Accumulated water detection radar based on millimeter wave technology

Abstract

The utility model discloses an accumulated water detection radar based on a millimeter wave technology, and belongs to the technical field of radar detection. Comprising an antenna for transmitting and receiving millimeter wave signals; the radar sensor is connected with the antenna; the communication level conversion circuit is connected with the radar sensor; the main controller is connected with the communication level conversion circuit; the communication isolation circuit is connected with the main controller; the first communication circuit is connected with the communication isolation circuit; the second communication circuit is connected with the communication isolation circuit; and the power supply circuit is connected with the communication level conversion circuit, the main controller and the communication isolation circuit. The beneficial effects of the above technical scheme are that by adopting the above technical scheme, the radar can carry out detection and identification in a severe environment, the detection precision is high, the anti-interference capability is strong, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of radar detection, in particular to a water accumulation detection radar based on millimeter wave technology. Background Art

[0002] In recent years, with the development of cities, more and more cities have begun to strengthen intelligent buildings in facilities such as sewers, road waterlogging, subways, tunnels, and overpasses. Road waterlogging in cities will seriously affect traffic order and consume a lot of manpower and financial resources. If road waterlogging can be discovered in time and actively responded to, the losses can be minimized.

[0003] In the prior art, ultrasonic level meters are often used to detect water levels. Ultrasonic level meters are easily affected by climate, temperature, etc., and periodic errors may occur in foggy weather, during the day and at night, with errors as high as 10 cm. In addition, this method has high installation costs and is difficult to promote across the board. Electronic water gauges, laser water level meters, immersion water level meters and other sensors are also easily affected by climate, temperature, etc., resulting in low detection accuracy and large errors. Utility Model Content

[0004] The purpose of the utility model is to provide a water accumulation detection radar based on millimeter wave technology to solve the above technical problems;

[0005] A water accumulation detection radar based on millimeter wave technology, comprising:

[0006] Antennas, which transmit and receive millimeter wave signals;

[0007] A radar sensor connected to the antenna;

[0008] A communication level conversion circuit connected to the radar sensor;

[0009] A main controller connected to the communication level conversion circuit;

[0010] A communication isolation circuit connected to the main controller;

[0011] A first communication circuit, connected to the communication isolation circuit;

[0012] A second communication circuit connected to the communication isolation circuit;

[0013] A power supply circuit is connected to the communication level conversion circuit, the main controller and the communication isolation circuit.

[0014] Preferably, the radar sensor comprises:

[0015] A first capacitor, wherein a first end of the first capacitor is connected to a first voltage power supply, and a second end of the first capacitor is grounded;

[0016] a second capacitor, wherein a first end of the second capacitor is connected to the first voltage power supply, a second end of the second capacitor is grounded, the first end of the second capacitor is also connected to a first power supply pin of a millimeter-wave radar chip, and the first power supply pin of the millimeter-wave radar chip is also connected to a second power supply pin of the millimeter-wave radar chip;

[0017] a third capacitor, a first end of the third capacitor being connected to the first voltage power supply, and a second end of the third capacitor being grounded;

[0018] a fourth capacitor, wherein a first end of the fourth capacitor is connected to the first voltage power supply, a second end of the fourth capacitor is grounded, the first end of the fourth capacitor is also connected to a third power supply pin of the millimeter-wave radar chip, and the third power supply pin of the millimeter-wave radar chip is also connected to a fourth power supply pin of the millimeter-wave radar chip;

[0019] a fifth capacitor, wherein a first end of the fifth capacitor is connected to the first voltage power supply, and a second end of the fifth capacitor is grounded;

[0020] a sixth capacitor, wherein a first end of the sixth capacitor is connected to the first voltage power supply, a second end of the sixth capacitor is grounded, a first end of the sixth capacitor is also connected to a fifth power supply pin of the millimeter-wave radar chip, the fifth power supply pin of the millimeter-wave radar chip is connected to a sixth power supply pin of the millimeter-wave radar chip, and the sixth power supply pin of the millimeter-wave radar chip is connected to a bias voltage pin of the millimeter-wave radar chip;

[0021] The interrupt signal pin of the millimeter wave radar chip is grounded through a second resistor;

[0022] The universal input and output pins of the millimeter wave radar chip are grounded through a third resistor;

[0023] A crystal oscillator, wherein a first end of the crystal oscillator is connected to a first crystal oscillator pin of the millimeter-wave radar chip, a second end of the crystal oscillator is connected to a second crystal oscillator pin of the millimeter-wave radar chip, and a third pin and a fourth pin of the crystal oscillator are grounded;

[0024] a seventh capacitor, wherein a first end of the seventh capacitor is grounded, and a second end of the seventh capacitor is connected to the first end of the crystal oscillator;

[0025] An eighth capacitor, wherein a first end of the eighth capacitor is grounded, and a second end of the eighth capacitor is connected to the second end of the crystal oscillator.

[0026] Preferably, the communication level conversion circuit comprises:

[0027] A ninth capacitor, wherein a first end of the ninth capacitor is grounded, a second end of the ninth capacitor is connected to a second voltage power supply, and the second voltage power supply is further connected to a first power supply pin of a level conversion chip;

[0028] a tenth capacitor, wherein a first end of the tenth capacitor is connected to a first voltage power supply, a second end of the tenth capacitor is grounded, and the first voltage power supply is also connected to a second power supply pin of the level conversion chip;

[0029] The first clock signal pin of the level conversion chip is connected to the clock signal pin of the millimeter wave radar chip;

[0030] The first slave transmission pin of the level conversion chip is connected to the slave transmission pin of the millimeter wave radar chip through a first resistor;

[0031] The first host transmission pin of the level conversion chip is connected to the host transmission pin of the millimeter wave radar chip;

[0032] The first chip select signal pin of the level conversion chip is connected to the chip select signal pin of the millimeter wave radar chip;

[0033] The first enable pin of the level conversion chip is connected to the enable pin of the millimeter wave radar chip;

[0034] The first interrupt signal pin of the level conversion chip is connected to the interrupt signal pin of the millimeter wave radar chip;

[0035] The first control pin of the level conversion chip is connected to the general input and output pin of the millimeter wave radar chip;

[0036] The control output enable pin of the level conversion chip is connected to the first voltage power supply through a fourth resistor;

[0037] A ground pin of the level conversion chip is grounded.

[0038] Preferably, the main controller comprises:

[0039] a fifth resistor, wherein a first end of the fifth resistor is connected to a second voltage power supply, and a second end of the fifth resistor is connected to a reset pin of a main control chip;

[0040] An eleventh capacitor, a first end of the eleventh capacitor is connected to a reset pin of the main control chip, and a second end of the eleventh capacitor is grounded;

[0041] A first inductor, wherein a first end of the first inductor is connected to the second voltage power supply, and a second end of the first inductor is connected to an analog power pin of the main control chip;

[0042] A twelfth capacitor, a first end of the twelfth capacitor is connected to an analog power pin of the main control chip, and a second end of the twelfth capacitor is grounded;

[0043] The wake-up pin of the main control chip is grounded through a sixth resistor;

[0044] The first clock signal pin of the main control chip is connected to the second clock signal pin of the level conversion chip;

[0045] The slave transmission pin of the master control chip is connected to the second slave transmission pin of the level conversion chip;

[0046] The host transmission pin of the main control chip is connected to the second host transmission pin of the level conversion chip;

[0047] The chip select signal pin of the main control chip is connected to the second chip select signal pin of the level conversion chip;

[0048] The enable pin of the main control chip is connected to the second enable pin of the level conversion chip;

[0049] The interrupt signal pin of the main control chip is connected to the second interrupt signal pin of the level conversion chip;

[0050] The control pin of the main control chip is connected to the second control pin of the level conversion chip;

[0051] The battery voltage pin of the main control chip is connected to the second voltage power supply;

[0052] The first power pin, the second power pin, the third power pin and the fourth power pin of the main control chip are connected to the battery voltage pin of the main control chip;

[0053] The first ground pin, the second ground pin, the third ground pin, the fourth ground pin and the analog ground pin of the main control chip are grounded.

