Chemical liquid drainage switching mechanism applied to wafer polishing

Abstract

The utility model discloses a chemical liquid drainage switching mechanism applied to wafer polishing, which comprises a liquid distribution box, an isolation plate is arranged in the middle of the liquid distribution box, the liquid distribution box is divided into a first liquid drainage area and a second liquid drainage area by the isolation plate, liquid drainage pipes are arranged in the first liquid drainage area and the second liquid drainage area respectively, and the first liquid drainage area and the second liquid drainage area are communicated through the liquid drainage pipes. A switching box is arranged above the isolation plate, a liquid discharging opening is formed in the bottom of the switching box, the switching box is connected with a switching power cylinder, and the switching power cylinder drives the switching box and the liquid discharging opening to move in the first liquid discharging area and the second liquid discharging area in a reciprocating mode. The device can be used for automatically discharging discharged liquid in different areas, and is simple in structure and convenient and fast to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a chemical liquid discharge switching mechanism used for wafer polishing. Background Art

[0002] The main function of wafer polishing is to remove surface unevenness and dirt, improve the quality and performance of the wafer, and is an indispensable process in semiconductor technology.

[0003] Wafer polishing is carried out using polishing equipment, and polishing liquid is required to assist in the polishing process. The polishing liquid is a mixture of ultrafine solid abrasive materials and chemical additives. It appears as a uniformly dispersed milky white colloid and has a certain corrosive effect. During use, the polishing liquid is discharged from the drain port of the polishing equipment and stored, filtered and reused through a liquid storage device.

[0004] After polishing, the polishing equipment needs to be cleaned. Pure water is used for cleaning to ensure the purity of the wafer, remove impurities and metal contaminants, and improve production efficiency, thereby ensuring the quality and reliability of semiconductor products. Since the polishing equipment has only one drain port, if pure water is discharged together with the polishing liquid, it will dilute the polishing liquid, which is not conducive to subsequent polishing. If they need to be discharged separately, it is necessary to manually connect the drain pipe on the drain port to different pipes to achieve the purpose of separate discharge. However, in the actual operation process, it is very easy to forget to convert the interface, causing pure water to enter the liquid storage device. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a chemical liquid discharge switching mechanism used for wafer polishing, which can automatically discharge the discharge liquid in different areas, has a simple structure and is easy to operate.

[0006] In order to solve the above technical problems, the utility model provides a chemical liquid drainage switching mechanism used for wafer polishing, including a liquid separation box, an isolation plate is arranged in the middle of the liquid separation box, the isolation plate divides the liquid separation box into a first drainage area and a second drainage area, the first drainage area and the second drainage area are both provided with drainage pipes, a switching box is arranged above the isolation plate, a drainage port is arranged at the bottom of the switching box, the switching box is connected to a switching power cylinder, and the switching power cylinder drives the switching box and the drainage port to reciprocate in the first drainage area and the second drainage area.

[0007] Furthermore, an avoidance groove is provided on the upper portion of the isolation plate, and the switch box is arranged in the avoidance groove.

[0008] Furthermore, a guide track is provided between the avoidance groove and the switch box.

[0009] Furthermore, the guide rail includes a plastic guide bar and a plastic support block, the plastic guide bar is fixed on the side wall of the switching box, the plastic support block is fixed on the top of the avoidance groove, the plastic guide bar is mounted on the plastic support block, and guide rails are provided on both sides of the notch of the avoidance groove.

[0010] Furthermore, a clamping plate is provided on one side of the switching box, and an internal threaded connecting column is provided on the clamping plate. The internal threaded connecting column is threadedly connected to the protruding end of the switching power cylinder and locked by a nut. A protective cover is provided on the protruding end of the switching power cylinder.

[0011] Furthermore, the clamping plate includes an outer clamping plate and an inner clamping plate, and the outer clamping plate and the inner clamping plate are respectively fixed on the side walls of the switching box by screws, and the internal threaded connecting column, nut, outer clamping plate and inner clamping plate are all made of plastic.

[0012] Furthermore, the first drainage area and the inner wall of the switch box are coated with an anti-corrosion coating.

[0013] Furthermore, an upper cover is provided on the top of the liquid separation box, a mounting protrusion is provided on one side wall of the liquid separation box, and an oblong hole is provided on the mounting protrusion.

[0014] Furthermore, a temperature sensor is provided in the first liquid discharge area.

