Semiconductor packaging machine for rapid dispensing packaging

Abstract

The utility model discloses a semiconductor packaging machine capable of fast dispensing packaging, which comprises a base and a second cylinder, two slide rails are arranged at the upper end of the base, two mounting rods are arranged at the upper ends of the two slide rails, springs are arranged in the mounting rods, one end of each spring is provided with a limiting plate, and the other end of each spring is provided with a second cylinder. A movable rod is arranged on the side wall of the limiting plate, and one end of the movable rod penetrates through one end of the mounting rod, extends to the outside and is fixedly connected with a positioning block. Through the above structure, the two sliding rails are utilized to enable the two mounting rods on the same sliding rail to move oppositely under the cooperation of the threaded rod and the threaded block so as to adjust the position of the positioning block, and the spring is utilized to push the movable rod to move, so that the positioning block positions the semiconductor, and the semiconductor can be kept stable and prevented from deviating during packaging.

Description

Technical Field

[0001] The utility model relates to the technical field of glue dispensing packaging, in particular to a semiconductor packaging machine for rapid glue dispensing packaging. Background Art

[0002] Semiconductor packaging, as the name suggests, is to protect and package the manufactured semiconductor chips to facilitate the protection, connection, heat dissipation and other functions of the semiconductor chips when in use. Common semiconductor packaging methods include bare unpackaged, QFP, BGA, etc. These different packaging methods have different advantages and adaptability scenarios, and need to be selected according to specific application requirements. The importance of semiconductor packaging is self-evident. The packaged semiconductor chip not only has protection performance, but also can complete the connection with other devices, so that the chip can be mounted on the circuit board and can perform electrical connection and signal transmission.

[0003] Currently, when packaging semiconductors, workers place the semiconductors on a workbench. Due to the lack of positioning of the semiconductors, the dispensing head can easily cause the semiconductors to shift when packaging the semiconductors, thereby affecting the packaging effect. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor packaging machine with fast glue dispensing packaging, so as to solve the technical problem in the prior art that due to the lack of semiconductor positioning, the glue dispensing head is prone to cause the semiconductor to shift when packaging the semiconductor, thereby affecting the packaging effect.

[0005] To achieve the above-mentioned purpose, a semiconductor packaging machine for rapid dispensing packaging is provided, comprising: a base and a second cylinder, two slide rails are arranged on the upper end of the base, two mounting rods are arranged on the upper ends of the two slide rails, a spring is arranged inside the mounting rod, a limit plate is arranged on one end of the spring, a movable rod is arranged on the side wall of the limit plate, one end of the movable rod passes through one end of the mounting rod and extends to the outside and is fixedly connected with a positioning block, a threaded rod is rotatably connected to the middle part of the two slide rails, two threaded blocks are threadedly connected to the outside of the two threaded rods, and the upper ends of the threaded blocks are fixedly connected to the lower surface of the mounting rod, a plurality of vertical rods are arranged on the upper end of the base, a cross rod is arranged on the upper end of the two connected vertical rods, a support rod is arranged on the upper end of the two cross rods, a fixed rod is arranged on the side wall of the support rod, and a dispensing head is arranged on the side wall of the fixed rod, and the two mounting rods on the same slide rail are moved toward each other by using the two slide rails in cooperation with the threaded rod and the threaded block to adjust the position of the positioning block, and the spring is used to push the movable rod to move so that the positioning block positions the semiconductor, so that the semiconductor can remain stable during packaging to avoid displacement.

[0006] According to the semiconductor packaging machine for rapid dispensing packaging, both side walls of the two slide rails are provided with knobs, the knob side walls are fixedly connected to one end of the threaded rod, and a connecting plate is fixedly connected between two adjacent threaded blocks.

[0007] According to the semiconductor packaging machine for rapid dispensing packaging, a first movable block is provided in the middle of the two cross bars, an electric rod is provided at one end of one of the cross bars, and an output end of the electric rod is fixedly connected to a side wall of one of the movable blocks.

[0008] According to the semiconductor packaging machine with rapid dispensing packaging, a first cylinder is arranged on one side of the support rod, the output end of the second cylinder extends to the inside through one end of the support rod, the side wall of the fixed rod is fixedly connected to the output end of the second cylinder, and the first cylinder is arranged on the upper end of the fixed rod.

[0009] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

[0010] The purpose of the utility model is to provide a semiconductor packaging machine for rapid dispensing packaging, the main innovations are:

[0011] The utility model utilizes the cooperation of a threaded rod and a threaded block to drive two mounting rods on the same slide rail to move toward each other, adjusts the position of a positioning block during the movement, and utilizes the elasticity of a spring to push the movable rod to move, so that the positioning block clamps the semiconductor, which is convenient for packaging and avoids the semiconductor from shifting during the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0013] Figure 1 This is a front view of a semiconductor packaging machine for rapid dispensing packaging according to the utility model;

[0014] Figure 2 This is a rear view of a semiconductor packaging machine for rapid dispensing packaging according to the utility model;

[0015] Figure 3 This is a diagram showing the internal structure of a slide rail and a mounting rod of a semiconductor packaging machine for rapid dispensing packaging according to the utility model;

[0016] Figure 4 For this utility model Figure 3 Enlarged view of point A in the middle.