[0054] Preferably, the main controller further includes:

[0055] A first connector, wherein a first terminal of the first connector is grounded, a second terminal of the first connector is connected to a second clock signal pin of the main control chip, a third terminal of the first connector is connected to a communication pin of the main control chip, and a fourth terminal of the first connector is connected to the second voltage power supply;

[0056] a thirteenth capacitor, a first end of the thirteenth capacitor being connected to the second voltage power supply, and a second end of the thirteenth capacitor being grounded;

[0057] A crystal oscillator, wherein a power supply voltage pin of the crystal oscillator is connected to the second voltage power supply, an output pin of the crystal oscillator is connected to an external crystal oscillator input pin of the main control chip, and a ground pin of the crystal oscillator is grounded;

[0058] a fourteenth capacitor, a first end of the fourteenth capacitor being connected to the second voltage power supply, and a second end of the fourteenth capacitor being grounded;

[0059] a seventh resistor, wherein a first end of the seventh resistor is connected to the startup mode selection pin of the main control chip, and a second end of the seventh resistor is grounded;

[0060] a fifteenth capacitor, a first end of the fifteenth capacitor being connected to the second voltage power supply, and a second end of the fifteenth capacitor being grounded;

[0061] A sixteenth capacitor, connected in parallel with the fifteenth capacitor;

[0062] a seventeenth capacitor, connected in parallel with the sixteenth capacitor;

[0063] An eighteenth capacitor is connected in parallel with the seventeenth capacitor.

[0064] Preferably, the communication isolation circuit comprises:

[0065] A nineteenth capacitor, a first end of the nineteenth capacitor is grounded, and a second end of the nineteenth capacitor is connected to a positive power supply pin of an isolation chip;

[0066] The ground pin of the isolation chip is grounded;

[0067] The positive power supply pin of the isolation chip is also connected to a second voltage power supply;

[0068] a twentieth capacitor, wherein a first end of the twentieth capacitor is connected to an external power pin of the isolation chip, and a second end of the twentieth capacitor is connected to a digital ground;

[0069] The digital ground pin of the isolation chip is connected to the digital ground;

[0070] The external power pin of the isolation chip is also connected to a third voltage power supply;

[0071] an eighth resistor, a first end of the eighth resistor being connected to a selection pin of the isolation chip, and a second end of the eighth resistor being connected to a digital ground;

[0072] The first external signal receiving pin of the isolation chip is connected to the data sending pin of the main control chip;

[0073] The output data pin of the isolation chip is connected to the serial receiving pin of the main control chip;

[0074] The second external signal receiving pin of the isolation chip is connected to the communication control pin of the main control chip.

[0075] Preferably, the first communication circuit comprises:

[0076] A data transceiver chip, wherein an output pin of the data transceiver chip is connected to a signal receiving pin of an isolation chip, an input control pin and an output control pin of the data transceiver chip are connected to a second output signal pin of the isolation chip, a signal input pin of the data transceiver chip is connected to a first output signal pin of the isolation chip, a power pin of the data transceiver chip is connected to a digital ground via a twenty-first capacitor, a power pin of the data transceiver chip is also connected to a third voltage power supply, and a ground pin of the data transceiver chip is connected to a digital ground;

[0077] a tenth resistor, wherein a first end of the tenth resistor is connected to a first bus pin of the data transceiver chip, and a second end of the tenth resistor is connected to a second bus pin of the data transceiver chip;

[0078] a ninth resistor, wherein a first end of the ninth resistor is connected to a digital ground, and a second end of the ninth resistor is connected to a first bus pin of the data transceiver chip;

[0079] an eleventh resistor, a first end of the eleventh resistor being connected to the second bus pin of the data transceiver chip, and a second end of the eleventh resistor being connected to the third voltage power supply;

[0080] A protection chip, wherein a first input terminal of the protection chip is connected to a first bus pin of the data transceiver chip, a second input terminal of the protection chip is connected to a second bus pin of the data transceiver chip, a ground terminal of the protection chip is connected to a digital ground, a power terminal of the protection chip is connected to the digital ground via a twenty-second capacitor, and a power terminal of the protection chip is also connected to the third voltage power supply;

[0081] A second connector, wherein a first connection terminal of the second connector is connected to a first bus pin of the data transceiver chip, and a second connection terminal of the second connector is connected to a second bus pin of the data transceiver chip.

[0082] Preferably, the power supply circuit comprises:

[0083] A buck-boost power supply chip, wherein a first power switch pin of the buck-boost power supply chip is connected to a first end of a second inductor, a second power switch pin of the buck-boost power supply chip is connected to a second end of the second inductor, a first cross-over capacitor pin of the buck-boost power supply chip is connected to the first end of the second inductor via a twenty-seventh capacitor, a second cross-over capacitor pin of the buck-boost power supply chip is connected to the second end of the second inductor via a twenty-eighth capacitor, a first power input pin, a second power input pin and a state control pin of the buck-boost power supply chip are connected to a second terminal of a third connector, and a mode control pin, a power ground pin and a ground pin of the buck-boost power supply chip are grounded;

[0084] A twenty-third capacitor, wherein a first end of the twenty-third capacitor is connected to the second terminal of the third connector, a second end of the twenty-third capacitor is connected to the first terminal of the third connector, and the first terminal of the third connector is grounded;

[0085] a twenty-fourth capacitor, a first end of the twenty-fourth capacitor being connected to the first end of the twenty-third capacitor, and a second end of the twenty-fourth capacitor being grounded;

[0086] a twenty-fifth capacitor, a first end of the twenty-fifth capacitor being connected to the first end of the twenty-fourth capacitor, and a second end of the twenty-fifth capacitor being grounded;

[0087] A twelfth resistor, a first end of the twelfth resistor is connected to the output current programming pin of the buck-boost power supply chip, and a second end of the twelfth resistor is grounded;

[0088] a twenty-sixth capacitor, wherein a first end of the twenty-sixth capacitor is connected to the first end of the twelfth resistor, and a second end of the twenty-sixth capacitor is connected to the second end of the twelfth resistor;

[0089] A twenty-ninth capacitor, a first end of which is connected to the voltage stabilization output pin of the buck-boost power supply chip and the third power supply input pin, and a second end of which is grounded;

[0090] A thirtieth capacitor, a first end of the thirtieth capacitor is connected to the error amplifier output pin of the buck-boost power supply chip, and a second end of the thirtieth capacitor is grounded via a thirteenth resistor.

[0091] Preferably, the power supply circuit further includes:

[0092] a fourteenth resistor, wherein a first end of the fourteenth resistor is connected to a converter output pin of the buck-boost power supply chip, and a second end of the fourteenth resistor is connected to a feedback voltage input pin of the buck-boost power supply chip;

[0093] A fifteenth resistor, a first end of the fifteenth resistor is connected to the feedback voltage input pin of the buck-boost power supply chip, and a second end of the fifteenth resistor is grounded;

[0094] a thirty-first capacitor, a first end of the thirty-first capacitor being connected to the first end of the fourteenth resistor, and the thirty-first capacitor being grounded;

[0095] A thirty-second capacitor, a first end of the thirty-second capacitor is connected to the first end of the thirty-first capacitor, and a second end of the thirty-second capacitor is grounded;

[0096] a thirty-third capacitor, wherein a first end of the thirty-third capacitor is connected to the first end of the thirty-second capacitor, a second end of the thirty-third capacitor is grounded, and the first end of the thirty-third capacitor is further connected to a second voltage power supply;

[0097] a voltage regulator chip, wherein an input voltage pin of the voltage regulator chip is connected to the first end of the thirty-third capacitor, an enable pin of the voltage regulator chip is grounded through a sixteenth resistor, an output voltage pin of the voltage regulator chip is connected to a first voltage power supply, a ground pin of the voltage regulator chip is grounded, and the enable pin of the voltage regulator chip is also connected to an enable pin of a main control chip;

[0098] A thirty-fourth capacitor, a first end of the thirty-fourth capacitor is connected to the output voltage pin of the regulator chip, and a second end of the thirty-fourth capacitor is grounded.

[0099] Preferably, it also includes:

[0100] A seventeenth resistor, a first end of the seventeenth resistor is connected to a data sending pin of the main control chip;

[0101] An eighteenth resistor, a first end of the eighteenth resistor is connected to a serial receiving pin of the main control chip;

[0102] a nineteenth resistor, a first end of the nineteenth resistor being grounded, and a second end of the nineteenth resistor being connected to a digital ground;

[0103] A fourth connector, wherein the first terminal of the fourth connector is connected to the second end of the eighteenth resistor, the second terminal of the fourth connector is connected to the second end of the seventeenth resistor, the third terminal of the fourth connector is connected to the digital ground, and the fourth terminal of the fourth connector is connected to the wake-up pin of the main control chip.

