Carrier assembly for low-temperature vacuum coating and coating equipment

Abstract

The utility model relates to the technical field of coating process components, and discloses a carrier component for low-temperature vacuum coating and coating equipment, which can effectively increase the contact area between a cooling wall of the equipment and a carrying disc by arranging a heat-conducting soft gasket between the cooling wall of the equipment and the carrying disc. The thermal resistance between the cooling wall of the equipment and the carrying disc is reduced, and the contact area between the carrying disc and the wafer is increased through the structural cooperation of the heat conduction through holes in the carrying disc and the heat conduction soft gaskets, so that the thermal resistance between the carrying disc and the wafer is reduced; therefore, the problem of poor surface contact caused by poor processing flatness of the wafer, the metal carrying disc and the equipment cooling wall is solved, and the heat conduction effect of the wafer, the metal carrying disc and the equipment cooling wall under the vacuum condition is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating process components, in particular to a carrier component and coating equipment for low-temperature vacuum coating. Background Art

[0002] In the field of infrared detectors, low-temperature vacuum evaporation coating of indium metal is a conventional process, which usually requires the actual coating temperature of the wafer to be between -20°C and -70°C or lower. In the actual low-temperature vacuum coating process, the wafer substrate needs to be attached to the cooling system of the vacuum coating equipment through a metal carrier, and the cooling temperature is transferred to the substrate by heat conduction.

[0003] In the actual operation process, the wafer is a solid substrate with a certain degree of warpage. At the same time, the metal carrier is a hard material and has the problem of processing flatness. The equipment cooling wall of the coating equipment is usually the equipment cooling wall, which also has the problem of processing flatness. Figure 1 As shown, Figure 1 The structure of the coating equipment in the prior art is illustrated, in which the equipment cooling wall 1, the carrier plate 2 and the wafer 3 are sequentially attached. During the hard contact process between the equipment cooling wall 1, the carrier plate 2 and the wafer 3, poor surface contact between the three may occur due to processing flatness problems, which makes it difficult to achieve a better heat conduction effect by simply relying on heat conduction under vacuum conditions. Utility Model Content

[0004] The utility model provides a carrier assembly and coating equipment for low-temperature vacuum coating, which solves the technical problem that during the hard contact process between a wafer, a metal carrier and a cooling wall of an equipment, poor surface contact between the three is likely to occur due to processing flatness problems, which makes it difficult to achieve a better heat conduction effect by simply relying on heat conduction under vacuum conditions.

[0005] In view of this, the utility model provides a low-temperature vacuum coating carrier assembly in a first aspect, which is applied to a coating device, wherein the coating device comprises a device cooling wall and a carrier plate, wherein a surface of the carrier plate away from the device cooling wall is bonded with a wafer, and the carrier assembly comprises: a thermally conductive soft gasket;

[0006] The carrier plate is provided with a heat-conducting through hole, the heat-conducting soft gasket is attached between the equipment cooling wall and the carrier plate, and the heat-conducting soft gasket is arranged on the outer surface of the heat-conducting through hole.

[0007] Optionally, the thermally conductive soft gasket is a graphite sheet or an indium sheet.

[0008] Optionally, the thermally conductive soft gasket can be detachably mounted on the carrier plate.

[0009] Optionally, the carrier assembly further includes: a screw, the carrier plate is provided with a screw hole, and the screw passes through a through hole provided in the thermally conductive soft gasket and is threadedly connected to the screw hole.

[0010] Optionally, the carrier assembly further comprises a tray placement rack, wherein the tray placement rack is provided with a tray placement opening, and the tray placement opening is adapted to the structure of the tray.

[0011] Optionally, a bracket is provided at the bottom of the tray placement rack.

[0012] In a second aspect, the utility model further provides a coating device, including the above-mentioned low-temperature vacuum coating carrier assembly.

[0013] It can be seen from the above technical solutions that the utility model has the following advantages:

[0014] The utility model can effectively increase the contact area between the equipment cooling wall and the carrier plate by arranging a thermally conductive soft gasket between the equipment cooling wall and the carrier plate, reduce the thermal resistance between the equipment cooling wall and the carrier plate, and increase the contact area between the carrier plate and the wafer and reduce the thermal resistance between the carrier plate and the wafer through the structural cooperation of the thermally conductive through hole on the carrier plate and the thermally conductive soft gasket, thereby overcoming the problem of poor surface contact caused by the processing flatness problem of the wafer, the metal carrier plate and the equipment cooling wall, and improving the heat conduction effect of the wafer, the metal carrier plate and the equipment cooling wall under vacuum conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a coating device in the prior art;

[0016] Figure 2 A schematic structural diagram of a low-temperature vacuum coating carrier assembly provided in an embodiment of the utility model.

[0017] Reference numerals:

[0018] 1. Equipment cooling wall; 2. Carrier; 21. Thermal through hole; 22. Screw; 23. Screw hole; 3. Wafer; 4. Thermally conductive soft gasket; 5. Carrier placement rack; 51. Carrier placement port; 52. Bracket DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] In the actual operation process, the wafer is a solid substrate with a certain degree of warpage. At the same time, the metal carrier is a hard material and has the problem of processing flatness. The cooling system of the coating equipment is usually the equipment cooling wall, which also has the problem of processing flatness. Figure 1 As shown, Figure 1 The structure of the coating equipment in the prior art is illustrated, in which the equipment cooling wall 1, the carrier plate 2 and the wafer 3 are sequentially attached. During the hard contact process between the equipment cooling wall 1, the carrier plate 2 and the wafer 3, poor surface contact between the three may occur due to processing flatness problems, which makes it difficult to achieve a better heat conduction effect by simply relying on heat conduction under vacuum conditions.

