Screen burning device and equipment for display chip

Abstract

The utility model discloses a screen burning device and equipment for display chips, and relates to the technical field of screen burning testing, and the screen burning device comprises a screen burning assembly which is used for carrying out a screen burning process on a plurality of display chips; the vacuum jig is used for adsorbing and fixing the plurality of display chips; and the heat dissipation jig is connected with the vacuum jig and is used for dissipating heat generated by the display chip in the screen burning process. The display chip can be tightly adsorbed and fixed through the vacuum jig, and cannot fall off due to excessive heat generated by the display chip, so that the heat dissipation continuity of the display chip is ensured. The heat dissipation jig connected with the vacuum jig is additionally arranged, so that the high efficiency of heat dissipation of the display chip is ensured. Besides, a plurality of display chips can be subjected to a screen burning process at the same time and can be adsorbed and fixed on the vacuum jig, so that batch processing and production of the display chips are realized, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of screen burn-in testing, and in particular to a screen burn-in device and equipment for a display chip. Background Art

[0002] Inorganic micro-pixel light-emitting diodes, also known as micro-light-emitting diodes (Micro LED or μ-LED), have become increasingly important since they have been used in various applications, including self-luminous micro-displays, visible light communications, optogenetics, etc. Compared with traditional LEDs, Micro LEDs have better strain relaxation, better light extraction efficiency, uniform current spreading, and higher output performance. Micro LEDs also have the advantages of improved thermal effects, faster response, wider operating temperature range, higher resolution, wider color gamut, higher contrast, lower power consumption, and higher current density.

[0003] At present, in the testing phase of Micro LED display chips, it is necessary to fix the Micro LED display chip on the burn-in board, which is used to power the Micro LED display chip and control the operation of the Micro LED display chip. The Micro LED display chip is placed in an environment of 25±1℃, and the brightness is adjusted to the maximum brightness by adjusting the register value of the Micro LED display chip, and it works for a long time in a certain length of off cycle. The above method is called the burn-in process of the Micro LED display chip. Experimental data show that the burn-in process can improve the luminous brightness of the Micro LED display chip and reduce the probability of afterimage of the Micro LED display chip.

[0004] However, the existing technology still has many problems in the burn-in process of Micro LED display chips. Utility Model Content

[0005] The technical problem solved by the utility model is to provide a screen burning device and equipment for a display chip, so as to ensure the continuity and high efficiency of heat dissipation of the display chip and improve production efficiency.

[0006] In order to solve the above problems, the technical solution of the utility model provides a burn-in device for a display chip, comprising: a burn-in component, used to perform a burn-in process on a plurality of display chips; a vacuum jig, used to adsorb and fix the plurality of display chips; and a heat dissipation jig connected to the vacuum jig, used to dissipate the heat generated by the display chips during the burn-in process.

[0007] Optionally, the vacuum fixture includes: a vacuum body having a vacuum cavity; a plurality of adsorption openings opened on the vacuum body, the adsorption openings being connected to the vacuum cavity and being used to adsorb and fix the display chip; and a negative pressure connector connected to the vacuum body, the negative pressure connector being connected to the vacuum cavity and being used to connect an external negative pressure device.

[0008] Optionally, the vacuum main body includes: a vacuum platform; and a vacuum cover plate detachably connected to the vacuum platform, wherein the vacuum chamber is formed after the vacuum cover plate is connected to the vacuum platform.

[0009] Optionally, the vacuum body further includes: a heat transfer body; wherein the heat transfer body and the vacuum carrier are an integrated structure, and the vacuum cover plate is connected to the heat transfer body.

[0010] Optionally, the adsorption opening is opened on the vacuum cover plate.

[0011] Optionally, the structure of the adsorption opening includes: a polygonal hole, a round hole, a cross hole, a long waist hole or a plum blossom hole.

[0012] Optionally, the vacuum cover plate is detachably connected to the vacuum carrier via countersunk bolts.

[0013] Optionally, the heat dissipation fixture includes: a heat sink having fins of an integrated structure.