[0104] The beneficial effects of the utility model are as follows: due to the adoption of the above technical solution, the radar can perform detection and identification in a harsh environment, and has high detection accuracy, strong anti-interference ability and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0105] Figure 1This is a framework diagram of the water accumulation detection radar based on millimeter wave technology of the utility model;

[0106] Figure 2 It is a circuit connection diagram of the radar sensor of the utility model;

[0107] Figure 3 It is a circuit connection diagram of the communication level conversion circuit of the utility model;

[0108] Figure 4 It is a circuit connection diagram of the main controller of the utility model;

[0109] Figure 5 It is a circuit connection diagram of the first connector of the utility model;

[0110] Figure 6 It is a circuit connection diagram of the crystal oscillator of the utility model;

[0111] Figure 7 It is a circuit connection diagram of the seventh resistor of the utility model;

[0112] Figure 8 It is a circuit connection diagram of the main controller of the utility model;

[0113] Fig. 9 It is a circuit connection diagram of the communication isolation circuit of the utility model;

[0114] Fig.10 This is the circuit connection diagram of the first communication circuit of the utility model

[0115] Fig.11 It is a circuit connection diagram of the second connector of the utility model;

[0116] Fig.12 It is a circuit connection diagram of the power supply circuit of the utility model;

[0117] Fig.13 It is a circuit connection diagram of the seventeenth resistor of the utility model;

[0118] Fig.14 It is a circuit connection diagram of the eighteenth resistor of the utility model;

[0119] Fig.15 It is a circuit connection diagram of the nineteenth resistor of the utility model;

[0120] Fig.16 It is a circuit connection diagram of the fourth connector of the utility model.

[0121] In the accompanying drawings: 1. antenna; 2. radar sensor; 3. main controller; 4. communication circuit; 401. first communication circuit; 402. second communication circuit; 5. power supply circuit; 6. communication isolation circuit; 7. communication level conversion circuit. DETAILED DESCRIPTION

[0122] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0123] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0124] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0125] A water detection radar based on millimeter wave technology, such as Figure 1 As shown, including,

[0126] Antenna 1, transmitting and receiving millimeter wave signals;

[0127] Radar sensor 2, connected to antenna 1;

[0128] A communication level conversion circuit 7 connected to the radar sensor 2;

[0129] A main controller 3 connected to a communication level conversion circuit 7;

[0130] A communication isolation circuit 6 connected to the main controller 3;

[0131] The first communication circuit 401 is connected to the communication isolation circuit 6;

[0132] The second communication circuit 402 is connected to the communication isolation circuit 6;

[0133] The power supply circuit 5 is connected to the communication level conversion circuit 7 , the main controller 3 and the communication isolation circuit 6 .

[0134] Specifically, the utility model provides a water accumulation detection radar based on millimeter wave technology, which is mainly used for radar water accumulation detection, can perform detection and identification in harsh environments, and has high detection accuracy, strong anti-interference ability and low cost.

[0135] More specifically, the main controller 3 is used to reduce overall power consumption, improve the computing power and stability of digital signals, the radar sensor 2 can solve the problem that other sensors cannot accurately identify in harsh environments, and improve anti-interference ability. The communication circuit 4 includes a first communication circuit 401 and a second communication circuit 402. The communication protocol of the first communication circuit 401 is the RS485 serial communication protocol, and the second communication circuit 402 communicates through a logic level conversion serial port, which improves the data transmission distance. A power supply circuit 5 with a wide voltage input is used to meet the power supply voltage requirements commonly used in various fields.

[0136] More specifically, the second communication circuit 402 transmits signals through the TTL serial port, and then the millimeter wave radar detection probe automatically enters the standby mode, and the wake-up and data transmission time are extremely short, which can reach the millisecond level. TTL level logic uses a low level (0V) to represent logic 0, and a high level (usually 5V) to represent logic 1. This low voltage logic makes the TTL circuit more efficient in terms of power consumption; TTL serial port communication usually uses UART (Universal Asynchronous Receiver / Transmitter, Universal Asynchronous Receiver / Transmitter Transmission Protocol), which is relatively simple and easy to implement. It allows devices to communicate bidirectionally in an asynchronous manner and is suitable for many embedded systems. TTL serial ports are usually used for short-distance communication, can provide low transmission delay, and are widely used in embedded systems and various electronic devices. They are easy to integrate into various systems and have relatively low manufacturing costs.

[0137] In a preferred embodiment, Figure 2 As shown, the radar sensor 2 includes:

[0138] A first capacitor C1, a first end of the first capacitor C1 is connected to a first voltage power source V1, and a second end of the first capacitor C1 is grounded;

[0139] A second capacitor C2, wherein a first end of the second capacitor C2 is connected to the first voltage power supply V1, a second end of the second capacitor C2 is grounded, and the first end of the second capacitor C2 is also connected to a first power supply pin U1_VIO_1A of a millimeter-wave radar chip U1, and the first power supply pin U1_VIO_1A of the millimeter-wave radar chip U1 is also connected to a second power supply pin U1_VIO_1B of the millimeter-wave radar chip U1;

[0140] A third capacitor C3, a first end of the third capacitor C3 is connected to the first voltage power source V1, and a second end of the third capacitor C3 is grounded;

[0141] A fourth capacitor C4, a first end of the fourth capacitor C4 is connected to the first voltage power supply V1, a second end of the fourth capacitor C4 is grounded, the first end of the fourth capacitor C4 is also connected to the third power supply pin U1_VIO_2A of the millimeter-wave radar chip U1, and the third power supply pin U1_VIO_2A of the millimeter-wave radar chip U1 is also connected to the fourth power supply pin U1_VIO_2B of the millimeter-wave radar chip U1;

[0142] A fifth capacitor C5, a first end of the fifth capacitor C5 is connected to the first voltage power source V1, and a second end of the fifth capacitor C5 is grounded;

[0143] The sixth capacitor C6, the first end of the sixth capacitor C6 is connected to the first voltage power supply V1, the second end of the sixth capacitor C6 is grounded, the first end of the sixth capacitor C6 is also connected to the fifth power supply pin U1_VIO_3A of the millimeter wave radar chip U1, the fifth power supply pin U1_VIO_3A of the millimeter wave radar chip U1 is connected to the sixth power supply pin U1_VIO_3B of the millimeter wave radar chip U1, and the sixth power supply pin U1_VIO_3B of the millimeter wave radar chip U1 is connected to the bias voltage pin U1_VBIAS of the millimeter wave radar chip U1;

[0144] An interrupt signal pin U1_INTERRUPT of the millimeter wave radar chip U1 is grounded through a second resistor R2;

[0145] The general input and output pin U1_GPIO_0 of the millimeter wave radar chip U1 is grounded through a third resistor R3;

[0146] A crystal oscillator X1, wherein a first end of the crystal oscillator X1 is connected to a first crystal oscillator pin U1_XIN of the millimeter-wave radar chip U1, a second end of the crystal oscillator X1 is connected to a second crystal oscillator pin U1_XOUT of the millimeter-wave radar chip U1, and a third pin and a fourth pin of the crystal oscillator X1 are grounded;

[0147] A seventh capacitor C7, a first end of the seventh capacitor C7 is grounded, and a second end of the seventh capacitor C7 is connected to a first end of the crystal oscillator X1;

[0148] An eighth capacitor C8 , wherein a first end of the eighth capacitor C8 is grounded, and a second end of the eighth capacitor C8 is connected to a second end of the crystal oscillator X1 .

[0149] Specifically, the millimeter-wave radar chip U1 is A111-001-TY. One side of the millimeter-wave radar chip U1 is completely grounded. The SoC (system-level) A111 millimeter-wave radar is used as a detection sensor to solve the problem that other sensors cannot accurately identify in harsh environments and improve anti-interference capabilities.

[0150] Specifically, the A111 millimeter-wave radar chip can penetrate some common materials, such as plastic and cloth, and can detect and measure target objects. It can also effectively detect target objects even if they are obscured. It has a higher resolution and can provide clearer and more accurate imaging results, and can accurately capture the details and shapes of target objects.

[0151] To be more specific, the A111 millimeter-wave radar chip has strong adaptability and can work in different environmental conditions, such as indoors, outdoors, and in bad weather, with high stability and reliability. The chip adopts a low-power design, which can reduce energy consumption while ensuring performance and extend the service life of the equipment.

