Device for improving electroplating uniformity of IC (integrated circuit) support plate
By designing an IC carrier plate plating device including hanger parts and butterfly screws, the problem of current cannot be effectively controlled in the prior art is solved, the uniformity of copper plating is achieved, and the risks of uneven copper thickness of the plate and residual copper in the line are reduced.
Patent Information
- Application Number
- CN202421268767.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-05
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-06-05
AI Technical Summary
The existing IC carrier plate plating device cannot effectively control the current flowing in each hanger and four chucks, resulting in uneven copper plating, resulting in uneven copper thickness of the plate and residual copper in the subsequent process of the line.
A device including a first hanger part and a second hanger part is designed. It is fixed by a butterfly head screw. The bottom of the hanger is positioned between the hanger chuck and the thin plate frame. It is possible to control the inflow current of each hanger and four chucks, and the current is divided into each chuck according to the thickness of the plating.
The precise control of the inflow current of each hanger and four chucks is achieved to ensure uniformity of copper plating, and reduce the problems of uneven copper thickness of the plate and residual copper in the line.
Smart Images
Figure CN222574842U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of high-density printed circuit boards and flexible circuit boards, in particular to a device for improving the electroplating uniformity of IC carrier boards. Background Art
[0002] The device for improving the uniformity of electroplating of IC substrates is a supporting device for electroplating of IC substrates. With the increasing number of transistors in the upstream die, the pith of the downstream IC substrates is required to be smaller and smaller, the overall thickness tolerance is becoming more and more stringent, and the requirements for copper plating uniformity are also getting higher and higher. For the existing common cathode and common anode electroplating equipment, the required current is converted by thickness & area, and then the alternating current is converted into direct current for electroplating through a rectifier. With the continuous development of science and technology, people have higher and higher requirements for the manufacturing process of the device for improving the uniformity of electroplating of IC substrates.
[0003] The existing IC substrate electroplating device has certain drawbacks when in use. At present, each VCP electroplating line in the factory has sixteen sections of copper cylinders connected, and each section of the copper cylinder has two rectifiers to control the current of the anode and cathode respectively. Each section of the copper cylinder can accommodate four flying targets at the same time, and each flying target clamps a production board. The current monitoring and power supply logic is that each rectifier is controlled separately, and the current flowing into each hanger and the four clamps of the hanger cannot be seen, which makes the hanger poorly conductive or the current flowing into the clamps different, resulting in uneven copper thickness of the board and residual copper in the circuit of the post-process. The existing device can only monitor the output current of the rectifier, and the input current size and conductivity of each controlled four flying targets are unknown, resulting in the inability to find the plating thickness and thinness, and the later sorting is time-consuming and laborious. For this reason, we propose a device for improving the uniformity of IC substrate electroplating. Utility Model Content
[0004] Technical problem solved: In view of the shortcomings of the prior art, the utility model provides a device for improving the uniformity of electroplating of IC substrates, which can control the current flowing into each hanger and four chucks and distribute the current evenly to each chuck according to the plating thickness. The R value of a single piece is ≤2um, and the distance between pieces is ≤4um, which can effectively solve the problems in the background technology.
[0005] Technical solution: To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a device for improving the uniformity of electroplating of IC substrates, comprising a first hanger part and a second hanger part, a third hanger part and a fourth hanger part are positioned at the bottom of the first hanger part and the second hanger part, butterfly head screws are positioned between the first hanger part, the second hanger part and the third hanger part, and the fourth hanger part, the first hanger part and the second hanger part are both provided with a long hanger forward driving foot and a short hanger forward driving foot, the third hanger part and the fourth hanger part are both installed with hangers, and a hanger chuck is positioned at the bottom of the hanger.
[0006] Preferably, a thin plate frame is positioned and installed at the bottom of the hanger chuck, a production plate is arranged inside the thin plate frame, and the hanger chuck is one of a common clamping plate type and a top buckle type.
[0007] Preferably, it further comprises a rectifier, wherein the rectifier is connected to an anode rod, and an anode titanium mesh is positioned on the anode rod.
[0008] Preferably, the hanger clamp and the thin plate frame are engaged and positioned by a clamping assembly, and the production plate is engaged and positioned inside the thin plate frame.
[0009] Preferably, the rectifier is electrically connected to the anode rod, an electrical rod is arranged between the anode rod and the anode titanium mesh, and the anode rod and the anode titanium mesh are electrically connected via the electrical rod.
[0010] Preferably, the first hanger part, the second hanger part and the third hanger part, the fourth hanger part are fixed by butterfly screws.
[0011] Beneficial effects: Compared with the prior art, the utility model provides a device for improving the uniformity of electroplating of IC substrates, which has the following beneficial effects: the device for improving the uniformity of electroplating of IC substrates can control the current flowing into each hanger and four chucks and distribute the current evenly to each chuck according to the plating thickness, the R value of a single piece is ≤2um, and the interval between pieces is ≤4um. The first hanger part, the second hanger part, the third hanger part, and the fourth hanger part are fixed by butterfly head screws, and the bottom of the hanger is positioned between the hanger chucks and the thin plate frame. The entire device for improving the uniformity of electroplating of IC substrates has a simple structure, is easy to operate, and has better effect than the traditional method. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 The utility model is a schematic diagram of the overall structure of a device for improving the electroplating uniformity of an IC substrate.
[0013] Figure 2The utility model is a schematic structural diagram of a first rack component and a second rack component in a device for improving the electroplating uniformity of an IC substrate.
[0014] Figure 3 The utility model is a schematic structural diagram of a thin plate frame installation in a device for improving the electroplating uniformity of an IC carrier board.
[0015] Figure 4 The utility model is a schematic structural diagram of a rectifier connection in a device for improving the electroplating uniformity of an IC substrate.
