Heat dissipation system and laser equipment

Abstract

The utility model provides a heat dissipation system and laser equipment. The laser equipment comprises a first heating element with relatively low heat productivity and a second heating element with relatively high heat productivity, the heat dissipation system comprises a heat absorption plate, a heat conduction device and a heat dissipation device; wherein a heat absorption flow channel in the heat absorption plate and the heat dissipation device form a heat exchange loop for circulation of a heat exchange medium; the heat absorption plate comprises a first heat absorption area and a second heat absorption area which are sequentially arranged in the heat exchange medium flowing direction. The first heat-absorbing area is in heat-conducting connection with a first heating element, and the second heat-absorbing area is in heat-conducting connection with a second heating element through a heat-conducting device; and the heat exchange efficiency of the second heating element in heat-conducting connection with the heat-absorbing plate through the heat-conducting device is higher than that of the first heat-absorbing area in heat-conducting connection with the first heating element. According to the scheme, the same heat dissipation system is adopted to dissipate heat of different heating elements, the heat dissipation requirements of the different heating elements are met at the same time, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] The present application relates to the technical field of optical equipment, and in particular to a heat dissipation system and a laser device. Background Art

[0002] Laser equipment, especially high-power laser equipment, such as laser cutting equipment, laser marking equipment, laser welding equipment, etc., these laser equipment themselves have optical components that generate a lot of heat, and components such as pump sources have relatively strict requirements on the operating temperature. Therefore, a heat dissipation system needs to be set up to control the temperature of the optical components.

[0003] Different optical devices in the same laser device generate different amounts of heat and have different requirements for operating temperatures. However, in the prior art, when setting up a heat dissipation system on a laser device, it is often difficult to use a highly integrated and efficient heat dissipation system to best meet the heat dissipation requirements of different optical devices in the laser device. Utility Model Content

[0004] The present application provides a heat dissipation system and a laser device, aiming to provide a highly integrated and efficient heat dissipation system, and the heat dissipation system can better meet the heat dissipation requirements of different optical devices of the laser device.

[0005] In a first aspect, the present application provides a heat dissipation system, which is applied to a laser device, wherein the laser device comprises a first heating element and a second heating element, and the heat generated by the first heating element is less than the heat generated by the second heating element; the heat dissipation system comprises a heat absorbing plate and a heat dissipation device; wherein,

[0006] The heat absorbing plate is provided with a heat absorbing channel inside, and the heat absorbing channel and the heat dissipation device form a heat exchange circuit for the circulation of heat exchange medium; the heat absorbing plate comprises a first heat absorbing area and a second heat absorbing area which are sequentially arranged along the flow direction of the heat exchange medium;

[0007] The first heat absorption area is used for thermally connecting with the first heating element;

[0008] The heat dissipation system also includes a heat conducting device thermally connected to the second heat absorbing area, and the second heat absorbing area is thermally connected to the second heating element through the heat conducting device; the heat exchange efficiency of the second heating element thermally connected to the heat absorbing plate through the heat conducting device is higher than the heat exchange efficiency between the first heat absorbing area and the first heating element.

[0009] In the above technical solution, the first heat absorbing zone dissipates heat for the first heating element, and the second heat absorbing zone and the heat conducting device dissipate heat for the second heating element, thereby realizing the use of the same heat dissipation system to dissipate heat for different heating elements and simultaneously meet the heat dissipation requirements of different heating elements, thereby ensuring that the heat dissipation system has a high degree of integration; and the heat dissipation efficiency of the heat dissipation system is improved by setting a heat exchange loop and using a circulating medium to dissipate heat for the heat absorbing plate.

[0010] In a possible implementation, the heat conducting device includes a heat conducting substrate and a heat exchange chip; wherein,

[0011] The thermally conductive substrate is used for thermally conductive connection with the second heating element;

[0012] The cold pole of the heat exchange chip is thermally connected to the heat conductive substrate, and the hot pole of the heat exchange chip is thermally connected to the second heat absorption area.

