Surface-mounted aluminum electrolytic capacitor

Abstract

The utility model discloses a surface-mounted aluminum electrolytic capacitor, comprising a housing; the connecting ring is arranged on the outer wall of the shell; the pins are arranged at the bottom of the shell; the annular block is arranged at the bottom of the shell; the heat dissipation mechanism is located on the inner side of the connecting ring and used for conducting heat dissipation on the shell. According to the heat dissipation mechanism, after the annular block and the connecting ring are installed, the multiple heat dissipation fins are attached to the outer wall of the annular block, heat generated by the annular block is dissipated to the outside, when air around the connecting ring circulates and inflows into the second vent groove or the first vent groove, the inrush air is guided through the partition plate, and the heat dissipation effect is improved. Therefore, the flowing air is blown to the heat dissipation fins, the heat dissipation effect of the heat dissipation fins is accelerated, heat is prevented from being accumulated at the bottom of the annular block, and the service life of the capacitor is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of capacitors, in particular to a chip aluminum electrolytic capacitor. Background Art

[0002] Aluminum electrolytic capacitors, also known as capacitors, are energy storage components. Their structures can be divided into three types: fixed capacitors, semi-variable capacitors, and variable capacitors. In electronic products, aluminum electrolytic capacitors are common electronic devices. They play the role of smoothing filters in rectifiers, bypassing AC signals, and AC coupling in AC and DC circuits in electronic equipment.

[0003] According to the announcement number "CN116469679A" published on the China Patent Network, it is "a seismic-resistant mounting structure of a chip aluminum electrolytic capacitor and its welding method". The seismic-resistant mounting structure has a mounting seat with a mounting groove for accommodating the capacitor, and at least two lead grooves are provided in the mounting groove. The at least two lead grooves are not located on the same straight line, and the lead groove extends from the middle of the mounting groove to the edge. After the capacitor is installed in the mounting groove, the lead pins of the capacitor are accommodated in the lead groove along the length direction of the lead groove. The seismic-resistant mounting structure of the chip aluminum electrolytic capacitor can stably fix the chip aluminum electrolytic capacitor, and has the advantages of simple structure and easy installation.

[0004] Although the bottom of the capacitor can be reinforced in the above patent, the reinforced part of the capacitor is wrapped, which affects the heat dissipation at the bottom of the capacitor, making it easy for heat to accumulate at the bottom of the capacitor, accelerating the wear of the capacitor, and thus reducing the service life of the capacitor. For this reason, we provide a chip aluminum electrolytic capacitor to solve the above problem. Utility Model Content

[0005] The utility model aims at a chip aluminum electrolytic capacitor to solve the problem in the above background technology that a large amount of heat is easily accumulated at the bottom of the capacitor and is not easy to dissipate.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A chip aluminum electrolytic capacitor comprises: a shell; a connecting ring, which is arranged on the outer wall of the shell; pins, which are arranged on the bottom of the shell; an annular block, which is arranged on the bottom of the shell; and a heat dissipation mechanism, which is located on the inner side of the connecting ring and is used to dissipate heat from the shell.

[0008] According to a further technical solution, the heat dissipation mechanism includes heat dissipation fins installed on the inner side of the connecting ring, a second ventilation groove and a first ventilation groove are respectively opened on the inner side of the connecting ring, and a partition is arranged between the first ventilation groove and the second ventilation groove.

[0009] According to a further technical solution, the second ventilation groove is inclined upward, and the second ventilation groove passes through the connecting ring.

[0010] According to a further technical solution, a plurality of grooves are provided on one side of the heat dissipation fin.

[0011] According to a further technical solution, a plurality of plastic blocks are fixedly connected to the outer wall of the connecting ring, and a top of each of the plastic blocks is provided with an inclined surface.

[0012] According to a further technical solution, the plastic block is configured to be U-shaped, the inner height of the plastic block matches the height of the annular block, and the top and bottom of the annular block are both provided with conical surfaces.

[0013] Beneficial effects of the utility model:

[0014] 1. The utility model provides a heat dissipation mechanism. When the annular block and the connecting ring are installed, a plurality of heat dissipation fins are attached to the outer wall of the annular block to dissipate the heat generated by the annular block to the outside. When the air around the connecting ring flows into the second ventilation groove or the first ventilation groove, the inflowing air is guided by the partition plate so that the flowing air is blown onto the heat dissipation fins, thereby accelerating the heat dissipation effect of the heat dissipation fins, thereby avoiding heat accumulation at the bottom of the annular block, thereby increasing the service life of the capacitor;

[0015] 2. The utility model provides the cooperation of parts such as a plastic card block to install the shell and the connecting ring. When the conical surface at the bottom of the annular block contacts the inclined surface at the top of the plastic card block, the plastic card block itself has elasticity, so that the plastic card block rotates outward under the action of the conical surface at the bottom of the annular block. When the bottom of the annular block fits on the top of the connecting ring, the top of the annular block is flush with the top of the inner side of the plastic card block, so that the plastic card block is no longer squeezed and resets under the action of its own elastic force. Since the height of the inner side of the plastic card block matches the height of the annular block, the plastic card block is stuck on the top of the annular block under its own action, thereby limiting the annular block, thereby connecting the annular block to the connecting ring, thereby improving the stability of the annular block after installation.

[0016] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 : The structural schematic diagram of the utility model.

