Wafer back cleaning device
By setting up a valve and bent pipe structure in the leakage drain pipe, the acid gas return in the factory drain pipe is isolated, and the problem of the impact of the working environment of the external concentration meter is solved, and the stable working environment of the concentration meter and the stability of the overall working condition of the device is achieved.
Patent Information
- Application Number
- CN202420606886.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-26
AI Technical Summary
In the existing wafer back cleaning device, the external concentration meter is easily refluxed by acid gas in the factory drainage pipe, which leads to the normal working environment and may cause abnormal working conditions such as downtime.
A valve and bending structure can be installed in the leakage drain pipe to isolate the acid gas return in the factory drain pipe through the normally closed design of the valve structure to ensure that the concentration meter works in a stable and dry environment.
It effectively isolates the return of acid gas, ensures the stable working environment of the external concentration meter, avoids the downtime caused by acid gas corrosion, and maintains the overall working condition stability of the wafer back cleaning device.
Smart Images
Figure CN222581107U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field related to semiconductor preparation, and in particular to a wafer backside cleaning device. Background Art
[0002] In the conventional design of a wafer backside cleaning device, due to internal space limitations, a mainframe for placing wafers and wet cleaning the backside of the wafers and a concentration meter for detecting the concentration of the acid solution for cleaning the backside of the wafers are usually separated, that is, the concentration meter is placed externally on the mainframe.
[0003] In conventional designs, an external concentration meter is equipped with a leakage drain pipe, which is used to drain liquid in time when the concentration meter leaks. Since the leakage drain pipe is connected to the plant drain pipe, the concentration meter is prone to back-absorb a certain amount of acidic gas from the plant drain pipe during the negative pressure exhaust process. These acidic gases will affect the normal working environment of the concentration meter, corrode the metal interface joints, cause the concentration meter to crash and other abnormal operating conditions, and affect the overall stability of the wafer back side cleaning device. Utility Model Content
[0004] In view of the problems in the prior art, the purpose of the present disclosure is to provide a wafer backside cleaning device that can effectively isolate the backflow of acidic gases in the factory drainage pipe, thereby ensuring that the external concentration meter is always in a stable and dry working environment.
[0005] Specifically, the first aspect of the present disclosure provides a wafer backside cleaning device, which includes a mainframe for placing a wafer and wet cleaning the backside of the wafer, and a concentration meter for detecting the concentration of a wafer backside cleaning acid solution, the concentration meter being externally disposed on the mainframe, wherein:
[0006] The first interface of the concentration meter is connected to the factory acid exhaust pipe;
[0007] The second interface of the concentration meter is connected to the leakage drain pipe;
[0008] The leakage drain pipe is connected to the plant drain pipe; and
[0009] An openable and closable valve is provided at one end of the leakage drainage pipe close to the second interface, which is used to prevent the acid gas in the factory drainage pipe from flowing back to the concentration meter through the leakage drainage pipe.
[0010] In a possible implementation of the first aspect above, the concentration meter includes an RS232 serial data communication interface;
[0011] The connector housing of the RS232 serial data communication interface is made of metal.
[0012] In a possible implementation of the first aspect above, the factory acid exhaust pipe provides a negative pressure exhaust environment;
[0013] The setting position of the first interface on the concentration meter is higher than the setting position of the second interface on the concentration meter in the vertical direction.
[0014] In a possible implementation of the first aspect, the main machine includes an acid liquid drainage pipe, which is connected to the factory drainage pipe; and
[0015] The first connection point between the leakage liquid drain pipe and the plant service drain pipe is located between the second connection point between the acid liquid drain pipe and the plant service drain pipe and the valve.
[0016] In a possible implementation of the first aspect above, the direction from the first connection point to the second connection point is the drainage direction of the factory drainage pipe.
[0017] In a possible implementation of the first aspect above, the valve is a manual switch valve;
[0018] When there is no leakage in the concentration meter, the manual switch valve remains closed continuously;
[0019] When there is leakage in the concentration meter, the manual switch valve is opened and the leakage is discharged through the leakage drain pipe.