[0013] In a possible implementation manner, the number of the second heating element is at least one;

[0014] The number of the heat-conducting device is at least one, wherein each of the heat-conducting devices is thermally connected to at least part of the second heating element.

[0015] In a possible implementation, the heat dissipation system further includes a driving device;

[0016] The driving device is used to drive the heat exchange medium to circulate in the heat exchange circuit.

[0017] In a possible implementation, the heat dissipation device includes a heat dissipation plate assembly and a heat dissipation fan;

[0018] The heat dissipation plate assembly is provided with a heat dissipation channel, one end of the heat dissipation channel is connected to the driving device, and the other end of the heat dissipation channel is connected to the heat absorption channel;

[0019] The heat dissipation fan is used to accelerate the air circulation speed on the surface of the heat dissipation plate assembly.

[0020] In a possible implementation, the heat sink assembly includes a first heat sink group and a second heat sink group, the first heat sink group and the second heat sink group each include at least one heat sink, and a heat sink channel is disposed in each of the heat sinks;

[0021] The heat dissipation channel in the first heat dissipation plate group is connected in parallel with the heat dissipation channel in the second heat dissipation plate group;

[0022] The first heat dissipation plate group is arranged on the air inlet side of the heat dissipation fan, and the second heat dissipation plate group is arranged on the air outlet side of the heat dissipation fan.

[0023] In a possible implementation, the heat sink assembly further includes heat sink fins, and the heat sink fins are fixed to at least one heat sink in the heat sink assembly.

[0024] In a possible implementation manner, the first heat dissipation plate group and the second heat dissipation plate group each include at least two heat dissipation plates;

[0025] At least two heat sinks in any heat sink group are spaced apart, and heat sink channels in the at least two heat sinks are connected in parallel.

[0026] In a possible implementation manner, the heat dissipation device further includes an air filter;

[0027] The air filter is fixed to a side of the first heat sink group facing away from the heat sink fan.

[0028] In a second aspect, the present application provides a laser device, which includes a laser device body, and any one of the above-mentioned heat dissipation devices arranged on the laser device body.

[0029] In the above technical solution, the first heat absorbing zone is used to dissipate heat for the first heating element, and the second heat absorbing zone and the heat conducting device are used to dissipate heat for the second heating element, thereby achieving the goal of using the same heat dissipation system to dissipate heat for different heating elements and simultaneously meet the heat dissipation requirements of different heating elements, thereby ensuring that the heat dissipation system has a high degree of integration; and furthermore, by setting a heat exchange loop and using a circulating medium to dissipate heat for the heat absorbing plate, the heat dissipation efficiency of the heat dissipation system is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 An overall schematic diagram of the heat dissipation system provided in an embodiment of the present application being installed on a laser device;

[0031] Figure 2 This is an overall isometric view of the heat dissipation system in the embodiment of the present application;

[0032] Figure 3 This is a side cross-sectional schematic diagram of a heat dissipation system in an embodiment of the present application;

[0033] Figure 4 Schematic diagram of the first heat sink group in the embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0035] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in one or more embodiments of this specification should be understood by people with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in one or more embodiments of this specification do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] To facilitate understanding of the heat dissipation system provided in the embodiment of the present application, its application scenario is first described. The heat dissipation system provided in the embodiment of the present application can be applied to laser equipment. Laser equipment, especially high-power laser equipment, such as laser cutting equipment, laser marking equipment, laser welding equipment, etc., the optical components of the laser equipment itself generate a large amount of heat, and components such as pump sources have relatively strict requirements on the operating temperature, so it is necessary to set a heat dissipation system to control the temperature of the optical components.

[0037] When cooling the laser equipment, it is necessary to consider that different parts of the laser equipment have different requirements for cooling. For example, some components or parts of the laser equipment generate a lot of heat, which means that the cooling requirements of these components or parts must be considered when setting up the cooling system. For another example, temperature changes have a great impact on the performance of some components or parts of the laser equipment, so when cooling these components or parts, it is also necessary to focus on keeping the temperature of these components or parts within a stable range.

