Cleaning jig for optical wafer

Abstract

The utility model discloses a cleaning jig for an optical wafer, which belongs to the technical field of optical wafer production and processing equipment and comprises a base and two fixing seats, the two fixing seats are respectively arranged on the upper side and the lower side of the base and detachably connected with the base, and the base and the two fixing seats are of cuboid structures. The base is provided with four clamping areas, a plurality of clamping holes are evenly formed in the positions, in the four clamping areas, of the base, the clamping holes are formed in an up-down penetrating mode, a plurality of fixing holes corresponding to the clamping holes in position are formed in the two fixing seats, the fixing holes are communicated with the clamping holes, the diameter of the fixing holes is smaller than that of the clamping holes, and the clamping holes are communicated with the fixing seats. Through the arrangement of the base and the two fixing seats, the wafer can be clamped and fixed through the clamping holes and the fixing holes in the base and the fixing seats, meanwhile, the diameter of the fixing holes is smaller than that of the clamping holes, the wafer cannot turn over when placed in the clamping holes, and then the cleaning quality of the wafer is guaranteed.

Description

Technical Field

[0001] The utility model discloses a cleaning jig for optical wafers, belonging to the technical field of optical crystal production and processing equipment. Background Art

[0002] Optical chips mainly refer to crystals used in optical circuits, which are mainly used in windows, prisms, lenses, filters, polarizing elements and phase compensators in optical instruments. They are mainly used in the emission, processing and receiving parts of light in optical circuits. The other type refers to fiber crystals and optical waveguide chips developed in recent years, which are mainly used in the transmission, conversion and branching of light in optical circuits.

[0003] At present, optical chips need to be cleaned in an ultrasonic cleaning device after processing. However, since the processed optical chips are very small, they are easily flipped over due to vibration when placed in existing cleaning jigs for cleaning. As a result, one side of the optical chip is easily cleaned twice while the other side is not cleaned. Manual inspection and wiping are required later, which seriously affects the cleaning efficiency and quality.

[0004] Therefore, a new solution needs to be proposed to solve this problem. Utility Model Content

[0005] The purpose of the utility model is to provide a cleaning tool for optical wafers in order to solve the above-mentioned problems, which has the effect of improving the cleaning efficiency and cleaning quality of optical wafers.

[0006] The utility model achieves the above-mentioned purpose through the following technical scheme, including a base and two fixing seats, the two fixing seats are respectively arranged on the upper and lower sides of the base and are detachably connected to the base, the base and the two fixing seats are both rectangular structures, the base is provided with four clamping areas, the base is evenly provided with a plurality of clamping holes at the four clamping areas, the clamping holes are opened through from top to bottom, the two fixing seats are provided with a plurality of fixing holes corresponding to the positions of the plurality of clamping holes, the fixing holes are connected with the clamping holes, and the diameter of the fixing holes is smaller than the clamping holes.

[0007] By adopting the above technical scheme, the clamping hole opened in the clamping area on the base is used to place the wafer. When the upper and lower ends of the base are respectively connected to the two fixing seats, the upper and lower ends of the clamping hole on the base can be connected to a fixing hole respectively, so that the wafer can be efficiently cleaned when it is placed in the clamping hole. The aperture of the fixing hole is smaller than the clamping hole, so that when the wafer is placed in the clamping hole, it is restricted by the fixing seat and can only move slightly but cannot be flipped, thereby firmly clamping the wafer and effectively preventing the wafer from flipping over by itself during the cleaning process.

[0008] Preferably, some of the clamping holes and fixing holes are circular through holes.

[0009] By adopting the above technical solution, the clamping holes and fixing holes of the circular through-hole structure have better permeability, so that the ultrasonic cleaning device can better clean the wafer placed in the clamping hole. At the same time, the circular through-hole structure can flexibly adapt to wafers of different shapes to clamp and fix them, thereby improving the versatility of the fixture.

[0010] Preferably, four grooves are provided on the outer sides of the two fixing seats, the four grooves correspond to the positions of the four clamping areas on the base, and a number of fixing holes on the two fixing seats are provided in the four grooves.

[0011] By adopting the above technical solution, the depth of the fixing hole is reduced by setting the groove, and the energy generated by the ultrasonic cleaning device can be concentrated to ensure that the cleaning quality of the chips placed in different clamping holes is consistent, thereby improving the cleaning effect and cleaning stability of the fixture.

[0012] Preferably, a support seat is detachably connected to the outer side of the fixing seat, and four protrusions matching the grooves are arranged on the upper end of the support seat. A number of protrusions equal in number to the fixing holes are arranged on the upper ends of the four protrusions, and the diameter and height of the protrusions are the same as the diameter and depth of the fixing holes.