[0016] In the figure: 1. First hanger part; 2. Second hanger part; 3. Long hanger forward driving foot; 4. Butterfly head screw; 5. Hanger; 6. Third hanger part; 7. Hanger clamp; 8. Thin plate frame; 9. Fourth hanger part; 10. Short hanger forward driving foot; 11. Production plate; 12. Rectifier; 13. Anode rod; 14. Anode titanium mesh. DETAILED DESCRIPTION
[0017] The technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings and specific embodiments, but those skilled in the art will understand that the embodiments described below are part of the embodiments of the utility model, rather than all of the embodiments, and are only used to illustrate the utility model, and should not be considered as limiting the scope of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the utility model. If the specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.
[0018] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0020] like Figure 1-4 As shown, a device for improving the uniformity of electroplating of IC substrates comprises a first hanger part 1 and a second hanger part 2, a third hanger part 6 and a fourth hanger part 9 are positioned at the bottom of the first hanger part 1 and the second hanger part 2, a butterfly head screw 4 is positioned between the first hanger part 1, the second hanger part 2 and the third hanger part 6, the fourth hanger part 9, a long hanger forward driving foot 3 and a short hanger forward driving foot 10 are arranged on the first hanger part 1 and the second hanger part 2, a hanger 5 is installed on the third hanger part 6 and the fourth hanger part 9, a hanger clamp 7 is positioned at the bottom of the hanger 5, the current flowing into each hanger and four clamps can be controlled and the current can be evenly distributed to each clamp according to the plating thickness, the single piece R value is ≤2um, and the interval between pieces is ≤4um.
[0021] Furthermore, a thin plate frame 8 is positioned and installed at the bottom of the hanger clamp 7, and a production plate 11 is arranged inside the thin plate frame 8. The hanger clamp 7 is one of a common clamping plate type and a top buckle type.
[0022] Furthermore, it also includes a rectifier 12 , the rectifier 12 is connected to an anode rod 13 , and an anode titanium mesh 14 is positioned on the anode rod 13 .
[0023] Furthermore, the hanger clamp 7 and the thin plate frame 8 are engaged and positioned by a clamping assembly, and the production plate 11 is engaged and positioned inside the thin plate frame 8 .
[0024] Furthermore, the rectifier 12 is electrically connected to the anode rod 13 , an electrical rod is provided between the anode rod 13 and the anode titanium mesh 14 , and the anode rod 13 and the anode titanium mesh 14 are electrically connected via the electrical rod.
[0025] Furthermore, the first hanger part 1 , the second hanger part 2 and the third hanger part 6 , the fourth hanger part 9 are fixed by butterfly head screws 4 .
[0026] Working principle: The utility model includes a first hanger part 1, a second hanger part 2, a long hanger forward driving foot 3, a butterfly head screw 4, a hanger 5, a third hanger part 6, a hanger clamp 7, a thin plate frame 8, a fourth hanger part 9, a short hanger forward driving foot 10, a production plate 11, a rectifier 12, an anode rod 13, and an anode titanium mesh 14. The first hanger part 1, the second hanger part 2 and the third hanger part 6, and the fourth hanger part 9 are fixed by a butterfly head screw 4. The bottom of the hanger 5 is positioned between the hanger clamp 7 and the thin plate frame 8. The current flowing into each hanger and the four clamps can be controlled and the current can be evenly distributed to each clamp according to the plating thickness. The R value of a single piece is ≤2um, and the interval between pieces is ≤4um.
[0027] It should be noted that, in this article, relational terms such as first and second (number one, number two), etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0028] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. The technicians in this industry should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.
Claims
1. A device for improving the uniformity of electroplating of an IC substrate, comprising a first rack component (1) and a second rack component (2), characterized in that: The third hanger part (6) and the fourth hanger part (9) are positioned at the bottom of the first hanger part (1) and the second hanger part (2); butterfly head screws (4) are positioned between the first hanger part (1), the second hanger part (2) and the third hanger part (6), and the fourth hanger part (9); the first hanger part (1) and the second hanger part (2) are both provided with a long hanger forward driving foot (3) and a short hanger forward driving foot (10); the third hanger part (6) and the fourth hanger part (9) are both installed with a hanger (5); and a hanger clamp (7) is positioned at the bottom of the hanger (5).
2. The device for improving the electroplating uniformity of an IC substrate according to claim 1, characterized in that: A thin plate frame (8) is positioned and installed at the bottom of the hanger chuck (7), and a production plate (11) is arranged on the inner side of the thin plate frame (8). The hanger chuck (7) is one of a common clamping plate type and a top buckle type.
3. The device for improving the electroplating uniformity of an IC substrate according to claim 1, characterized in that: It also comprises a rectifier (12), wherein the rectifier (12) is connected to an anode rod (13), and an anode titanium mesh (14) is positioned on the anode rod (13).
4. The device for improving the electroplating uniformity of an IC substrate according to claim 2, characterized in that: The hanger clamp (7) and the thin plate frame (8) are engaged and positioned via a clamping assembly, and the production plate (11) is engaged and positioned inside the thin plate frame (8).
5. The device for improving the electroplating uniformity of an IC substrate according to claim 3, characterized in that: The rectifier (12) is electrically connected to the anode rod (13), an electrical rod is arranged between the anode rod (13) and the anode titanium mesh (14), and the anode rod (13) and the anode titanium mesh (14) are electrically connected via the electrical rod.
6. The device for improving the electroplating uniformity of an IC substrate according to claim 1, characterized in that: The first hanger part (1), the second hanger part (2) and the third hanger part (6) and the fourth hanger part (9) are fixed by butterfly head screws (4).