[0014] Optionally, the vacuum jig is detachably connected to the heat dissipation jig.

[0015] Optionally, the vacuum jig and the heat dissipation jig are an integrated structure.

[0016] Optionally, the burn-in assembly includes: a control board; a substrate electrically connected to the control board; an adapter board electrically connected to the substrate, the adapter board having a plurality of adapter interfaces, the adapter interfaces being electrically connected to the corresponding display chip via flexible cables, for providing data control and power supply for the display chip.

[0017] Optionally, the control board is connected to the heat dissipation fixture via a plurality of support columns, and a support gap is provided between the control board and the heat dissipation fixture.

[0018] Optionally, the control panel has a first avoidance opening, and the first avoidance opening is used to avoid the vacuum jig.

[0019] Optionally, the control board is electrically connected to the substrate via a first connector, and the substrate has a second avoidance opening, and the second avoidance opening is used to avoid the vacuum jig.

[0020] Optionally, the substrate is electrically connected to the adapter plate via a second connector, and the adapter plate has a third avoidance opening, and the third avoidance opening is used to avoid the vacuum jig.

[0021] Optionally, the burn-in process is used to monitor one or more of temperature data, voltage data and current data of the display chip.

[0022] Correspondingly, the technical solution of the utility model also provides a burn-in device for a display chip, comprising: a plurality of burn-in devices as described in any one of the above technical solutions; a plurality of fixed frames, the fixed frames being used to fix and connect a plurality of the burn-in devices; and a support frame, the fixed frames being slidably assembled in the support frame.

[0023] Optionally, a plurality of the fixing frames are stacked and arranged in sequence in the supporting frame.

[0024] Optionally, the fixing frame has a pull-out handle.

[0025] Optionally, it further includes: a cabinet, in which the support frame is fixedly disposed.

[0026] Compared with the prior art, the technical solution of the utility model has the following advantages:

[0027] In the burn-in device for display chips of the technical solution of the utility model, the vacuum jig can tightly adsorb and fix the display chip, and the display chip will not fall off due to excessive heat generated by the display chip, thereby ensuring the continuity of heat dissipation of the display chip. By adding the heat dissipation jig connected to the vacuum jig, the high efficiency of heat dissipation of the display chip can be ensured. In addition, multiple display chips can be simultaneously subjected to the burn-in process and adsorbed and fixed on the vacuum jig, so as to realize batch processing and production of the display chips and improve production efficiency.

[0028] Furthermore, the vacuum main body includes: a vacuum stage; and a vacuum cover plate detachably connected to the vacuum stage, wherein the vacuum cover plate is connected to the vacuum stage to form the vacuum chamber. By arranging the vacuum stage and the vacuum cover plate as detachable structures, it is convenient to replace the vacuum cover plates with the adsorption openings of different sizes to meet the needs of display chips of different sizes.

[0029] Furthermore, the vacuum stage has a heat transfer body, and the vacuum cover plate is connected to the heat transfer body. The heat generated by the display chip can be quickly transferred to the heat dissipation fixture through the heat transfer body to improve the heat dissipation efficiency of the display chip.

[0030] Furthermore, the vacuum cover plate is detachably connected to the vacuum stage by a countersunk bolt. Since the head of the countersunk bolt can be hidden in the vacuum cover plate, it plays an aesthetic role. In addition, during the adsorption and fixation process of the display chip, the display chip needs to fit the surface of the vacuum cover plate as closely as possible to improve the adsorption and fixation effect. Therefore, by connecting with the countersunk bolt, the surface of the vacuum cover plate can be kept flat, so as to improve the adsorption and fixation effect of the display chip.

[0031] Furthermore, the heat dissipation fixture includes: a heat sink having fins of an integrated structure. The fins can increase the contact area with the air, transfer the heat to the circulating air to take away the heat, so as to improve the heat dissipation effect of the display chip.

[0032] Furthermore, the control board is connected to the heat dissipation fixture through a plurality of support columns, and a support gap is provided between the control board and the heat dissipation fixture. The support columns isolate the control board from the heat dissipation fixture by a certain distance, thereby preventing the control board from contacting with metal materials and causing a short circuit. In addition, the control board can be kept away from heat sources to prevent damage to the control board.