[0038] Specifically, taking a laser device with both a resonant cavity and a pump source as an example, during the operation of the laser device, the pump source generates a lot of heat and is extremely sensitive to temperature changes. Therefore, when designing a heat dissipation system, it is necessary to ensure the heat dissipation demand for the pump source and to keep the temperature of the pump source within a stable range. The heat generated by the resonant cavity itself is less than that of the pump source, and the resonant cavity is not as sensitive to temperature changes as the pump source. Therefore, compared with the pump source, the heat dissipation requirements for the resonant cavity are relatively loose.

[0039] However, in the prior art, when a heat dissipation system is provided on a laser device, it is often difficult to utilize a highly integrated and efficient heat dissipation system to better meet the heat dissipation requirements of different optical devices of the laser device.

[0040] To this end, the present application provides a heat dissipation system and a laser device, aiming to provide a highly integrated and efficient heat dissipation system, and the heat dissipation system can better meet the heat dissipation requirements of different optical devices of the laser device. The heat dissipation system and the laser device provided by the present application are specifically described below in conjunction with the accompanying drawings.

[0041] refer to Figure 1 , Figure 1 The overall schematic diagram of the heat dissipation system provided in the embodiment of the present application being installed on the laser device. First, the laser device to which the heat dissipation system 3 provided in the embodiment of the present application is applied is introduced, such as Figure 1 As shown, the laser device comprises a first heating element 1 and a second heating element 2 , and the heat generated by the first heating element 1 is less than the heat generated by the second heating element 2 during normal operation of the laser.

[0042] As an example, for a specific laser device, the heating element may include a pump source, a pump source, a gain medium, a resonant cavity, etc. During the operation of the laser device, the heating mechanism and the heat generation of these heating elements are not the same. For example, the heating of the pump source comes from the thermal effect of the current, etc., while the heating of the resonant cavity mainly comes from the optical element in the resonant cavity absorbing part of the laser energy and generating heat when the laser passes through the optical element of the resonant cavity. Generally speaking, for laser devices, especially high-power laser devices, the heat generation of the resonant cavity is generally less than the heat generation of the pump source. Therefore, as an optional embodiment, the first heating element 1 in the embodiment of the present application may include a resonant cavity, and the second heating element 2 may include a pump source. It should be understood that the exemplary description of the first heating element 1 and the second heating element 2 here is only a possible embodiment. In specific implementation, according to the different optical element compositions of different laser devices and the different powers of the laser devices, the first heating element 1 and the second heating element 2 can be other components, which are not listed here one by one.

[0043] For laser equipment, the heating elements in the operation process generate heat for various reasons, causing the temperature to rise, which may affect the performance, stability, life and even safety of the laser. It is difficult to meet the heat dissipation needs of the heating elements by relying on the heat exchange between these heating elements and the external environment. Therefore, the heat dissipation system 3 needs to intervene during the operation of the laser equipment.

[0044] Continue to refer Figure 1, the heat dissipation system 3 provided in the embodiment of the present application can be installed on the laser device and dissipate the heat of the heating element of the laser device. The heat dissipation system 3 provided in the embodiment of the present application includes a heat absorbing plate 31 and a heat dissipation device 32. Among them, the heat absorbing plate 31 is used for thermal connection with the heating element of the laser device. When the laser device is running, the heat absorbing plate 31 can absorb heat from the first heating element 1 and the second heating element 2, thereby achieving the effect of heat dissipation and cooling the first heating element 1 and the second heating element 2. The heat dissipation device 32 is thermally connected to the heat absorbing plate 31, and the heat dissipation device 32 is used to dissipate the heat absorbed by the heat absorbing plate 31 from the first heating element 1 and the second heating element 2 to the external space, thereby ensuring that the heat absorbing plate 31 can continuously dissipate the heat of the first heating element 1 and the second heating element 2.

