Cold storage data collector

Abstract

The utility model provides a cold storage data collector which comprises a high thermal conductivity heat preservation shell, a cavity is arranged in the high thermal conductivity heat preservation shell, a circuit board is installed in the cavity, and an MCU main control chip, a temperature detection circuit, a heating circuit and a power supply circuit are arranged on the circuit board. The MCU main control chip is respectively connected with the temperature detection circuit and the heating circuit, the temperature detection circuit and the heating circuit are respectively connected with the high-thermal-conductivity heat preservation shell, and the power supply circuit is used for providing a power supply for the cold storage data collector. A heat preservation layer used for shielding radiant heat and convective heat is installed outside the high-heat-conductivity heat preservation shell. The cold storage data collector has the advantages that components at normal temperature can be selected after stable environment control, cost is saved, and the requirement for frequent shuttling between the normal-temperature environment and the low-temperature environment in automatic carrying operation of a cold storage can be met.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a cold storage data collector. Background Art

[0002] There are not many data acquisition boards in cold storage environments, and the range of components for data acquisition is relatively narrow. In terms of material selection, they are generally low-temperature resistant components, and they must also be suitable for normal temperature environments, which results in high component costs. Among the various components of the acquisition board, MCU is more sensitive to temperature than general devices, and it is difficult to buy MCUs on the market that can meet the working temperature below -40 degrees Celsius. At the same time, the automated handling operations in cold storage require frequent shuttles between normal temperature and low temperature environments, and the temperature difference varies greatly, which can easily lead to unstable performance of the data acquisition board. Utility Model Content

[0003] In order to solve the problems of high cost and difficulty in purchasing components of cold storage data collectors in the prior art, as well as unstable performance of acquisition boards caused by large temperature differences, the utility model provides a cold storage data collector, which includes a high thermal conductivity insulation shell, a cavity is provided inside the high thermal conductivity insulation shell, a circuit board is installed in the cavity, an MCU main control chip, a temperature detection circuit, a heating circuit, and a power supply circuit are provided on the circuit board, the MCU main control chip is respectively connected to the temperature detection circuit and the heating circuit, the temperature detection circuit and the heating circuit are respectively connected to the high thermal conductivity insulation shell, the power supply circuit is used to provide power to the cold storage data collector, and an insulation layer for shielding radiant heat and convection heat is installed on the outside of the high thermal conductivity insulation shell.

[0004] As a further improvement of the present invention, the temperature detection circuit is a thermistor sensor circuit, one end of the thermistor sensor circuit is connected to the MCU main control chip, and the other end of the thermistor sensor circuit is connected to the high thermal conductivity insulation shell.

[0005] As a further improvement of the present invention, the cold storage data collector also includes a relay output circuit, and the relay output circuit is connected to the MCU main control chip.

[0006] As a further improvement of the present invention, the cold storage data collector also includes an optocoupler isolation input circuit, and the optocoupler isolation input circuit is connected to the MCU main control chip.

[0007] As a further improvement of the present invention, the cold storage data collector also includes a CAN communication interface circuit, and the CAN communication interface circuit is connected to the MCU main control chip.

[0008] As a further improvement of the utility model, the cold storage data collector also includes a 232 communication interface circuit, and the 232 communication interface circuit is connected to the MCU main control chip.

[0009] As a further improvement of the present invention, the high thermal conductivity heat-insulating shell is a metal shell.

[0010] As a further improvement of the utility model, the high thermal conductivity heat-insulating shell is a high thermal conductivity heat-insulating shell with copper alloy or aluminum alloy.

[0011] As a further improvement of the present invention, the high thermal conductivity heat-insulating outer shell comprises a bottom outer shell with a cavity inside and a top outer shell installed on the bottom outer shell.

[0012] The beneficial effects of the utility model are: 1. The cold storage data collector provided by the utility model can select components at normal temperature after performing environmental stabilization control, thereby saving costs; 2. The cold storage data collector provided by the utility model realizes environmental temperature control by controlling the heat radiation of the high thermal conductivity insulation shell, which is more convenient and more stable and effective than directly heating the circuit board body to control the temperature; 3. The cold storage data collector provided by the utility model has stable performance and can better meet the working conditions of the cold storage automated handling operation that needs to frequently shuttle between normal temperature environment and low temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an exploded view of the utility model cold storage data collector;

[0014] Figure 2 This is the axial view of the cold storage data collector of the utility model;

[0015] Figure 3 This is the overall structure diagram of the cold storage data collector of the utility model;

[0016] Figure 4 This is the circuit board schematic diagram of the utility model cold storage data collector;

[0017] Digital identification: 1-insulation layer, 20-top shell, 21-bottom shell, 3-circuit board, 4-heating rod, 5-thermistor; DETAILED DESCRIPTION

[0018] The utility model discloses a cold storage data collector, which is provided with a high thermal conductivity heat-insulating shell, an MCU main control chip, and a temperature detection circuit and a heating circuit connected with the high thermal conductivity heat-insulating shell. The cold storage data collector realizes environmental temperature control by controlling the heat radiation of the high thermal conductivity heat-insulating shell. When the temperature is low, the high thermal conductivity heat-insulating shell is heated, and when the temperature is normal, the heating is stopped, which can better meet the working conditions of the cold storage automatic handling operation that needs to frequently shuttle between the normal temperature environment and the low temperature environment.

