Closed ray machine and projection device

Abstract

The utility model discloses a closed ray machine and a projection device. The closed ray machine is characterized in that a closed shell is provided with a cavity; the imaging assembly is arranged in the cavity; the first fan is arranged in the cavity to form a first internal circulation air duct in the cavity, and the first internal circulation air duct passes through the imaging assembly and is provided with a first air inlet for entering the imaging assembly and a first air outlet for exhausting from the imaging assembly; and the first semiconductor cooler comprises a first cold end and a first hot end opposite to the first cold end, the first cold end is arranged on the outer side of the closed shell in an attached mode, and the first cold end corresponds to the first air inlet and / or the first air outlet in position. The first cold end can be close to the imaging assembly serving as a main heating source in the cavity as much as possible, the heat exchange efficiency is improved, and therefore the temperature control capacity of the sealed optical machine is improved, and the sealed optical machine can meet the requirement for heat dissipation under the development trend of miniaturization and high brightness.

Description

Technical Field

[0001] The present invention belongs to the field of projection technology, and in particular relates to a closed optical machine and a projection device. Background Art

[0002] In a projection device, the optical engine is an important component, and the optical components and heat dissipation components of the projection device are integrated in the optical engine. There are two types of optical engines: open optical engines and closed optical engines. The optical components of the open optical engine have no dust protection. After long-term use, the dustproof effect is poor, which affects the projection effect and service life, and is gradually eliminated by the market; the closed optical engine is equipped with a closed shell to protect the optical components from dust, and the projection effect and service life can be improved to a certain extent. However, with the increasing demand for convenience, compactness and display brightness, the heat dissipation requirements for the closed optical engine are getting higher and higher. How to improve the temperature control ability of the sealed optical engine under the conditions of compact size and high display brightness is an urgent problem to be solved.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0004] The present disclosure aims to at least to some extent solve the technical problem of how to improve the temperature control capability of a sealed optical engine under the conditions of compact size and high display brightness. To this end, the present disclosure provides a sealed optical engine and a projection device.

[0005] A closed optical machine is provided in an embodiment of the present disclosure, and the closed optical machine includes: a closed shell having a cavity; an imaging component, the imaging component is arranged in the cavity; a first fan, the first fan is arranged in the cavity to form a first internal circulation air duct in the cavity, the first internal circulation air duct passes through the imaging component and has a first air inlet for entering the imaging component and a first air outlet for exhausting air from the imaging component; and a first semiconductor refrigerator, the first semiconductor refrigerator includes a first cold end and a first hot end arranged opposite to the first cold end, the first cold end is arranged in contact with the outer side of the closed shell, and the first cold end corresponds to the position of the first air inlet and / or the first air outlet.

[0006] In some embodiments, the closed shell has a first opening connected to the cavity; the closed optical engine also includes a first radiator, which is arranged at the first opening and sealed with the closed shell; the first internal circulation air duct passes through the first radiator adjacent to the inner side of the cavity, and the first cold end is arranged on the outer side of the first radiator away from the cavity.

[0007] In some embodiments, the imaging assembly is vertically disposed in the cavity, the first air inlet is located at the bottom of the imaging assembly, and the first air outlet is located at the top of the imaging assembly; the first radiator at least covers the bottom of the imaging assembly and / or the top of the imaging assembly.

[0008] In some embodiments, the inner side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is a curved surface, and the outer side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is a fixed plane.

[0009] In some embodiments, the closed light engine also includes: a light source assembly, which is disposed in the cavity; a second heat sink, which is disposed on the outside of the closed shell corresponding to the light source assembly; and a second fan, which is disposed outside the closed shell to form a second external air duct outside the closed shell, and the second external air duct passes through the second heat sink.

[0010] In some embodiments, the second fan is located on a side of the second radiator away from the closed shell, and the second fan includes a second fan air inlet and a second fan air outlet, the second fan air inlet faces the second radiator, and the second fan air outlet faces a side away from the second radiator.

[0011] In some embodiments, the first semiconductor refrigerator further includes a first hot end radiator connected to the first hot end, and the first hot end radiator is disposed outside the closed shell.

[0012] In some embodiments, the second external air duct passes through the first hot end and / or the first hot end heat sink.

[0013] In some embodiments, the second heat sink includes: a central heat sink, which is arranged on the outside of the closed shell corresponding to the light source assembly; a plurality of first heat sink ribs, which are arranged at intervals around the central heat sink, and the plurality of first heat sink ribs extend around the central heat sink; and a plurality of second heat sink ribs, which are connected to one end of the first heat sink away from the central heat sink, and the plurality of second heat sink ribs extend around the plurality of first heat sink ribs.

[0014] In some embodiments, one end of each of the first heat dissipation ribs away from the central heat dissipation plate is connected to at least two of the second heat dissipation ribs.

[0015] In some embodiments, the closed optical machine also includes: a second semiconductor refrigerator, the second semiconductor refrigerator is arranged in the cavity, the second semiconductor refrigerator includes a second cold end and a second hot end arranged opposite to the second cold end, and the second hot end is arranged on the inner side of the closed shell.

[0016] In some embodiments, the closed optical machine also includes: a lens assembly, the closed shell is provided with a second opening, the lens assembly is arranged at the second opening and is sealed and connected to the closed shell; and, a first reflector, the first reflector is arranged in the cavity, the first reflector is inclined relative to the imaging assembly to reflect the imaging light path of the imaging assembly to the lens assembly; the part of the closed shell corresponding to the first reflector is provided with a shell chamfer, the first internal circulation air duct passes through the inner side of the shell chamfer and the second external air duct passes through the outer side of the shell chamfer; wherein, the second hot end is arranged in affixed relationship with the inner side of the shell chamfer.

[0017] In some embodiments, the closed optical machine further includes: a third fan, the third fan is arranged outside the closed shell to form a third external air duct outside the closed shell, the third external air duct passes through the outer side of the chamfer of the shell and is connected with the second external air duct.

[0018] In some embodiments, the closed shell is provided with a hollow support frame located outside the shell chamfer, and the third fan is arranged on the hollow support frame so that the third external air duct is located between the shell chamfer and the hollow support frame.

[0019] In some embodiments, the third fan includes a third fan air inlet and a third fan air outlet, the first hot end heat sink is located at the third fan air outlet, and the second hot end is located at the third fan air inlet.

[0020] The disclosed embodiment further provides a projection device, which includes a projection screen and the above-mentioned optical machine, wherein the projection screen is used to receive the projection image of the optical machine.

[0021] The embodiments of the present disclosure have at least the following beneficial effects:

[0022] The above-mentioned closed optical machine sets the first cold end of the first semiconductor refrigerator corresponding to the first air inlet and / or the first air outlet, so that the first cold end can be as close as possible to the imaging component in the cavity that serves as the main heat source. There is a large temperature difference between the first cold end and the hot air formed by the imaging component, which can increase the heat exchange rate between the first cold end and the hot air and improve the heat exchange efficiency, thereby improving the cooling effect on the imaging component and other structures in the cavity, improving the temperature control ability of the sealed optical machine, and enabling the sealed optical machine to meet the heat dissipation requirements under the development trend of miniaturization and high brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the three-dimensional structure of a closed optical machine in an embodiment of the present disclosure is shown;

[0025] Figure 2 A top view of a closed optical engine in another embodiment of the present disclosure is shown;

[0026] Figure 3 Shows Figure 2 AA section view of the closed optical machine;

[0027] Figure 4 A schematic diagram of the three-dimensional structure of a closed optical engine in another embodiment of the present disclosure is shown;

[0028] Figure 5 Shows Figure 1 Top view of the enclosed optical machine;

[0029] Figure 6 Shows Figure 4 The front view of the closed optical machine;

[0030] Figure 7 Shows Figure 6 BB section view of the closed optical machine;

[0031] Figure 8 A schematic diagram of the three-dimensional structure of a closed optical engine in another embodiment of the present disclosure is shown;

[0032] Fig. 9 Shows Figure 8 Schematic diagram of the internal structure of the closed optical machine;

[0033] Fig.10 Shows Figure 8A schematic diagram of the three-dimensional structure of the first semiconductor refrigerator in the closed optical machine;

[0034] Fig.11 A schematic diagram of the three-dimensional structure of the second heat sink and the second fan of the enclosed optical machine in the embodiment of the present disclosure after being assembled is shown;

[0035] Fig.12 Shows Fig.11 A front view of the second radiator and the second fan after assembly;

[0036] Fig.13 Shows Fig.11 The right side view of the second radiator and the second fan after assembly;

[0037] Fig.14 Shows Fig.11 A schematic diagram of the three-dimensional structure of the second radiator;

[0038] Fig.15 Shows Fig.11 A front view of the second radiator;

[0039] Fig.16 The temperature distribution diagram of plane Z=0 when there is no first semiconductor refrigerator in the closed optical machine is shown;

[0040] Fig.17 The air flow velocity distribution diagram at plane Z=0 when there is no first semiconductor refrigerator in the closed optical machine is shown;

[0041] Fig.18 Shows Fig.11 Temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 0A;

[0042] Fig.19 Shows Fig.11 Temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 2.5A;

[0043] Fig. 20 Shows Fig.11 Temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 2.5A and a third fan is provided;

[0044] Fig.21 Shows Fig.11 Temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 4.5A;

[0045] Fig. 22 Shows Fig.11Temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 4.5A and a third fan is provided;

[0046] Fig.23 Shows Fig.11 Temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 0A;

[0047] Fig.24 Shows Fig.11 Temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 2.5A;

[0048] Fig.25 Shows Fig.11 Temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 2.5A and a third fan is provided;

[0049] Fig.26 Shows Fig.11 Temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 4.5A;

[0050] Fig. 27 Shows Fig.11 Temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 4.5A and a third fan is provided;

[0051] Fig.28 Shows Fig.11 A three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 0A;

[0052] Fig.29 Shows Fig.11 The three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 2.5A;

[0053] Fig.30 Shows Fig.11 A three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 2.5A and a third fan is provided;

[0054] Fig.31 Shows Fig.11 The three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 4.5A;

[0055] Fig.32 Shows Fig.11A three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 4.5A and a third fan is provided;

[0056] Fig.33 Shows Fig.11 The cooling capacity-operating current curve of the first semiconductor refrigerator in the closed optical machine when the hot end temperature is 25 degrees Celsius;

[0057] Fig.34 Shows Fig.11 Working voltage-working current curve when the hot end temperature of the first semiconductor cooler in the closed optical machine is 25 degrees Celsius.