[0152] In a preferred embodiment, Figure 3 As shown, the communication level conversion circuit 7 includes,

[0153] A ninth capacitor C9, a first end of the ninth capacitor C9 is grounded, a second end of the ninth capacitor C9 is connected to a second voltage power source V2, and the second voltage power source V2 is further connected to a first power supply pin U6_VCCB of a level conversion chip U6;

[0154] A tenth capacitor C10, a first end of the tenth capacitor C10 is connected to the first voltage power source V1, a second end of the tenth capacitor C10 is grounded, and the first voltage power source V1 is also connected to the second power supply pin U6_VCCA of the level conversion chip U6;

[0155] The first clock signal pin U6_SPI_CLK of the level conversion chip U6 is connected to the clock signal pin U1_SPI_CLK of the millimeter wave radar chip U1;

[0156] The first slave transmission pin U6_SPI_MISO of the level conversion chip U6 is connected to the slave transmission pin U1_SPI_MISO of the millimeter wave radar chip U1 through a first resistor R1;

[0157] The first host transmission pin U6_SPI_MOSI of the level conversion chip U6 is connected to the host transmission pin U1_SPI_MOSI of the millimeter wave radar chip U1;

[0158] The first chip select signal pin U6_SPI_SS of the level conversion chip U6 is connected to the chip select signal pin U1_SPI_SS of the millimeter wave radar chip U1;

[0159] The first enable pin U6_ENABLE of the level conversion chip U6 is connected to the enable pin U1_ENABLE of the millimeter wave radar chip U1;

[0160] The first interrupt signal pin U6_INTERRUPT of the level conversion chip U6 is connected to the interrupt signal pin U1_INTERRUPT of the millimeter wave radar chip U1;

[0161] The first control pin U6_CTRL of the level conversion chip U6 is connected to the general input and output pin U1_GPIO_0 of the millimeter wave radar chip U1;

[0162] The control output enable pin U6_OE of the level conversion chip U6 is connected to the first voltage power source V1 through a fourth resistor R4;

[0163] A ground pin U6_GND of the level conversion chip U6 is grounded.

[0164] Specifically, the level conversion chip U6 is TXS0108EPW, the communication level conversion circuit 7 is SPI level conversion, the radar sensor 2 communicates with the main controller 3 via SPI, and the communication signal is level converted through the bidirectional level converter chip to solve the problem of mismatch in communication signal levels.

[0165] Specifically, the SPI communication protocol supports high-speed data transmission, can achieve fast data exchange and transmission, and improve the response speed and efficiency of the system; SPI communication only requires 4 lines, namely the clock line, data line, master-slave selection line and chip select line. Compared with other communication methods, it requires fewer pins, which simplifies hardware connection and layout.

[0166] To be more specific, SPI communication supports multiple communication modes, such as master-slave mode, multi-master mode, etc. The most suitable communication mode can be selected according to specific needs to improve the flexibility and scalability of the system; it has a low bit error rate and high anti-interference ability, which can ensure reliable data transmission and reduce the possibility of data transmission errors and losses.

[0167] To be more specific, the SPI communication protocol does not require complex protocol processing and address resolution during the transmission process. Compared with other communication methods, it has lower power consumption and is suitable for power-sensitive application scenarios.

[0168] In a preferred embodiment, Figure 4 As shown, the main controller 3 includes,

[0169] A fifth resistor R5, wherein a first end of the fifth resistor R5 is connected to a second voltage power source V2, and a second end of the fifth resistor R5 is connected to a reset pin U2_NRST of a main control chip U2;

[0170] An eleventh capacitor C11, a first end of the eleventh capacitor C11 is connected to a reset pin U2_NRST of the main control chip U2, and a second end of the eleventh capacitor C11 is grounded;

[0171] A first inductor L1, wherein a first end of the first inductor L1 is connected to a second voltage power source V2, and a second end of the first inductor L1 is connected to an analog power pin U2_VDDA of a main control chip U2;

[0172] A twelfth capacitor C12, a first end of the twelfth capacitor C12 is connected to an analog power pin U2_VDDA of the main control chip U2, and a second end of the twelfth capacitor C12 is grounded;

[0173] The wake-up pin U2_PA0_WKUP of the main control chip U2 is grounded through a sixth resistor R6;

[0174] The first clock signal pin U2_PB13_SPI_CLK of the main control chip U2 is connected to the second clock signal pin U6_PB13_SPI_CLK of the level conversion chip U6;

[0175] The slave transmission pin U2_PB14_SPI_MISO of the master chip U2 is connected to the second slave transmission pin U6_PB14_SPI_MISO of the level conversion chip U6;

[0176] The host transmission pin U2_PB15_SPI_MOSI of the main control chip U2 is connected to the second host transmission pin U6_PB15_SPI_MOSI of the level conversion chip U6;

[0177] The chip select signal pin U2_PC6_SPI_SS of the main control chip U2 is connected to the second chip select signal pin U6_PC6_SPI_SS of the level conversion chip U6;

[0178] The enable pin U2_PC7_ENABLE of the main control chip U2 is connected to the second enable pin U6_PC7_ENABLE of the level conversion chip U6;

[0179] The interrupt signal pin U2_PB12_INTERRUPT of the main control chip U2 is connected to the second interrupt signal pin U6_PB12_INTERRUPT of the level conversion chip U6;

[0180] The control pin U2_CTRL_B of the main control chip U2 is connected to the second control pin U6_CTRL_B of the level conversion chip U6;

[0181] The battery voltage pin U2_VBAT of the main control chip U2 is connected to the second voltage power supply V2;

[0182] The first power pin U2_VDD_1, the second power pin U2_VDD_2, the third power pin U2_VDD_3 and the fourth power pin U2_VDD_4 of the main control chip U2 are connected to the battery voltage pin U2_VBAT of the main control chip U2;

[0183] A first ground pin U2_VSS_1, a second ground pin U2_VSS_2, a third ground pin U2_VSS_3, a fourth ground pin U2_VSS_4 and an analog ground pin U2_VSSA of the main control chip U2 are grounded.

[0184] Specifically, the model of the main control chip U2 is STM32L496RG, the main controller 3 is an STM32 processor, and the 32-bit MCU main controller 3STM32 L series chip is adopted. It has strong data processing capability and can ensure stable operation of the system. The TXS0108 chip can convert the signal level of the STM32 processor into a level suitable for external devices, thereby realizing connection and communication with external devices.

[0185] Specifically, the TXS0108 chip can provide level isolation and overvoltage protection functions to protect the STM32 processor from electrical threats that may be posed by external devices. Through the TXS0108 chip, the STM32 processor can communicate with external devices of different levels, improving the flexibility and compatibility of the system.

[0186] More specifically, using the TXS0108 chip can simplify system design, reduce the number and complexity of external components, and improve system reliability and stability.

[0187] In a preferred embodiment, Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the main controller 3 also includes,

[0188] A first connector J1, wherein a first terminal of the first connector J1 is grounded, a second terminal of the first connector J1 is connected to a second clock signal pin U2_SWCLK of the main control chip U2, a third terminal of the first connector J1 is connected to a communication pin U2_SWDIO of the main control chip U2, and a fourth terminal of the first connector J1 is connected to a second voltage power supply V2;

[0189] A thirteenth capacitor C13, a first end of the thirteenth capacitor C13 is connected to the second voltage power supply V2, and a second end of the thirteenth capacitor C13 is grounded;

[0190] Crystal oscillator X1, a power supply voltage pin X1_VCC of the crystal oscillator X1 is connected to a second voltage power supply V2, an output pin X1_OUT of the crystal oscillator X1 is connected to an external crystal oscillator input pin U2_OSC_IN of the main control chip U2, and a ground pin X1_GND of the crystal oscillator X1 is grounded;

[0191] A fourteenth capacitor C14, a first end of the fourteenth capacitor C14 is connected to the second voltage power source V2, and a second end of the fourteenth capacitor C14 is grounded;

[0192] A seventh resistor R7, a first end of the seventh resistor R7 is connected to the boot mode selection pin U2_BOOT0 of the main control chip U2, and a second end of the seventh resistor R7 is grounded;

[0193] A fifteenth capacitor C15, a first end of the fifteenth capacitor C15 is connected to the second voltage power source V2, and a second end of the fifteenth capacitor C15 is grounded;

[0194] A sixteenth capacitor C16 is connected in parallel with the fifteenth capacitor C15;

[0195] A seventeenth capacitor C17 is connected in parallel with the sixteenth capacitor C16;

[0196] The eighteenth capacitor C18 is connected in parallel with the seventeenth capacitor C17.