[0013] By adopting the above technical solution, when the support base is connected to the fixed base, the four protrusions on the support base are inserted into the four grooves of the fixed base, so that the several protrusions on the four protrusions are inserted into the fixing holes one by one, and the protrusion diameter and height are the same as the hole diameter and depth of the fixing hole, so that the protrusion fills the fixing hole after being inserted into the fixing hole, so that when the staff places the chip in the clamping hole, one corner of the chip will not fall into the fixing hole due to the placement angle, causing the chip to warp and wear, thereby improving the convenience of chip placement, and thereby improving the efficiency of the jig to clean the chip.

[0014] Preferably, a plurality of bolt holes are provided on the base and the two fixing seats, and the two fixing seats are detachably connected to the base by bolts.

[0015] By adopting the above technical solution, the structure in which the base and the fixing seat are detachably connected by bolts and bolt holes makes the assembly and disassembly of the base more convenient, and facilitates the use and maintenance of the base.

[0016] Preferably, the base is made of brass.

[0017] By adopting the above technical solution, the brass base has good corrosion resistance and mechanical properties, so that the base can have better ductility when it is made into a thinner size, avoiding it from warping and creating gaps when connected to the fixed base, thereby affecting the clamping effect of the chip.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] Firstly, by setting the base and two fixing seats, the clamping holes and fixing holes on the base and the fixing seats can clamp and fix the wafer, and at the same time, the diameter of the fixing hole is smaller than the structure of the clamping hole, so that the wafer cannot be turned over when placed in the clamping hole, thereby ensuring the cleaning quality of the wafer;

[0020] Secondly, through the support seat and the setting, the bumps and protrusions on the support seat can be inserted into the grooves and fixing holes in the fixing seat, so that the upper surface of the fixing seat is flat, which is convenient for workers to place the wafer, and effectively avoids the situation where one corner of the wafer is stuck in the fixing hole when placing the wafer, resulting in warping and wear, thereby improving the convenience of using the fixture;

[0021] Third, through the detachable connection and flexible clamping and fixing design, the fixture can adapt to optical wafers of different sizes, improving the versatility and adaptability of the fixture;

[0022] Fourthly, the base is made of brass, which has good thermal conductivity, corrosion resistance and mechanical properties. Therefore, choosing brass as the material of the base can improve the service life and stability of the fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The figure is a schematic diagram of the structure of a cleaning jig for optical wafers;

[0024] Figure 2 A cross-sectional view of a cleaning jig for optical wafers;

[0025] Figure 3 This is a schematic diagram of the structure of a fixing seat of an optical wafer cleaning jig;

[0026] Figure 4 A schematic diagram of the base structure of an optical wafer cleaning jig;

[0027] Figure 5 The present invention is a schematic diagram of the support structure of an optical chip cleaning jig.

[0028] Figure numerals: 1, base; 2, fixing seat; 3, clamping hole; 4, fixing hole; 5, groove; 6, supporting seat; 7, bump; 8, protrusion; 9, bolt hole. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. In the description of the utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0030] A cleaning jig for optical wafers, such as Figure 1-Figure 5 As shown, it includes a base 1 and two fixing seats 2, the two fixing seats 2 are respectively arranged on the upper and lower sides of the base 1 and are detachably connected to the base 1, the base 1 and the two fixing seats 2 are both rectangular structures, the base 1 is provided with four clamping areas, the base 1 is evenly provided with a plurality of clamping holes 3 at the four clamping areas, the clamping holes 3 are opened through from top to bottom, the two fixing seats 2 are provided with a plurality of fixing holes 4 corresponding to the positions of the plurality of clamping holes 3, the fixing holes 4 are connected to the clamping holes 3, the diameter of the fixing holes 4 is smaller than the clamping holes 3, and the base 1 is opened in the clamping area The clamping hole 3 is used to place the wafer. When the upper and lower ends of the base 1 are respectively connected to the two fixing seats 2, the upper and lower ends of the clamping hole 3 on the base 1 can be connected to a fixing hole 4 respectively, so that the wafer can be efficiently cleaned when it is placed in the clamping hole 3 for cleaning. The aperture of the fixing hole 4 is smaller than the clamping hole 3, so that when the wafer is placed in the clamping hole 3, it is restricted by the fixing seat 2 and can only move slightly but cannot be turned over, thereby firmly clamping the wafer and effectively preventing the wafer from turning over by itself during the cleaning process.

[0031] The plurality of clamping holes 3 and fixing holes 4 are all circular through holes. The clamping holes 3 and fixing holes 4 of the circular through hole structure have better passability, so that the ultrasonic cleaning device can better clean the wafer placed in the clamping hole 3. At the same time, the circular through hole structure can flexibly adapt to wafers of different shapes to clamp and fix them, thereby improving the versatility of the fixture. Four grooves 5 are provided on the outer sides of the two fixing seats 2, and the four grooves 5 correspond to the positions of the four clamping areas on the base 1. The plurality of fixing holes 4 on the two fixing seats 2 are provided in the four grooves 5. Through the setting of the grooves 5, the hole depth of the fixing hole 4 is reduced, and at the same time, the energy generated by the ultrasonic cleaning device can be concentrated to ensure that the wafers placed in different clamping holes 3 are cleaned with consistent quality, thereby improving the cleaning effect and cleaning stability of the fixture.