[0058] Reference numerals:

[0059] 100, closed shell; 110, main shell; 120, shell chamfer; 130, hollow support frame; 140, optical cup shell; 150, base; 200, imaging component; 210, first Fresnel lens; 220, heat-insulating transparent body; 230, display panel; 240, second Fresnel lens; 300, first fan; 310, first internal circulation air duct; 311, first air inlet; 312, first air outlet; 400, first semiconductor refrigerator; 410, first cold end; 420, first hot end; 430, first hot end radiator; 440, connecting heat pipe; 500, first radiator; 510, first upper cover heat dissipation device; 520, first lower cover radiator; 600, light source assembly; 610, lamp board; 620, optical cup; 630, optical cup radiator; 700, second radiator; 710, central heat sink; 720, first heat dissipation rib plate; 730, second heat dissipation rib plate; 800, second fan; 810, second external air duct; 900, lens assembly; 1000, first reflector; 1100, second semiconductor refrigerator; 1110, second cold end; 1120, second hot end; 1200, third fan; 1210, third external air duct; 1300, supplementary radiator; X, front and rear side direction; Y, left and right side direction; Z, upper and lower side direction. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0061] In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides various specific examples of processes and materials, but those of ordinary skill in the art may recognize the application of other processes and / or the use of other materials.

[0062] The present disclosure is described below with reference to specific embodiments and in conjunction with the accompanying drawings:

[0063] With the development of display technology, different display solutions have become popular. A projection device is a device that can project images or videos onto a screen. It can be connected to computers, game consoles, televisions, mobile phones and other devices through different interfaces to play the corresponding video signals.

[0064] In a projection device, the optical engine is an important component, and the optical components and heat dissipation components of the projection device are integrated in the optical engine. There are two types of optical engines: open optical engines and closed optical engines. The optical components of the open optical engine have no dust protection. After long-term use, the dustproof effect is poor, which affects the projection effect and service life, and is gradually eliminated by the market; the closed optical engine is equipped with a closed shell to protect the optical components from dust, and the projection effect and service life can be improved to a certain extent. However, with the increasing demand for convenience, compactness and display brightness, the operating temperature of the imaging components in the optical engine has risen significantly, and the heat dissipation requirements for the closed optical engine are getting higher and higher. How to improve the temperature control ability of the sealed optical engine under the conditions of compact size and high display brightness is an urgent problem that needs to be solved.

[0065] The design of the internal circulation air duct of a closed optical machine is a core issue in the optical machine and also a technical difficulty. Since the internal circulation air duct is in a closed state, the air in the internal circulation air duct can only circulate inside the closed optical machine, and can only dissipate heat with the outside through heat exchange through the heat exchanger on the shell, and the heat dissipation efficiency is subject to certain limitations. In related technologies, the thermal conductivity of the heat exchanger on the shell is generally 90W / mK~210W / mK, which cannot meet the heat dissipation requirements of the closed optical machine with increasing display brightness. The internal circulation air duct is suppressed in a high temperature state. When running for a long time, the performance of various devices in the closed optical machine will be reduced, resulting in a shortened life of the closed optical machine.

[0066] In order to improve the temperature control capability of a sealed optical engine, the present disclosure provides a sealed optical engine, such as Figures 1 to 10As shown, the closed optical machine includes a closed housing, an imaging component, a first fan and a first semiconductor refrigerator. The closed housing is provided with a cavity; the imaging component is arranged in the cavity; the first fan is arranged in the cavity to form a first internal circulation air duct in the cavity, the first internal circulation air duct passes through the imaging component and has a first air inlet for entering the imaging component and a first air outlet for discharging from the imaging component; the first semiconductor refrigerator includes a first cold end and a first hot end arranged opposite to the first cold end, the first cold end is arranged in contact with the outer side of the closed housing, and the first cold end corresponds to the position of the first air inlet and / or the first air outlet.

[0067] The closed optical machine proposed in the embodiment of the present disclosure sets the first cold end of the first semiconductor refrigerator corresponding to the first air inlet and / or the first air outlet, so that the first cold end can be as close as possible to the imaging component in the cavity that serves as the main heat source. There is a large temperature difference between the first cold end and the hot air formed by the imaging component, which can increase the heat exchange rate between the first cold end and the hot air, improve the heat exchange efficiency, and thus improve the cooling effect on the imaging component and other structures in the cavity, thereby improving the temperature control ability of the sealed optical machine, optimizing the display effect of the imaging component, and avoiding, to a certain extent, the uneven color temperature phenomenon caused by the large temperature difference; at the same time, it can also increase the upper limit of the brightness of the closed optical machine, so that the closed optical machine can meet the heat dissipation requirements under the development trend of miniaturization and high brightness, and can meet the heat dissipation requirements of closed optical machines with higher lumen designs.

[0068] In the closed optical machine proposed in the embodiment of the present disclosure, the first cold end of the first semiconductor refrigerator will not increase any wind resistance to the first internal circulation air duct, which can avoid the increase of noise in the cavity to a certain extent and meet the development trend of closed optical machines with low noise requirements.

[0069] It should be noted that the directional terms "up, down, front, back (back), horizontal, vertical" in the present disclosure, unless otherwise specified, are all relative concepts, not absolute concepts. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0070] For the sake of convenience and brevity, this application takes the normal working position of the closed optical machine as the reference standard, that is, Figure 1 The side of the enclosed optical machine facing the projected image (such as a projection screen) is called the front side or the front; the rear side or the back refers to the side of the enclosed optical machine facing away from the projected image, and the left side and the right side are the lateral directions perpendicular to the front side and the rear side. The upper side and the lower side are the directions perpendicular to the front side and the rear side, as well as the left side and the right side. Figure 1 For example, the second fan and the second radiator are located on the left side of the lens assembly, and the first semiconductor refrigerator is located on the upper side of the closed shell.

[0071] In some embodiments of the present disclosure, Figure 3 , Figure 7 as well as Fig. 9 As shown, the imaging component includes a display panel, which may be a liquid crystal display (LCD). The display panel may be detachably disposed in the cavity through a fixed frame or other structures, or may be detachably disposed in the cavity through a card slot or other structures inside a closed housing.

[0072] In some embodiments of the present disclosure, Figure 3 , Figure 7 as well as Fig. 9 As shown, the imaging assembly also includes a first Fresnel lens and a second Fresnel lens, and the first Fresnel lens and the second Fresnel lens are respectively located on both sides of the display panel. The first Fresnel lens is located on the side of the display panel adjacent to the light source assembly, and is used to adjust the light beam emitted by the light source assembly into parallel light, so as to increase the brightness around the display panel, remove the solar photoelectric effect, and thus improve the uniformity of the display brightness. The second Fresnel lens is located on the side of the display panel away from the light source assembly, and is used to focus the light beam emitted by the display panel into the lens assembly to improve the clarity of the displayed image. Optionally, the first Fresnel lens and the second Fresnel lens can be detachably disposed in the cavity through a structure such as a fixing frame, or can be detachably disposed in the cavity through a structure such as a card slot on the inner side of the closed shell.

[0073] In some embodiments of the present disclosure, Figure 3 , Figure 7 as well as Fig. 9 As shown, the imaging assembly also includes a heat-insulating transparent body, which is disposed between the display panel and the light source assembly, and is used to insulate the display panel from the light source assembly, and prevent the heat generated by the light source assembly from entering the area where the display panel is located, causing the display panel to overheat. The heat-insulating transparent body can be a flat glass, and the light can maintain its original path when passing through the heat-insulating transparent body, and will not converge or diverge. Optionally, the heat-insulating transparent body can be detachably disposed in the cavity through a structure such as a fixing frame, or can be detachably disposed in the cavity through a structure such as a card slot inside the closed shell.

[0074] In some embodiments of the present disclosure, Figure 3 , Figure 7 as well as Fig. 9 As shown, the first Fresnel lens, the heat-insulating transparent body, the display panel and the second Fresnel lens in the imaging assembly are sequentially spaced and arranged in the cavity, and there are certain gaps between the first Fresnel lens, the heat-insulating transparent body, the display panel and the second Fresnel lens. When air circulates in the first internal circulation air duct, it can enter these gaps to exchange heat with the display panel, that is, these gaps can serve as components of the first internal circulation air duct.

[0075] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first fan is arranged in the cavity, and the air in the cavity is driven to flow by the first fan to form a first internal circulation air duct in the cavity, and the first internal circulation air duct passes through the imaging component, so that the air flowing in the first internal circulation air duct can exchange heat with the imaging component and take away the heat generated by the imaging component.

[0076] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first fan can be a vortex fan or a piezoelectric fan, which drives the air in the cavity to flow in the first internal circulation air duct. At the same time, the vortex fan or the piezoelectric fan can change the flow direction of the air, so that the air can circulate continuously in the cavity.

[0077] In some embodiments of the present disclosure, Figures 1 to 10 As shown, some air guide structures may be provided on the inner side of the closed shell to adjust the flow direction of the air, and cooperate with the first fan to form a first internal circulation air duct for air to circulate in the cavity. Optionally, an arc-shaped air guide portion may be provided on the inner side of the closed shell at the turning point of the first internal circulation air duct, and the flow direction of the air is changed by the arc-shaped air guide portion, so that the air can form a first internal circulation air duct that can circulate in the cavity under the guiding effect of the arc-shaped air guide portion and the driving effect of the first fan.