[0197] In a preferred embodiment, Fig. 9 As shown, the communication isolation circuit 6 includes:

[0198] A nineteenth capacitor C19, a first end of the nineteenth capacitor C19 is grounded, and a second end of the nineteenth capacitor C19 is connected to a positive power supply pin U3_Vcc of an isolation chip U3;

[0199] The ground pin U3_GND1 of the isolation chip U3 is grounded;

[0200] The positive power supply pin U3_Vcc of the isolation chip U3 is also connected to the second voltage power supply V2;

[0201] A twentieth capacitor C20, a first end of the twentieth capacitor C20 is connected to an external power pin U3_Viso of the isolation chip U3, and a second end of the twentieth capacitor C20 is connected to a digital ground;

[0202] The digital ground pin U3_GND2 of the isolation chip U3 is connected to the digital ground;

[0203] The external power pin U3_Viso of the isolation chip U3 is also connected to a third voltage power source V3;

[0204] an eighth resistor R8, wherein a first end of the eighth resistor R8 is connected to a selection pin U3_SEL of the isolation chip U3, and a second end of the eighth resistor R8 is connected to a digital ground;

[0205] The first external signal receiving pin U3_INA of the isolation chip U3 is connected to the data sending pin U2_USART_TX of the main control chip U2;

[0206] The output data pin U3_OUTD of the isolation chip U3 is connected to the serial receiving pin U2_USART_RX of the main control chip U2;

[0207] The second external signal receiving pin U3_INB of the isolation chip U3 is connected to the communication control pin U2_RS485_CTRL of the main control chip U2.

[0208] Specifically, the isolation chip U3 is ISOW7841DWE, and the distance data of the millimeter-wave radar detection probe is transmitted to the customer through the RS485 protocol or serial port TTL. The two communication interfaces are isolated by the ISOW7841 isolation chip for data communication, realizing electrical isolation between input and output, and preventing interference signals such as current and voltage from being transmitted through the communication lines, thereby improving the stability and reliability of the system.

[0209] In a preferred embodiment, Fig.10 , Fig.11 As shown, the first communication circuit 401 includes:

[0210] A data transceiver chip IC1, an output pin IC1_RO of the data transceiver chip IC1 is connected to a signal receiving pin U3_IND of the isolation chip U3, an input control pin IC1_RE and an output control pin IC1_DE of the data transceiver chip IC1 are connected to a second output signal pin U3_OUTB of the isolation chip U3, a signal input pin IC1_DI of the data transceiver chip IC1 is connected to a first output signal pin U3_OUTA of the isolation chip U3, a power pin IC1_VCC of the data transceiver chip IC1 is connected to a digital ground via a twenty-first capacitor C21, a power pin IC1_VCC of the data transceiver chip IC1 is also connected to a third voltage power supply V3, and a ground pin IC1_GND of the data transceiver chip IC1 is connected to a digital ground;

[0211] A tenth resistor R10, a first end of the tenth resistor R10 is connected to a first bus pin IC1_B of the data transceiver chip IC1, and a second end of the tenth resistor R10 is connected to a second bus pin IC1_A of the data transceiver chip IC1;

[0212] A ninth resistor R9, a first end of the ninth resistor R9 is connected to the digital ground, and a second end of the ninth resistor R9 is connected to the first bus pin IC1_B of the data transceiver chip IC1;

[0213] An eleventh resistor R11, a first end of the eleventh resistor R11 is connected to the second bus pin IC1_A of the data transceiver chip IC1, and a second end of the eleventh resistor R11 is connected to the third voltage power source V3;

[0214] Protection chip U4, a first input terminal U4_D1 of the protection chip U4 is connected to the first bus pin IC1_B of the data transceiver chip IC1, a second input terminal U4_D2 of the protection chip U4 is connected to the second bus pin IC1_A of the data transceiver chip IC1, a ground terminal U4_GND of the protection chip U4 is connected to the digital ground, a power terminal U4_VCC of the protection chip U4 is connected to the digital ground via a twenty-second capacitor C22, and the power terminal U4_VCC of the protection chip U4 is also connected to the third voltage power supply V3;

[0215] The second connector J2 has a first connection terminal connected to a first bus pin IC1_B of the data transceiver chip IC1 , and a second connection terminal connected to a second bus pin IC1_A of the data transceiver chip IC1 .

[0216] Specifically, the data transceiver chip IC1 is SP3485EN-L, and the protection chip U4 is SRV05-4TCT. The RS485 communication circuit is used to increase the data transmission distance to meet the communication distance requirements of several hundred meters, and even reach a distance of thousands of meters.

[0217] To be more specific, RS485 supports a data transmission rate of up to 10Mbps, which can meet the needs of high-speed data transmission. It can perform reliable data transmission at a distance of up to 1200m, is suitable for application scenarios that require long-distance communication, supports multiple nodes to communicate at the same time, and can realize data exchange and sharing between multiple devices.

[0218] To be more specific, RS485 uses differential signal transmission, has strong anti-interference ability, can operate stably in industrial environments, is easy to implement and maintain, and has high reliability and stability.

[0219] In a preferred embodiment, Fig.12 As shown, the power supply circuit 5 includes:

[0220] Buck-boost power supply chip U5, a first power switch pin U5_SW1 of the buck-boost power supply chip U5 is connected to a first end of a second inductor L2, a second power switch pin U5_SW2 of the buck-boost power supply chip U5 is connected to a second end of the second inductor L2, a first jump capacitor pin U5_BST1 of the buck-boost power supply chip U5 is connected to a first end of the second inductor L2 via a twenty-seventh capacitor C27, a second jump capacitor pin U5_BST2 of the buck-boost power supply chip U5 is connected to a second end of the second inductor L2 via a twenty-eighth capacitor C28, a first power input pin U5_Vin, a second power input pin U5_PVin and a state control pin U5_RUN of the buck-boost power supply chip U5 are connected to a second connection terminal of a third connector J3, and a mode control pin U5_MODE, a power ground pin U5_PGND and a ground pin U5_GND of the buck-boost power supply chip U5 are grounded;

[0221] A twenty-third capacitor C23, a first end of the twenty-third capacitor C23 is connected to the second terminal of the third connector J3, a second end of the twenty-third capacitor C23 is connected to the first terminal of the third connector J3, and the first terminal of the third connector J3 is grounded;

[0222] A twenty-fourth capacitor C24, a first end of the twenty-fourth capacitor C24 is connected to the first end of the twenty-third capacitor C23, and a second end of the twenty-fourth capacitor C24 is grounded;

[0223] A twenty-fifth capacitor C25, a first end of the twenty-fifth capacitor C25 is connected to the first end of the twenty-fourth capacitor C24, and a second end of the twenty-fifth capacitor C25 is grounded;

[0224] A twelfth resistor R12, a first end of the twelfth resistor R12 is connected to an output current programming pin U5_PROG of the buck-boost power supply chip U5, and a second end of the twelfth resistor R12 is grounded;

[0225] A twenty-sixth capacitor C26, a first end of the twenty-sixth capacitor C26 is connected to the first end of the twelfth resistor R12, and a second end of the twenty-sixth capacitor C26 is connected to the second end of the twelfth resistor R12;

[0226] A twenty-ninth capacitor C29, a first end of the twenty-ninth capacitor C29 is connected to the voltage stabilization output pin U5_PLDO of the buck-boost power supply chip U5 and the third power supply input pin U5_LDO, and a second end of the twenty-ninth capacitor C29 is grounded;

[0227] A thirtieth capacitor C30, a first end of the thirtieth capacitor C30 is connected to the error amplifier output pin U5_VC of the buck-boost power supply chip U5, and a second end of the thirtieth capacitor C30 is grounded via a thirteenth resistor R13;

[0228] The power supply circuit 5 further includes,

[0229] A fourteenth resistor R14, a first end of the fourteenth resistor R14 is connected to a converter output pin U5_PVout of the buck-boost power supply chip U5, and a second end of the fourteenth resistor R14 is connected to a feedback voltage input pin U5_FB of the buck-boost power supply chip U5;

[0230] A fifteenth resistor R15, a first end of the fifteenth resistor R15 is connected to a feedback voltage input pin U5_FB of the buck-boost power supply chip U5, and a second end of the fifteenth resistor R15 is grounded;

[0231] A thirty-first capacitor C31, a first end of the thirty-first capacitor C31 is connected to the first end of the fourteenth resistor R14, and the thirty-first capacitor C31 is grounded;

[0232] A thirty-second capacitor C32, a first end of the thirty-second capacitor C32 is connected to the first end of the thirty-first capacitor C31, and a second end of the thirty-second capacitor C32 is grounded;

[0233] A thirty-third capacitor C33, a first end of the thirty-third capacitor C33 is connected to the first end of the thirty-second capacitor C32, a second end of the thirty-third capacitor C33 is grounded, and the first end of the thirty-third capacitor C33 is also connected to the second voltage power supply V2;

[0234] A voltage regulator chip U7, an input voltage pin U7_IN of the voltage regulator chip U7 is connected to the first end of the thirty-third capacitor C33, an enable pin U7_EN of the voltage regulator chip U7 is grounded through a sixteenth resistor R16, an output voltage pin U7_OUT of the voltage regulator chip U7 is connected to the first voltage power supply V1, a ground pin U7_GND of the voltage regulator chip U7 is grounded, and the enable pin U7_EN of the voltage regulator chip U7 is also connected to the enable pin U2_1V8_EN of the main control chip U2;

[0235] The thirty-fourth capacitor C34 has a first end connected to the output voltage pin U7_OUT of the voltage regulator chip U7 , and a second end of the thirty-fourth capacitor C34 is grounded.