[0032] The outer side of the fixing seat 2 is detachably connected to a support seat 6, and four protrusions 7 matching the grooves 5 are arranged on the upper end of the support seat 6. The upper ends of the four protrusions 7 are provided with a number of protrusions 8 of the same number as the fixing holes 4. When the support seat 6 is connected to the fixing seat 2, the four protrusions 7 on the support seat 6 are inserted into the four grooves 5 of the fixing seat 2, so that the protrusions 8 on the four protrusions 7 are inserted into the fixing holes 4 one by one. The diameter and height of the protrusions 8 are the same as the diameter and depth of the fixing holes 4, so that the protrusions 8 fill the fixing holes 4 after being inserted into the fixing holes 4, so that when the staff places the wafer in the clamping hole 3, one corner of the wafer will not fall into the fixing hole 4 due to the placement angle. The base 1 and the two fixing seats 2 are provided with a plurality of bolt holes 9, and the two fixing seats 2 are detachably connected to the base 1 by bolts. The structure in which the base 1 and the fixing seats 2 are detachably connected by bolts and bolt holes 9 makes it more convenient to assemble and disassemble, and facilitates its use and maintenance. The base 1 is made of brass. The brass base 1 has good corrosion resistance and mechanical properties, so that the base 1 has better ductility when it is made into a thinner size, avoiding warping and generating gaps when it is connected to the fixing seat 2, thereby affecting the clamping effect on the wafer.

[0033] When the staff wants to clean the chip, the lower end of the base 1 is connected to one of the fixed seats 2, and then the support seat 6 is connected to the fixed seat 2 at the lower end of the base 1, so that the bump 7 and the protrusion 8 on the support seat 6 are inserted into the groove 5 and the fixing hole 4 in the fixed seat 2 at the lower end of the base 1, so that the upper end surface of the fixed seat 2 at the lower end of the base 1 is kept flat, and then the staff can place the chip in the clamping hole 3. After the chip is placed, the other fixed seat 2 is connected to the upper end of the base 1, and the two fixed seats 2 and the base 1 are fixed by bolts. Finally, the support seat 6 is removed and the jig can be placed in the ultrasonic cleaning device for cleaning. When the ultrasonic cleaning device completes cleaning one side of the chip, the flip jig can continue to clean the other side of the chip, which effectively prevents the chip from flipping over by itself during the cleaning process, thereby ensuring the cleaning quality and cleaning efficiency of the chip.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A cleaning tool for optical wafers, characterized in that: The invention comprises a base (1) and two fixing seats (2), wherein the two fixing seats (2) are respectively arranged on the upper and lower sides of the base (1) and are detachably connected to the base (1), the base (1) and the two fixing seats (2) are both rectangular parallelepiped structures, the base (1) is provided with four clamping areas, the base (1) is evenly provided with a plurality of clamping holes (3) at the four clamping areas, the clamping holes (3) are through-opened from top to bottom, and the two fixing seats (2) are both provided with a plurality of fixing holes (4) corresponding to the positions of the plurality of clamping holes (3), the fixing holes (4) are connected to the clamping holes (3), and the diameter of the fixing holes (4) is smaller than that of the clamping holes (3).

2. The optical wafer cleaning tool according to claim 1, characterized in that: The plurality of clamping holes (3) and fixing holes (4) are all circular through holes.

3. The cleaning tool for optical wafer according to claim 1, characterized in that: Four grooves (5) are provided on the outer sides of the two fixing seats (2), the four grooves (5) correspond to the positions of the four clamping areas on the base (1), and a plurality of fixing holes (4) on the two fixing seats (2) are provided in the four grooves (5).

4. The cleaning tool for optical wafer according to claim 3, characterized in that: The fixing seat (2) is detachably connected to a support seat (6) on its outer side. The support seat (6) is provided with four protrusions (7) matching the grooves (5) on its upper end. The four protrusions (7) are provided with a plurality of protrusions (8) on their upper ends, the same number as the fixing holes (4). The diameter and height of the protrusions (8) are the same as the hole diameter and depth of the fixing holes (4).

5. The optical wafer cleaning tool according to claim 1, characterized in that: A plurality of bolt holes (9) are provided on the base (1) and the two fixing seats (2), and the two fixing seats (2) are detachably connected to the base (1) via bolts.

6. The optical wafer cleaning tool according to claim 1, characterized in that: The base (1) is made of brass.

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