[0045] When the heat-conducting connection between the heat-absorbing plate 31 and the heat-dissipating device 32 is specifically realized, a heat-absorbing channel is provided inside the heat-absorbing plate 31, and the heat-absorbing channel and the heat-dissipating device 32 can form a heat-exchanging circuit for the circulation of the heat-exchanging medium. When the heat-exchanging medium flows through the heat-absorbing channel, it can absorb the heat of the heat-absorbing plate 31, causing the temperature of the heat-exchanging medium to rise; then the heat-exchanging medium flows into the heat-dissipating device 32 through the heat-exchanging circuit, and the heat-dissipating device 32 dissipates the heat absorbed by the heat-exchanging medium into the air, and the heat-exchanging medium is cooled; after the heat-exchanging medium is cooled, it flows back to the heat-absorbing channel in the heat-absorbing plate 31 through the heat-exchanging circuit to absorb heat, and in this way, the heat absorbed by the heat-absorbing plate 31 from the first heating element 1 and the second heating element 2 can be continuously dissipated into the air, so as to achieve the purpose of heat dissipation of the first heating element 1 and the second heating element 2.

[0046] It is worth noting that when the heat exchange medium is specifically set, the heat exchange medium can be common heat exchange materials such as common water, ethylene glycol, heat transfer oil, etc.

[0047] As an optional implementation, in order to specifically realize the circulation of the heat exchange medium in the heat exchange circuit, the heat dissipation system 3 in the embodiment of the present application also includes a driving device, which is connected to the heat exchange circuit, and the driving device can be used to drive the heat exchange medium to circulate in the heat exchange circuit. Specifically, the driving device in the embodiment of the present application can be various pumps and pump groups. By setting a driving device to drive the flow of the heat exchange medium, on the one hand, the flow speed of the heat exchange medium can be increased, thereby improving the heat dissipation efficiency of the heat dissipation system 3; on the other hand, the flow rate of the heat exchange medium can be adjusted by adjusting the output power of the driving device, thereby adjusting the heat dissipation rate of the overall heat dissipation system 3, so as to facilitate the control of the temperature of each heating element of the laser to remain within a suitable temperature range.

[0048] Optional, such as Figure 1As shown, the driving device includes an input end and an output end, wherein the input end of the driving device is connected to the heat sink 32, and the input end of the driving device is connected to the heat absorbing plate 31, so that the driving device can extract the heat exchange medium from the heat sink 32 and pump the heat exchange medium into the heat absorbing plate 31. The heat exchange medium is at a relatively low temperature before it reaches the heat absorbing plate 31 after passing through the heat sink 32. Such a setting of the driving device can keep the operating temperature of the driving device at a relatively low level, thereby improving the operating stability of the driving device.

[0049] Of course, using a driving device to drive is only an example of realizing the circulation of the heat exchange medium in the heat exchange circuit. In other possible implementations, the principle of thermal expansion and contraction of liquids can also be used to achieve the circulation of the heat exchange medium by thermal convection between the heat exchange medium in the heat sink 32 and the heat absorption plate 31.

[0050] When the heat absorbing plate 31 is thermally connected to the first heating element 1 and the second heating element 2, since the heat generation of the first heating element 1 and the second heating element 2 is different, different thermal connection methods can be set according to the heat dissipation requirements of the first heating element 1 and the second heating element 2.

[0051] For reference Figure 1 and Figure 2 , Figure 2 This is an overall isometric view of the heat dissipation system in the embodiment of the present application. Figure 2 As shown in , the heat absorbing plate 31 includes a first heat absorbing area 311 and a second heat absorbing area 312 sequentially arranged along the flow direction of the heat exchange medium. Among them, the first heat absorbing area 311 is used for heat conduction connection with the first heating element 1, and the second heat absorbing area 312 is used for heat conduction connection with the second heating element 2. The first heat absorbing area 311 and the second heat absorbing area 312 are sequentially arranged along the flow direction of the heat exchange medium, which means that the heat exchange medium cooled by the heat dissipation device 32 first flows through the first heat absorbing area 311 and then flows through the second heat absorbing area 312 when returning to the heat absorbing plate 31. The first heat absorbing area 311 is thermally connected with the first heating element 1, that is, the cooled heat exchange medium first cools the first heating element 1 in the heat absorbing plate 31, and then cools the second heating element 2. Since the heat generation of the first heating element 1 is less than that of the second heating element 2, the heat exchange medium is arranged to cool the first heating element 1 first, which can reduce the risk that the temperature of the heat exchange medium is too high due to the large heat generation of the second heating element 2, and thus the first heating element 1 cannot be cooled.