[0078] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first semiconductor cooler (TEC) is a device that uses the thermoelectric effect of semiconductors to produce cooling, including a first cold end and a first hot end arranged opposite to the first cold end, and a semiconductor cooling plate is arranged between the first cold end and the first hot end. When direct current is connected, the temperature difference between the first cold end and the first hot end can be increased, so that the temperature of the first cold end is reduced and the temperature of the first hot end is increased. By fitting the first cold end to the outside of the closed shell and corresponding to the position of the first air inlet and / or the first air outlet, the temperature difference between the first cold end and the first air inlet and / or the first air outlet can be increased, thereby improving the heat exchange efficiency between the first cold end and the air at the first air inlet and / or the first air outlet; at the same time, the increase in the temperature of the first hot end can increase the temperature difference between the first hot end and the environment, thereby improving the heat exchange efficiency between the first hot end and the ambient air, and then improving the heat dissipation efficiency of the first hot end. The first semiconductor refrigerator can improve the heat dissipation efficiency of the air at the first air inlet and / or the first air outlet, thereby improving the heat dissipation efficiency of the imaging component; in addition, the cooling capacity of the first semiconductor refrigerator is easy to adjust, and the cooling capacity can be adjusted according to the heat dissipation requirements, thereby improving the temperature control capability of the sealed optical machine.

[0079] In some embodiments of the present disclosure, Figures 1 to 10 As shown, through the internal structure of the first fan and the closed shell, a first internal circulation air duct with a circulation loop can be formed in the cavity, and the first internal circulation air duct has a first air inlet entering the imaging component and a first air outlet discharged from the imaging component, so that the first internal circulation air duct can pass through the imaging component to dissipate the heat of the imaging component.

[0080] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a first cold end is provided on the outside of the closed shell corresponding to the position of the first air outlet, and the hot air heated by the heat generating devices such as the display panel in the imaging assembly is discharged from the first air outlet, and is cooled by heat exchange with the first cold end to form cold air, and the cold air circulates in the first internal circulation air duct to cool the cavity of the closed shell, taking away the heat in the cavity, so that the temperature of different areas in the cavity can be reduced, and the overall temperature average in the cavity is reduced. In this embodiment, the closed optical machine needs to make partial changes to the outside of the closed shell corresponding to the first air outlet position so that it can transfer heat with the first cold end. The method of adding the first semiconductor refrigerator is simple, has little impact on the overall structural design of the closed optical machine, and has little impact on the cost of the closed optical machine.

[0081] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a first cold end is provided on the outer side of the closed shell corresponding to the position of the first air inlet, and the air at the first air inlet is cooled by the first cold end to form cold air. The formed cold air first enters the imaging component and performs heat exchange and cooling on the heat-generating devices such as the display panel in the imaging component, and takes away the heat generated by the heat-generating devices such as the display panel, which has a better cooling effect on the display panel, especially under low power conditions, and has a better cooling effect on the display panel.

[0082] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a first cold end is provided on the outer side of the closed shell corresponding to the first air inlet position, and a first cold end is provided on the outer side of the closed shell corresponding to the first air outlet position, that is, the air in the cavity can be cooled at the first air inlet to form cold air and enter the imaging component area to cool down the heat-generating devices such as the display panel, thereby improving the cooling and heat dissipation effect of the display panel; at the same time, the hot air discharged from the first air outlet is cooled down at the first air outlet, and after cooling down to form cold air, it can enter the first internal circulation air duct to cool down the cavity, so that the temperature of different areas in the cavity can be reduced, and the overall temperature average in the cavity is reduced.

[0083] It should be noted that in order for the first cold end to be able to exchange heat with the air in the inner cavity of the closed shell when it is attached to the outside of the closed shell, the position where the closed shell and the first cold end are attached needs to have thermal conductivity.

[0084] As an optional implementation, Figures 1 to 10 As shown, the closed shell is provided with a first opening connected to the cavity; the closed optical machine also includes a first radiator, which is arranged at the first opening and is sealed with the closed shell; the first internal circulation air duct passes through the inner side of the first radiator adjacent to the cavity, and the first cold end is arranged on the outer side of the first radiator away from the cavity.

[0085] In some embodiments of the present disclosure, Figures 1 to 10 As shown, a first opening is provided on the closed shell, and the first opening is connected to the cavity; at the same time, a first radiator is provided at the first opening, so that the first radiator is sealed and connected to the closed shell, and the closed shell can be kept in a closed state by sealing the first opening with the first radiator.

[0086] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first inner circulation air duct passes through the inner side of the cavity adjacent to the first radiator, and the air flowing in the first inner circulation air duct can dissipate heat through the first radiator, thereby taking away the heat in the cavity, thereby achieving heat dissipation and cooling of the closed optical engine.

[0087] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first cold end is arranged on the outside of the first radiator away from the cavity, and the first cold end exchanges heat with the air in the cavity through the first radiator, and the heat exchange purpose between the first cold end and the air in the cavity is achieved through the thermal conductivity of the first radiator.

[0088] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the area on the outside of the first heat sink for contacting the first cold end is a plane, so that the first cold end can contact the outside of the first heat sink away from the cavity, facilitating heat exchange. Figure 1 and Figure 4 As shown, the outer side of the first heat sink corresponding to the first air inlet and / or the first air outlet is a fixed plane, and the fixed plane is used for attaching and fixing the first cold end. Optionally, the first cold surface is also coated with thermal conductive silicone grease to increase the thermal conductivity with the fixed plane. Optionally, the first cold surface can also be fixed to the fixed plane by screws.

[0089] In some embodiments of the present disclosure, Figures 1 to 10As shown, the first air inlet and / or the first air outlet is generally the turning point of the first internal circulation air duct. While the outer side of the first radiator corresponding to the first air inlet and / or the first air outlet is made a fixed plane, the inner side of the first radiator corresponding to the first air inlet and / or the first air outlet can be made an arc-shaped surface. The arc-shaped surface can enhance the guiding effect of the air flowing in the first internal circulation air duct, so that the air can flow in a directed manner along the first internal circulation air duct to avoid turbulence and the like.

[0090] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first air inlet and / or the first air outlet are respectively the turning points of the first internal circulation air duct. In order to make the first cold surface fully contact with the air at the first air inlet and / or the first air outlet, the fixed plane can be a fixed inclined plane inclined relative to the first radiator, so that the air at the first air inlet and / or the first air outlet can exchange heat more fully with the first cold surface here. Optionally, the inclination angle of the fixed inclined plane relative to the horizontal plane is 30° to 60°. For example, the fixed inclined plane can be a plane inclined 45° relative to the horizontal plane.

[0091] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a plurality of cooling fins may be provided on the outside of the first heat sink away from the cavity (except the area where the first cold surface is provided), and the contact area between the first heat sink and the ambient air is increased by the cooling fins, thereby improving the heat dissipation efficiency of the first heat sink.

[0092] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the first radiator can be a cast aluminum radiator.

[0093] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the first radiator includes a first upper cover radiator and a first lower cover radiator, and accordingly, the closed shell is provided with first openings at the top and bottom, respectively, the first upper cover radiator is arranged at the first opening at the top of the closed shell, and the first lower cover radiator is arranged at the first opening at the bottom of the closed shell, the first upper cover radiator and the first lower cover radiator are respectively sealed and connected to the closed shell, and the closed shell can be kept in a closed state by sealing the first opening with the first upper cover radiator and the first lower cover radiator. Through the first upper cover radiator and the first lower cover radiator, the air in the cavity can have a heat dissipation function at both the top and the bottom of the closed shell, thereby improving the heat dissipation capacity of the closed shell.

[0094] In some embodiments of the present disclosure, Figures 1 to 10As shown, optionally, the closed optical machine also includes a base, which is arranged at the bottom of the closed shell so that the bottom of the closed shell is suspended, so that a certain air flow space can be provided at the bottom of the closed shell for air flow to pass through so that the first lower cover radiator can better dissipate heat.

[0095] As an optional embodiment, the imaging assembly is vertically arranged in the cavity, the first air inlet is located at the bottom of the imaging assembly, and the first air outlet is located at the top of the imaging assembly; the first radiator at least covers the bottom of the imaging assembly and / or the top of the imaging assembly.

[0096] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the imaging assembly is vertically arranged in the cavity, that is, the first Fresnel lens, the heat-insulating transparent body, the display panel and the second Fresnel lens in the imaging assembly are spaced and vertically arranged in the cavity, and the gaps between the first Fresnel lens, the heat-insulating transparent body, the display panel and the second Fresnel lens are in a vertical state, so that the first air inlet can be located at the bottom of the imaging assembly and the first air outlet can be located at the top of the imaging assembly, so that the first internal circulation air duct enters the gaps between the imaging assemblies from the bottom of the imaging assembly to cool down the heat-generating devices such as the display panel in the imaging assembly.

[0097] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the first radiator covers at least the bottom of the imaging assembly and / or the top of the imaging assembly. On the one hand, the air in the cavity can be cooled down by the first radiator before entering the imaging assembly to form cold air, and the hot air discharged from the imaging assembly can be cooled down by the first radiator to avoid bringing heat into other areas in the cavity, and at the same time, the contact area between the first radiator and the air in the cavity can be increased to improve the heat dissipation efficiency; on the other hand, the first cold end can be set by the first radiator, so that the first cold end corresponds to the position of the first air inlet and / or the first air outlet, and the air at the first air inlet and / or the first air outlet is cooled down by the first cold end.

[0098] As an optional implementation, Figures 1 to 10 As shown, the inner side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is an arc surface, and the outer side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is a fixed plane.

