LED chip cooling device

Abstract

The utility model relates to an LED chip cooling device which comprises a base, a vertical plate is arranged on one side of the top of the base, a plurality of sets of supporting plates for fixing LED chips are arranged on one side of the vertical plate side by side up and down, a circle of surrounding edge for surrounding the LED chips is arranged on the top of each supporting plate, and a snakelike cooling coil is arranged in the side wall of each supporting plate. Wherein any two vertically adjacent groups of cooling coils are connected through a connecting pipe, a sliding opening is further vertically formed in the vertical plate above the supporting plate, sliding blocks are arranged in the sliding opening, a vertical rod connected with the vertically corresponding sliding blocks is arranged on one side of the vertical plate, an electric push rod is arranged at the bottom of the lowermost sliding block, and the electric push rod is connected with the vertical plate. A cover plate connected with the corresponding sliding block is further arranged above the supporting plate, a plurality of sets of air inlet branch pipes are perpendicularly arranged at the bottom of the cover plate in a crossed mode, the air inlet branch pipes are connected with an air inlet main pipe through hoses, and spray heads are further evenly arranged at the bottoms of the air inlet branch pipes. The device is simple in structure and convenient to use.

Description

Technical Field

[0001] The invention relates to the field of LED chip production, and in particular to an LED chip cooling device. Background Art

[0002] LED generally refers to light-emitting diodes, which are solid-state semiconductor devices that convert electrical energy into light energy. As a new type of light-emitting device, LED has the advantages of high light efficiency, energy saving, long service life, short response time, and environmental protection, so it is called the most potential new generation of light sources.

[0003] Part of the LED chip processing process needs to be carried out at high temperature, such as the PECVD growth temperature of SIO2 at 250-300℃, but the subsequent processing requires the source to cool down to room temperature before it can continue. The current practice is to place the LED chip in the plug for natural cooling, but it takes at least 10 minutes, which greatly reduces the production efficiency. Therefore, there is a LED chip cooling device with patent number CN218957678U to solve this problem, but the device still has the following defects when used, such as: the nitrogen blown out from the outlet will quickly flow out from the gap between the upper and lower loading plates before it contacts the top of the LED chip, thereby affecting the cooling of the product, and it cannot cool the bottom surface of the product well. Summary of the invention

[0004] The purpose of the present invention is to provide a LED chip cooling device.

[0005] The technical problem of the present invention is mainly solved by the following technical solutions:

[0006] A LED chip cooling device comprises a base, wherein a vertical plate is arranged on one side of the top of the base, wherein a plurality of support plates for fixing LED chips are arranged in parallel up and down on one side of the vertical plate, and a surrounding edge is arranged on the top of the support plate to encircle the LED chip, a serpentine cooling coil is arranged in the side wall of the support plate, wherein any two adjacent groups of cooling coils above and below are connected by a connecting pipe, a sliding opening is also vertically arranged on the vertical plate above the support plate, wherein a slider is arranged in the sliding opening, a vertical rod connecting the upper and lower corresponding sliders is arranged on one side of the vertical plate, wherein an electric push rod is arranged at the bottom of the lowest slider, a cover plate connected to the corresponding slider is also arranged above the support plate, wherein a plurality of air intake branch pipes are vertically cross-arranged at the bottom of the cover plate, and the air intake branch pipes are connected to the air intake mother pipe through a hose, and nozzles are also evenly arranged at the bottom of the air intake branch pipes.

[0007] Preferably, a notch is provided on one side wall of the surrounding edge, wherein the thickness of the LED chip is smaller than the height of the surrounding edge.

[0008] Preferably, the surrounding edge is located directly below the corresponding cover plate, and the air intake branch pipe is located directly above the opening of the surrounding edge.

[0009] Preferably, a liquid inlet pipe is provided at the inlet end of the uppermost cooling coil, and a liquid outlet pipe is provided at the outlet end of the lowermost cooling coil.

[0010] Preferably, the bottom end of the sliding opening is lower than the horizontal plane of the top end of the corresponding surrounding edge, wherein the size of the sliding block is adapted to the size of the corresponding sliding opening.

[0011] The beneficial effect of the present invention is as follows: the present invention cools the support plate through the coolant in the cooling coil, and then cools the bottom end surface of the product above it. At the same time, the top end of the surrounding edge is covered by the cover plate, so that the gas sprayed by the nozzle sliding into the surrounding edge can fully contact the top end surface of the product before being discharged from the notch, thereby cooling the top end surface to improve the cooling effect and efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the present invention;

[0013] Figure 2 It is a three-dimensional diagram between the vertical plate and the supporting plate in the present invention.