[0033] Furthermore, the control board has a first avoidance opening, and the first avoidance opening is used to avoid the vacuum jig. The first avoidance opening can better arrange the positional relationship between the control board and the vacuum jig, thereby making the burn-in device have a more compact overall structure.

[0034] Furthermore, the control board is electrically connected to the substrate via a first connector, and the substrate has a second avoidance opening, and the second avoidance opening is used to avoid the vacuum fixture. The second avoidance opening can better arrange the positional relationship between the substrate and the vacuum fixture, thereby making the burn-in device have a more compact overall structure.

[0035] Furthermore, the substrate is electrically connected to the adapter plate through a second connector, and the adapter plate has a third avoidance opening, and the third avoidance opening is used to avoid the vacuum jig. The third avoidance opening can better arrange the positional relationship between the adapter plate and the vacuum jig, thereby making the burn-in device have a more compact overall structure.

[0036] In the burn-in device for display chips of the technical solution of the utility model, each burn-in device can tightly adsorb and fix the display chip through the vacuum fixture, and will not fall off due to excessive heat generated by the display chip, thereby ensuring the continuity of heat dissipation of the display chip. By adding the heat dissipation fixture connected to the vacuum fixture, the high efficiency of heat dissipation of the display chip can be ensured. In addition, multiple display chips can be burned in at the same time and adsorbed and fixed on the vacuum fixture, and multiple burn-in devices can be fixed at the same time through the fixed frame, so as to realize batch processing and production of the display chips and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional structural schematic diagram of a screen burning device of a display chip according to an embodiment of the utility model;

[0038] Figure 2 yes Figure 1 A side view of the burn-in device of the display chip along direction A shown;

[0039] Figure 3 yes Figure 1 A bottom view of the burn-in device of the display chip shown along direction B;

[0040] Figure 4 yes Figure 1 A schematic diagram of the structure of a vacuum fixture in a screen burn-in device for a display chip according to the embodiment shown;

[0041] Figure 5 yes Figure 1 A schematic diagram of the heat dissipation fixture structure in the screen burn-in device of the display chip of the illustrated embodiment;

[0042] Figure 6 yes Figure 1 A schematic diagram of the structure of a screen burn-in component in a screen burn-in device for a display chip in the illustrated embodiment;

[0043] Figure 7 It is a structural schematic diagram of a fixed frame and a screen burning device in a screen burning device of a display chip according to an embodiment of the utility model;

[0044] Figure 8 yes Figure 7 A side view of the burn-in device of the display chip shown along direction C;

[0045] Fig. 9 It is a schematic diagram of the structure of a fixed frame, a screen burning device and a support frame in the screen burning device of the display chip of the embodiment of the utility model;

[0046] Fig.10 It is a schematic diagram of the cabinet structure in the screen burn-in device of the display chip according to the embodiment of the utility model. DETAILED DESCRIPTION

[0047] As described in the background art, there are still many problems in the prior art during the burn-in process of Micro LED display chips, which will be described in detail below.

[0048] During the burn-in process, the Micro LED display chip will generate a lot of heat during operation. If the temperature of the Micro LED display chip is too high, it will cause it to fail. To avoid the failure of the Micro LED display chip, it needs to be cooled. At present, most Micro LED display chips are fixed on the heat dissipation fixture by means of thermal conductive tape, and the Micro LED display chip is connected to the burn-in board, and the heat conduction of the heat dissipation fixture is used to dissipate the heat of the Micro LED display chip.

[0049] However, the temperature of the Micro LED display chip will rise sharply during operation. Excessive temperature will reduce the viscosity of the thermal conductive tape, causing the Micro LED display chip to warp up on the heat dissipation fixture, resulting in the Micro LED display chip being unable to effectively dissipate heat, making it impossible for the Micro LED display chip to smoothly perform the burn-in process. At the same time, excessive temperature will cause the Micro LED display chip to fail.