[0017] Legend:

[0018] 1. Base; 2. Vertical rod; 3. Glue dispensing head; 4. Slide rail; 5. Mounting rod; 6. Movable rod; 7. Positioning block; 8. Connecting plate; 9. Knob; 10. Threaded rod; 11. Threaded block; 12. Spring; 13. Limit plate; 14. Cross rod; 15. Support rod; 16. First cylinder; 17. Second cylinder; 18. Electric rod. DETAILED DESCRIPTION

[0019] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0020] Reference Figure 1-4 The utility model embodiment is a semiconductor packaging machine for fast dispensing packaging, which includes: a base 1 and a second cylinder 17. Two slide rails 4 are arranged on the upper end of the base 1. Two mounting rods 5 are arranged on the upper ends of the two slide rails 4. A spring 12 is arranged inside the mounting rod 5. A limit plate 13 is arranged at one end of the spring 12. A movable rod 6 is arranged on the side wall of the limit plate 13. The elasticity of the spring 12 is used to push the movable rod 6 to move, so that the positioning block 7 clamps the four corners of the semiconductor. One end of the movable rod 6 passes through one end of the mounting rod 5 and extends to the outside and is fixedly connected with the positioning block 7. The positioning block 7 is arranged in an L shape. It is convenient to position the four corners of the semiconductor. The middle parts of the two slide rails 4 are rotatably connected with threaded rods 10. The external threads of the threaded rods 10 are symmetrically arranged so that the two threaded blocks 11 move toward each other. The two threaded rods 10 are threadedly connected to the outside with two threaded blocks 11. The upper ends of the threaded blocks 11 are fixedly connected to the lower surface of the mounting rod 5. A plurality of vertical rods 2 are arranged on the upper end of the base 1. A cross rod 14 is arranged on the upper ends of the two connected vertical rods 2. Support rods 15 are arranged on the upper ends of the two cross rods 14. The side walls of the support rods 15 are provided with fixed rods. The side walls of the fixed rods are provided with glue heads 3 for packaging semiconductors.

[0021] The side walls of the two slide rails 4 are each provided with a knob 9, and the side wall of the knob 9 is fixedly connected to one end of the threaded rod 10, and a connecting plate 8 is fixedly connected between two adjacent threaded blocks 11, so that the threaded blocks 11 can move simultaneously and remain stable during the movement. A first movable block is provided in the middle of the two cross bars 14, and an electric rod 18 is provided at one end of one of the cross bars 14, and the output end of the electric rod 18 is fixedly connected to the side wall of one of the movable blocks. A first cylinder 16 is provided on one side of the support rod 15, and the output end of the second cylinder 17 extends to the inside through one end of the support rod 15, and the side wall of the fixed rod is fixedly connected to the output end of the second cylinder 17. The upper end of the fixed rod is provided with the first cylinder 16, which is used to adjust the position of the dispensing head 3 to facilitate the packaging of semiconductors.

[0022] Working principle: When in use, the knob 9 is used to drive the threaded rod 10 to rotate, and during the rotation, the threaded block 11 is used to drive the mounting rod 5 to move toward each other, and the elasticity of the spring 12 is used to push the movable rod 6 to move, so that the positioning block 7 clamps the four corners of the semiconductor, and the first cylinder 16, the second cylinder 17 and the electric rod 18 are used to drive the dispensing head 3 to move, and the dispensing head 3 is used to encapsulate the semiconductor. During the encapsulation, the semiconductor can be kept stable to avoid displacement that affects the encapsulation effect.

[0023] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor packaging machine for rapid dispensing packaging, characterized in that: include: A base (1) and a second cylinder (17), wherein the upper end of the base (1) is provided with two slide rails (4), and the upper ends of the two slide rails (4) are provided with two mounting rods (5), a spring (12) is provided inside the mounting rod (5), one end of the spring (12) is provided with a limit plate (13), and a side wall of the limit plate (13) is provided with a movable rod (6), one end of the movable rod (6) passes through one end of the mounting rod (5) and extends to the outside and is fixedly connected to a positioning block (7), and the middle of the two slide rails (4) The two threaded rods (10) are rotatably connected, and the two threaded rods (10) are externally threadedly connected to two threaded blocks (11), and the upper ends of the threaded blocks (11) are fixedly connected to the lower surface of the mounting rod (5). The upper end of the base (1) is provided with a plurality of vertical rods (2), and the upper ends of the two connected vertical rods (2) are provided with a cross rod (14), and the upper ends of the two cross rods (14) are provided with a support rod (15), and the side wall of the support rod (15) is provided with a fixing rod, and the side wall of the fixing rod is provided with a glue head (3).

2. A semiconductor packaging machine for rapid dispensing packaging according to claim 1, characterized in that: The side walls of the two slide rails (4) are each provided with a knob (9), the side wall of the knob (9) is fixedly connected to one end of a threaded rod (10), and a connecting plate (8) is fixedly connected between two adjacent threaded blocks (11).

3. A semiconductor packaging machine for rapid dispensing packaging according to claim 1, characterized in that: A first movable block is disposed in the middle of each of the two cross bars (14), an electric rod (18) is disposed at one end of one of the cross bars (14), and an output end of the electric rod (18) is fixedly connected to a side wall of one of the movable blocks.

4. A semiconductor packaging machine for rapid dispensing packaging according to claim 1, characterized in that: A first cylinder (16) is disposed on one side of the support rod (15); an output end of the second cylinder (17) passes through one end of the support rod (15) and extends to the inside; a side wall of the fixed rod is fixedly connected to the output end of the second cylinder (17); and the first cylinder (16) is disposed on the upper end of the fixed rod.

Images