[0015] Beneficial effects of the utility model:

[0016] 1. Through the isolation and segmentation of the liquid separation box and in conjunction with the switching box, the polishing liquid and the pure water for washing the equipment can be effectively discharged separately, that is, they can be discharged into the first drainage area and the second drainage area respectively, and then discharged by two drainage pipes respectively, so that the operator does not need to manually replace the pipe, avoiding the problem of pure water entering the polishing liquid due to forgetting to replace it.

[0017] 2. The switching box adopts a switching power cylinder to realize the switching position. When polishing normally, the switching power cylinder brings the switching box to the first position to recycle the polishing liquid. When cleaning the equipment, the switching power cylinder brings the switching box to the second position to discharge the pure water after cleaning. It can also be controlled by the main program of the polishing equipment, eliminating manual operation and ensuring the stability and accuracy of the equipment operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 The utility model Figure 1 Schematic diagram of the structure of the middle part;

[0020] Figure 3It is a schematic diagram of the matching connection structure between the switching box and the switching power cylinder of the utility model;

[0021] Figure 4 It is a schematic diagram of the structure of the utility model with a guide track;

[0022] Figure 5 It is a structural schematic diagram of the utility model with an upper cover. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0024] Reference Figures 1 to 3 As shown, an embodiment of the chemical liquid discharge switching mechanism used for wafer polishing of the utility model includes a liquid separation box 1, an isolation plate 2 is arranged in the middle of the liquid separation box, the isolation plate divides the liquid separation box into a first drainage area 3 and a second drainage area 4, drainage pipes 5 are arranged in the first drainage area and the second drainage area, a switching box 6 is arranged above the isolation plate, a drainage port 7 is arranged at the bottom of the switching box, the switching box is connected to a switching power cylinder 8, and the switching power cylinder drives the switching box and the drainage port to reciprocate in the first drainage area and the second drainage area.

[0025] The drain hose or hard pipe of the polishing equipment can be directly placed in the switching box, and it directly drains into the switching box. The switching cylinder drives the switching box to move between the first drain area and the second drain area, so that the liquid discharged from the polishing equipment can be diverted to the first drain area or the second drain area, wherein the switching cylinder can be an oil cylinder, an electric cylinder or an air cylinder. When the polishing equipment discharges polishing liquid, the switching cylinder retracts, and the drain port set at the bottom of the switching box is placed in the first drain area. After the polishing liquid enters the switching box, it directly enters the first drain area through the drain port, and finally is discharged from the drain pipe of the first drain area. When the polishing equipment discharges pure water after cleaning the equipment, the switching cylinder extends, drives the drain port set at the bottom of the switching box to be placed in the second drain area. After the pure water after cleaning the equipment enters the switching box, it directly enters the second drain area through the drain port, and finally is discharged from the drain pipe of the second drain area.

[0026] During operation, the switching power cylinder can be operated manually or controlled by the main program of the polishing equipment. That is, during normal polishing work, the switching power cylinder is in a retracted state, and when the cleaning program is started, the switching power cylinder is in an extended state, achieving an automatic switching effect.

[0027] Since the liquid is directly discharged, the liquid level retained in the liquid separation box is not high, and the isolation plate can be prepared relatively low to ensure the compactness of the overall structure of the mechanism. Specifically, an avoidance groove 9 can be provided on the upper part of the isolation plate, and the switching box is provided in the avoidance groove to achieve an avoidance effect on the switching box during reciprocating movement.

[0028] The polishing liquid is a chemical agent and has a certain degree of corrosiveness. Therefore, the first drainage area, the second drainage area and the inner wall of the switch box are coated with an anti-corrosion coating. The liquid separation box and the switch box can be made of metal, such as stainless steel, which has strong strength. Of course, anti-corrosion materials can also be used instead. A clamping plate 12 is provided on one side of the switch box, and an internal threaded connecting column 13 is provided on the clamping plate. The internal threaded connecting column is threadedly connected to the protruding end 14 of the switching power cylinder and locked by a nut 15. A protective cover 16 is sleeved on the protruding end of the switching power cylinder. The setting of the clamping plate can improve the strength of the connection side of the switch box, and the internal threaded connecting column and the protruding end are threadedly connected and fastened with a nut, which is convenient to connect and has a good fixing effect; the protective cover can protect and shield the surface of the protruding rod of the switching power cylinder, thereby preventing the corrosive polishing liquid from entering the inside of the switching power cylinder and causing corrosion.

