High and low temperature test platform

Abstract

According to the high and low temperature test platform provided by the utility model, when a product is tested, the pressing plate module is driven by the rapid clamp to be attached to the carrier plate, and the product is fixedly attached to the carrier plate, and then, different high and low temperature environments are accurately simulated for the product placed in the carrier plate through the cooperation of the TEC module and the water-cooling row module, so that the test efficiency is improved. In addition, through the arrangement of the TEC module and the water-cooling row module, high-efficiency switching between high temperature and low temperature can be achieved, so that the efficiency of simulating different environment temperatures is improved, meanwhile, a heating system and a refrigerating system do not need to be independently installed on the supporting machine table, and the testing efficiency is improved. Therefore, the test platform is simple in structure, small in occupied space and low in temperature control difficulty. The utility model belongs to the technical field of test equipment.

Description

Technical Field

[0001] The utility model belongs to the technical field of testing equipment, and in particular relates to a high and low temperature testing platform. Background Art

[0002] When conventional test platforms perform performance tests on electronic components and optical components in electronic products, most of the tests are conducted at room temperature by simply reading relevant functional parameters of the electronic products to determine whether the performance of the electronic products meets the requirements. As a result, the test results of the conventional test platform are different from the actual performance of the product in different temperature environments, making the test results inaccurate. Utility Model Content

[0003] The purpose of the utility model is to provide a high and low temperature testing platform, so as to achieve a method of simulating different temperature environments for electronic products when testing electronic products, thereby improving the test accuracy.

[0004] The high and low temperature testing platform includes a supporting machine, which is equipped with a carrier plate, a TEC module, a water cooling radiator module and a quick clamp. The carrier plate is used to place the product. The TEC module is connected to the carrier plate by heat energy transfer. The TEC module is connected to the water cooling radiator module by pipeline. The quick clamp drives a pressure plate module that can adhere to the carrier plate and fix the product to the carrier plate.

[0005] According to the technical solution, the utility model can achieve the following beneficial effects:

[0006] 1. When testing the product, the quick clamp drives the pressure plate module to attach to the carrier and fix the product to the carrier. After that, the TEC module and the water cooling module are used to accurately simulate different high and low temperature environments for the product placed in the carrier, thereby improving the accuracy of testing the safety performance of electronic products.

[0007] 2. The setting of TEC module and water cooling module can realize efficient switching between high and low temperatures, thereby improving the efficiency of simulating different ambient temperatures;

[0008] 3. Through the setting of TEC module and water cooling row module, there is no need to install heating and cooling systems independently on the supporting machine, so that the test platform has a simple structure, small space occupation and low difficulty in temperature control.

[0009] In order to further optimize the above technical solution, it can be optionally combined with one or more of the following implementation methods without conflict.

[0010] In some embodiments, the support machine is installed with a sealing cover, the sealing cover is a vacuum environment, and the TEC module is installed in the vacuum environment; according to the technical solution, when the TEC module switches between high and low temperatures, condensation of dew on the TEC module can be effectively avoided.

[0011] In some embodiments, the carrier is provided with a groove for placing the product, the TEC module is provided with a heat conductor, and a mounting base supporting the TEC module is installed in the vacuum environment so that the heat conductor is fixed to the bottom of the groove; according to the technical solution, the TEC module can more efficiently simulate different temperature environments for the product placed in the carrier.

[0012] In some embodiments, a buffer sealing ring is protruded inside the periphery of the carrier plate and can contact the pressure plate module. According to the technical solution, when the pressure plate module and the carrier plate are in contact, the buffer sealing ring can buffer the impact force when the pressure plate module contacts the product to protect the product. At the same time, a sealed space can be formed in the groove on the carrier plate to reduce condensation when switching between high and low temperatures.

[0013] In some embodiments, the top wall of the sealing cover is the carrier plate; according to the technical solution, when different high and low temperature environments are simulated for the product placed in the carrier plate, the heat conduction or cooling efficiency can be further improved.