[0236] Specifically, the buck-boost power supply chip U5 is LTC3114EFE-1#PBF, and the regulator chip U7 is TLV70218DBVT. The LTC3114 buck-boost power supply circuit is used to provide power for the entire millimeter-wave radar detection probe. It can operate in a wide input voltage range and is suitable for a variety of application scenarios. It uses efficient buck and boost conversion technology, which can achieve a conversion efficiency of up to 95%, reduce energy loss, and improve system efficiency.

[0237] Specifically, it has an adjustable output voltage, and the output voltage can be set as needed to adapt to different application requirements. It has low static power consumption in standby mode, which can save energy and extend battery life. LTC3114 has built-in multiple protection functions, including over-temperature protection, over-current protection and short-circuit protection, which can effectively protect the safe operation of the system and chip. LTC3114 uses a small size package, occupies a small space, and is suitable for compact application scenarios.

[0238] More specifically, the voltage input range of the power supply circuit 5 is 2.2V to 40V, the voltage output range of the power supply circuit 5 is 2.7V to 40V, and the current of the power supply circuit 5 is 1A. The LTC3114 buck-boost power supply circuit is used to provide power for the entire millimeter-wave radar detection probe, with small ripple, meeting the system power supply requirements.

[0239] In a preferred embodiment, Fig.13 , Fig.14 , Fig.15 , Fig.16 As shown, it also includes,

[0240] A seventeenth resistor R17, a first end of the seventeenth resistor R17 is connected to a data sending pin U2_USART_TX of the main control chip U2;

[0241] An eighteenth resistor R18, a first end of the eighteenth resistor R18 is connected to a serial receiving pin U2_USART_RX of the main control chip U2;

[0242] a nineteenth resistor R19, a first end of the nineteenth resistor R19 is grounded, and a second end of the nineteenth resistor R19 is connected to a digital ground;

[0243] The fourth connector J4, the first terminal of the fourth connector J4 is connected to the second end of the eighteenth resistor R18, the second terminal of the fourth connector J4 is connected to the second end of the seventeenth resistor R17, the third terminal of the fourth connector J4 is connected to the digital ground, and the fourth terminal of the fourth connector J4 is connected to the wake-up pin U2_PA0_WKUP of the main control chip U2.

[0244] The first communication circuit 401 further includes an anti-interference chip, which is an SRV05 chip.

[0245] Specifically, in the RS485 interface circuit, the SRV05 chip is used to prevent static electricity from interfering with the circuit and communication, thereby achieving reliability and stability of data transmission.

[0246] Specifically, the SRV05 chip can effectively absorb and suppress electrostatic discharge, prevent static electricity from damaging interface circuits and communication lines, and protect equipment from the effects of static electricity; by preventing electrostatic interference, the SRV05 chip can improve the reliability of RS485 interface circuits and communications, and reduce communication errors and failures.

[0247] The first connector J1 and the fourth connector J4 are HDR2.54-1X4 connectors, and the second connector J2 and the third connector J3 are HDR2.54-1X2 connectors, which can provide stable and reliable signal transmission, waterproof and dustproof functions, ensure connection stability, and facilitate maintenance and replacement, thereby improving the performance and reliability of the radar system and ensuring its normal operation and accurate detection of water accumulation.

[0248] The first voltage power supply V1 is a 1.8V low voltage, the second voltage power supply V2 is a 3.3V DC power supply voltage, and the third voltage power supply V3 is a 3.3V DC power supply voltage for digital circuits.

[0249] In summary, the present application provides a water accumulation detection radar based on millimeter wave technology, which is mainly used for water accumulation detection. A smaller beam width of antenna 1 is used to further concentrate the radar energy. The sensitivity and accuracy are improved by optimizing a specific recognition algorithm. A simple and highly integrated hardware system is used to reduce the volume and cost, which is also beneficial to reducing the installation cost of the equipment. The system's responsiveness, reliability and stability are improved by optimizing the logic control algorithm of the main controller 3. The distance of the detected object is identified through the SDK (software development kit) officially provided by the A111 chip, and a specific automatic recognition algorithm is used according to the characteristics of the detected object to achieve data fusion and recognition, thereby improving the system and accuracy and stability. The probe system can wake up the probe by transmitting the rising edge of the 3.3V high level to the wake-up pin. The distance data of the detected object can be obtained each time it is awakened. The data is transmitted to the customer through the RS485 protocol or the serial port TTL signal, and then the millimeter wave radar detection probe automatically enters the standby mode. The wake-up and data transmission time are extremely short. , can reach millisecond level, and added electrostatic protection (ESD) circuit; for industrial, electric power, municipal roads, overpasses and other IoT applications, it provides narrow beam, high-precision object position detection and measurement, is in the 60GHz frequency band, can detect distance of 0.2m ~ 7m, accuracy of 1mm, only 100mW power when working, uA level standby current, with small detection angle, high sensitivity, high detection accuracy, strong environmental adaptability, small size, stable performance, easy integration, high cost performance, all-solid-state electronic devices, long service life, long data communication distance and other characteristics, to some extent, it can replace ultrasonic and laser ranging, and realize reliable operation in rain, dust and smoke environment, can be powered by battery, NB-IOT (narrowband Internet of Things) transmission data or wired data transmission can actively report intrusion targets, through signal processing and pattern recognition, can distinguish between human and vehicle targets, and effectively filter out interference such as insects, birds, dust, small particles, etc., can accurately identify in harsh environments, with high accuracy, can be widely promoted and applied.

[0250] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A water accumulation detection radar based on millimeter wave technology, characterized in that: include, An antenna (1) for transmitting and receiving millimeter wave signals; A radar sensor (2) connected to the antenna (1); A communication level conversion circuit (7) connected to the radar sensor (2); A main controller (3), connected to the communication level conversion circuit (7); A communication isolation circuit (6) connected to the main controller (3); A first communication circuit (401), connected to the communication isolation circuit (6); A second communication circuit (402), connected to the communication isolation circuit (6); A power supply circuit (5) is connected to the communication level conversion circuit (7), the main controller (3) and the communication isolation circuit (6).

2. The water accumulation detection radar based on millimeter wave technology according to claim 1 is characterized in that: The radar sensor (2) comprises: A first capacitor C1, wherein a first end of the first capacitor C1 is connected to a first voltage power source V1, and a second end of the first capacitor C1 is grounded; A second capacitor C2, wherein a first end of the second capacitor C2 is connected to the first voltage power supply V1, a second end of the second capacitor C2 is grounded, and the first end of the second capacitor C2 is also connected to a first power supply pin U1_VIO_1A of a millimeter-wave radar chip U1, and the first power supply pin U1_VIO_1A of the millimeter-wave radar chip U1 is also connected to a second power supply pin U1_VIO_1B of the millimeter-wave radar chip U1; A third capacitor C3, a first end of the third capacitor C3 is connected to the first voltage power supply V1, and a second end of the third capacitor C3 is grounded; A fourth capacitor C4, wherein a first end of the fourth capacitor C4 is connected to the first voltage power supply V1, a second end of the fourth capacitor C4 is grounded, and the first end of the fourth capacitor C4 is also connected to a third power supply pin U1_VIO_2A of the millimeter-wave radar chip U1, and the third power supply pin U1_VIO_2A of the millimeter-wave radar chip U1 is also connected to a fourth power supply pin U1_VIO_2B of the millimeter-wave radar chip U1; a fifth capacitor C5, wherein a first end of the fifth capacitor C5 is connected to the first voltage power source V1, and a second end of the fifth capacitor C5 is grounded; a sixth capacitor C6, wherein a first end of the sixth capacitor C6 is connected to the first voltage power supply V1, a second end of the sixth capacitor C6 is grounded, and a first end of the sixth capacitor C6 is also connected to a fifth power supply pin U1_VIO_3A of the millimeter-wave radar chip U1, a fifth power supply pin U1_VIO_3A of the millimeter-wave radar chip U1 is connected to a sixth power supply pin U1_VIO_3B of the millimeter-wave radar chip U1, and a sixth power supply pin U1_VIO_3B of the millimeter-wave radar chip U1 is connected to a bias voltage pin U1_VBIAS of the millimeter-wave radar chip U1; The interrupt signal pin U1_INTERRUPT of the millimeter wave radar chip U1 is grounded through a second resistor R2; The general input and output pin U1_GPIO_0 of the millimeter wave radar chip U1 is grounded through a third resistor R3; A crystal oscillator X1, wherein a first end of the crystal oscillator X1 is connected to a first crystal oscillator pin U1_XIN of the millimeter-wave radar chip U1, a second end of the crystal oscillator X1 is connected to a second crystal oscillator pin U1_XOUT of the millimeter-wave radar chip U1, and a third pin and a fourth pin of the crystal oscillator X1 are grounded; A seventh capacitor C7, a first end of the seventh capacitor C7 is grounded, and a second end of the seventh capacitor C7 is connected to the first end of the crystal oscillator X1; An eighth capacitor C8, a first end of the eighth capacitor C8 is grounded, and a second end of the eighth capacitor C8 is connected to the second end of the crystal oscillator X1.