[0050] On this basis, the utility model provides a burn-in device and equipment for display chips, wherein the display chip can be tightly adsorbed and fixed by the vacuum jig, and will not fall off due to excessive heat generated by the display chip, thereby ensuring the continuity of heat dissipation of the display chip. By adding the heat dissipation jig connected to the vacuum jig, the high efficiency of heat dissipation of the display chip can be ensured. In addition, multiple display chips can be simultaneously subjected to the burn-in process and adsorbed and fixed on the vacuum jig, so as to realize batch processing and production of the display chips and improve production efficiency.

[0051] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0052] In the description of the present invention, it should be understood that the terms "upper", "lower", "top surface", "bottom surface" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the positions or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations of the present invention. In addition, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order or relative importance between these entities or operations.

[0053] Figure 1 It is a three-dimensional structural schematic diagram of a screen burning device of a display chip according to an embodiment of the utility model; Figure 2 yes Figure 1 A side view of the burn-in device of the display chip along direction A shown; Figure 3 yes Figure 1 A bottom view of the burn-in device of the display chip shown along direction B; Figure 4 yes Figure 1 A schematic diagram of the structure of a vacuum fixture in a screen burn-in device for a display chip according to the embodiment shown; Figure 5 yes Figure 1 A schematic diagram of the heat dissipation fixture structure in the screen burn-in device of the display chip of the illustrated embodiment; Figure 6 yes Figure 1 A schematic diagram of the structure of a screen burn-in component in a screen burn-in device for a display chip according to the illustrated embodiment.

[0054] Please refer to Figures 1 to 3 A display chip 10 comprises: a burn-in component 101, used for performing a burn-in process on a plurality of display chips 102; a vacuum fixture 103, used for adsorbing and fixing the plurality of display chips 102; and a heat dissipation fixture 104 connected to the vacuum fixture 103, used for dissipating the heat generated by the display chips 102 during the burn-in process.

[0055] By adding the heat dissipation fixture 104 connected to the vacuum fixture 103, the high efficiency of heat dissipation of the display chip 102 is ensured. In addition, a plurality of display chips 102 can be simultaneously subjected to the screen burn-in process and adsorbed and fixed on the vacuum fixture 103, so as to realize batch processing and production of the display chips 102 and improve production efficiency.

[0056] In some embodiments, the display chip 102 may be a Micro LED display chip.

[0057] Please refer to Figure 4In some embodiments, the vacuum fixture 103 includes: a vacuum body 1031, wherein the vacuum body 1031 has a vacuum cavity 1032; a plurality of adsorption openings 1033 provided on the vacuum body 1031, wherein the adsorption openings 1033 are connected to the vacuum cavity 1032 and are used to adsorb and fix the display chip 102; and a negative pressure connector 1034 connected to the vacuum body 1031, wherein the negative pressure connector 1034 is connected to the vacuum cavity 1032 and is used to connect an external negative pressure device.

[0058] In some embodiments, the negative pressure device may use a vacuum compression pump.

[0059] Please continue to refer to Figure 4 In some embodiments, the vacuum body 1031 includes: a vacuum stage 10311; a vacuum cover plate 10312 detachably connected to the vacuum stage 10311, wherein the vacuum cover plate 10312 is connected to the vacuum stage 10311 to form the vacuum chamber 1032, and the adsorption opening 1033 is opened on the vacuum cover plate 10312. By setting the vacuum stage 10311 and the vacuum cover plate 10312 as a detachable structure, it is convenient to replace the vacuum cover plate 10312 with the adsorption opening 1033 of different sizes to meet the needs of the display chip 102 of different sizes.

[0060] Please continue to refer to Figure 4 In some embodiments, the vacuum body 1031 further includes a heat transfer body 10313; wherein the heat transfer body 10313 and the vacuum stage 10311 are an integrated structure, and the vacuum cover plate 10312 is connected to the heat transfer body 10313. The heat generated by the display chip 102 can be quickly transferred to the heat dissipation fixture 104 through the heat transfer body 10313, so as to improve the heat dissipation efficiency of the display chip 102.

