Universal drum assembly
By designing universal drum assembly, including guide connections that can be compatible with multiple tracks and flexible chip assembly mounting parts, the problem of different models of developing boxes corresponds to different models of drum assembly is solved, achieving higher versatility and lower manufacturing costs.
Patent Information
- Application Number
- CN202420644500.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-29
AI Technical Summary
Different models of developing boxes correspond to different models of drum components, resulting in the same model/appearance of developing boxes cannot be installed with each other, resulting in waste of costs.
A general drum assembly is designed, including a drum frame and a chip assembly mounting part, where the guide connection part is arranged on the drum frame to cooperate with a variety of tracks, and the chip assembly mounting part allows flexible installation of the chip assembly.
It realizes flexible installation of drum frames and chip components, improves the versatility of general-purpose drum components, and reduces manufacturing costs.
Smart Images

Figure CN222580409U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a universal drum component. Background Art
[0002] The drum assembly can be installed together with the developing box along the track on the side wall of the image forming device to perform developing work in the image forming device. Different models of developing boxes correspond to different models of drum assemblies, and different drum assemblies correspond to different tracks when installed in the image forming device. For some developing boxes with similar models / appearances, their corresponding drum assemblies are also very similar, that is, some developing boxes with similar models / appearances can be installed in the drum assembly with each other, but the drum assemblies cannot be universally installed in the image forming device due to slight differences, resulting in cost waste. Utility Model Content
[0003] According to one aspect of the utility model, a universal drum assembly is provided, which can be detachably installed in an image forming device together with a developing cartridge, comprising:
[0004] A drum frame having a space therein for accommodating a developing cartridge and having a first direction and a second direction, the drum frame being installable in the image forming device along the second direction, the drum frame having a first end and a second end in the first direction, the drum frame having a third end and a fourth end in the second direction, the drum frame being provided with a guide connection portion on a side wall of the first end, the guide connection portion being able to cooperate with a variety of tracks in the image forming device;
[0005] The chip assembly installation part is arranged on the side wall of the first end of the drum frame, and the chip assembly installation part is used for detachably installing the chip assembly, and the chip assembly is used for electrically connecting with the image forming device.
[0006] The universal drum assembly of the utility model is achieved by arranging a chip assembly mounting portion and a guide connecting portion on the drum frame, wherein the guide connecting portion can cooperate with a variety of tracks in the image forming device, and the chip assembly mounting portion is used for detachable installation of the chip assembly, thereby achieving effective installation of the drum frame and flexible installation of the chip assembly, thereby improving the versatility of the universal drum assembly and reducing manufacturing costs.
[0007] In some embodiments, in the first direction, the chip component mounting portion is closer to the second end relative to the guide connection portion; in the second direction, the chip component mounting portion is closer to the fourth end relative to the guide connection portion.
[0008] In some embodiments, the guiding connection portion includes a first protrusion and a second protrusion, and in the second direction, the second protrusion is closer to the fourth end than the first protrusion; when the chip component is installed on the chip component mounting portion, the second protrusion is closer to the chip component than the first protrusion.
[0009] In some embodiments, the guide connection portion further includes a first guide rail, and two ends of the first guide rail are respectively connected to the first protrusion and the second protrusion in a one-to-one correspondence.
[0010] In some embodiments, the guiding connection portion further includes a second guide rail, which is connected to the first protrusion, and in the second direction, the second guide rail is closer to the third end relative to the first protrusion; when the chip assembly is installed on the chip assembly mounting portion, the second guide rail is farther from the chip assembly relative to the first protrusion.
[0011] In some embodiments, the guiding connection portion includes a first guide rail and a second guide rail, the first guide rail is connected to the second guide rail, and in the second direction, the second guide rail is closer to the third end relative to the first guide rail; when the chip assembly is installed on the chip assembly mounting portion, the first guide rail is closer to the chip assembly relative to the second guide rail.
[0012] In some embodiments, a bending portion is provided on both the first guide rail and the second guide rail.
[0013] In some embodiments, at least two bending portions are provided on the second guide rail, and among the bending portions, the bending portion close to the first guide rail is closer to the chip assembly than the bending portion far from the first guide rail.