[0052] When the second heating element 2 is specifically provided to be thermally connected to the heat absorbing plate 31, since the second heating element 2 generates a large amount of heat, the second heating element 2 may be thermally connected to the heat absorbing plate 31 via an additional heat conducting device 33. Figure 1 and Figure 2, the heat-conducting device 33 is connected between the second heating element 2 and the heat-absorbing plate 31. The heat-conducting device 33 is heat-conductingly connected to the second heating element 2, so that the heat-conducting device 33 can absorb the heat generated by the second heating element 2; the heat-conducting device 33 is also heat-conductingly connected to the second heat-absorbing area 312, so that the heat absorbed by the second heating element 2 can be transferred to the heat-absorbing plate 31, and then the heat is dissipated through the heat dissipation device 32. And the second element heat dissipation device 32 also satisfies: the heat exchange efficiency of the second heating element 2 through the heat-conducting connection with the heat-absorbing plate 31 through the heat-conducting device 33 is higher than the heat exchange efficiency between the first heat-absorbing area 311 and the first heating element 1. That is, by setting the second heating element 2, the heat of the second heating element 2 can be dissipated more efficiently, so that the same set of equipment can be used to meet the heat dissipation requirements of the first heating element 1 and the second heating element 2 with different heat output.

[0053] Since the heat generated by the first heating element 1 is less than that of the second heating element 2, the heat dissipation requirement is also less than that of the second heating element 2. When the first heating element 1 and the heat absorbing plate 31 are specifically set to be heat-conductively connected, the first heating element 1 can be set to be in direct contact and fixed to the heat absorbing plate 31. Of course, in order to improve the heat transfer efficiency between the first heating element 1 and the heat absorbing plate 31, heat exchange can also be assisted by coating a thermally conductive adhesive between the first heating element 1 and the heat absorbing plate 31. It should be understood that if the heat generated by the first heating element 1 is less than that of the second heating element 2, but the absolute value of the heat generated by the first heating element 1 is larger, and the direct contact and fixation of the first heating element 1 and the heat absorbing plate 31 is difficult to meet the heat dissipation requirement, an auxiliary device similar to the heat-conductive device 33 can also be used to further improve the heat dissipation efficiency.

[0054] In the above technical solution, the first heat absorbing area 311 is used to dissipate heat for the first heating element 1, and the second heat absorbing area 312 and the heat conducting device 33 are used to dissipate heat for the second heating element 2, thereby realizing that the same heat dissipation system 3 is used to dissipate heat for different heating elements and simultaneously meet the heat dissipation requirements of different heating elements, thereby ensuring that the heat dissipation system 3 has a high degree of integration; and the heat dissipation efficiency of the heat dissipation system 3 is improved by setting a heat exchange loop and using a circulating medium to dissipate heat for the heat absorbing plate 31.

[0055] As an optional embodiment, a laser device equipped with a heat dissipation system 3 provided in an embodiment of the present application includes at least one second heating element 2. That is, when the heat dissipation system 3 is applied to a laser device, there may be one, two, three or more second heating elements 2 on the laser device. For example, when the number of the second heating element 2 is one, the second heating element 2 may include only one pump source, or only one circuit board; when the number of the second heating element 2 is two, the second heating element 2 may include two pump sources, or the second heating element 2 may include a pump source and a circuit board; when the number of the second heating element 2 is three, the second heating element 2 may include a pump source, a circuit board and a gain medium, or the second heating element 2 may include two pump sources and a circuit board. That is, when the number of the second heating elements 2 is two or more, the two or more second heating elements 2 may be the same or different.