[0061] It should be noted that the vacuum fixture 103 not only needs to absorb and fix the display chip 102, but also needs to have good thermal conductivity to ensure that the heat generated by the display chip 102 during the screen burn-in process can be quickly transferred to the heat dissipation fixture 104. In some embodiments, the vacuum fixture 103 can be made of aluminum alloy.

[0062] In some embodiments, the structure of the adsorption opening 1033 includes: a polygonal hole, a round hole, a cross hole, a long waist hole or a plum blossom hole; wherein, the adsorption opening 1033 of the plum blossom hole has a larger adsorption area, which can make the display chip 102 better adsorbed and fixed, thereby ensuring the close combination of the display chip 102 and the vacuum fixture 103.

[0063] Please continue to refer to Figure 4 In some embodiments, the vacuum cover plate 10312 is detachably connected to the vacuum stage 10311 by a countersunk bolt 1035. Since the head of the countersunk bolt 1035 can be hidden in the vacuum cover plate 10312, it plays an aesthetic role. In addition, during the adsorption and fixation process of the display chip 102, the display chip 102 needs to fit the surface of the vacuum cover plate 10312 as much as possible to improve the adsorption and fixation effect. Therefore, by connecting with the countersunk bolt 1035, the surface of the vacuum cover plate 10312 can be kept flat, so as to improve the adsorption and fixation effect of the display chip 102.

[0064] It should be noted that, in this embodiment, the vacuum fixture 103 is a rectangular parallelepiped structure.

[0065] In some embodiments, the vacuum jig 103 is detachably connected to the heat dissipation jig 104. Specifically, at least two through holes 1043 may be provided at the bottom of the heat dissipation jig 104, and threaded holes may be provided at the bottom of the vacuum jig 103. Bolts pass through the through holes 1043 and are threadedly connected to the threaded holes, thereby achieving detachable connection between the vacuum jig 103 and the heat dissipation jig 104.

[0066] In some embodiments, the vacuum fixture 103 and the heat dissipation fixture 104 may also adopt an integrated structure.

[0067] Please refer to Figure 5 In some embodiments, the heat dissipation fixture 104 can use a heat sink 1041, and the heat sink 1041 has an integrated fin 1042. The fin 1042 can increase the contact area with the air, transfer the heat to the circulating air to take away the heat, so as to improve the heat dissipation effect of the display chip 102.

[0068] In some embodiments, the heat dissipation fixture 104 can be made of aluminum, copper, silver, graphite, aluminum alloy and other materials. In order to ensure the heat dissipation efficiency of the heat dissipation fixture 104 and reduce the cost of the heat dissipation fixture 104, the heat dissipation fixture 104 is preferably made of aluminum alloy material.

[0069] Please refer to Figure 6The burn-in component 101 includes: a control board 1011; a substrate 1012 electrically connected to the control board 1011; an adapter board 1013 electrically connected to the substrate 1012, and the adapter board 1013 has a plurality of adapter interfaces 10131, and the adapter interfaces 10131 are electrically connected to the corresponding display chip 102 through a flexible flat cable 1014, so as to provide data control and power supply for the display chip 102.

[0070] It should be noted that, in some embodiments, in actual use, a plurality of the adsorption openings 1033 are uniformly formed on the top of the vacuum fixture 103, and the adsorption openings 1033 can be arranged in a single row or a double row. When the adsorption openings 1033 are in a single row structure, the adapter 10131 on the adapter plate 1013 is located on one side of the vacuum fixture 103, and the adapter 10131 and the adsorption openings 1033 are arranged in a one-to-one correspondence; when the adsorption openings 1033 are in a double row structure, the adapter 10131 on the adapter plate 1013 is also arranged in two rows, and the two rows of the adapter 10131 are located on both sides of the vacuum fixture 103, so that the two rows of adapters 10131 correspond to the two rows of the adsorption openings 1033, and each of the adapters 10131 corresponds to the corresponding adsorption opening 1033. Figure 1 Two rows of the adsorption openings 1033 and two rows of the transfer ports 10131 are shown, and only one display chip 102 is adsorbed and fixed on the adsorption opening 1033 , and is electrically connected to the corresponding transfer port 10131 through the flexible flat cable 1014 .