[0014] In the figure: 1. base, 2. vertical plate, 3. support plate, 4. LED chip, 5. surrounding edge, 6. cooling coil, 7. connecting pipe, 8. sliding opening, 9. slider, 10. vertical rod, 11. electric push rod, 12. cover plate, 13. air intake branch pipe, 14. air intake main pipe, 15. nozzle, 16. notch, 17. liquid inlet pipe, 18. liquid outlet pipe. DETAILED DESCRIPTION

[0015] The technical solution of the present invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0016] An LED chip cooling device comprises a base 1, wherein a vertical plate 2 is arranged on one side of the top of the base 1, wherein a plurality of groups of support plates 3 for fixing LED chips 4 are arranged in parallel up and down on one side of the vertical plate 2, and a circle of surrounding edges 5 for encircling the LED chips 4 is arranged on the top of the support plate 3, and a serpentine cooling coil 6 is arranged in the side wall of the support plate 3, wherein any two adjacent groups of cooling coils 6 are connected by a connecting pipe 7, and a liquid inlet pipe 17 is arranged at the inlet end of the uppermost cooling coil 6, and a liquid outlet pipe 18 is arranged at the outlet end of the lowermost cooling coil 6;

[0017] A sliding opening 8 is also vertically arranged on the vertical plate 2 above the support plate 3, wherein a slider 9 is arranged in the sliding opening 8, a vertical rod 10 connecting the upper and lower corresponding sliders 9 is arranged on one side of the vertical plate 2, wherein an electric push rod 11 is arranged at the bottom of the lowest slider 9, and a cover plate 12 connected to the corresponding slider 9 is also arranged above the support plate 3, wherein a plurality of groups of intake branch pipes 13 are vertically cross-arranged at the bottom of the cover plate 12, and the intake branch pipes 13 are connected to the intake main pipe 14 through a hose, and nozzles 15 are evenly arranged at the bottom of the intake branch pipes 13.

[0018] In this embodiment, a notch 16 is provided on one side wall of the surround 5 , wherein the thickness of the LED chip 4 is smaller than the height of the surround 5 , the surround 5 is located directly below the corresponding cover plate 12 , and the air intake branch pipe 13 is located directly above the opening of the surround 5 .

[0019] In this embodiment, the bottom end of the sliding opening 8 is lower than the horizontal plane of the top end of the corresponding surrounding edge 5 , wherein the size of the sliding block 9 is adapted to the size of the corresponding sliding opening 8 .

[0020] The method of use of the present invention is as follows: after placing the product on the support plate 3 within the surrounding edge 5, the coolant is injected into the upper cooling coil 6 through the liquid inlet pipe 17, and then the liquid flows into the multiple groups of cooling coils 6 below in sequence through the corresponding connecting pipes 7, and finally discharged from the liquid outlet pipe 18. In the above process, when the coolant flows in the cooling coil 6, it will cool down the side wall of the support plate 3, and then conduct the cold air to the bottom end surface of the LED chip 4 to cool it down;

[0021] At the same time, the electric push rod 11 drives the lower slider 9 to move downward in the sliding opening 8. At this time, the vertical rod 10 will also drive the upper multiple groups of sliders 9 to move downward in the corresponding sliding openings 8 to drive the corresponding cover plate 12 to move downward to cover the top opening of the surrounding edge 5. At this time, the air intake branch pipe 13 and the nozzle 15 are suspended in the opening of the surrounding edge 5 above the LED chip 4. Then, the nitrogen introduced through the air intake main pipe 14 and sprayed by the hose, the air intake branch pipe 13 and the nozzle 15 can evenly contact the top surface of the LED chip 4, and finally be discharged through the notch 16, so that the gas is fully in contact with the top surface of the product before being discharged, thereby cooling its top surface, and the above components can be reset after use.

[0022] The present invention cools the support plate 3 through the coolant in the cooling coil 6, and then cools the bottom end surface of the product above it. At the same time, the cover plate 12 covers the top end of the surrounding edge 5, so that the gas sprayed by the nozzle 15 that slides into the surrounding edge 5 can fully contact the top end surface of the product before being discharged from the notch 16, thereby cooling the top end surface to improve the cooling effect and efficiency of the product.

[0023] The present invention is described in detail above, but the contents are only preferred embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An LED chip cooling device, comprising a base, characterized in that: A vertical plate is provided on one side of the top of the base, wherein a plurality of support plates for fixing LED chips are arranged in parallel up and down on one side of the vertical plate, and a surrounding edge is provided on the top of the support plate to encircle the LED chip, a serpentine cooling coil is provided in the side wall of the support plate, wherein any two adjacent groups of cooling coils above and below are connected by a connecting pipe, a sliding opening is also vertically provided on the vertical plate above the support plate, wherein a slider is provided in the sliding opening, a vertical rod connecting the upper and lower corresponding sliders is provided on one side of the vertical plate, wherein an electric push rod is provided at the bottom of the lowest slider, a cover plate connected to the corresponding slider is also provided above the support plate, wherein a plurality of air intake branch pipes are vertically cross-arranged at the bottom of the cover plate, and the air intake branch pipes are connected to the air intake main pipe through a hose, and nozzles are evenly provided at the bottom of the air intake branch pipes.

2. The LED chip cooling device according to claim 1, characterized in that: A notch is arranged on one side wall of the surrounding edge, wherein the thickness of the LED chip is smaller than the height of the surrounding edge.

3. The LED chip cooling device according to claim 1, characterized in that: The surrounding edge is located directly below the corresponding cover plate, and the air intake branch pipe is located directly above the opening of the surrounding edge.

4. The LED chip cooling device according to claim 1, characterized in that: A liquid inlet pipe is arranged at the inlet end of the uppermost cooling coil, and a liquid outlet pipe is arranged at the outlet end of the lowermost cooling coil.

5. The LED chip cooling device according to claim 1, characterized in that: The bottom end of the sliding opening is lower than the horizontal plane of the top end of the corresponding surrounding edge, wherein the size of the sliding block is adapted to the size of the corresponding sliding opening.

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