3. The water accumulation detection radar based on millimeter wave technology according to claim 1 is characterized in that: The communication level conversion circuit (7) comprises: A ninth capacitor C9, wherein a first end of the ninth capacitor C9 is grounded, and a second end of the ninth capacitor C9 is connected to a second voltage power source V2, and the second voltage power source V2 is further connected to a first power supply pin U6_VCCB of a level conversion chip U6; A tenth capacitor C10, wherein a first end of the tenth capacitor C10 is connected to a first voltage power source V1, a second end of the tenth capacitor C10 is grounded, and the first voltage power source V1 is also connected to a second power supply pin U6_VCCA of the level conversion chip U6; The first clock signal pin U6_SPI_CLK of the level conversion chip U6 is connected to the clock signal pin U1_SPI_CLK of the millimeter wave radar chip U1; The first slave transmission pin U6_SPI_MISO of the level conversion chip U6 is connected to the slave transmission pin U1_SPI_MISO of the millimeter wave radar chip U1 through a first resistor R1; The first host transmission pin U6_SPI_MOSI of the level conversion chip U6 is connected to the host transmission pin U1_SPI_MOSI of the millimeter wave radar chip U1; The first chip select signal pin U6_SPI_SS of the level conversion chip U6 is connected to the chip select signal pin U1_SPI_SS of the millimeter wave radar chip U1; The first enable pin U6_ENABLE of the level conversion chip U6 is connected to the enable pin U1_ENABLE of the millimeter wave radar chip U1; The first interrupt signal pin U6_INTERRUPT of the level conversion chip U6 is connected to the interrupt signal pin U1_INTERRUPT of the millimeter wave radar chip U1; The first control pin U6_CTRL of the level conversion chip U6 is connected to the general input and output pin U1_GPIO_0 of the millimeter wave radar chip U1; The control output enable pin U6_OE of the level conversion chip U6 is connected to the first voltage power source V1 through a fourth resistor R4; A ground pin U6_GND of the level conversion chip U6 is grounded.

4. The water accumulation detection radar based on millimeter wave technology according to claim 1 is characterized in that: The main controller (3) comprises: a fifth resistor R5, wherein a first end of the fifth resistor R5 is connected to a second voltage power source V2, and a second end of the fifth resistor R5 is connected to a reset pin U2_NRST of a main control chip U2; An eleventh capacitor C11, a first end of the eleventh capacitor C11 is connected to a reset pin U2_NRST of the main control chip U2, and a second end of the eleventh capacitor C11 is grounded; A first inductor L1, wherein a first end of the first inductor L1 is connected to the second voltage power source V2, and a second end of the first inductor L1 is connected to an analog power pin U2_VDDA of the main control chip U2; A twelfth capacitor C12, a first end of the twelfth capacitor C12 is connected to an analog power pin U2_VDDA of the main control chip U2, and a second end of the twelfth capacitor C12 is grounded; The wake-up pin U2_PA0_WKUP of the main control chip U2 is grounded through a sixth resistor R6; The first clock signal pin U2_PB13_SPI_CLK of the main control chip U2 is connected to the second clock signal pin U6_PB13_SPI_CLK of the level conversion chip U6; The slave transmission pin U2_PB14_SPI_MISO of the master control chip U2 is connected to the second slave transmission pin U6_PB14_SPI_MISO of the level conversion chip U6; The host transmission pin U2_PB15_SPI_MOSI of the main control chip U2 is connected to the second host transmission pin U6_PB15_SPI_MOSI of the level conversion chip U6; The chip select signal pin U2_PC6_SPI_SS of the main control chip U2 is connected to the second chip select signal pin U6_PC6_SPI_SS of the level conversion chip U6; The enable pin U2_PC7_ENABLE of the main control chip U2 is connected to the second enable pin U6_PC7_ENABLE of the level conversion chip U6; The interrupt signal pin U2_PB12_INTERRUPT of the main control chip U2 is connected to the second interrupt signal pin U6_PB12_INTERRUPT of the level conversion chip U6; The control pin U2_CTRL_B of the main control chip U2 is connected to the second control pin U6_CTRL_B of the level conversion chip U6; The battery voltage pin U2_VBAT of the main control chip U2 is connected to the second voltage power supply V2; The first power pin U2_VDD_1, the second power pin U2_VDD_2, the third power pin U2_VDD_3 and the fourth power pin U2_VDD_4 of the main control chip U2 are connected to the battery voltage pin U2_VBAT of the main control chip U2; The first ground pin U2_VSS_1, the second ground pin U2_VSS_2, the third ground pin U2_VSS_3, the fourth ground pin U2_VSS_4 and the analog ground pin U2_VSSA of the main control chip U2 are grounded.

5. The water accumulation detection radar based on millimeter wave technology according to claim 4 is characterized in that: The main controller (3) further comprises: A first connector J1, wherein a first terminal of the first connector J1 is grounded, a second terminal of the first connector J1 is connected to a second clock signal pin U2_SWCLK of the main control chip U2, a third terminal of the first connector J1 is connected to a communication pin U2_SWDIO of the main control chip U2, and a fourth terminal of the first connector J1 is connected to the second voltage power supply V2; a thirteenth capacitor C13, a first end of the thirteenth capacitor C13 is connected to the second voltage power supply V2, and a second end of the thirteenth capacitor C13 is grounded; A crystal oscillator X1, wherein a power supply voltage pin X1_VCC of the crystal oscillator X1 is connected to the second voltage power supply V2, an output pin X1_OUT of the crystal oscillator X1 is connected to an external crystal oscillator input pin U2_OSC_IN of the main control chip U2, and a ground pin X1_GND of the crystal oscillator X1 is grounded; a fourteenth capacitor C14, a first end of the fourteenth capacitor C14 is connected to the second voltage power source V2, and a second end of the fourteenth capacitor C14 is grounded; A seventh resistor R7, a first end of the seventh resistor R7 is connected to the boot mode selection pin U2_BOOT0 of the main control chip U2, and a second end of the seventh resistor R7 is grounded; a fifteenth capacitor C15, a first end of the fifteenth capacitor C15 being connected to the second voltage power source V2, and a second end of the fifteenth capacitor C15 being grounded; A sixteenth capacitor C16, connected in parallel with the fifteenth capacitor C15; A seventeenth capacitor C17, connected in parallel with the sixteenth capacitor C16; The eighteenth capacitor C18 is connected in parallel with the seventeenth capacitor C17.

6. The water accumulation detection radar based on millimeter wave technology according to claim 1, characterized in that: The communication isolation circuit (6) comprises: A nineteenth capacitor C19, wherein a first end of the nineteenth capacitor C19 is grounded, and a second end of the nineteenth capacitor C19 is connected to a positive power supply pin U3_Vcc of an isolation chip U3; The ground pin U3_GND1 of the isolation chip U3 is grounded; The positive power supply pin U3_Vcc of the isolation chip U3 is also connected to the second voltage power supply V2; A twentieth capacitor C20, wherein a first end of the twentieth capacitor C20 is connected to an external power pin U3_Viso of the isolation chip U3, and a second end of the twentieth capacitor C20 is connected to a digital ground; The digital ground pin U3_GND2 of the isolation chip U3 is connected to the digital ground; The external power pin U3_Viso of the isolation chip U3 is also connected to a third voltage power source V3; an eighth resistor R8, a first end of the eighth resistor R8 is connected to the selection pin U3_SEL of the isolation chip U3, and a second end of the eighth resistor R8 is connected to the digital ground; The first external signal receiving pin U3_INA of the isolation chip U3 is connected to the data sending pin U2_USART_TX of the main control chip U2; The output data pin U3_OUTD of the isolation chip U3 is connected to the serial receiving pin U2_USART_RX of the main control chip U2; The second external signal receiving pin U3_INB of the isolation chip U3 is connected to the communication control pin U2_RS485_CTRL of the main control chip U2.