[0071] In some embodiments, multiple rows of the adapter ports 10131 may be formed on the adapter board 1013 to correspond to different display chips 102 . Such a configuration may make the connection of the display chip 102 more troublesome and is generally not used.

[0072] Please continue to refer to Figure 1 In some embodiments, the control board 1011 is connected to the heat dissipation fixture 104 through a plurality of support columns 105, and a support gap is provided between the control board 1011 and the heat dissipation fixture 104. The support columns 105 isolate the control board 1011 from the heat dissipation fixture 104 by a certain distance, thereby preventing the control board 1011 from contacting with metal materials and causing a short circuit. In addition, the control board 1011 can be kept away from heat sources to prevent damage to the control board 1011.

[0073] Please continue to refer to Figure 6In some embodiments, the control board 1011 has a first avoidance opening 10111, and the first avoidance opening 10111 is used to avoid the vacuum fixture 103. The first avoidance opening 10111 can better arrange the positional relationship between the control board 1011 and the vacuum fixture 103, thereby making the overall structure of the vacuum fixture 103 more compact.

[0074] Please continue to refer to Figure 6 In some embodiments, the control board 1011 is electrically connected to the substrate 1012 via a first connector (not shown), and the substrate 1012 has a second avoidance opening 10121, and the second avoidance opening 10121 is used to avoid the vacuum fixture 103. The second avoidance opening 10121 can better arrange the positional relationship between the substrate 1012 and the vacuum fixture 103, thereby making the overall structure of the 10 more compact.

[0075] Please continue to refer to Figure 6 In some embodiments, the substrate 1012 is electrically connected to the adapter plate 1013 via a second connector (not shown), and the adapter plate 1013 has a third avoidance opening 10132, and the third avoidance opening 10132 is used to avoid the vacuum fixture 103. The third avoidance opening 10132 can better arrange the positional relationship between the adapter plate 1013 and the vacuum fixture 103, thereby making the overall structure of the 10 more compact.

[0076] It should be noted that, in some embodiments, in order to achieve compatibility with a variety of display chips 102, the adapter board 1013 is detachably fixed on the substrate 1012, so that a variety of different adapter boards 1013 can be replaced.

[0077] In some embodiments, the burn-in process is used to monitor one or more of temperature data, voltage data, and current data during operation of the display chip 102 .

[0078] In a specific embodiment, the burn-in process is used to monitor the temperature data, voltage data and current data of the display chip 102 during operation. Specifically, the control board 1011 includes a serial port module interface, a serial port module, a processor module, and a control board power conversion module (not shown); the substrate 1012 includes a substrate power conversion module and a power detection module (not shown).

[0079] The external DC power supply is connected to the power supply module to supply power to the processor module, the serial port module, and the control board power conversion module; the control board 1011 transmits the data and power on the data bus to the substrate 1012, and the substrate power conversion module converts the power into a power supply voltage suitable for the power detection module and the display chip 102. The serial port module interface is connected to the UART line and connected to the PC end, and the serial port module interface is connected to the 1-to-N serial port expansion board, and the 1-to-N serial port expansion board is connected to the PC end. After the hardware connection is completed, the PC end sends corresponding instructions to control the reading of the display chip 102 temperature data, the voltage data and current data of the power detection module, the engineering version number and other data, and then the processor module transmits the read data back to the PC end through the serial port module for display.