[0099] In some embodiments of the present disclosure, Figures 1 to 10As shown, the inner side of the first radiator corresponding to the bottom of the imaging component is the area where the first air inlet is located, and the first internal circulation air duct turns here, so that the inner side of the first radiator corresponding to the bottom of the imaging component can be an arc-shaped surface, and the arc-shaped surface can enhance the guiding effect on the air flowing in the first internal circulation air duct, so that the air can flow along the first internal circulation air duct in a direction, avoiding turbulence, etc.; at the same time, the outer side of the first radiator corresponding to the bottom of the imaging component is a fixed plane, and the fixed plane is used to fix the first cold end, so that the first cold end can correspond to the position of the first air inlet.

[0100] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the inner side of the first radiator corresponding to the top of the imaging component is the area where the first air outlet is located, and the first internal circulation air duct turns here, so that the inner side of the first radiator corresponding to the top of the imaging component can be an arc-shaped surface, and the arc-shaped surface can enhance the guiding effect on the air flowing in the first internal circulation air duct, so that the air can flow along the first internal circulation air duct in a directed manner, avoiding turbulence, etc.; at the same time, the outer side of the first radiator corresponding to the top of the imaging component is a fixed plane, and the fixed plane is used to fix the first cold end, so that the first cold end can correspond to the position of the first air outlet.

[0101] As an optional implementation, Figures 1 to 10 As shown, the enclosed optical engine further includes a light source assembly, a second heat sink and a second fan. The light source assembly is disposed in the cavity; the second heat sink and the light source assembly are disposed on the outside of the enclosed housing correspondingly; the second fan is disposed outside the enclosed housing to form a second external air duct outside the enclosed housing, and the second external air duct passes through the second heat sink.

[0102] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the light source assembly includes a lamp board, which may be an LED lamp board, which has the advantages of long life, low energy consumption, low heat generation rate, and low noise. Optionally, the closed housing is provided with a third opening, the lamp board is arranged at the third opening and is sealed and connected to the closed housing, and the light emitting direction of the lamp board is toward the cavity.

[0103] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the light source assembly further includes a focusing member, which is arranged on the side of the light source board where the light is emitted, and the light emitted by the light source board is converged or shaped by the focusing member, thereby improving the utilization rate of the light emitted by the light source assembly and improving energy efficiency. Optionally, the focusing member can be a plano-convex lens or a light cup.

[0104] For example, Figure 7As shown, the light source assembly includes a lamp board and a light cup. The lamp board is arranged at the third opening, and the light emitting direction of the lamp board is toward the cavity. At the same time, the light cup is arranged in the cavity in the light emitting direction of the lamp board, and the light emitted by the lamp board is converged or shaped by the light cup.

[0105] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the closed shell includes a main shell and an optical cup shell connected to the main shell, the corresponding cavity portion in the main shell is used to set the imaging component and the first fan, and the corresponding cavity portion in the optical cup shell can be used to set the optical cup. At the same time, a third opening is opened on the optical cup shell to set the light board. Optionally, an optical cup radiator can be provided on the optical cup shell, and the optical cup radiator is used to dissipate heat from the optical cup. The setting method of the optical cup radiator can be the same as the first radiator, or it can be different, and it can be suitably selected according to the heat dissipation requirements of the optical cup, which will not be repeated here.

[0106] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second heat sink is arranged on the outside of the closed housing corresponding to the light source assembly, and is used to dissipate heat from the light source assembly. Optionally, the second heat sink can be in close contact with the light source assembly for heat transfer and heat dissipation, and the second heat sink can also be connected to the light source assembly through a heat pipe for heat transfer and heat dissipation.

[0107] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second fan is arranged outside the closed housing. Optionally, the second fan can be fixed on the outside of the closed housing, or can be fixed through a second radiator so that the second radiator is located outside the closed housing. The second fan is used to form a second external air duct outside the closed housing, so that the second external air duct passes through the second radiator, thereby increasing the air flow speed of the second radiator, thereby improving the heat dissipation efficiency of the second radiator. Optionally, the second external air duct can pass through any one or more of the upper side, lower side, front side and rear side of the closed optical machine.

[0108] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second fan can be a vortex fan or an axial flow fan.

[0109] As an optional implementation, Figures 1 to 10 As shown, the second external air duct passes through the outer side of the first radiator. In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second external air duct formed by the second fan also passes through the outside of the first radiator, increasing the air flow speed outside the first radiator, thereby improving the heat dissipation efficiency of the first radiator. Figure 1As shown, the first radiator includes a first upper cover radiator located on the upper side of the closed optical machine and a first lower cover radiator located on the lower side of the closed optical machine. The second external air duct can pass through the upper and lower sides of the closed optical machine, thereby improving the heat dissipation efficiency of the first radiator through the first upper cover radiator and the first lower cover radiator.

[0110] As an optional implementation, Figures 1 to 10 As shown, the second external air duct passes through the first hot end.

[0111] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second external air duct formed by the second fan also passes through the first hot end, increasing the air flow speed of the first hot end, thereby improving the heat dissipation efficiency of the first semiconductor refrigerator. Figure 1 As shown, the first radiator includes a first upper cover radiator located on the upper side of the closed optical machine and a first lower cover radiator located on the lower side of the closed optical machine, and at the same time, the first semiconductor refrigerator is arranged on the first upper cover radiator and / or the first lower cover radiator, and the second external air duct can pass through the upper and lower sides of the closed optical machine, thereby improving the heat dissipation efficiency of the first hot end of the first semiconductor refrigerator through the first upper cover radiator and / or the first lower cover radiator.

[0112] As an optional implementation, Figures 1 to 10 As shown, the second fan is located on a side of the second radiator away from the closed shell, and the second fan includes a second fan air inlet and a second fan air outlet. The second fan air inlet faces the second radiator, and the second fan air outlet faces a side away from the second radiator.

[0113] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second fan is located on the side of the second radiator away from the closed housing, and the air inlet of the second fan is directed toward the second radiator, and the air outlet of the second fan is directed toward the side away from the second radiator, as shown in FIG. Figure 1 As shown, a second external air duct can be formed to flow from the right side of the closed optical machine to the left side of the closed machine. When the air flows in the second external air duct, it can exchange heat with the first radiator and the second radiator, thereby taking away the heat of the first heat exchanger and the second heat exchanger.

[0114] As an optional implementation, Figures 1 to 10 As shown, the first semiconductor refrigerator also includes a first hot end radiator communicated with the first hot end, and the first hot end radiator is arranged outside the closed shell.

[0115] In some embodiments of the present disclosure, Figures 1 to 10As shown, the first semiconductor refrigerator also includes a first hot end radiator connected to the first hot end, and the first hot end radiator can be fixed outside the closed shell. The first hot end radiator is used to dissipate heat to the first hot end. The heat generated by the first hot end can be dissipated outwardly through the first hot end radiator. The first hot end radiator can improve the heat dissipation efficiency of the first hot end and improve the cooling effect of the first semiconductor refrigerator on the cavity.

[0116] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the first hot end includes a copper substrate, the first hot end radiator includes a plurality of cooling fins, and the first hot end and the first hot end radiator can be connected through a connecting heat pipe so that the heat of the first hot end is transferred to the first hot end radiator and dissipated through the first hot end radiator.

[0117] As an optional implementation, the second external air duct passes through the first hot end and / or the first hot end radiator.

[0118] In some embodiments of the present disclosure, Figures 1 to 10 As shown, by passing the second external air duct through the first hot end, the air flowing in the second external air duct can exchange heat with the first hot end, taking away the heat of the first hot end, so as to achieve heat dissipation and cooling of the first semiconductor refrigerator.

[0119] In some embodiments of the present disclosure, Figures 1 to 10 As shown, by passing the second external air duct through the first hot end radiator, the air flowing in the second external air duct can exchange heat with the first hot end radiator, taking away the heat of the first hot end radiator and the first hot end, so as to achieve heat dissipation and cooling of the first semiconductor refrigerator. In this embodiment, the first cold end absorbs the heat in the cavity, and transfers the absorbed heat and the heat generated by the first semiconductor refrigerator itself to the first hot end, the first hot end conducts the heat to the first hot end radiator, and the first hot end radiator dissipates the heat through the second external air duct, thereby completing a heat dissipation cycle.

[0120] In some embodiments of the present disclosure, Figures 1 to 10As shown, optionally, the heat dissipation capacity of the first hot end radiator needs to match the working power of the electronic components in the first semiconductor refrigerator. For example, if the working power of the first semiconductor refrigerator is 20W and the cooling efficiency of the first semiconductor refrigerator is 60%, the heat dissipation required to be performed by the first hot end radiator is about 33W. The heat dissipation capacity of a single heat pipe with a diameter of 8mm is 40W, and the heat dissipation capacity of a single heat pipe with a diameter of 6mm is 30W. In order to enable the first hot end radiator to meet the heat dissipation required to be performed, the first hot end radiator can be provided with a heat pipe with a diameter of 8mm or two heat pipes with a diameter of 8mm. At the same time, when the closed optical machine is working, the working power of the first semiconductor refrigerator and the air volume of the second external air duct will also affect the heat dissipation capacity of the second hot end radiator, and then affect the cooling effect of the first semiconductor refrigerator. Therefore, the area and working power of the first semiconductor refrigerator, the speed of the second fan and the heat dissipation capacity of the first hot end radiator can be adjusted according to the heat dissipation requirements. These parameters can be adjusted through simulation analysis so that the first semiconductor refrigerator can meet the heat dissipation requirements of the closed optical machine.

[0121] As an optional implementation, Figures 11 to 15 As shown, optionally, the second heat sink includes a central heat sink, a plurality of first heat sink ribs, and a plurality of second heat sink ribs. The central heat sink and the light source assembly are arranged on the outside of the closed housing in correspondence; the plurality of first heat sink ribs are arranged at intervals around the central heat sink, and the plurality of first heat sink ribs extend around the central heat sink; the plurality of second heat sink ribs are connected to one end of the first heat sink away from the central heat sink, and the plurality of second heat sink ribs extend around the plurality of first heat sink ribs.