7. The water accumulation detection radar based on millimeter wave technology according to claim 1 is characterized in that: The first communication circuit (401) comprises: A data transceiver chip IC1, wherein the output pin IC1_RO of the data transceiver chip IC1 is connected to the signal receiving pin U3_IND of the isolation chip U3, the input control pin IC1_RE and the output control pin IC1_DE of the data transceiver chip IC1 are connected to the second output signal pin U3_OUTB of the isolation chip U3, the signal input pin IC1_DI of the data transceiver chip IC1 is connected to the first output signal pin U3_OUTA of the isolation chip U3, the power pin IC1_VCC of the data transceiver chip IC1 is connected to the digital ground through a twenty-first capacitor C21, the power pin IC1_VCC of the data transceiver chip IC1 is also connected to the third voltage power supply V3, and the ground pin IC1_GND of the data transceiver chip IC1 is connected to the digital ground; a tenth resistor R10, wherein a first end of the tenth resistor R10 is connected to a first bus pin IC1_B of the data transceiver chip IC1, and a second end of the tenth resistor R10 is connected to a second bus pin IC1_A of the data transceiver chip IC1; A ninth resistor R9, wherein a first end of the ninth resistor R9 is connected to a digital ground, and a second end of the ninth resistor R9 is connected to a first bus pin IC1_B of the data transceiver chip IC1; an eleventh resistor R11, a first end of the eleventh resistor R11 is connected to the second bus pin IC1_A of the data transceiver chip IC1, and a second end of the eleventh resistor R11 is connected to the third voltage power source V3; A protection chip U4, wherein a first input terminal U4_D1 of the protection chip U4 is connected to a first bus pin IC1_B of the data transceiver chip IC1, a second input terminal U4_D2 of the protection chip U4 is connected to a second bus pin IC1_A of the data transceiver chip IC1, a ground terminal U4_GND of the protection chip U4 is connected to a digital ground, a power terminal U4_VCC of the protection chip U4 is connected to a digital ground via a twenty-second capacitor C22, and a power terminal U4_VCC of the protection chip U4 is also connected to the third voltage power supply V3; The second connector J2, the first connection terminal of the second connector J2 is connected to the first bus pin IC1_B of the data transceiver chip IC1, and the second connection terminal of the second connector J2 is connected to the second bus pin IC1_A of the data transceiver chip IC1.

8. The water accumulation detection radar based on millimeter wave technology according to claim 1, characterized in that: The power supply circuit (5) comprises: A buck-boost power supply chip U5, wherein a first power switch pin U5_SW1 of the buck-boost power supply chip U5 is connected to a first end of a second inductor L2, a second power switch pin U5_SW2 of the buck-boost power supply chip U5 is connected to a second end of the second inductor L2, a first jump capacitor pin U5_BST1 of the buck-boost power supply chip U5 is connected to a first end of the second inductor L2 via a twenty-seventh capacitor C27, a second jump capacitor pin U5_BST2 of the buck-boost power supply chip U5 is connected to a second end of the second inductor L2 via a twenty-eighth capacitor C28, a first power input pin U5_Vin, a second power input pin U5_PVin and a state control pin U5_RUN of the buck-boost power supply chip U5 are connected to a second terminal of a third connector J3, and a mode control pin U5_MODE, a power ground pin U5_PGND and a ground pin U5_GND of the buck-boost power supply chip U5 are grounded; A twenty-third capacitor C23, a first end of the twenty-third capacitor C23 is connected to the second terminal of the third connector J3, a second end of the twenty-third capacitor C23 is connected to the first terminal of the third connector J3, and the first terminal of the third connector J3 is grounded; A twenty-fourth capacitor C24, a first end of the twenty-fourth capacitor C24 is connected to the first end of the twenty-third capacitor C23, and a second end of the twenty-fourth capacitor C24 is grounded; a twenty-fifth capacitor C25, a first end of the twenty-fifth capacitor C25 being connected to the first end of the twenty-fourth capacitor C24, and a second end of the twenty-fifth capacitor C25 being grounded; A twelfth resistor R12, wherein a first end of the twelfth resistor R12 is connected to an output current programming pin U5_PROG of the buck-boost power supply chip U5, and a second end of the twelfth resistor R12 is grounded; A twenty-sixth capacitor C26, wherein a first end of the twenty-sixth capacitor C26 is connected to the first end of the twelfth resistor R12, and a second end of the twenty-sixth capacitor C26 is connected to the second end of the twelfth resistor R12; A twenty-ninth capacitor C29, a first end of the twenty-ninth capacitor C29 is connected to the voltage stabilization output pin U5_PLDO of the buck-boost power supply chip U5 and the third power supply input pin U5_LDO, and a second end of the twenty-ninth capacitor C29 is grounded; A thirtieth capacitor C30, a first end of the thirtieth capacitor C30 is connected to the error amplifier output pin U5_VC of the buck-boost power supply chip U5, and a second end of the thirtieth capacitor C30 is grounded via a thirteenth resistor R13.

9. The water accumulation detection radar based on millimeter wave technology according to claim 8, characterized in that: The power supply circuit (5) further comprises: A fourteenth resistor R14, wherein a first end of the fourteenth resistor R14 is connected to a converter output pin U5_PVout of the buck-boost power supply chip U5, and a second end of the fourteenth resistor R14 is connected to a feedback voltage input pin U5_FB of the buck-boost power supply chip U5; A fifteenth resistor R15, a first end of the fifteenth resistor R15 is connected to a feedback voltage input pin U5_FB of the buck-boost power supply chip U5, and a second end of the fifteenth resistor R15 is grounded; A thirty-first capacitor C31, a first end of the thirty-first capacitor C31 is connected to the first end of the fourteenth resistor R14, and the thirty-first capacitor C31 is grounded; A thirty-second capacitor C32, a first end of the thirty-second capacitor C32 is connected to the first end of the thirty-first capacitor C31, and a second end of the thirty-second capacitor C32 is grounded; A thirty-third capacitor C33, wherein a first end of the thirty-third capacitor C33 is connected to the first end of the thirty-second capacitor C32, a second end of the thirty-third capacitor C33 is grounded, and a first end of the thirty-third capacitor C33 is also connected to a second voltage power source V2; A voltage regulator chip U7, an input voltage pin U7_IN of the voltage regulator chip U7 is connected to the first end of the thirty-third capacitor C33, an enable pin U7_EN of the voltage regulator chip U7 is grounded through a sixteenth resistor R16, an output voltage pin U7_OUT of the voltage regulator chip U7 is connected to the first voltage power supply V1, a ground pin U7_GND of the voltage regulator chip U7 is grounded, and the enable pin U7_EN of the voltage regulator chip U7 is also connected to the enable pin U2_1V8_EN of the main control chip U2; A thirty-fourth capacitor C34, a first end of the thirty-fourth capacitor C34 is connected to the output voltage pin U7_OUT of the regulator chip U7, and a second end of the thirty-fourth capacitor C34 is grounded.

10. The water accumulation detection radar based on millimeter wave technology according to claim 1, characterized in that: Also includes, A seventeenth resistor R17, a first end of the seventeenth resistor R17 is connected to a data sending pin U2_USART_TX of the main control chip U2; An eighteenth resistor R18, a first end of the eighteenth resistor R18 is connected to a serial receiving pin U2_USART_RX of the main control chip U2; A nineteenth resistor R19, a first end of the nineteenth resistor R19 is grounded, and a second end of the nineteenth resistor R19 is connected to a digital ground; The fourth connector J4, the first terminal of the fourth connector J4 is connected to the second end of the eighteenth resistor R18, the second terminal of the fourth connector J4 is connected to the second end of the seventeenth resistor R17, the third terminal of the fourth connector J4 is connected to the digital ground, and the fourth terminal of the fourth connector J4 is connected to the wake-up pin U2_PA0_WKUP of the main control chip U2.

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