[0023] In view of this, the utility model provides a low-temperature vacuum coating carrier assembly, which is applied to coating equipment, such as Figure 1 As shown, the coating equipment includes a cooling wall 1 and a carrier plate 2. The surface of the carrier plate 2 away from the cooling wall 1 is attached with a wafer 3. Figure 2 , Figure 2 The structure of the carrier assembly for low-temperature vacuum coating is schematically shown, and the carrier assembly includes: a thermally conductive soft gasket 4;

[0024] The carrier plate 2 is provided with a heat-conducting through hole 21 , and the heat-conducting soft gasket 4 is attached between the equipment cooling wall and the carrier plate 2 , and the heat-conducting soft gasket 4 is arranged on the outer surface of the heat-conducting through hole 21 .

[0025] It can be understood that the thermally conductive soft gasket 4 may have a certain elasticity. When the thermally conductive soft gasket 4 is squeezed by the equipment cooling wall and the carrier 2, the thermally conductive soft gasket 4 will be squeezed toward the wafer 3 through the thermal conductive through hole 21, thereby increasing the contact area between the carrier 2 and the wafer 3 and reducing the thermal resistance between the carrier 2 and the wafer 3.

[0026] It should be noted that the utility model can effectively increase the contact area between the equipment cooling wall and the carrier plate by arranging a thermally conductive soft gasket between the equipment cooling wall and the carrier plate, thereby reducing the thermal resistance between the equipment cooling wall and the carrier plate, and through the structural coordination of the heat-conducting through holes on the carrier plate and the heat-conducting soft gasket, the contact area between the carrier plate and the wafer is increased, and the thermal resistance between the carrier plate and the wafer is reduced, thereby overcoming the problem of poor surface contact caused by the processing flatness problem of the wafer, the metal carrier plate and the equipment cooling wall, and improving the heat conduction effect of the wafer, the metal carrier plate and the equipment cooling wall under vacuum conditions.

[0027] In one practicable manner, the thermally conductive soft gasket 4 can be made of a material with high thermal conductivity and soft texture, such as a graphite sheet or an indium sheet, but is not limited to these two materials.

[0028] In one practicable manner, in order to facilitate replacement of the thermally conductive soft gasket 4 , the thermally conductive soft gasket 4 is detachably mounted on the carrier plate 2 .

[0029] In one example, if Figure 2 As shown, the carrier assembly also includes: a screw 22, and the carrier plate 2 is provided with a screw hole 23. The screw 22 passes through the through hole provided in the thermally conductive soft gasket 4 and is threadedly connected with the screw hole 23, so that the screw 22 fixes the thermally conductive soft gasket 4 on the carrier plate 2, which can avoid repeated installation and removal of the thermally conductive soft gasket 4, and greatly improve the service life of the thermally conductive soft gasket 4.

[0030] In one achievable approach, Figure 2 As shown, the carrier assembly further includes a tray placement rack 5 , which is provided with a tray placement opening 51 , and the tray placement opening 51 is adapted to the structure of the tray 2 .

[0031] In practical applications, the carrier plate 2 equipped with the thermally conductive soft gasket 4 can be placed on the carrier plate placement opening 51 on the carrier plate placement rack 5, and the carrier plate placement rack 5 can be turned over to fix the wafer patch on the opposite side of the carrier plate 2 away from the thermally conductive soft gasket 4, such as Figure 2As shown, a bracket 52 is provided at the bottom of the carrier tray placement rack 5. The bracket 52 has a certain height, which can prevent the thermally conductive soft gasket 4 from contacting with the workbench and causing contamination. At the same time, it can reduce the contamination of the machine and the workshop caused by the dust falling from the thermally conductive soft gasket 4 (such as a graphite sheet). After the wafer bonding is completed, the carrier tray 2 is taken out from the carrier tray placement rack 5, and after the carrier tray placement rack 5 is turned over again, it is placed in the coating equipment for coating.

[0032] The utility model also provides a coating device, comprising the above-mentioned low-temperature vacuum coating carrier assembly.

[0033] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A low-temperature vacuum coating carrier assembly, applied to a coating device, the coating device comprising a device cooling wall and a carrier, a surface of the carrier away from the device cooling wall being attached with a wafer, characterized in that: The carrier assembly includes: a thermally conductive soft gasket; The carrier plate is provided with a heat-conducting through hole, the heat-conducting soft gasket is attached between the equipment cooling wall and the carrier plate, and the heat-conducting soft gasket is arranged on the outer surface of the heat-conducting through hole.

2. The low-temperature vacuum coating carrier assembly according to claim 1, characterized in that: The thermally conductive soft gasket is a graphite sheet or an indium sheet.

3. The low-temperature vacuum coating carrier assembly according to claim 1, characterized in that: The thermally conductive soft gasket is detachably mounted on the carrier plate.

4. The low-temperature vacuum coating carrier assembly according to claim 1, characterized in that: Also includes: The carrier plate is provided with a screw hole, and the screw passes through a through hole provided in the thermally conductive soft gasket and is threadedly connected with the screw hole.

5. The low-temperature vacuum coating carrier assembly according to claim 1, characterized in that: It also includes a tray placing rack, which is provided with a tray placing opening, and the tray placing opening is adapted to the structure of the tray.

6. The low-temperature vacuum coating carrier assembly according to claim 5, characterized in that: A bracket is provided at the bottom of the tray placing frame.

7. A coating device, characterized in that: A carrier assembly for low-temperature vacuum coating comprising the low-temperature vacuum coating assembly as claimed in any one of claims 1 to 6.

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