[0014] In some embodiments, the guide connection portion is also disposed on a side wall of the drum frame at the second end.
[0015] In some embodiments, the chip assembly includes a chip frame and a chip disposed on the chip frame, the chip frame can be mounted on the chip assembly mounting portion, and the chip is used to be electrically connected to the image forming device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A three-dimensional diagram of a part of the structure of the universal drum assembly in Embodiment 1 of the present utility model when installed in an image forming device at one angle;
[0017] Figure 2 A three-dimensional diagram of a part of the structure of the universal drum assembly in Embodiment 1 of the present utility model when installed in an image forming device from another angle;
[0018] Figure 2a It is a three-dimensional diagram of the universal drum assembly in Example 1 of the utility model;
[0019] Figure 3 A three-dimensional diagram of a drum frame having a guide connection portion of the first structure in Example 1 of the utility model;
[0020] Figure 4 It is a three-dimensional diagram of the chip assembly in Example 1 of the utility model;
[0021] Figure 5 It is a three-dimensional diagram of the universal drum assembly in Embodiment 2 of the present utility model when installed in an image forming device;
[0022] Figure 6 A three-dimensional diagram of a drum frame having a guide connecting portion of a second structure in Example 2 of the present utility model;
[0023] Figure 7 A three-dimensional diagram of a portion of the structure of the universal drum assembly in Embodiment 3 of the present utility model when installed in an image forming device;
[0024] Figure 8 It is a stereoscopic view of a drum frame having a guide connection portion of the third structure in Example 3 of the utility model.
[0025] In the figure: 10, drum frame; 100, chip assembly mounting portion; 101, guide connection portion; 102, first protrusion; 103, second protrusion; 104, first guide rail; 105, second guide rail; 106, first end; 107, second end; 108, third end; 109, fourth end; 20, chip assembly; 200, chip rack; 201, chip mounting position; 202, block; 203, groove; 30, image forming device; 300, track. DETAILED DESCRIPTION
[0026] The utility model is further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0028] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0030] In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.
[0031] The two current image forming devices can be respectively assembled with two different types of drum assemblies, namely, a first drum assembly and a second drum assembly, wherein the second drum assembly can be detachably installed in an image forming device together with a second developing box, the second drum assembly includes a second drum frame and a chip assembly, the second drum frame has a space for accommodating the second developing box and has a first direction and a second direction, the second drum assembly and the second developing box can be installed in the image forming device along the second direction, the second drum frame has a first end and a second end in the first direction, the second drum frame has a third end and a fourth end in the second direction, the second drum frame is provided with a chip assembly fixing portion, a guide connecting portion and a second protrusion on the side wall of the first end, the guide connecting portion and the second protrusion can be connected with The chip assembly is mounted on the chip assembly fixing part; the first drum assembly can be detachably mounted in another image forming device together with the first developing box, the first drum assembly includes a first drum frame, the first drum frame has a space for accommodating the first developing box and has a first direction and a second direction, the first drum assembly and the first developing box can be mounted in the image forming device along the second direction, the first drum frame has a first end and a second end in the first direction, the first drum frame has a third end and a fourth end in the second direction, the first drum frame is provided with a guide connection part and a first protrusion on the side wall of the first end, the guide connection part and the first protrusion can be matched with the track in the image forming device, and the structures of the tracks of the two image forming devices are different. The first developing box and the second developing box are of different models. The first direction intersects with the second direction.
[0032] Embodiment 1:
[0033] Please refer to Figure 1-2a The present embodiment provides a universal drum assembly, which can be detachably installed in an image forming device 30 together with a first developing cartridge and a second developing cartridge. Specifically, the universal drum assembly includes a photosensitive drum, a drum frame 10, a chip assembly mounting portion 100 and a snap-fit structure. The photosensitive drum extends along a first direction and is rotatably supported by the drum frame 10. The drum frame 10 can be detachably installed in the image forming device 30 along a second direction. The chip assembly mounting portion 100 is arranged on one end of the drum frame 10. Under the action of the snap-fit structure, the chip assembly 20 can be detachably mounted on the chip assembly mounting portion 100 and can be electrically connected to the image forming device 30. Thus, the drum frame 10 and the chip assembly 20 can be flexibly installed, thereby improving the versatility of the universal drum assembly and reducing the manufacturing cost.
