is a heating disk, and a heating wire is arranged in the heating disk; And / or, the second heater is an infrared heating lamp, and an irradiation port is provided at the bottom of the accommodating cavity, and the irradiation port faces the first supporting member.

5. The wafer load lock device according to claim 3, characterized in that: The heater assembly also includes a first temperature sensor and a controller; The first temperature sensor is disposed in the first chamber and is used to detect the temperature heated by the second heater; The controller is electrically connected to the first temperature sensor and the second heater. The controller is used to receive first temperature information detected by the first temperature sensor and control the second heater to heat the wafer according to the first temperature information so that the temperature of the wafer reaches a target temperature.

6. The wafer load lock device according to claim 5, characterized in that: The heater assembly also includes a second temperature sensor; The second temperature sensor is disposed in the first heater and is used to detect the temperature heated by the first heater; The controller is electrically connected to the second temperature sensor and the first heater, and is used to receive second temperature information detected by the second temperature sensor, and control the first heater to heat according to the second temperature information so that the temperature of the wafer reaches the target temperature.

7. The wafer load lock device according to claim 2, characterized in that: It also includes a first lifting mechanism disposed in the load locking cavity, wherein a telescopic end of the first lifting mechanism is located in the first cavity and connected to the first support member, and is used to drive the first support member to rise and fall.

8. The wafer load lock device according to any one of claims 1 to 7, characterized in that: Also included is a second support member and a cooling plate disposed in the second chamber; The second support member is used to support the wafer; The cooling plate is arranged at the bottom of the second chamber, and is close to the second supporting member for cooling the wafer.

9. The wafer load lock device according to claim 8, characterized in that: A cooling channel is formed inside the cooling disk, and a liquid inlet hole and a liquid outlet hole are provided at intervals on the side wall of the cooling disk. The liquid inlet hole and the liquid outlet hole are both connected to the cooling channel, and the liquid inlet hole and the liquid outlet hole are both used to connect with an external cooling device, and the cooling device is used to transport coolant to the cooling channel.

10. A chemical vapor deposition device, characterized in that: It comprises a front-end module, a transmission cavity and a wafer load locking device as claimed in any one of claims 1 to 9, wherein the front-end module, the wafer load locking device and the transmission cavity are connected in sequence.

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