[0056] The number of heat-conducting devices 33 is also at least one, and each heat-conducting device 33 is connected to at least part of the second heating elements 2 by heat conduction. It should be understood that the number of heat-conducting devices 33 is also at least one, which does not mean that the number of heat-conducting devices 33 is equal to the number of second heating elements 2. For example, if the laser device includes three second heating elements 2, the number of heat-conducting devices 33 can be one, three, four, etc. When these heat-conducting devices 33 are specifically set, one heat-conducting device 33 can be set to correspond to one second heating element 2; two or more heat-conducting devices 33 can also be set to correspond to one second heating element 2; and one heat-conducting device 33 can be used for two or more second heating elements 2. It should also be understood that the heat-conducting device 33 is connected to at least part of the second heating elements 2 by heat conduction, that is, when the number of the second heating elements 2 is two or more, some of the second heating elements 2 can be connected to the heat-conducting device 33 by heat conduction, or all of the second heating elements 2 can be connected to the heat-conducting device 33 by heat conduction.

[0057] As an example, a laser device includes two second heating elements 2, both of which are pump sources, and the heat dissipation device 32 provided on the laser device may be provided with two heat conducting devices 33, and the two heat conducting devices 33 correspond to the two second heating elements 2 one by one; the heat dissipation device 32 provided on the laser device may be provided with one heat conducting device 33, and the one heat conducting device 33 is thermally connected to the two second heating elements 2 at the same time. Of course, there may be more situations in the specific implementation, which are not listed here one by one.

[0058] In the above optional implementation manner, the number and arrangement of the heat-conducting devices 33 can be determined according to the heat dissipation requirements of different second heating elements 2, thereby improving the layout design flexibility of the heat-conducting devices 33 and improving the adaptability of the heat dissipation system 3 to different laser equipment.

[0059] When the heat conducting device 33 is specifically provided, the heat conducting device 33 may be in various forms.

[0060] As an optional implementation, continue to refer to Figure 2 The heat-conducting device 33 includes a heat-conducting substrate 332 and a heat-exchanging chip 331. The heat-exchanging chip 331 is a micro heat-exchanging device, and has two opposite heat-exchanging ends, one end is a cold pole, and the other end is a hot pole. The cold pole of the heat-exchanging chip 331 can absorb heat from the outside, and the heat-exchanging chip 331 can transfer the heat to the hot pole and dissipate it outside the heat-exchanging chip 331 through the hot pole, and the heat-exchanging chip 331 can control the rate of heat transfer. The heat-conducting substrate 332 can be made of a heat-conducting material.

[0061] When the heat exchange chip 331 is specifically arranged, the cold pole of the heat exchange chip 331 is thermally connected to the heat conductive substrate 332, the hot pole of the heat exchange chip 331 is thermally connected to the second heat absorption area 312, and the heat conductive substrate 332 is thermally connected to the second heating element 2. In this arrangement, the second heating element 2 and the heat absorption plate 31 can be thermally connected through the heat conductive substrate 332 and the heat exchange chip 331.

[0062] By providing the heat exchange chip 331, the heat transfer rate between the second heating element 2 and the heat absorbing plate 31 can be controlled. When the second heating element 2 is an optical element such as a pump source that needs to be stable within a certain temperature range, the heat exchange chip 331 can improve the temperature stability of the second heating element 2. On the other hand, by providing the heat conductive substrate 332, the temperature uniformity of the second heating element 2 can be improved, and the second heating element 2 can also be supported by the heat conductive substrate 332.

[0063] Optionally, when the heat-conducting substrate 332 is specifically provided, the heat-conducting substrate 332 may be made of metal or non-metallic material with good thermal conductivity. Also, when the heat-conducting substrate 332, the second heating element 2, the heat exchange chip 331, and the second heat absorption area 312 are specifically provided for thermal connection, in addition to the direct contact and fixation method as shown in the figure, a heat-conducting glue may be applied between any two components to improve the heat transfer efficiency between the components.

[0064] In the above scheme, the heat of the first heating element 1 and the second heating element 2 can be absorbed by the heat absorbing plate 31, and the heat absorbed by the heat absorbing plate 31 can be dissipated to the outside through the heat dissipation device 32. The heat dissipation device 32 in the embodiment of the present application is described in detail below. Figure 1 And as 3, Figure 3 It is a schematic side cross-sectional view of the heat dissipation system in the embodiment of the present application.