[0034] Please refer to Figure 1-3The drum frame 10 has a space for accommodating a developing cartridge and has a first direction and a second direction. The developing cartridge can be installed in the drum frame 10 along the second direction or the third direction (the third direction is also a direction intersecting the first direction and the second direction). The drum frame 10 has a first end 106 and a second end 107 in the first direction. The drum frame 10 has a third end 108 and a fourth end 109 in the second direction. The drum frame 10 is provided with a guide connection portion 101 on the side wall of the first end 106. The guide connection portion 101 can cooperate with at least two rails 300 in the image forming device 30. The chip assembly mounting portion 100 is provided on the side wall of the first end 106 of the drum frame 10.
[0035] Please refer to Figure 1-3 In the first direction, the chip assembly mounting portion 100 is closer to the second end 107 than the guide connection portion 101; in the second direction, the chip assembly mounting portion 100 is closer to the fourth end 109 than the guide connection portion 101. The chip assembly mounting portion 100 configured in this way can realize effective installation of the chip assembly 20 without interfering with the guide connection portion 101 and the various tracks 300 in the image forming device 30.
[0036] When the first developing cartridge is installed in the image forming device 30, please refer to Figure 1-3 The guide connection part 101 on the universal drum assembly includes a first protrusion 102 and a second protrusion 103. In the second direction, the second protrusion 103 is closer to the fourth end 109 than the first protrusion 102. When the chip assembly 20 is mounted on the chip assembly mounting part 100, in the third direction, the second protrusion 103 is closer to the chip assembly 20 than the first protrusion 102. The guide connection part 101 configured in this way can cooperate with at least two rails 300 in the image forming device 30 to increase the contact area with the rails 300, thereby improving the stability of the mounting structure of the drum frame 10.
[0037] Specifically, the structure of the first protrusion 102 is similar to a semicircle, and the structure of the second protrusion 103 is similar to a circle. This arrangement makes the guide connection part 101 simple in structure, easy to manufacture, high in strength, and highly versatile.
[0038] Please refer to Figure 1-3 The guide connection part 101 further includes a first guide rail 104. The two ends of the first guide rail 104 are respectively connected to the first protrusion 102 and the second protrusion 103 in a one-to-one correspondence. Under the action of the first guide rail 104, the stability of the overall structure of the guide connection part 101 can be further improved. Specifically, the first guide rail 104 is configured as an inclined plate connecting the first protrusion 102 and the second protrusion 103. The first guide rail 104 configured in this way has a simple structure, is easy to manufacture, and has high versatility.
[0039] For further information, please refer to Figure 1-3 The guide connection part 101 further includes a second guide rail 105, which is connected to the first protrusion 102. In the second direction, the second guide rail 105 is closer to the third end 108 than the first protrusion 102. When the chip assembly 20 is installed on the chip assembly installation part 100, in the third direction, the second guide rail 105 is farther from the chip assembly 20 than the first protrusion 102. By adding the second guide rail 105 in the second direction, the contact area between the guide connection part 101 and the track 300 can be further increased, thereby better improving the stability of the installation structure of the drum frame 10.
[0040] Specifically, at least two bends are provided on the second guide rail 105, wherein the bend close to the first guide rail 104 is closer to the chip assembly 20 in the third direction than the bend far from the first guide rail 104. The second guide rail 105 provided in this way can further improve the contact effect between the guide connection portion 101 and the track 300 in the second direction. More specifically, the bends have a bend angle, and the bend angle is set to 90°-180°, so that the second guide rail 105 can fit the track 300 more closely.
[0041] Please refer to Figure 1-2 Another guide connection part 101 is provided on the side wall of the second end 107 of the drum frame 10, that is, the side walls of the first end 106 and the second end 107 of the drum frame 10 are both provided with guide connection parts 101, and the above-mentioned guide connection parts 101 can correspond to the rails 300 at both ends of the image forming device 30, so that the drum frame 10 can be stably installed in the image forming device 30.