[0020] In a possible implementation of the first aspect above, the concentration meter includes a liquid leakage sensor, and the liquid leakage sensor is electrically connected to the valve;
[0021] When the leakage sensor detects leakage in the concentration meter, a control signal is sent to the valve to open the valve;
[0022] When the leakage sensor does not detect leakage in the concentration meter, the valve remains closed.
[0023] In a possible implementation of the first aspect above, the leakage drainage pipe is provided with at least one elbow between the first connection point between the leakage drainage pipe and the plant drainage pipe and the valve.
[0024] In a possible implementation of the first aspect above, the leakage drain pipe between the second interface and the valve is provided with at least one elbow.
[0025] In a possible implementation of the first aspect above, the wafer backside cleaning acid solution includes a mixture of hydrofluoric acid and nitric acid;
[0026] Acidic gases include acidic gases generated by the volatilization of hydrofluoric acid and acidic gases generated by the volatilization of nitric acid.
[0027] Compared with the prior art, the present invention has the following beneficial effects:
[0028] Through the technical solution provided by the present invention, the leakage pipeline of the external concentration meter in the wafer back side cleaning device is modified, and a valve structure and a bent pipe structure are additionally arranged in the leakage drain pipe. The normally closed design of the valve structure can effectively isolate the reflux of acidic gas in the factory drain pipe, thereby ensuring that the external concentration meter is always in a stable and dry working environment, avoiding abnormal working conditions such as downtime due to the corrosion of acidic gas on the internal interface joints, and maintaining the overall working stability of the wafer back side cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Other features, objects and advantages of the present disclosure will become more apparent from a reading of the detailed description of non-limiting embodiments made with reference to the following accompanying drawings.
[0030] Figure 1 According to an embodiment of the present disclosure, a schematic structural diagram of a wafer back side cleaning device is provided. DETAILED DESCRIPTION
[0031] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in the present disclosure. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in the present disclosure can also be modified or changed in various ways according to different viewpoints and application systems without departing from the spirit of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.
[0032] The following is a detailed description of the embodiments of the present disclosure with reference to the accompanying drawings so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.
[0033] In the representations of the present disclosure, the reference terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" and the like mean that the specific features, structures, materials, or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics represented may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples represented in the present disclosure and the features of different embodiments or examples, unless they are mutually contradictory.
[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0035] In order to clearly describe the present disclosure, components not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.
[0036] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.
[0037] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.
[0038] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.
[0039] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.
[0040] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which the present disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the content of relevant technical literature and current disclosures, and unless defined, shall not be overly interpreted as ideal or very formal meanings.
[0041] It is understandable that, based on the relevant description in the background technology, the external concentration meter of the wafer backside cleaning device has the problem of acid gas reflux. In order to solve the above problems arising in the practical application process, the present disclosure provides a wafer backside cleaning device, and the specific implementation of the present disclosure will be explained and illustrated in combination with specific embodiments below.
[0042] In some embodiments of the present disclosure, Figure 1 A schematic diagram of the structure of a wafer backside cleaning device is provided. Figure 1 As shown, the wafer backside cleaning device includes a mainframe for placing wafers and wet cleaning the backside of the wafers, and a concentration meter for detecting the concentration of the acid solution for cleaning the backside of the wafers, and the concentration meter 200 is externally disposed on the mainframe 100. It can be understood that the technical solutions provided in the present disclosure all support the wafer backside cleaning device with an external concentration meter design.
[0043] like Figure 1 As shown, specifically, the first interface 201 of the concentration meter 200 is connected to the factory acid exhaust pipe 300; the second interface 202 of the concentration meter 200 is connected to the leakage drainage pipe 400; the leakage drainage pipe 400 is connected to the factory drainage pipe 500. Among them, the leakage drainage pipe 400 is provided with an openable and closable valve 600 at one end close to the second interface 202, which is used to prevent the acid gas in the factory drainage pipe 500 from flowing back to the concentration meter 200 through the leakage drainage pipe 400.
