Cutter wheel flange capable of improving wafer cutting efficiency

Abstract

The utility model provides a cutter wheel flange capable of improving wafer cutting efficiency, which comprises a cutter head seat, a cutter head and a cutter head, the cutterhead cover is mounted on the cutterhead seat and is used for clamping the blades; the cutterhead nut is positioned on the outer side of the cutterhead cover, is mounted on the cutterhead seat through threads and is used for fixing the cutterhead cover on the cutterhead seat; and the gasket is arranged between the two blades and used for isolating and fixing the blades. The cutter wheel flange structure provided by the utility model effectively solves the problems of low wafer cutting efficiency, high labor cost, unstable processing size and the like in the prior art, and realizes high efficiency, refinement and stabilization of the wafer cutting process; through the structural design of the cutterhead seat and the cutterhead cover, a plurality of blades can be mounted and fixed at the same time, so that the wafer cutting-up processing efficiency is greatly improved, and the manual operation time and cost are reduced; the gasket adopts a T-shaped cross section design, an effective cooling channel is formed, the gasket can be replaced according to different wafer cutting spacing requirements, effective heat dissipation of the blade in the high-speed operation process is ensured, the service life of the cutter is prolonged, and the cutting precision is kept.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to a cutter wheel flange for improving wafer dicing efficiency. Background Art

[0002] In the semiconductor manufacturing process, wafer dicing is a key step, in which precision blades with air-suspended electric spindles are usually used to accurately cut the wafers. The current blade flange design on the market can generally only install a single blade radially, and cannot realize simultaneous processing of multiple blades, resulting in frequent manual operations and low overall processing efficiency. Secondly, the single-blade processing method increases the difficulty of controlling the processing width dimension and poor consistency, which can easily cause uneven or large deviations in the cutting size of the wafer. Thirdly, during the wafer dicing process, due to the rotation accuracy limitation and poor stability of the blade flange, the wafer cutting position may be displaced, affecting the yield and quality of the final product.

[0003] The shortcomings of the existing technology are summarized as follows:

[0004] 1. The current blade wheel flange structure design is single and can only install one blade. It cannot meet the needs of efficient and continuous multi-blade cutting of wafers at the same time, resulting in high labor costs and low production efficiency.

[0005] 2. The blade installation method and flange structure design are not conducive to precise control of the cutting width, resulting in unstable processing dimensions and difficulty in ensuring product quality.

[0006] 3. The stability and rotation accuracy of the cutter wheel flange under high-speed rotation need to be improved to reduce wafer cutting errors caused by vibration or displacement.

[0007] Therefore, the prior art has deficiencies and needs further improvement. Utility Model Content

[0008] In view of the problems existing in the prior art, the utility model provides a cutter wheel flange which improves wafer dicing efficiency.

[0009] To achieve the above purpose, the specific scheme of the utility model is as follows:

[0010] The utility model provides a cutter wheel flange for improving wafer dicing efficiency, comprising:

[0011] The cutter head is mounted on the main shaft and is used to drive the cutter to rotate;

[0012] A cutter disc cover is installed on the cutter disc seat and is used to clamp the blade;

[0013] The cutter head nut is located on the outside of the cutter head cover and is installed on the cutter head seat through threads to fix the cutter head cover on the cutter head seat;

[0014] The spacer is arranged between the two blades and is used for isolating and fixing the blades.

[0015] Furthermore, the gasket has a T-shaped cross section, which is used to form a cooling channel between the blade and the gasket. The gasket is replaced according to different wafer dicing spacing requirements.

[0016] Furthermore, the cutter disc cover is an annular structure, which is sleeved on the cutter disc seat and is used to fix the blade and the gasket on the cutter disc seat.

[0017] Furthermore, the cutter disc seat is provided with at least two positioning holes, and the main shaft is provided with at least two positioning pins, and the positioning holes match the positioning pins and are used to fix the cutter disc seat on the main shaft.

[0018] Furthermore, a circle of grooves is provided on the side of the cutter disc seat facing the cutter disc nut.

[0019] Furthermore, a heat dissipation groove is provided on the surface of the blade seat facing the blade cover.

[0020] Furthermore, the surfaces where the blade seat and the blade cover contact each other are provided with anti-slip textures.

[0021] Furthermore, the blade disc cover is bowl-shaped, with one side of the bowl mouth facing the blade disc seat, the edge of the bowl mouth contacts the blade disc seat, and a gap is formed between the inner space of the blade disc cover and the blade disc seat.

[0022] Furthermore, the surfaces where the cutter disc seat and the cutter disc cover contact each other are both provided with an anti-corrosion coating.

[0023] Furthermore, the diameter of the cutter seat is smaller than the diameter of the main shaft.