[0014] In some embodiments, the sealing cover is equipped with a pipe connector connected to the TEC module pipe, and the water-cooling radiator module pipe is connected with a joint that can be removed from the pipe connector; according to the technical solution, when the water-cooling radiator module is installed or moved, the pipe connecting the water-cooling radiator module and the TEC module can be prevented from moving and causing air leakage in the vacuum environment. At the same time, it can also facilitate the installation and replacement of the water-cooling radiator module.

[0015] In some embodiments, the quick clamp includes a support plate and a 7-shaped handle, the support plate is installed with a guide sleeve, the guide sleeve is slidably provided with a guide column, one end of the guide column is connected to the pressure plate module, the other end of the guide column is axially connected to a transmission rod, the other end of the transmission rod is connected to the corner axis of the 7-shaped handle, and one end of the 7-shaped handle is connected to the support plate axis;

[0016] According to the technical solution, when testing the product, by pulling one end of the 7-shaped handle, the corner end of the 7-shaped handle pulls the transmission rod, the transmission rod drives the guide column to rise and fall, and the guide column drives the pressure plate module to rise and fall, thereby conveniently driving the pressure plate module and the carrier to fit or separate.

[0017] In some embodiments, the carrier is provided with a positioning hole, and the pressure plate module is installed with a positioning column that can enter the positioning hole; according to the technical solution, when the pressure plate module descends and approaches the carrier, the positioning column enters the positioning hole, so that the pressure plate module can accurately and stably fit with the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation of the present invention, the following is a brief description of the drawings and reference numerals required to be used in the description of the specific implementation.

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is an exploded view of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the TEC module of the utility model;

[0022] Figure 4 It is a structural schematic diagram of the carrier plate and the pressure plate module of the utility model;

[0023] Figure 5 It is a structural schematic diagram of the quick clamp of the utility model.

[0024] Reference numerals:

[0025] 1. Support machine; 2. Sealing cover; 21. Vacuum environment; 22. Mounting seat; 23. Pipe connector; 3. TEC module; 31. Heat transfer element; 4. Carrier plate; 41. Groove; 42. Buffer seal ring; 43. Positioning hole; 5. Water cooling radiator module; 51. Joint; 6. Quick clamp; 61. Support plate; 62. 7-shaped handle; 63. Guide sleeve; 64. Guide column; 65. Transmission rod; 7. Press plate module; 71. Positioning column. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings.

[0027] like Figures 1 to 5 As shown, this specific embodiment provides a high and low temperature test platform, which includes a supporting machine 1, and the supporting machine 1 is equipped with a sealing cover 2, a TEC module 3, a carrier plate 4, a water cooling row module 5 and a quick clamp 6.

[0028] The sealing cover 2 contains a vacuum environment 21, the TEC module 3 is located in the vacuum environment 21, a mounting seat 22 for supporting the TEC module 3 is installed in the vacuum environment 21, and the TEC module 3 is provided with a heat transfer member 31. The outer wall of the sealing cover 2 is provided with a pipe connector 23 connected to the pipe of the TEC module 3, and the pipe of the water cooling radiator module 5 is connected with a joint 51 that can be removed from the pipe connector 23.

[0029] The top wall of the sealing cover 2 is the carrier plate 4, which is provided with a groove 41 for placing the product, and the heat transfer element 31 is fixed at the bottom of the groove 41, so that the TEC module 3 can transfer the temperature to the groove 41. A buffer sealing ring 42 is protruded inside the periphery of the carrier plate 4. The carrier plate 4 is provided with a positioning hole 43.

[0030] The quick clamp 6 includes a support plate 61 and a 7-shaped handle 62. The support plate 61 is fixed on the supporting machine 1. The support plate 61 is installed with a guide sleeve 63. The guide sleeve 63 is slid with a guide column 64. The upper end axis of the guide column 64 is connected to a transmission rod 65. The other end of the transmission rod 65 is connected to the corner axis of the 7-shaped handle 62. One end of the 7-shaped handle 62 is connected to the support plate 61 axis, and the other end of the 7-shaped handle 62 is a hand-holding part.