[0080] In some embodiments, the serial port module sends instructions to the processor module through the UART communication protocol. The processor module parses the instructions sent by the PC through the serial port module, and determines which of the following functions it is by parsing the corresponding bytes of the instructions: 1. The reading of the project version number is sent back to the serial port module and printed by the PC to determine whether the project in the processor module is the latest; 2. The data of the power detection module is sent through the processor module through the IIC communication protocol to drive the power detection module to collect data. The power detection module then sends the collected power, voltage, current and other data back to the processor module through the IIC communication protocol. The processor module then sends it back to the serial port module through the UART communication protocol, and prints it through the PC to determine whether the current power, voltage, current and other data are in accordance with the display chip engineering. working status; 3. The data of the display chip 102 is sent through the processor module to drive the display chip 102 to collect data through QSPI, SPI, IIC and other communication protocols, and the collected temperature data is returned to the processor module through QSPI, SPI, IIC and other communication protocols. The processor module returns the data to the serial port module through the UART communication protocol, and prints it on the PC to determine whether the current temperature data conforms to the working status of the display chip; 4. The display chip 102 data is sent through the processor module to send instructions to the display chip 102 through QSPI, SPI, IIC and other communication protocols, and the processor module controls the status of the display chip 102 through QSPI, SPI, IIC and other communication protocols.

[0081] In some embodiments, the control board 1011 can be adapted and compatible with different interface protocols of different display chips 102 by updating different projects.

[0082] Figure 7 It is a structural schematic diagram of a fixed frame and a screen burning device in a screen burning device of a display chip according to an embodiment of the utility model; Figure 8 yes Figure 7 A side view of the burn-in device of the display chip shown along direction C; Fig. 9 It is a schematic diagram of the structure of a fixed frame, a screen burning device and a support frame in the screen burning device of the display chip of the embodiment of the utility model; Fig.10 It is a schematic diagram of the cabinet structure in the screen burn-in device of the display chip according to the embodiment of the utility model.

[0083] Correspondingly, the embodiment of the utility model also provides a display chip burn-in device 20, please continue to refer to Figures 1 to 6 Combined with reference Figures 7 to 9 , including: a plurality of 10 as described in any one of the above embodiments; a plurality of fixed frames 201, wherein the fixed frames 201 are used to fix and connect a plurality of the 10; and a support frame 202, wherein the fixed frames 201 are slidably assembled in the support frame 202.

[0084] Each of the 10 can tightly adsorb and fix the display chip 102 through the vacuum jig 103, and will not fall off due to excessive heat generated by the display chip 102, thereby ensuring the continuity of heat dissipation of the display chip 102. The heat dissipation jig 104 connected to the vacuum jig 103 is added to ensure the high efficiency of heat dissipation of the display chip 102. In addition, multiple display chips 102 can be simultaneously subjected to the screen burn-in process and adsorbed and fixed on the vacuum jig 103, and multiple 10 can be simultaneously fixed by the fixed frame 201, so as to realize batch processing and production of the display chips 102 and improve production efficiency. In addition, the fixed frame 201 is horizontally slidably installed in the support frame 202. By sliding the fixed frame 201, multiple 10 can be put in and out of the experimental cabinet, which is convenient for loading and unloading the display chips 102.

[0085] The following is a detailed description of the loading and unloading process: When loading, the display chip 102 is pre-installed on the adapter board 1013, and the adapter board 1013 is installed on the control board 1011 together with the substrate 1012 to complete the loading. When unloading, the substrate 1012 is first removed from the control board 1011, and then the display chips 102 on the adapter board 1013 are removed one by one to complete the unloading.

[0086] In some embodiments, the fixing frame 201 fixes and connects the plurality of heat dissipation fixtures 104 by opening screw holes on the end faces of the heat dissipation fixtures 104, and fixing the plurality of heat dissipation fixtures 104 in the same fixing frame 201 by bolts.

[0087] It should be noted that in order to prevent the heat dissipation fixture 104 from being installed upside down, different numbers of screw holes are opened on both ends of the heat dissipation fixture 104. For example, one screw hole is opened on one end of the heat dissipation fixture 104, and four screw holes are opened on the other end (please continue to refer to Figure 1 ).

[0088] Please continue to refer to Fig. 9 In some embodiments, a plurality of the fixing frames 201 are stacked and arranged in sequence in the supporting frame 202 .

[0089] Please continue to refer to Figure 7 In some embodiments, the fixing frame 201 has a pull-out handle 203 .