[0122] In some embodiments of the present disclosure, Figures 11 to 15 As shown, the first heat dissipation rib is arranged around the periphery of the central heat dissipation plate, and the second heat dissipation rib is connected to the end of the first heat dissipation rib away from the first heat dissipation rib, which can form a structure shaped like a sunflower. In the embodiments of the present disclosure, the radiator with this structure can be called a sunflower-type radiator.

[0123] In some embodiments of the present disclosure, Figures 11 to 15As shown, the central heat dissipation plate of the second heat sink is arranged on the outside of the closed shell corresponding to the light source assembly, and can exchange heat with the light source assembly, and the heat of the light source assembly can be transferred to the central heat dissipation plate. A plurality of first heat dissipation ribs are arranged at intervals around the central heat dissipation plate. The central heat dissipation plate can not only exchange heat with the air in the environment, but also transfer heat to the first heat dissipation ribs, and there are ventilation gaps between adjacent heat dissipation ribs, so that the first heat dissipation ribs can exchange heat with the air in the environment. A plurality of second heat dissipation ribs are connected to one end of the first heat dissipation rib away from the central heat dissipation plate, and extend around the first heat dissipation ribs. The first heat dissipation ribs can transfer heat to the second heat dissipation ribs, and exchange heat with the air in the environment through the second heat dissipation ribs. The second heat sink not only has a relatively large heat dissipation area, but also has ventilation gaps between adjacent first heat dissipation ribs and adjacent second heat dissipation ribs, so that the air flowing in the second external air duct can pass through these ventilation gaps, which can not only increase the heat dissipation efficiency of the first heat dissipation ribs and the second heat dissipation ribs, but also has low wind resistance, and does not require high power for the second fan. In addition, the second heat sink

[0124] In some embodiments of the present disclosure, Figures 11 to 15 As shown, the sunflower-shaped heat sink can be integrally formed by die-casting, so that the manufacturing cost of the second heat sink is low, which can effectively reduce the manufacturing cost of the closed optical machine. At the same time, the sunflower-shaped heat sink is relatively compact and is more suitable for closed optical machines with relatively large size restrictions.

[0125] In some embodiments of the present disclosure, Figures 11 to 15 As shown, the central heat sink corresponds to the light board structure in the light source assembly, and is suitable to be equivalent to the size of the light board. For example, the size of the central heat sink can be obtained according to the following formula:

[0126] The length / width of the central heat dissipation plate = the length / width of the lamp panel + the gap width + the wall thickness of the closed shell, wherein the gap is the sealing gap when the sealing plate and the closed shell are assembled, which can generally be 0.1mm~0.3mm, for example, it can be 0.1mm, 0.2mm, 0.3mm; the wall thickness of the closed shell can be 0.1mm~0.3mm, for example, it can be 0.1mm, 0.2mm, 0.3mm.

[0127] In some embodiments of the present disclosure, Figures 11 to 15As shown, the first heat dissipation rib is arranged around the periphery of the central heat dissipation plate and extends toward the periphery of the central heat dissipation plate, and the second heat dissipation rib extends toward the periphery of the central heat dissipation plate to form a roughly circular second heat dissipation area; the second heat dissipation rib is connected to the end of the first heat dissipation rib away from the central heat dissipation plate and extends toward the periphery of the second heat dissipation rib (second heat dissipation area) to form a roughly circular third heat dissipation area. Optionally, the diameter of the second heat dissipation area is 30% to 40% of the diameter of the third heat dissipation area.

[0128] For example, when the length and width of the lamp board are 40 mm respectively and the length and width of the fan are 120 mm respectively, it is concluded through simulation experiments that the second heat dissipation area formed by the second heat dissipation rib can be a circle with a diameter 1.8 times the size of the lamp board. That is to say, the second heat dissipation area formed by the second heat dissipation rib is a circular area with a diameter of 40 mm × 1.8 = 720 mm, so that the second heat dissipation rib serves as the main branch of heat conduction in the second radiator, which can improve the heat dissipation conductivity and heat dissipation efficiency of the second radiator.

[0129] In some embodiments of the present disclosure, Figures 11 to 15 As shown, optionally, the orthographic projection of the second radiator on the second fan is equal to that of the second fan. That is, by making the orthographic projection of the second radiator on the second fan substantially equal to that of the second fan, the cross section of the second external air duct formed by the second fan can be made the same as that of the second radiator, and the area of ​​the second external air duct through which air flows through the second radiator can be increased as much as possible.

[0130] As an optional implementation, Figures 11 to 15 As shown, one end of each first heat dissipation rib away from the central heat dissipation plate is connected to at least two second heat dissipation ribs.

[0131] In some embodiments of the present disclosure, Figures 11 to 15 As shown, by connecting the first heat dissipation rib plate to at least two second heat dissipation rib plates, on the one hand, the heat conduction structure of the third heat dissipation area of ​​the sunflower-type radiator can be increased, thereby increasing the heat exchange area; on the other hand, since there are ventilation gaps between each second heat dissipation rib plate, the wind resistance of the second fan will not be increased.

[0132] In some embodiments of the present disclosure, Figures 11 to 15As shown, optionally, the second heat dissipation rib plate extends toward the light source assembly compared to the central heat dissipation plate. The second heat dissipation rib plate extends toward the light source assembly by a certain distance, which can increase the heat exchange distance between the second heat dissipation rib plate and the air in the second external air duct, thereby improving the heat exchange efficiency of the second heat dissipation rib plate to a certain extent. Similarly, the third heat dissipation rib plate is connected to the second heat dissipation rib plate, and the third heat dissipation rib plate extends toward the light source assembly compared to the central heat dissipation plate. The third heat dissipation rib plate extends toward the light source assembly by a certain distance, which can increase the heat exchange distance between the third heat dissipation rib plate and the air in the second external air duct, thereby improving the heat exchange efficiency of the third heat dissipation rib plate to a certain extent.

[0133] In some embodiments of the present disclosure, Figures 11 to 15 As shown, optionally, the light cup shell part of the closed shell can appropriately adjust the outer contour of the light cup shell according to the structure of the light cup, so that the cross-sectional area of ​​the light cup shell in the vertical direction is smaller than the cross-sectional area of ​​the main shell in the vertical direction, that is, the space occupied by the light cup shell is reduced, and a certain space is reserved for the second heat dissipation rib plate and the third heat dissipation rib plate to avoid the light source assembly.

[0134] As an optional implementation, Figures 1 to 10 As shown, the closed optical machine also includes a second semiconductor refrigerator, which is arranged in the cavity. The second semiconductor refrigerator includes a second cold end and a second hot end arranged opposite to the second cold end, and the second hot end is arranged on the inner side of the closed shell.

[0135] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the second semiconductor refrigerator is located in the cavity, and can cool the cavity through the first cold end, and transfer heat to the second hot end at the same time. The second hot end is arranged on the inner side of the closed shell by bonding, and can transfer and diffuse heat outward through the closed shell, and can increase the temperature of the closed shell and the second hot end, increase the temperature difference between the closed shell and the ambient air, and thus increase the heat dissipation efficiency.

[0136] In some embodiments of the present disclosure, Figures 1 to 10As shown, the second semiconductor refrigerator is located in the cavity. Compared with the solution in which the first semiconductor refrigerator is arranged at the bottom of the closed shell and the position corresponding to the first air inlet, the second hot end of the second semiconductor refrigerator proposed in the embodiment of the present disclosure is attached to the inner side of the closed shell, which will not increase the wind resistance of the second external air duct outside the closed shell, and the original air volume per unit time remains unchanged, which can improve the utilization rate of the second fan. In addition, in the solution in which the first semiconductor refrigerator is arranged at the bottom of the closed shell and the position corresponding to the first air inlet, the size of the first semiconductor refrigerator is limited, resulting in low heat exchange efficiency; if the size of the copper plate in the first semiconductor refrigerator is increased to increase the heat dissipation area, the cost of the first semiconductor refrigerator is high, which is not conducive to reducing or maintaining the cost of the closed optical machine.

[0137] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a first semiconductor refrigerator can be arranged on the outside of the closed shell corresponding to the first air outlet, and a second semiconductor refrigerator can be arranged in the cavity. The cost of combining the first semiconductor refrigerator with the second semiconductor refrigerator is not much different from the cost of arranging the first semiconductor refrigerator at the bottom of the closed shell corresponding to the first air inlet, but the heat dissipation effect can be significantly improved.

[0138] In some embodiments of the present disclosure, Figures 1 to 10 As shown, since the second hot end dissipates heat by fitting with the closed housing, the area where the closed housing fits with the second hot end needs to be thermally conductive. Optionally, the area where the closed housing fits with the second hot end can be a part of the first radiator or a separately provided heat-conducting structure.

[0139] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the first internal circulation air duct passes through a second cold end, and the second cold end is in the path of the first internal circulation air duct. The air in the first internal circulation air duct can be cooled by the second cold end, thereby reducing the air temperature of the first internal circulation air duct and further reducing the temperature in the cavity and the imaging component.

[0140] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the second cold end may be provided with a plurality of fins extending into the cavity, so that the heat exchange area with the air in the cavity is increased by the fins.

[0141] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the second external air duct can increase the air flow speed of the closed shell part attached to the second hot end through the closed shell part attached to the second hot end, thereby improving the heat dissipation efficiency there.

[0142] As an optional implementation, Figures 1 to 10 As shown, the closed optical machine also includes a lens assembly and a first reflector. The closed housing is provided with a second opening, the lens assembly is arranged at the second opening and is sealed and connected to the closed housing; the first reflector is arranged in the cavity, and the first reflector is arranged obliquely relative to the imaging assembly to reflect the imaging light path of the imaging assembly to the lens assembly; the closed housing is provided with a housing chamfer at a portion corresponding to the first reflector, the first internal circulation air duct passes through the inner side of the housing chamfer and the second external air duct passes through the outer side of the housing chamfer; the second hot end is arranged in affixed relation to the inner side of the housing chamfer.