[0042] Please refer to Figure 2 , 4 The chip assembly 20 can be mounted on the chip assembly mounting portion 100 along the third direction and can be electrically connected to the image forming device 30 , so that the chip assembly 20 can communicate with the image forming device 30 .
[0043] Please refer to Figure 2 , 4 The chip assembly 20 includes a chip frame 200 and a chip arranged on the chip frame 200. The chip frame 200 can be installed on the chip assembly mounting portion 100 along a third direction. The chip is used to be electrically connected to the image forming device 30. With such an arrangement, the chip assembly 20 can be disassembled and assembled, effectively improving the versatility of the universal drum assembly.
[0044] Please refer to Figure 2-4, the chip rack 200 can be installed on the chip assembly mounting portion 100 along the third direction through a snap-fit structure. Specifically, the snap-fit structure includes a block 202 and a groove 203, the block 202 protrudes from the bottom surface of the chip rack 200, and the groove 203 is formed by the top surface of the chip assembly mounting portion 100 being recessed toward the bottom surface. In another embodiment, the block 202 protrudes from the top surface of the chip assembly mounting portion 100, and the groove 203 is formed by the bottom surface of the chip rack 200 being recessed toward the top surface. As a result, the chip assembly 20 is facilitated to be disassembled and assembled, and the versatility of the universal drum assembly is effectively improved. In some embodiments, the chip assembly 20 can also be detachably mounted on the chip assembly mounting portion 100 by means of a threaded connection, and the chip assembly mounting portion 100 can also have a threaded hole in the first direction for the chip assembly 20 to be threadedly connected.
[0045] Please refer to Figure 4 The chip frame 200 has a chip mounting position 201 on the top, the chip is mounted in the chip mounting position 201, and has an electrical connection end on the image forming device 30. The chip has an electrical connection portion. When the chip assembly 20 is mounted on the chip assembly mounting portion 100 and the universal drum assembly and the developing box are mounted in the image forming device 30, the electrical connection portion can correspond to the electrical connection end position to achieve electrical connection, thereby achieving effective communication between the chip and the image forming device 30. The chip and the electrical connection portion are fixed relative to the drum frame 10. In some embodiments, the chip and the electrical connection portion are movable relative to the drum frame 10.
[0046] Please refer to Figure 1-4 , the universal drum assembly, relative to the first drum assembly, does not have the first protrusion 102 thereon, and relative to the second drum assembly, does not have the second protrusion 103 thereon. The drum frame 10 can be installed in the image forming device 30 corresponding to the first developing box, and can also be installed in the image forming device 30 corresponding to the second developing box, and both can be used normally without interfering with the track 300 on the image forming device 30. Since the first drum assembly does not have the chip assembly 20 relative to the second drum assembly, a chip assembly mounting portion 100 is provided on the drum frame 10 of the universal drum assembly. When the universal drum assembly is applicable to the second developing box, the chip assembly 20 can be installed through the chip assembly mounting portion 100. When it is applicable to the first developing box, it is only necessary to remove the chip assembly 20 from the chip assembly mounting portion 100. Through such an arrangement, the drum frame 10 can be applicable to both the second developing box and the first developing box, that is, the universal drum assembly can be effectively installed in the image forming devices 30 corresponding to at least two types of developing boxes, thereby improving the versatility of the universal drum assembly and reducing the manufacturing cost.
[0047] Embodiment 2:
[0048] Compared with Example 1, assuming that Example 1 provides a guide connecting portion 101 of the first structure, this embodiment provides a guide connecting portion 101 of the second structure, please refer to Figure 5-6 , which includes a first protrusion 102, a second protrusion 103 and a second guide rail 105. In the second direction, the second protrusion 103 is closer to the fourth end 109 than the first protrusion 102; when the chip assembly 20 is mounted on the chip assembly mounting portion 100, in the third direction, the second protrusion 103 is closer to the chip assembly 20 than the first protrusion 102. The second guide rail 105 is connected to the first protrusion 102. In the second direction, the second guide rail 105 is closer to the third end 108 than the first protrusion 102; when the chip assembly 20 is mounted on the chip assembly mounting portion 100, in the third direction, the second guide rail 105 is farther from the chip assembly 20 than the first protrusion 102.