[0044] In the above embodiment, if Figure 1As shown, the plant acid exhaust pipe 300 can provide a negative pressure exhaust environment, and the first interface at the location where the concentration meter is set is higher than the second interface at the location where the concentration meter is set in the vertical direction. This is determined by the physical properties of exhaust and drainage, and the negative pressure exhaust environment also causes the acid gas in the plant drainage pipe 500 to be easily sucked back to the concentration meter 200. In a specific implementation, the plant acid exhaust pipe 300 can provide 150 kPa of negative pressure exhaust.
[0045] In the above embodiment, if Figure 1 As shown, the main station 100 further includes an acid liquid drain pipe 101, which is connected to the factory drain pipe 500 and is used to discharge the processing acid liquid into the factory drain pipe 500 during the operation of the main station 100. It can be understood that in a specific implementation, the wafer backside cleaning acid liquid may include hydrofluoric acid, nitric acid, and a mixture of hydrofluoric acid and nitric acid, and correspondingly, the acid gas includes acid gas generated by the volatilization of hydrofluoric acid and / or acid gas generated by the volatilization of nitric acid.
[0046] In the above embodiment, if Figure 1 As shown, the first connection point A between the leakage drain pipe 400 and the factory drain pipe 500 is located between the second connection point B between the acid drain pipe 101 and the factory drain pipe 500 and the valve 600. Furthermore, the direction from the first connection point A to the second connection point B is the drainage direction of the factory drain pipe 500.
[0047] In the above embodiment, the concentration meter 200 includes an RS232 serial data communication interface (not shown in the figure), and the connector shell of the RS232 serial data communication interface is made of metal. It can be understood that in a normal working environment, the concentration meter 200 is in a stable working environment with humidity and temperature atmosphere, and can perform normal detection operation and data transmission; when the acid gas is generated, the acid gas will react with the metal material (such as copper) to produce corrosion. As time goes by, the acid gas will accumulate and cause serious corrosion to each interface and the concentration meter, which will cause abnormal working conditions such as downtime of the concentration meter, affecting the overall stability of the wafer back cleaning device.
[0048] In the above embodiment, the valve 600 can be configured as a manual switch valve, or as an electrically controlled valve that performs switch control according to a control signal. Specifically, when the valve 600 is a manual switch valve, it can be kept closed when there is no leakage in the concentration meter, thereby blocking and isolating the acid gas sucked back from the plant service drainage pipe 500; when there is leakage in the concentration meter, the valve 600 can be opened manually to connect the leakage drainage pipe 400 to discharge the leakage. Similarly, when the valve 600 is an electrically controlled valve, a leakage sensor for detecting leakage can be additionally configured for the concentration meter 200. The leakage sensor is electrically connected to the valve 600. When the leakage sensor detects that there is leakage in the concentration meter, a control signal is sent to the valve 600 to open the valve; when the leakage sensor does not detect that there is leakage in the concentration meter, the valve 600 is kept closed, thereby blocking and isolating the acid gas sucked back from the plant service drainage pipe 500.
[0049] In the above embodiment, if Figure 1 As shown, the leakage drain pipe 400 between the first connection point A of the leakage drain pipe 400 and the factory drain pipe 500 and the valve 600 is provided with at least one elbow 401. The added elbow section 401 can effectively prevent and reduce the acid gas reflux caused by the back suction pressure generated by the negative pressure of the factory exhaust pipe 300. Specifically, the leakage drain pipe at the elbow portion can be arranged in a U-shape or a serpentine shape, which is not limited here.
[0050] Furthermore, at least one elbow may be added to the leakage drain pipe 400 between the second interface 202 and the valve 600. Figure 1 (not shown), at least one elbow may be added to the leakage drain pipe 400 between the second interface 202 and the valve 600. Figure 1 (not shown in the figure), the leakage drain pipe of the elbow part can also be arranged in a U-shaped or serpentine shape, which is not limited here. It can be understood that the elbow provided between the second interface 202 and the valve 600 can also effectively prevent and reduce the acid gas reflux caused by the back suction pressure generated by the negative pressure of the factory exhaust pipe 300, and at the same time, it can give the valve 600 enough opening reaction time when leakage occurs, so as to prevent the leakage from refluxing into the concentration meter 200.