[0143] In some embodiments of the present disclosure, Figures 1 to 10 As shown, a second opening communicating with the cavity is provided on the front side of the closed housing, and the lens assembly can be arranged at the second opening and sealedly connected to the closed housing. Optionally, an airtight sealing filler is provided between the second opening and the lens assembly, so that the cavity can maintain good sealing, dust can be prevented from entering the cavity, and the optical device in the cavity can be kept clean.

[0144] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the lens assembly is located at the front side of the closed optical machine, the light source assembly and the imaging assembly are arranged along the left and right direction of the closed optical machine, the imaging light path of the imaging assembly is perpendicular to the projection direction of the lens assembly, and the imaging light path of the imaging assembly cannot directly enter the lens assembly, and the direction of the imaging light path needs to be adjusted by the first reflector. Optionally, the first reflector is disposed in the cavity, and the first reflector is tilted relative to the imaging assembly, so that the imaging light path of the imaging assembly can be adjusted by the first reflector, so that the imaging pipeline changes direction and is reflected into the lens assembly.

[0145] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, a shell chamfer can be provided at the portion of the closed shell corresponding to the first reflector, and the second hot end is arranged on the inner side of the shell chamfer. At the same time, since the first internal circulation air duct passes through the inner side of the shell chamfer and the second external air duct passes through the outer side of the shell chamfer, the air flowing in the first internal circulation air duct can exchange heat with the second cold end for cooling in the cavity; outside the closed shell, the wind resistance of the second external air duct at the shell chamfer is relatively small, and the air flowing in the second external air duct can exchange heat with the outer side of the shell chamfer corresponding to the second cold end for cooling. At the same time, outside the closed shell, the structure of the closed shell itself remains unchanged, and the wind resistance of the second external air duct will not be increased.

[0146] As an optional implementation, Figures 1 to 10 As shown, the closed optical engine also includes a third fan, which is arranged outside the closed shell to form a third external air duct outside the closed shell. The third external air duct passes through the outer side of the chamfer of the shell and is connected with the second external air duct.

[0147] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the closed optical machine also includes a third fan, which is arranged outside the closed shell to form a third external air duct outside the closed shell. The third external air duct passes through the outer side of the shell chamfer, which can increase the air volume contacted by the shell chamfer that the second hot end is attached to, and improve the heat exchange efficiency of the shell chamfer. Optionally, by connecting the third external air duct with the second external air duct, the driving force of the third fan and the second fan can be superimposed, and the total air volume formed by the third fan and the second fan can be increased to a certain extent under the same power, the utilization rate is increased, the wind resistance is reduced, and the total speed of the fan does not need to be increased much; at the same time, the second external air duct is connected with the third external air duct, which can form a continuous air duct on the rear side of the closed optical machine, increase the overall air flow range and flow speed of the rear side of the closed optical machine, and form an air flow field of a certain length and range, so as to improve the overall heat dissipation capacity of the closed optical machine.

[0148] As an optional implementation, Figures 1 to 10 As shown, optionally, a hollow support frame located outside the chamfer of the shell is provided on the closed shell, and the third fan is arranged on the hollow support frame so that the third external air duct is located between the chamfer of the shell and the hollow support frame.

[0149] In some embodiments of the present disclosure, Figures 1 to 10 As shown, by arranging a hollow support frame on the chamfer of the shell, fixing the third fan through the hollow support frame, adjusting the direction of the third fan air inlet and the third fan air outlet of the third fan and the path of the third external air duct through the setting position of the third fan, the third external air duct is located between the chamfer of the shell and the hollow support frame, thereby increasing the heat exchange efficiency between the air flowing in the third external air duct and the second hot end. A plurality of hollow holes are opened on the hollow support frame to reduce the wind resistance generated by the hollow support frame.

[0150] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the third fan may be a turbine fan.

[0151] As an optional implementation, Figures 1 to 10 As shown, the third fan includes a third fan air inlet and a third fan air outlet, the first hot end radiator is located at the third fan air outlet, and the second hot end is located at the third fan air inlet.

[0152] In some embodiments of the present disclosure, Figures 1 to 10 As shown, by locating the first hot end radiator at the air outlet of the third fan and the second hot end at the air inlet of the third fan, the air flowing in the third external air duct formed by the third fan can exchange heat with the second hot end and the first hot end radiator in sequence, and the heat exchange efficiency of the second hot end and the first hot end radiator can be improved simultaneously through the third fan.

[0153] In some embodiments of the present disclosure, Figures 1 to 10 As shown, optionally, the closed optical machine is provided with a first semiconductor refrigerator, a second semiconductor refrigerator and a first fan. The first hot end radiator in the first semiconductor refrigerator and the second hot end of the second semiconductor refrigerator both correspond to the third external air duct formed by the third fan. The first hot end radiator and the second hot end can be cooled by the third external air duct. At the same time, the first hot end radiator and the second hot end have a lower wind resistance to the third fan, so that the utilization rate of the third fan is higher and the demand for rotation speed is lower, which can also reduce the damage caused by the operation of the third fan to a certain extent.

[0154] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the enclosed optical engine can also design other radiators according to the heat dissipation requirements. For example, a supplementary radiator can be set on the right side and / or the rear side of the enclosed housing, and the supplementary radiator exchanges heat with the air in the cavity, thereby achieving the purpose of supplementary heat dissipation of the cavity. The location and method of setting the supplementary radiator can be adaptively adjusted according to the structure of the enclosed optical engine, and will not be repeated here.

[0155] In some embodiments of the present disclosure, Figures 1 to 10 As shown, the first cold end of the first semiconductor refrigerator corresponds to the air outlet of the first fan in the first internal circulation air duct and the first air inlet of the imaging component. The first cold end is used to exchange heat with the air flowing in the first internal circulation air duct to reduce the temperature of the air in the first internal circulation air duct, thereby reducing the temperature of the imaging component passing through the first internal circulation air duct; the function of the first hot end heat sink is to use the external air duct to take away the heat exchanged by the first cold end and the heat generated by the first semiconductor refrigerator itself, thereby realizing the heat dissipation of the closed optical machine. Figure 8 As shown, cold air enters from the right side of the closed light machine, exchanges heat with the first radiator through the upper and lower sides of the closed light machine, and exchanges heat with the first hot-end radiator through the first hot-end radiator at the same time, and then discharges the heat from the right side of the closed light machine to the area where the closed light machine is located, thereby achieving the heat dissipation purpose of the light machine.

[0156] Next, the heat dissipation effect of the enclosed fan proposed in the present disclosure is analyzed through simulation analysis.

[0157] Example 1

[0158] The first semiconductor refrigerator is not provided in the closed optical machine. Fig.16 The temperature distribution diagram of plane Z=0 when there is no first semiconductor refrigerator in the closed optical machine is shown. Fig.17The air flow velocity distribution diagram of plane Z=0 when there is no first semiconductor refrigerator in the closed optical machine is shown. From the simulation analysis results, it can be concluded that the temperature of the display panel is 73.9°C, the temperature of the insulating transparent body is 72.1°C, and the air temperature at the first air inlet in the cavity is 47.3°C.

[0159] Example 2

[0160] The closed optical machine is provided with a first semiconductor refrigerator. Fig.18 The temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 0A is shown. Fig.23 The temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 0A is shown. Fig.28 The three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor cooler in the closed optical machine is 0A is shown. From the simulation analysis results, it can be concluded that when the TEC working current is 0A, the temperature of the display panel is 71.6°C, the temperature of the insulating transparent body is 68.2°C, and the air temperature at the first air inlet in the cavity is 46°C.

[0161] By comparing Example 1 and Example 2, it can be seen that when the first semiconductor cooler is provided in the closed optical machine and its operating current is 0A, the heat dissipation improvement is not obvious. The reason is that when the operating current of the first semiconductor cooler is 0A, the thermal conductivity of the first semiconductor cooler is low, resulting in an insignificant heat dissipation improvement effect.

[0162] Example 3

[0163] A first semiconductor refrigerator is provided in the closed optical machine and the working current of the first semiconductor refrigerator is 2.5A. Fig.19 The temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 2.5A is shown. Fig.24 The temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 2.5A is shown. Fig.29 The three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor refrigerator in the closed optical machine is 2.5A is shown. From the simulation analysis results, it can be concluded that when the working current of the first semiconductor refrigerator is 2.5A, the temperature of the display panel is 67.3°C, the temperature of the insulating transparent body is 63.4°C, and the air temperature at the first air inlet in the cavity is 41.9°C.

[0164] By comparing Example 1 with Example 3, it can be seen that the first semiconductor refrigerator in the closed optical machine has a relatively obvious heat dissipation improvement effect under a certain working current. The reason is that after the first semiconductor refrigerator is working, the temperature of the first cold end is low, which can reduce the air temperature in the first internal circulation air duct, so that the temperature of the display panel and the insulating transparent body is relatively significantly reduced.

[0165] Example 4

[0166] The closed optical machine is provided with a first semiconductor refrigerator and a third fan, and the working current of the first semiconductor refrigerator is 2.5A. Fig. 20 The temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 2.5A and a third fan is provided is shown. Fig.25 The temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 2.5A and a third fan is provided is shown. Fig.30 The three-dimensional temperature distribution diagram of the first hot end heat sink in the closed optical machine is shown when the working current of the first semiconductor cooler is 2.5A and a third fan is provided. From the simulation analysis results, it can be concluded that when the third fan is working and the working current of the first semiconductor cooler is 2.5A, the temperature of the display panel is 64.6°C, the temperature of the insulating transparent body is 59.9°C, and the air temperature at the first air inlet in the cavity is 39.1°C.