[0024] The technical solution of the utility model has the following beneficial effects:

[0025] 1. Multi-blade installation and quick replacement: Through the structural design of the blade seat and the blade cover, multiple blades can be installed and fixed at the same time, which greatly improves the processing efficiency of wafer dicing and reduces manual operation time and cost.

[0026] 2. Efficient cooling system: The gasket adopts a T-shaped cross-section design to form an effective cooling channel. The gasket can be replaced according to the requirements of different wafer dicing spacing, ensuring effective heat dissipation of the blade during high-speed operation, extending the tool life and maintaining cutting accuracy.

[0027] 3. Precise positioning and enhanced stability: The positioning holes on the cutter head match the positioning pins on the spindle, which can ensure the stable installation and precise positioning of the cutter head on the spindle, reducing the wafer dicing displacement caused by vibration.

[0028] 4. Optimized heat dissipation and anti-slip design: Heat dissipation grooves and anti-slip patterns are set on the blade seat, which accelerates heat dissipation and protects the equipment. On the other hand, it enhances the connection stability between the blade seat and the blade cover to avoid relative sliding during high-speed rotation.

[0029] 5. Compact structure and corrosion resistance: The cutter head cover adopts a bowl-shaped design, which not only saves space, but also effectively prevents equipment damage caused by corrosion by setting an anti-corrosion coating on the contact surface with the cutter head seat, thereby extending the service life of the equipment.

[0030] 6. Lightweight design: The diameter of the cutter head is smaller than the spindle diameter, which helps to reduce the moment of inertia and further improve the rotation accuracy and dynamic response speed of the cutter wheel flange, thereby improving the overall work efficiency and product quality of wafer dicing.

[0031] 7. The cutter wheel flange structure provided by the utility model effectively solves the problems of low wafer cutting efficiency, high labor cost, unstable processing size, etc. in the prior art, and realizes the high efficiency, refinement and stabilization of the wafer cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structure of a flange for installing a blade in the prior art;

[0033] Figure 2 yes Figure 1 A partial enlarged view of the middle A;

[0034] Figure 3 It is a three-dimensional diagram of the utility model;

[0035] Figure 4 It is a side view of the utility model;

[0036] Figure 5 yes Figure 3 A partial enlarged view of point B in the middle;

[0037] Figure 6 yes Figure 5 A partial enlarged view of point C in the middle.

[0038] In the figure:

[0039] 1. Knife disc seat;

[0040] 2. Knife disc cover;

[0041] 3. Cutter nut;

[0042] 4. Blade;

[0043] 5. Gasket;

[0044] 6. Groove;

[0045] 7. Heat sink;

[0046] 8. Main axis. DETAILED DESCRIPTION

[0047] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0048] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0050] In the description of this embodiment, the terms "upper", "lower", "front", "back", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0051] Combination Figure 3-Figure 6As shown, the utility model provides a cutter wheel flange for improving wafer dicing efficiency, comprising: a cutter disc seat 1, mounted on a spindle 8, for driving a blade 4 to rotate; a cutter disc cover 2, mounted on the cutter disc seat 1, for clamping the blade 4; a cutter disc nut 3, located on the outside of the cutter disc cover 2, mounted on the cutter disc seat 1 through a thread, for fixing the cutter disc cover 2 on the cutter disc seat 1; a gasket 5, arranged between two blades 4, for isolating and fixing the blades 4; the cross-section of the gasket 5 is T-shaped, for forming a cooling channel between the blades 4 and the gasket 5, and the gasket 5 is replaced according to different wafer dicing spacing requirements; the cutter disc cover 2 is an annular structure, which is sleeved on the cutter disc seat 1, for fixing the blade 4 and the gasket 5 on the cutter disc seat 1.

[0052] The cutter seat 1 is provided with at least two positioning holes, and the spindle 8 is provided with at least two positioning pins, and the positioning holes match the positioning pins, and are used to fix the cutter seat 1 on the spindle 8; the cutter seat 1 is also provided with a circle of grooves 6 on the side facing the cutter nut 3; the surface of the cutter seat 1 facing the cutter cover 2 is also provided with heat dissipation grooves 7. The surface of the cutter seat 1 and the cutter cover 2 that contact each other is provided with anti-slip textures.

[0053] The blade cover 2 is bowl-shaped, with one side of the bowl mouth facing the blade seat 1, the edge of the bowl mouth contacts the blade seat 1, and a gap is formed between the inner space of the blade cover 2 and the blade seat 1; the surfaces where the blade seat 1 and the blade cover 2 contact each other are provided with an anti-corrosion coating; the diameter of the blade seat 1 is smaller than the diameter of the main shaft 8.