[0051] To sum up, through the technical solution provided by the present invention, the leakage pipeline of the external concentration meter in the wafer back side cleaning device is modified, and a valve structure and a bent pipe structure are additionally arranged in the leakage drain pipe. The normally closed design of the valve structure can effectively isolate the reflux of acidic gas in the factory drain pipe, and can ensure that the external concentration meter is always in a stable and dry working environment, avoiding abnormal working conditions such as downtime due to the corrosion of acidic gas on the internal interface joints, and can maintain the overall working stability of the wafer back side cleaning device, which has promotion value.
[0052] The above content is a further detailed description of the present disclosure in combination with specific preferred implementation modes, and it cannot be determined that the specific implementation of the present disclosure is limited to these descriptions. For ordinary technicians in the technical field to which the present disclosure belongs, several simple deductions or substitutions can be made without departing from the concept of the present disclosure, which should be regarded as falling within the scope of protection of the present disclosure.
Claims
1. A wafer backside cleaning device, characterized in that: It includes a host platform for placing wafers and performing wet cleaning on the back of the wafers, and a concentration meter for detecting the concentration of the cleaning acid solution on the back of the wafers, wherein the concentration meter is externally arranged on the host platform, wherein: The first interface of the concentration meter is connected to the factory acid exhaust pipe; The second interface of the concentration meter is connected to the leakage drain pipe; The leakage drain pipe is connected to the factory drain pipe; and An openable and closable valve is provided at one end of the leakage drainage pipe close to the second interface, which is used to prevent the acid gas in the factory drainage pipe from flowing back to the concentration meter through the leakage drainage pipe.
2. The wafer backside cleaning device according to claim 1, characterized in that: The concentration meter includes an RS232 serial data communication interface; The connector housing of the RS232 serial data communication interface is made of metal.
3. The wafer backside cleaning device according to claim 1, characterized in that: The factory acid exhaust pipe provides a negative pressure exhaust environment; The first interface is disposed at a position on the concentration meter that is higher than the second interface is disposed at the concentration meter in a vertical direction.
4. The wafer backside cleaning device according to claim 1, characterized in that: The main machine includes an acid drainage pipe, and the acid drainage pipe is connected to the factory drainage pipe; and The first connection point between the leakage drainage pipe and the factory drainage pipe is located between the second connection point between the acid drainage pipe and the factory drainage pipe and the valve.
5. The wafer backside cleaning device according to claim 4, characterized in that: The direction from the first connection point to the second connection point is the drainage direction of the factory drainage pipe.
6. The wafer backside cleaning device according to claim 1, characterized in that: The valve is a manual switch valve; When there is no leakage in the concentration meter, the manual switch valve is kept closed continuously; When the concentration meter leaks, the manual switch valve opens and the leaked liquid is discharged through the leakage drain pipe.
7. The wafer backside cleaning device according to claim 1, characterized in that: The concentration meter includes a liquid leakage sensor, and the liquid leakage sensor is electrically connected to the valve; When the liquid leakage sensor detects that the concentration meter is leaking, a control signal is sent to the valve to open the valve; When the liquid leakage sensor does not detect that the concentration meter has liquid leakage, the valve continues to remain in the closed state.
8. The wafer backside cleaning device according to claim 1, characterized in that: The leakage drainage pipe is provided with at least one elbow between the first connection point between the leakage drainage pipe and the factory drainage pipe and the valve.
9. The wafer backside cleaning device according to claim 1 or claim 8, characterized in that: The leakage drain pipe between the second interface and the valve is provided with at least one elbow.
10. The wafer backside cleaning device according to claim 1, characterized in that: The wafer backside cleaning acid solution includes a mixture of hydrofluoric acid and nitric acid; The acidic gas includes the acidic gas generated by the volatilization of the hydrofluoric acid and the acidic gas generated by the volatilization of the nitric acid.