[0019] like Figure 1-4 As shown, the utility model discloses a cold storage data collector, including a high thermal conductivity insulation shell, a cavity is provided inside the high thermal conductivity insulation shell, a circuit board 3 is installed in the cavity, the circuit board 3 is provided with an MCU main control chip, a temperature detection circuit, a heating circuit, and a power supply circuit, the MCU main control chip is respectively connected to the temperature detection circuit and the heating circuit, the temperature detection circuit and the heating circuit are respectively connected to the high thermal conductivity insulation shell, the temperature detection circuit is used to detect the temperature of the high thermal conductivity insulation shell, the heating circuit is used to heat the high thermal conductivity insulation shell, the power supply circuit is used to provide power to the cold storage data collector, and an insulation layer 1 for shielding radiant heat and convection heat is installed outside the high thermal conductivity insulation shell.

[0020] The MCU main control chip controls the heating circuit to heat or not heat the high thermal conductivity insulation shell according to the temperature detected by the temperature detection circuit. When the temperature detection circuit detects a low temperature environment, the MCU main control chip will control the heating circuit to heat the high thermal conductivity insulation shell to increase the temperature of the high thermal conductivity insulation shell. When the temperature detection circuit detects that the high thermal conductivity insulation shell is at a normal temperature environment, the MCU main control chip will control the heating circuit to stop heating.

[0021] The temperature detection circuit of the utility model is a thermistor sensor circuit, one end of the thermistor sensor circuit is connected to the DAC pin of the MCU main control chip, and the other end of the thermistor sensor circuit is connected to the high thermal conductivity heat preservation shell.

[0022] The cold storage data collector also includes a relay output circuit, which is connected to the GPIO pin of the MCU main control chip.

[0023] The cold storage data collector also includes an optocoupler isolation input circuit, which is connected to the GPIO pin of the MCU main control chip.

[0024] The cold storage data collector also includes a CAN communication interface circuit, and the CAN communication interface circuit is connected to the CAN pin of the MCU main control chip.

[0025] The cold storage data collector also includes a 232 communication interface circuit, and the 232 communication interface circuit is connected to the MCU main control chip.

[0026] The high thermal conductivity insulation shell is a metal shell.

[0027] The high thermal conductivity insulation shell is a high thermal conductivity insulation shell with copper alloy or aluminum alloy.

[0028] The high thermal conductivity heat-insulating housing comprises a bottom housing 21 with a cavity inside and a top housing 20 mounted on the bottom housing 21 .

[0029] In order to reduce power consumption, the cold storage data collector selects a critical heating temperature of 10 degrees Celsius. When the thermistor sensor circuit detects that the temperature of the high thermal conductivity insulation shell reaches this critical heating temperature, the heating rod 4 of the heating circuit starts heating.

[0030] The beneficial effects of the utility model are: 1. The cold storage data collector provided by the utility model can select components at normal temperature after performing environmental stabilization control, thereby saving costs; 2. The cold storage data collector provided by the utility model realizes environmental temperature control by controlling the heat radiation of the high thermal conductivity insulation shell, which is more convenient and more stable and effective than directly heating the circuit board body to control the temperature; 3. The cold storage data collector provided by the utility model has stable performance and can better meet the working conditions of the cold storage automated handling operation that needs to frequently shuttle between normal temperature environment and low temperature environment.

[0031] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A cold storage data collector, characterized in that: The invention comprises a high thermal conductivity heat-insulating shell, wherein a cavity is arranged inside the high thermal conductivity heat-insulating shell, a circuit board (3) is installed in the cavity, an MCU main control chip, a temperature detection circuit, a heating circuit, and a power supply circuit are arranged on the circuit board (3), the MCU main control chip is connected to the temperature detection circuit and the heating circuit respectively, the temperature detection circuit and the heating circuit are connected to the high thermal conductivity heat-insulating shell respectively, the power supply circuit is used to provide power to a cold storage data collector, and an insulation layer (1) for shielding radiant heat and convection heat is installed outside the high thermal conductivity heat-insulating shell.

2. The cold storage data collector according to claim 1 is characterized in that: The temperature detection circuit is a thermistor sensor circuit, one end of the thermistor sensor circuit is connected to the MCU main control chip, and the other end of the thermistor sensor circuit is connected to the high thermal conductivity insulation shell.

3. The cold storage data collector according to claim 1 is characterized in that: The cold storage data collector also includes a relay output circuit, which is connected to the MCU main control chip.

4. The cold storage data collector according to claim 1, characterized in that: The cold storage data collector also includes an optocoupler isolation input circuit, which is connected to the MCU main control chip.

5. The cold storage data collector according to claim 1 is characterized in that: The cold storage data collector also includes a CAN communication interface circuit, and the CAN communication interface circuit is connected to the MCU main control chip.

6. The cold storage data collector according to claim 1, characterized in that: The cold storage data collector also includes a 232 communication interface circuit, and the 232 communication interface circuit is connected to the MCU main control chip.

7. The cold storage data collector according to claim 1, characterized in that: The high thermal conductivity heat-insulating shell is a metal shell.

8. The cold storage data collector according to claim 7, characterized in that: The high thermal conductivity heat-insulating shell is a high thermal conductivity heat-insulating shell made of copper alloy or aluminum alloy.

9. The cold storage data collector according to claim 1, characterized in that: The high thermal conductivity heat-insulating outer shell comprises a bottom outer shell (21) with a cavity inside and a top outer shell (20) mounted on the bottom outer shell (21).

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