[0054] The principle of this utility model is as follows:

[0055] Driving and fixing mechanism: The cutter head seat 1 is mounted on the air suspension electric spindle 8, and the power transmission of the spindle 8 drives the blade 4 to rotate for wafer cutting. The cutter head cover 2 is fixed to the cutter head seat 1 through the threaded fit of the cutter head nut 3, forming a stable blade 4 clamping structure to ensure that the blade 4 remains stable during high-speed rotation without loosening or offset.

[0056] Multi-blade 4 structure: Install the cutter disc flange on the main shaft 8, and then install the cutter disc on the cutter disc flange. When the cutter disc rotates, the blade 4 on the cutter disc will cut along the surface of the wafer to complete the wafer cutting work. Arrange multiple blades 4 on the cutter disc in a certain order, and the distance between each blade 4 can be adjusted according to actual needs. When the cutter disc rotates, the blade 4 will rotate with the cutter disc, and each blade 4 will contact the surface of the wafer to perform cutting work. Due to the presence of multiple blades 4, each blade 4 can cut independently.

[0057] Multiple blade 4 installation and cooling design: The blade cover 2 adopts a ring structure, which can simultaneously install multiple blades 4, greatly improving processing efficiency. The gasket 5 adopts a T-shaped cross-section design, which can form a cooling channel between the blade 4 and the gasket 5 to facilitate the flow of coolant and achieve effective cooling of the blade 4, and the gasket 5 can be flexibly replaced according to different wafer dicing spacing requirements.

[0058] Precise positioning and stability: The positioning holes on the cutter seat 1 are precisely matched with the positioning pins on the spindle 8, ensuring the stable installation and precise positioning of the cutter seat 1 on the spindle 8, reducing vibration and displacement during the cutting process. At the same time, the anti-slip texture design on the contact surface between the cutter seat 1 and the cutter cover 2 enhances the friction between the two and further ensures stability during the rotation process.

[0059] Heat dissipation and anti-corrosion treatment: The side of the blade seat 1 is provided with a heat dissipation groove 7, which helps to dissipate heat, maintain a good working temperature of the blade 4, and extend the service life of the blade 4. The contact surface between the blade seat 1 and the blade cover 2 is coated with an anti-corrosion coating, which can prevent corrosion in harsh environments and ensure long-term stable operation of the equipment.

[0060] Structural optimization: The diameter of the cutter head 1 is smaller than the diameter of the spindle 8, which reduces the mass of the flange and enables the entire device to have higher rotation accuracy and dynamic performance, thereby improving the efficiency and accuracy of wafer dicing.

[0061] In summary, the cutter wheel flange of the utility model effectively solves the problems of low efficiency, high labor cost, unstable processing size, etc. of traditional cutter wheel flanges through ingenious structural design and function optimization, and realizes efficient, precise and stable operation of wafer cutting.

[0062] The above description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the protection scope of the present invention.

Claims

1. A cutter wheel flange for improving wafer dicing efficiency, characterized in that: include: The cutter head is mounted on the main shaft and is used to drive the cutter to rotate; A cutter disc cover is installed on the cutter disc seat and is used to clamp the blade; The cutter head nut is located on the outside of the cutter head cover and is installed on the cutter head seat through threads to fix the cutter head cover on the cutter head seat; The spacer is arranged between the two blades and is used for isolating and fixing the blades.

2. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The gasket has a T-shaped cross section and is used to form a cooling channel between the blade and the gasket. The gasket is replaced according to different wafer dicing spacing requirements.

3. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The cutter disc cover is an annular structure, which is sleeved on the cutter disc seat and is used to fix the blade and the gasket on the cutter disc seat.

4. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The cutter disc seat is provided with at least two positioning holes, and the main shaft is provided with at least two positioning pins. The positioning holes match the positioning pins and are used to fix the cutter disc seat on the main shaft.

5. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: A circle of grooves is also arranged on one side of the cutter disc seat facing the cutter disc nut.

6. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: A heat dissipation groove is also provided on the surface of the blade seat facing the blade cover.

7. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The surfaces where the blade seat and the blade cover contact each other are provided with anti-skid patterns.

8. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The knife disc cover is bowl-shaped, with one side of the bowl mouth facing the knife disc seat, the edge of the bowl mouth contacts the knife disc seat, and a gap is formed between the inner space of the knife disc cover and the knife disc seat.

9. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The surfaces where the cutter disc seat and the cutter disc cover contact each other are both provided with an anti-corrosion coating.

10. The cutter wheel flange for improving wafer dicing efficiency according to claim 1, characterized in that: The diameter of the cutter head seat is smaller than the diameter of the main shaft.

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