[0029] Specifically, the clamp includes an outer clamp 17 and an inner clamp 18, and the outer clamp and the inner clamp are respectively fixed to the side walls of the switch box by screws. The outer clamp and the inner clamp can effectively strengthen the side walls of the switch box and are not easily deformed. The internal threaded connecting column, nut, outer clamp and inner clamp are all made of plastic to reduce corrosion.

[0030] Since the polishing liquid needs to maintain a certain temperature during operation, a temperature sensor 21 can be provided in the first liquid discharge area so that the discharge liquid temperature can be measured and collected by the polishing equipment.

[0031] Reference Figure 4 As shown, the switch box and the switch power cylinder are connected to form a cantilever structure. After long-term use, the weight of the switch box forms a shear force on the connection. Therefore, a guide track can be set between the avoidance groove and the switch box to form a dragging and guiding movement effect. Specifically, the guide track includes a plastic guide bar 10 and a plastic support block 11. The plastic guide bar is fixed on the side wall of the switch box, and the plastic support block is fixed on the top of the avoidance groove. The plastic guide bar is mounted on the plastic support block. Guide tracks are set on both sides of the notch of the avoidance groove to form a bilateral dragging effect. The preparation cost of the plastic guide bar and the plastic support block is low. When moving, the self-lubricating effect of the plastic will not appear dry and cause poor sliding.

[0032] Reference Figure 5As shown, an upper cover 19 can also be provided on the top of the liquid separation box, and a hole is provided on the upper cover to avoid the drainage hose or hard pipe of the polishing equipment, so as to prevent debris from entering the liquid separation box. A mounting protrusion 111 is provided on one side wall of the liquid separation box, and an oblong hole 20 is provided on the mounting protrusion, which can be directly fixed to the polishing equipment by bolts.

[0033] Reference Figure 1 As shown, the switching power cylinder can be fixed in a mounting frame, the mounting frame is fixed on the polishing equipment, and an oblong hole is also provided on the mounting frame, which cooperates with the oblong hole on the mounting protrusion to achieve installation height matching between the switching power cylinder and the liquid separation box.

[0034] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A chemical liquid discharge switching mechanism used for wafer polishing, characterized in that: It includes a liquid separation box, an isolation plate is arranged in the middle of the liquid separation box, the isolation plate divides the liquid separation box into a first liquid drainage area and a second liquid drainage area, the first liquid drainage area and the second liquid drainage area are both provided with drainage pipes, a switching box is arranged above the isolation plate, a drainage port is arranged at the bottom of the switching box, the switching box is connected to a switching power cylinder, and the switching power cylinder drives the switching box and the drainage port to reciprocate in the first liquid drainage area and the second liquid drainage area.

2. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 1, characterized in that: An escape groove is arranged on the upper part of the isolation plate, and the switch box is arranged in the escape groove.

3. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 2, characterized in that: A guide track is arranged between the avoidance groove and the switching box.

4. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 3, characterized in that: The guide rail includes a plastic guide bar and a plastic support block. The plastic guide bar is fixed on the side wall of the switching box, the plastic support block is fixed on the top of the avoidance groove, the plastic guide bar is laid on the plastic support block, and guide rails are provided on both sides of the notch of the avoidance groove.

5. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 1, characterized in that: A clamping plate is provided on one side of the switching box, and an internal thread connecting column is provided on the clamping plate. The internal thread connecting column is threadedly connected to the protruding end of the switching power cylinder and is locked by a nut. A protective cover is sleeved on the protruding end of the switching power cylinder.

6. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 5, characterized in that: The clamping plate comprises an outer clamping plate and an inner clamping plate, and the outer clamping plate and the inner clamping plate are respectively fixed on the side wall of the switching box by screws, and the internal threaded connecting column, nut, outer clamping plate and inner clamping plate are all made of plastic.

7. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 1, characterized in that: The first drainage area, the second drainage area and the inner wall of the switch box are all coated with an anti-corrosion coating.

8. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 1, characterized in that: An upper cover is arranged on the top of the liquid separation box, a mounting protrusion is arranged on one side wall of the liquid separation box, and an oblong hole is arranged on the mounting protrusion.

9. The chemical liquid discharge switching mechanism for wafer polishing as claimed in claim 1, characterized in that: A temperature sensor is arranged in the first liquid discharge area.

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