[0167] Example 5

[0168] A first semiconductor refrigerator is provided in the closed optical machine and the working current of the first semiconductor refrigerator is 4.5A. Fig.21 The temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 4.5A is shown. Fig.26 The temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 4.5A is shown. Fig.31 The three-dimensional temperature distribution diagram of the first hot end heat sink when the working current of the first semiconductor refrigerator in the closed optical machine is 4.5A is shown. From the simulation analysis results, it can be concluded that when the working current of the first semiconductor refrigerator is 4.5A, the temperature of the display panel is 68.2°C, the temperature of the insulating transparent body is 64.4°C, and the air temperature at the first air inlet in the cavity is 42.8°C.

[0169] By comparing Example 3 and Example 5, it can be seen that after the working current of the first semiconductor refrigerator increases, the temperature of the display panel and the transparent insulation body increases. Analysis of the reasons shows that after the working current of the first semiconductor refrigerator increases, the heat generated by the first semiconductor refrigerator itself increases significantly, causing the temperature of the first hot end to increase significantly, resulting in an increase in the temperature of the first cold end, which increases the air temperature in the cavity.

[0170] Example 6

[0171] The closed optical machine is provided with a first semiconductor refrigerator and a third fan, and the working current of the first semiconductor refrigerator is 4.5A. Fig. 22 The temperature distribution diagram of plane Z=0 when the working current of the first semiconductor cooler in the closed optical machine is 4.5A and a third fan is provided is shown. Fig. 27 The temperature distribution diagram of the first cold end and the cavity when the working current of the first semiconductor refrigerator in the closed optical machine is 4.5A and a third fan is provided is shown. Fig.32 The three-dimensional temperature distribution diagram of the first hot end heat sink in the closed optical machine is shown when the working current of the first semiconductor cooler is 4.5A and a third fan is provided. From the simulation analysis results, it can be concluded that when the third fan is working and the working current of the first semiconductor cooler is 4.5A, the temperature of the display panel is 62.8°C, the temperature of the insulating transparent body is 58.2°C, and the air temperature at the first air inlet in the cavity is 37.4°C.

[0172] By comparing Example 5 and Example 6, it can be seen that by providing a third fan, the heat of the first hot end radiator can be taken away, the working efficiency of the first semiconductor refrigerator is significantly improved, the temperature of the first cold end is significantly reduced, the air in the cavity is cooled, and the temperature of the display panel and the transparent insulation body is reduced.

[0173] Table 1 Simulation analysis experimental results of Examples 1 to 6

[0174]

[0175] From Table 1 we can see that:

[0176] 1. When there is no first semiconductor refrigerator in the closed optical machine, the temperature of the display panel is 73.9°C; when the first semiconductor refrigerator is provided in the closed optical machine and the working current of the first semiconductor refrigerator is 0A, the temperature of the display panel is 71.6°C, and the temperature is reduced by 2.3°C;

[0177] 2. When the heat dissipation condition of the first semiconductor refrigerator is bad, after the working current of the first semiconductor refrigerator increases, the temperature of the first cold end and the first hot end increases, resulting in a certain increase in the temperature of the display panel and the transparent insulation body. By comparing Example 3 with Example 5, it can be seen that when the working current of the first semiconductor refrigerator increases from 2.5A to 4.5A, the temperature of the display panel increases by 0.9°C, and the temperature of the insulation transparent body increases by 1°C;

[0178] 3. When the heat dissipation condition of the first semiconductor refrigerator is good, after the working current of the first semiconductor refrigerator increases, the temperature of the first cold end and the first hot end decreases, and the temperature of the display panel and the heat-insulating transparent body decreases to a certain extent. By comparing Example 4 and Example 6, it can be seen that after adding the third fan to dissipate the heat of the first hot end radiator connected to the first hot end, the working current increases from 2.5A to 4.5A, the temperature of the display panel decreases by 1.8°C, and the temperature of the heat-insulating transparent body decreases by 1.6°C;

[0179] 4. Comparing Example 1 and Example 3, the working current of the first semiconductor refrigerator is 2.5A, and the temperature of the display panel is reduced by 6.6°C;

[0180] 5. Comparing Example 1 and Example 6, the working current of the first semiconductor cooler is 4.5A. After the third fan is added to dissipate heat from the first hot end radiator connected to the first hot end, the temperature of the display panel is reduced by 11.1°C.

[0181] According to the above simulation analysis embodiment, this article discloses a method for selecting a first semiconductor refrigerator in a closed optical machine (the method for selecting a second semiconductor refrigerator is the same and will not be repeated here), as follows:

[0182] S1. Determination of the cooling capacity of the first semiconductor refrigerator

[0183] (a) In the case where the closed optical machine is not provided with the first semiconductor cooler, the display panel temperature and the air temperature at the first air inlet in the cavity are obtained by simulation analysis. The display panel temperature and the air temperature at the first air inlet in this case are respectively recorded as T LCD and T 腔体 .

[0184] (b) When the first semiconductor refrigerator is set in the closed optical machine, the first cold end is made to correspond to the first air inlet position in the first internal circulation air duct, and the first cold end can exchange heat with the air at the first air inlet. When the temperature of the first cold end decreases, the temperature of the air at the first air inlet in the cavity will also decrease. In this case, the display panel temperature and the air temperature at the first air inlet are respectively recorded as T LCD1 and T 腔体1 , the temperature of the first cold end is recorded as T 第一冷端 If you want T LCD1 =T LCD -10℃, T 腔体1 =T 腔体 -10℃, and since the temperature of the first cold end is lower than the air temperature at the first air inlet, ΔT1=T 腔体1 -T 第一冷端 =10℃.

[0185] (c) The calculation formula for the cooling capacity required by the air in the cavity is Q1=C·M·ΔT1. Wherein, Q1 is the cooling capacity required by the air in the cavity (W); C is the specific heat capacity of the air (1005J / Kg·℃), which is calculated as 1005J / Kg·℃ in this disclosure; M is the air mass flow rate at the first fan outlet (Kg / s); ΔT1 is the temperature difference between the air temperature at the first air inlet and the first cold end (℃).

[0186] The calculation formula of the air mass flow rate at the first fan outlet is M = ρ·V / t = ρ·S·v / t. Where ρ is the density of air (Kg / m 3 ), in this disclosure, 1.205Kg / m 3 S is the area of ​​the first fan outlet (m 2 ), v is the average speed of the first fan outlet (m / s), which is obtained through simulation (when the closed optical machine is not equipped with the first semiconductor refrigerator).

[0187] Through the above formula, the cooling capacity Q1 required by the air in the cavity is finally calculated.

[0188] (d) The cooling capacity required by the air in the cavity is equal to the cooling capacity of the first cold end in the first semiconductor refrigerator.

[0189] (e) The calculation formula for the cooling capacity of the first cold end of the first semiconductor refrigerator is Q1 = h·A1·ΔT1, where h is the convection heat transfer coefficient (W / m 2 K), in this disclosure, h is 30W / m 2 K, A1 is the heat dissipation surface area of ​​the first cold end (m 2 ), ΔT1 is the temperature difference between the air temperature at the first air inlet and the first cold end (°C).

[0190] Through the above formula, the heat dissipation surface area A1 of the first cold end is finally calculated.

[0191] S2. Determination of the temperature difference of the first semiconductor refrigerator

[0192] TEC temperature difference refers to the temperature difference between the first hot end and the first cold end in TEC. The temperature difference of TEC is recorded as ΔT TEC温差 , the first hot end temperature is recorded as T 第一热端 , the first cold end temperature is recorded as T 第一冷端 If the temperature difference between the first hot end and the external environment is expected to be ≤15°C, that is, T 第一热端 -T 环温 ≤15℃, and at T 腔体1 =T 腔体 -10℃、T 腔体1 -T 第一冷端 =10℃, then ΔTTEC温差 =T 第一热端 -T 第一冷端 =T 环温 +15℃-(T 腔体1 -10℃)=T 环温 +25℃-(T 腔体 -10℃)=T 环温 +35℃-T 腔体 .

[0193] S3. Determination of the working current of the first semiconductor refrigerator

[0194] Through S1 and S2, the cooling capacity Q1 of the first semiconductor refrigerator and the temperature difference ΔT of the first semiconductor refrigerator are determined. TEC温差 , Fig.33 The cooling capacity-operating current curve diagram is shown when the hot end temperature of the first semiconductor refrigerator is 25 degrees Celsius. According to the cooling capacity-operating current curve diagram, the cooling capacity of the specific first semiconductor refrigerator and the operating current corresponding to the temperature difference of the specific first semiconductor refrigerator can be determined. It should be noted that if the intersection point of the cooling capacity of the specific first semiconductor refrigerator and the C temperature difference of the specific first semiconductor refrigerator exceeds the maximum operating current of the first semiconductor refrigerator, it means that the selection of the first semiconductor refrigerator is inappropriate.

[0195] S4. Determination of the working voltage of the first semiconductor refrigerator

[0196] After the working current of the first semiconductor cooler is determined, Fig.34 The working voltage-working current curve diagram is shown when the hot end temperature of the first semiconductor cooler is 25 degrees Celsius. The working voltage corresponding to a specific working current can be determined according to the working voltage-working current curve diagram.

[0197] S5. Determination of the dimensions of the first semiconductor refrigerator

[0198] After determining the cooling capacity of the first semiconductor refrigerator, the temperature difference of the first semiconductor refrigerator, the working current of the first semiconductor refrigerator and the working voltage of the first semiconductor refrigerator, the installation space of the first semiconductor refrigerator in the closed optical machine determines the external dimensions of the first semiconductor refrigerator.

[0199] S6. Determination of the first hot end radiator

[0200] The calculation formula of the total heating power of the first semiconductor refrigerator is Q2=Q1+P=Q1+I·U. Among them, Q2 is the total heating power of the first semiconductor refrigerator (W), Q1 is the cooling capacity required by the air in the cavity (W); P is the TEC power (W), I is the working current of the first semiconductor refrigerator (A), and U is the TEC working voltage (V).