[0031] The lower end of the guide column 64 is connected to the pressure plate module 7 located on the carrier 4. The pressure plate module 7 is installed with a positioning column 71. The guide column 64 can drive the pressure plate module 7 to fit the carrier 4 and fix the product tightly in the groove 41 of the carrier 4. When the pressure plate module 7 and the carrier 4 are in fit, the buffer sealing ring 42 is located between the pressure plate module 7 and the carrier 4, and the positioning column 71 enters the positioning hole 43.

[0032] The following is the working process of the high and low temperature test platform:

[0033] When testing the product, the product is placed in the groove 41 of the carrier 4; thereafter, by flipping up one end of the 7-shaped handle 62, the corner end of the 7-shaped handle 62 is pushed down by the transmission rod 65, the transmission rod 65 drives the guide column 64 to descend, the guide column 64 drives the pressure plate module 7 to descend, so that the pressure plate module 7 is attached to the carrier 4 and fixes the product tightly in the groove 41 of the carrier 4; thereafter, the TEC module 3 and the water cooling radiator module 5 work together to accurately simulate different high and low temperature environments for the product placed in the carrier 4, and thereafter, the test platform begins to read the relevant functional parameters of the product in the simulated temperature environment to detect the various functions and performances of the product in different temperature environments. After completing the test of the product, by pressing down one end of the 7-shaped handle 62, the corner end of the 7-shaped handle 62 pulls the transmission rod 65 up, the transmission rod 65 drives the guide column 64 to rise, and the guide column 64 drives the pressure plate module 7 to rise, so that the pressure plate module 7 is separated from the carrier 4; thereafter, the product is taken out from the groove 41 of the carrier 4.

Claims

1. A high and low temperature testing platform, comprising a supporting platform (1), wherein the supporting platform (1) is equipped with a carrier plate (4) for placing a product, and characterized in that: The support machine (1) is also equipped with a TEC module (3), a water-cooling row module (5) and a quick clamp (6); the TEC module (3) is connected to the carrier plate (4) for heat energy transfer; the TEC module (3) is connected to the water-cooling row module (5) by a pipeline; and the quick clamp (6) drives a pressure plate module (7) that can be attached to the carrier plate (4) and fix the product to the carrier plate (4).

2. A high and low temperature testing platform according to claim 1, characterized in that: The support platform (1) is installed with a sealing cover (2), the sealing cover (2) contains a vacuum environment (21), and the TEC module (3) is installed in the vacuum environment (21).

3. A high and low temperature testing platform according to claim 2, characterized in that: The carrier plate (4) is provided with a groove (41) for placing a product, the TEC module (3) is provided with a heat conduction member (31), and a mounting seat (22) supporting the TEC module (3) is installed in the vacuum environment (21), so that the heat conduction member (31) is fixed to the bottom of the groove (41).

4. A high and low temperature testing platform according to claim 3, characterized in that: A buffer sealing ring (42) is protruded inside the periphery of the carrier plate (4) and can contact the pressure plate module (7).

5. A high and low temperature testing platform according to claim 3, characterized in that: The top wall of the sealing cover (2) is the carrier plate (4).

6. A high and low temperature testing platform according to claim 3, characterized in that: The sealing cover (2) is provided with a pipe connector (23) connected to the pipe of the TEC module (3), and the pipe of the water cooling row module (5) is connected with a joint (51) that can be removed from the pipe connector (23).

7. A high and low temperature testing platform according to any one of claims 1 to 6, characterized in that: The quick clamp (6) comprises a support plate (61) and a 7-shaped handle (62), the support plate (61) is provided with a guide sleeve (63), the guide sleeve (63) is slidably provided with a guide column (64), one end of the guide column (64) is connected to the pressure plate module (7), the other end of the guide column (64) is axially connected to a transmission rod (65), the other end of the transmission rod (65) is connected to the corner axis of the 7-shaped handle (62), and one end of the 7-shaped handle (62) is axially connected to the support plate (61).

8. A high and low temperature testing platform according to claim 6, characterized in that: The carrier plate (4) is provided with a positioning hole (43), and the pressure plate module (7) is provided with a positioning column (71) that can enter the positioning hole (43).

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