[0018] Figure 2 : A cross-sectional view of a connecting ring of the present utility model.

[0019] Figure 3 : The utility model Figure 2 Enlarged view of point A in the middle.

[0020] Figure 4 : Schematic diagram of the connecting ring structure of the utility model.

[0021] Figure 5 : Schematic diagram of the heat dissipation mechanism structure of the utility model.

[0022] Figure numerals: 1, housing; 2, connecting ring; 3, pin; 4, plastic card block; 5, first ventilation groove; 6, heat dissipation fin; 7, partition; 8, second ventilation groove; 9, inclined surface; 10, annular block. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0024] Please refer to Figure 1-Figure 5 In an embodiment of the utility model, a chip aluminum electrolytic capacitor includes: a shell 1; a connecting ring 2, which is arranged on the outer wall of the shell 1; a pin 3, which is arranged at the bottom of the shell 1; an annular block 10, which is arranged at the bottom of the shell 1; a heat dissipation mechanism, which is located on the inner side of the connecting ring 2 and is used to dissipate heat for the shell 1, and the heat dissipation mechanism includes a heat dissipation fin 6 installed on the inner side of the connecting ring 2, and a second ventilation groove 8 and a first ventilation groove 5 are respectively opened on the inner side of the connecting ring 2, and a partition plate 7 is arranged between the first ventilation groove 5 and the second ventilation groove 8.

[0025] In this embodiment: after the annular block 10 and the connecting ring 2 are installed, a plurality of heat dissipating fins 6 are attached to the outer wall of the annular block 10 to dissipate the heat generated by the annular block 10 to the outside. When the air around the connecting ring 2 circulates and flows into the second ventilation groove 8 or the first ventilation groove 5, the incoming air is guided by the partition 7 so that the flowing air blows onto the heat dissipating fins 6, thereby accelerating the heat dissipation effect of the heat dissipating fins 6.

[0026] Please refer to Figure 3 and Figure 5 The second ventilation groove 8 is inclined upward, and the second ventilation groove 8 passes through the connecting ring 2. A plurality of grooves are arranged on one side of the heat dissipation fin 6.

[0027] In this embodiment: when the circulating gas enters the second ventilation groove 8, it is blown upward into the internal groove of the heat sink fin 6 through the second ventilation groove 8. The contact area between the heat sink fin 6 and the air is increased through the multiple grooves inside the heat sink fin 6, thereby improving the heat dissipation effect of the heat sink fin 6.

[0028] Please refer to Figure 4The outer wall of the connecting ring 2 is fixedly connected with a plurality of plastic blocks 4, and the top of each plastic block 4 is provided with a slope 9. The plastic block 4 is arranged in a U shape, and the inner height of the plastic block 4 matches the height of the annular block 10, and the top and bottom of the annular block 10 are provided with conical surfaces.

[0029] In this embodiment: first, the shell 1 and the annular block 10 form a capacitor, and the shell 1 and the connecting ring 2 are installed. When the bottom conical surface of the annular block 10 contacts the top inclined surface 9 of the plastic card block 4, the plastic card block 4 itself has elasticity, so that the plastic card block 4 rotates outward under the action of the bottom conical surface of the annular block 10. When the bottom of the annular block 10 is attached to the top of the connecting ring 2, the top of the annular block 10 is flush with the top inner side of the plastic card block 4, so that the plastic card block 4 is no longer squeezed and resets under the action of its own elastic force. Since the inner height of the plastic card block 4 matches the height of the annular block 10, the plastic card block 4 is stuck on the top of the annular block 10 under its own action, thereby limiting the annular block 10, thereby connecting the annular block 10 to the connecting ring 2, thereby improving the stability of the annular block 10 after installation.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A chip aluminum electrolytic capacitor, characterized in that: include: Housing (1); A connecting ring (2), wherein the connecting ring (2) is arranged on the outer wall of the housing (1); A pin (3), wherein the pin (3) is arranged at the bottom of the housing (1); an annular block (10), the annular block (10) being arranged at the bottom of the housing (1); A heat dissipation mechanism is located on the inner side of the connecting ring (2) and is used to dissipate heat from the outer shell (1).

2. A chip aluminum electrolytic capacitor according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat dissipation fin (6) mounted on the inner side of the connecting ring (2); a second ventilation groove (8) and a first ventilation groove (5) are respectively provided on the inner side of the connecting ring (2); and a partition plate (7) is provided between the first ventilation groove (5) and the second ventilation groove (8).

3. A chip aluminum electrolytic capacitor according to claim 2, characterized in that: The second ventilation groove (8) is inclined upward, and the second ventilation groove (8) passes through the connecting ring (2).

4. A chip aluminum electrolytic capacitor according to claim 2, characterized in that: A plurality of grooves are provided on one side of the heat dissipation fin (6).

5. The chip aluminum electrolytic capacitor according to claim 2, characterized in that: A plurality of plastic blocks (4) are fixedly connected to the outer wall of the connecting ring (2), and a slope (9) is arranged on the top of each of the plastic blocks (4).

6. A chip aluminum electrolytic capacitor according to claim 5, characterized in that: The plastic block (4) is arranged in a U shape, the inner height of the plastic block (4) matches the height of the annular block (10), and the top and bottom of the annular block (10) are both provided with conical surfaces.

Images