[0090] Please refer to Fig.10 In some embodiments, the invention further includes: a cabinet 204 , in which the support frame 202 is installed.

[0091] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A screen burn-in device for a display chip, characterized in that: include: Burn-in components, used to perform burn-in process on several display chips; A vacuum fixture, used for adsorbing and fixing a plurality of the display chips; The heat dissipation fixture connected to the vacuum fixture is used to dissipate the heat generated by the display chip during the screen burn-in process.

2. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The vacuum fixture includes: a vacuum body having a vacuum cavity; a plurality of adsorption openings provided on the vacuum body, the adsorption openings being connected to the vacuum cavity and being used for adsorbing and fixing the display chip; and a negative pressure joint connected to the vacuum body, the negative pressure joint being connected to the vacuum cavity and being used for externally connecting a negative pressure device.

3. The screen burn-in device of the display chip as claimed in claim 2, characterized in that: The vacuum main body comprises: a vacuum stage; and a vacuum cover plate detachably connected to the vacuum stage, wherein the vacuum chamber is formed after the vacuum cover plate is connected to the vacuum stage.

4. The screen burn-in device of the display chip as claimed in claim 3, characterized in that: The vacuum body further includes: a heat transfer body; wherein the heat transfer body and the vacuum stage are an integrated structure, and the vacuum cover plate is connected to the heat transfer body.

5. The screen burn-in device of the display chip as claimed in claim 3, characterized in that: The adsorption opening is opened on the vacuum cover plate.

6. The screen burn-in device of the display chip as claimed in claim 2, characterized in that: The structure of the adsorption opening includes: a polygonal hole, a round hole, a cross hole, a long waist hole or a plum blossom hole.

7. The screen burn-in device of the display chip as claimed in claim 3, characterized in that: The vacuum cover plate is detachably connected to the vacuum stage via countersunk bolts.

8. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The heat dissipation fixture comprises a heat sink having fins of an integrated structure.

9. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The vacuum fixture is detachably connected to the heat dissipation fixture.

10. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The vacuum fixture and the heat dissipation fixture are an integrated structure.

11. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The burn-in screen component includes: a control board; a substrate electrically connected to the control board; an adapter board electrically connected to the substrate, the adapter board having a plurality of adapter interfaces, the adapter interfaces being electrically connected to the corresponding display chip through a flexible flat cable, for providing data control and power supply for the display chip.

12. The screen burn-in device of the display chip according to claim 11, characterized in that: The control board is connected to the heat dissipation fixture through a plurality of support columns, and a support gap is provided between the control board and the heat dissipation fixture.

13. The screen burn-in device of the display chip according to claim 11, characterized in that: The control panel has a first avoidance opening, and the first avoidance opening is used to avoid the vacuum jig.

14. The screen burn-in device of the display chip according to claim 11, characterized in that: The control board is electrically connected to the substrate through a first connector. The substrate has a second avoidance opening, and the second avoidance opening is used to avoid the vacuum fixture.

15. The screen burning device of the display chip according to claim 11, characterized in that: The substrate is electrically connected to the adapter plate through a second connector. The adapter plate has a third avoidance opening. The third avoidance opening is used to avoid the vacuum fixture.

16. The screen burn-in device of the display chip as claimed in claim 1, characterized in that: The burn-in process is used to monitor one or more of the temperature data, voltage data and current data of the display chip.

17. A screen burn-in device for a display chip, characterized in that: include: Several screen burning devices according to any one of claims 1 to 16; A plurality of fixed frames, wherein the fixed frames are used to fixedly connect a plurality of the screen burning devices; The fixing frame is slidably mounted in the supporting frame.

18. The screen burn-in device of the display chip as claimed in claim 17, characterized in that: A plurality of the fixing frames are stacked and arranged in sequence in the supporting frame.

19. The screen burn-in device of the display chip as claimed in claim 17, characterized in that: The fixing frame has a pull-out handle.

20. The screen burn-in device of the display chip as claimed in claim 17, characterized in that: Also includes: The support frame is fixedly arranged in the cabinet.

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