[0049] Specifically, the structure of the first protrusion 102 is similar to a triangle, and the structure of the second protrusion 103 is similar to a concave shape. This arrangement makes the guide connection part 101 simple in structure, easy to manufacture, high in strength, and highly versatile.
[0050] Embodiment 3:
[0051] Compared with the first embodiment, the present embodiment provides a third structure of the guide connection portion 101, please refer to Figure 7-8 , which only includes a first guide rail 104 and a second guide rail 105, the first guide rail 104 is connected to the second guide rail 105, in the second direction, the second guide rail 105 is closer to the third end 108 than the first guide rail 104; when the chip assembly 20 is installed on the chip assembly mounting portion 100, in the third direction, the first guide rail 104 is closer to the chip assembly 20 than the second guide rail 105. Among them, the first guide rail 104 and the second guide rail 105 are both provided with a bending portion, and the first guide rail 104 is based on the inclined plate, and a horizontal plate is extended from the end of the inclined plate close to the fourth end 109, thereby forming a bending portion.
[0052] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A universal drum assembly, which can be detachably installed in an image forming device together with a developing cartridge, characterized in that: include: A drum frame having a space therein for accommodating a developing cartridge and having a first direction and a second direction, the drum frame being installable in the image forming device along the second direction, the drum frame having a first end and a second end in the first direction, the drum frame having a third end and a fourth end in the second direction, the drum frame being provided with a guide connection portion on a side wall of the first end, the guide connection portion being able to cooperate with a variety of tracks in the image forming device; The chip assembly installation part is arranged on the side wall of the first end of the drum frame, and the chip assembly installation part is used for detachably installing the chip assembly, and the chip assembly is used for electrically connecting with the image forming device.
2. The universal drum assembly according to claim 1, characterized in that In the first direction, the chip component mounting portion is closer to the second end than the guide connection portion; in the second direction, the chip component mounting portion is closer to the fourth end than the guide connection portion.
3. The universal drum assembly according to claim 1, characterized in that The guide connection portion includes a first protrusion and a second protrusion. In the second direction, the second protrusion is closer to the fourth end than the first protrusion; when the chip component is installed on the chip component installation portion, the second protrusion is closer to the chip component than the first protrusion.
4. The universal drum assembly according to claim 3, characterized in that The guide connection portion further includes a first guide rail, and two ends of the first guide rail are respectively connected to the first protrusion and the second protrusion in a one-to-one correspondence.
5. The universal drum assembly according to claim 3 or 4, characterized in that The guiding connection portion also includes a second guide rail, which is connected to the first protrusion. In the second direction, the second guide rail is closer to the third end than the first protrusion; when the chip component is installed on the chip component installation portion, the second guide rail is farther from the chip component than the first protrusion.
6. The universal drum assembly according to claim 1, characterized in that The guide connection portion includes a first guide rail and a second guide rail, the first guide rail is connected to the second guide rail, and in the second direction, the second guide rail is closer to the third end than the first guide rail; when the chip component is installed on the chip component installation portion, the first guide rail is closer to the chip component than the second guide rail.
7. The universal drum assembly according to claim 6, characterized in that The first guide rail and the second guide rail are both provided with bending parts.
8. The universal drum assembly according to claim 7, characterized in that At least two bending parts are provided on the second guide rail, and among the bending parts, the bending part close to the first guide rail is closer to the chip assembly than the bending part far from the first guide rail.
9. The universal drum assembly according to claim 1, characterized in that The guide connection portion is also arranged on the side wall of the drum frame at the second end.
10. The universal drum assembly according to claim 1, characterized in that The chip assembly includes a chip frame and a chip arranged on the chip frame. The chip frame can be installed on the chip assembly installation part. The chip is used to be electrically connected to the image forming device.