[0201] The heat dissipation of the first hot-end radiator is equal to the total heating power of the first semiconductor refrigerator. The heat dissipation of the first hot-end radiator is calculated by the formula Q2=h·A2·ΔT2.

[0202] Where h is the convective heat transfer coefficient (W / m 2 K), when the heat dissipation of the first hot end radiator is good, h is 30W / m 2 K, A2 is the heat dissipation surface area of ​​the first hot end radiator (m 2 ), ΔT2 is the temperature difference between the first hot end radiator and the external environment (°C). From S2, we can know that ΔT2 is 15°C, and thus A2, i.e. the heat dissipation surface area of ​​the first hot end radiator, is calculated.

[0203] In summary, through the above method, the model specifications and working conditions of the first semiconductor refrigerator suitable for the closed optical machine can be obtained. At the same time, the working current and working voltage of the first semiconductor refrigerator can be automatically adjusted according to the cooling capacity required by the air in the cavity, so that the cooling capacity of the TEC meets the cooling capacity required by the air in the cavity.

[0204] For example, Fig.16 and Fig.17 As shown in the figure, according to the temperature distribution diagram and air flow velocity distribution diagram in the closed optical machine without TEC installed, through simulation analysis, it is concluded that the temperature of the display panel is 73.9℃, and the air temperature at the first air inlet in the cavity is 47.3℃. Install the first semiconductor refrigerator. If you want to reduce the temperature of the display panel by about 10℃, the cooling capacity of the first semiconductor refrigerator is Q1=C·M·ΔT1=1005*1.205*96*30*10^(-6)*1.3*10=45.3W; the temperature difference ΔT of the first semiconductor refrigerator TEC温差 =T 环温 +35-T 腔体 =25+35-47.3=12.7℃. According to the cooling capacity of the first semiconductor refrigerator and the temperature difference of the first semiconductor refrigerator, Fig.33 The first semiconductor refrigerator's cooling capacity-operating current curve is shown in FIG. 1 , and the corresponding first semiconductor refrigerator's operating current is 4.8 A. According to the first semiconductor refrigerator's operating current, Fig.34The working voltage-working current curve diagram of the first semiconductor refrigerator shown in the figure shows that the corresponding working voltage of the first semiconductor refrigerator is 7.4V. When the working current of the first semiconductor refrigerator is 4.5A, simulation analysis shows that the temperature reduction value of the display panel is 73.9-68.2=5.7°C, which is different from the desired display panel temperature reduction value LCD temperature reduction value of 10°C. The reason for the analysis is that the heat dissipation of the first hot end radiator is poor and the heat cannot be dissipated, resulting in a higher temperature of the first hot end, which in turn affects the temperature of the first cold end. In order to solve this problem, a third fan can be added to the closed optical machine. The third fan can be used to improve the heat dissipation of the first hot end radiator and improve the heat dissipation efficiency of the first hot end radiator. When the third fan is set, it can be known through simulation analysis that if Fig. 22 , Fig. 27 as well as Fig.32 It can be known that the temperatures of the first cold end, the first hot end and the first hot end heat sink can be significantly reduced, so that the temperature of the display panel is reduced by 73.9-62.8=11.1°C.

[0205] By utilizing one or more embodiments of the present disclosure, a first semiconductor refrigerator is arranged outside the closed shell corresponding to the first air inlet, and when a certain working current is set for the first semiconductor refrigerator, the temperature of the display panel and the heat-insulating transparent body can be reduced; when the first hot-end radiator is not added with a fan for heat dissipation, the working current of the first semiconductor refrigerator increases, and the temperature of the display panel and the heat-insulating transparent body cannot be effectively reduced. The reason is that as the working current of the first semiconductor refrigerator increases, the temperature of the first hot-end radiator of the first semiconductor refrigerator increases greatly, the heat load increases greatly, and the heat cannot be dissipated in time; when the first semiconductor refrigerator is set with a certain working current, the first hot-end radiator of the first semiconductor refrigerator adds a third fan, and the temperature of the display panel and the heat-insulating transparent body can be reduced; after the first hot-end radiator of the first semiconductor refrigerator adds the third fan, the working current of the first semiconductor refrigerator increases, and the temperature of the first cold end and the first hot end can be significantly reduced, thereby reducing the temperature of the display panel and the heat-insulating transparent body.

[0206] Based on the same inventive concept, an embodiment of the present disclosure proposes a projection device, which includes a projection screen and the above-mentioned optical machine, and the projection screen is used to receive the projection image of the optical machine.

[0207] Since the projection device provided by the present invention includes the closed optical machine of the above technical solution, the projection device provided by the present invention has all the beneficial effects of the above closed optical machine, which will not be described in detail here.

[0208] In the present disclosure, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0209] In addition, in the present disclosure, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0210] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this disclosure.

[0211] Although embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A closed optical machine, characterized in that: The enclosed optical machine comprises: A closed shell, wherein the closed shell is provided with a cavity; An imaging component, the imaging component is disposed in the cavity; A first fan is disposed in the cavity to form a first internal circulation air duct in the cavity, the first internal circulation air duct passes through the imaging assembly and has a first air inlet for entering the imaging assembly and a first air outlet for discharging air from the imaging assembly; and A first semiconductor refrigerator, comprising a first cold end and a first hot end arranged opposite to the first cold end, wherein the first cold end is arranged on the outer side of the closed shell, and the first cold end corresponds to the position of the first air inlet and / or the first air outlet.

2. The enclosed optical machine according to claim 1, wherein: The closed shell is provided with a first opening connected to the cavity; the closed optical engine also includes a first radiator, which is arranged at the first opening and is sealed with the closed shell; the first internal circulation air duct passes through the first radiator adjacent to the inner side of the cavity, and the first cold end is arranged on the outer side of the first radiator away from the cavity.

3. The enclosed optical machine according to claim 2, characterized in that: The imaging assembly is vertically arranged in the cavity, the first air inlet is located at the bottom of the imaging assembly, and the first air outlet is located at the top of the imaging assembly; the first radiator at least covers the bottom of the imaging assembly and / or the top of the imaging assembly.

4. The enclosed optical machine according to claim 3, wherein: The inner side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is an arc surface, and the outer side of the first radiator corresponding to the bottom of the imaging component and / or the top of the imaging component is a fixed plane.

5. The enclosed optical machine according to any one of claims 1 to 4, characterized in that: The enclosed optical machine further comprises: A light source assembly, wherein the light source assembly is disposed in the cavity; a second heat sink, the second heat sink being arranged on the outer side of the closed housing corresponding to the light source assembly; A second fan is disposed outside the closed shell to form a second external air duct outside the closed shell, and the second external air duct passes through the second radiator.

6. The enclosed optical machine according to claim 5, characterized in that: The second fan is located on a side of the second radiator away from the closed shell, and includes a second fan air inlet and a second fan air outlet. The second fan air inlet faces the second radiator, and the second fan air outlet faces a side away from the second radiator.

7. The enclosed optical machine according to claim 5, characterized in that: The first semiconductor refrigerator further includes a first hot end radiator connected to the first hot end, and the first hot end radiator is arranged outside the closed shell.

8. The enclosed optical machine according to claim 6, wherein: The second external air duct passes through the first hot end and / or the first hot end radiator.

9. The enclosed optical machine according to claim 6, wherein: The second radiator comprises: A central heat dissipation plate, the central heat dissipation plate and the light source assembly are arranged on the outside of the closed housing in correspondence thereto; A plurality of first heat dissipation ribs, wherein the plurality of first heat dissipation ribs are arranged at intervals around the central heat dissipation plate, and the plurality of first heat dissipation ribs extend around the central heat dissipation plate; and, A plurality of second heat dissipation ribs are connected to one end of the first heat dissipation rib away from the central heat dissipation plate, and the plurality of second heat dissipation ribs extend around the plurality of first heat dissipation ribs.

10. The closed optical machine according to claim 9, characterized in that: One end of each of the first heat dissipation ribs away from the central heat dissipation plate is connected to at least two of the second heat dissipation ribs.

11. The enclosed optical machine according to claim 5, wherein: The enclosed optical machine further comprises: The second semiconductor refrigerator is arranged in the cavity, and comprises a second cold end and a second hot end arranged opposite to the second cold end, and the second hot end is arranged in close contact with the inner side of the closed shell.

12. The enclosed optical machine according to claim 11, wherein: The enclosed optical machine further comprises: A lens assembly, wherein the closed housing has a second opening, and the lens assembly is disposed at the second opening and is sealed and connected to the closed housing; and, a first reflector, the first reflector being disposed in the cavity, the first reflector being tilted relative to the imaging assembly to reflect the imaging light path of the imaging assembly to the lens assembly; a portion of the closed housing corresponding to the first reflector is provided with a housing chamfer, the first internal circulation air duct passes through the inner side of the housing chamfer and the second external air duct passes through the outer side of the housing chamfer; Wherein, the second hot end is arranged in contact with the inner side of the chamfer of the shell.

13. The enclosed optical machine according to claim 12, wherein: The enclosed optical machine further comprises: A third fan is arranged outside the closed shell to form a third external air duct outside the closed shell, and the third external air duct passes through the outer side of the chamfer of the shell and is connected with the second external air duct.

14. The enclosed optical machine according to claim 13, wherein: The closed shell is provided with a hollow support frame located outside the shell chamfer, and the third fan is arranged on the hollow support frame so that the third external air duct is located between the shell chamfer and the hollow support frame.

15. The enclosed optical machine according to claim 14, wherein: The third fan comprises a third fan air inlet and a third fan air outlet, the first hot end radiator is located at the third fan air outlet, and the second hot end is located at the third fan air inlet.

16. A projection device, characterized in that: The projection device comprises a projection screen and the optical machine according to any one of claims 1 to 15, wherein the projection screen is used to receive the projection image of the optical machine.

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