[0065] As an optional embodiment, the heat dissipation device 32 in the embodiment of the present application includes a heat dissipation plate assembly and a heat dissipation fan 323. Among them, the heat dissipation plate assembly is provided with a heat dissipation channel, one end of which is connected to the driving device, and the other end of which is connected to the heat absorption channel. The heat dissipation channel constitutes a part of the heat exchange circuit, and the heat exchange medium can flow in the heat dissipation channel. That is, when the heat exchange medium flows through the heat dissipation device 32, it actually flows in the heat dissipation channel. The outer wall of the heat dissipation channel can be directly exposed to the outside air. When the heat exchange medium is located in the heat dissipation channel, the heat of the heat exchange medium can be dissipated to the outside air through the heat dissipation channel, thereby reducing the temperature of the heat exchange medium and achieving the purpose of dissipating the heat of the heating element to the outside air. The heat dissipation fan 323 is used to accelerate the air circulation speed on the surface of the heat dissipation plate assembly, thereby accelerating the cooling rate of the heat exchange medium in the heat dissipation channel and improving the heat dissipation efficiency of the heat dissipation system 3. By providing the heat dissipation plate assembly and the heat dissipation fan 323, the heat dissipation device 32 can have a better heat dissipation effect. Compared with the traditional external water-cooling machine, the heat dissipation device 32 has a high degree of integration and does not require complicated pipes for connection, thereby improving the operating stability of the heat dissipation device 32.

[0066] As an optional implementation, the cooling fan 323 can be disposed in the middle of the cooling plate assembly to obtain a better cooling effect. Figure 3 and Figure 4 , Figure 4 Schematic diagram of the first heat sink group in the embodiment of the present application. Specifically, the heat sink assembly may include a first heat sink group 321 and a second heat sink group 322. The first heat sink group 321 and the second heat sink group 322 each include at least one heat sink 325, and a heat dissipation channel is provided in each heat sink 325. In the first heat sink group 321 or the second heat sink group 322, the heat dissipation channels in each heat sink 325 may be connected in parallel or in series, and the first heat sink group 321 and the second heat sink group 322 are connected in parallel. Figure 3 The blowing direction is shown by the arrow in the middle. The cooling fan 323 has an air inlet side and an air outlet side. The first heat sink group 321 is arranged on the air inlet side of the cooling fan 323, and the second heat sink 325 is arranged on the air outlet side of the cooling fan 323. During the operation of the cooling fan 323, the cooling fan 323 can accelerate the air and allow the outside air to enter the cooling plate assembly from the side of the first heat sink 325. The air is heated by the heat exchange medium and then blown out from the side of the second heat sink 325 to the outside air. When the cooling fan 323 is specifically set, the number of the cooling fan 323 can be one or more. Figure 2Of course, in other possible implementations, the number of cooling fans 323 may also be two, three, five, etc. In actual implementation, the number of cooling fans 323 may be determined according to the size of cooling fans 323, the size of the cooling plate assembly, and the cooling rate requirement of the cooling device 32.

[0067] It should be understood that the cooling fan disposed in the first heat sink group and the second heat sink group is only one way of implementing the cooling fan and the heat sink assembly. In other possible implementations, there may be more possible arrangements, such as three heat sink groups spaced apart in pairs and a cooling fan disposed between every two heat sink groups.

[0068] The cooling fan 323 can accelerate the air flow, but the air flow rate will gradually decrease as the distance from the cooling fan 323 increases. By arranging the cooling fan 323 between the first cooling plate group 321 and the second cooling plate group 322, the uniformity of the air flow rate in each part of the cooling plate assembly can be improved, thereby improving the temperature uniformity of each part of the cooling plate assembly, and reducing the risk of damage to the heat dissipation device 32 due to uneven temperature.

[0069] The cooling fan 323 can accelerate the heat dissipation rate of the heat dissipation device 32 by accelerating the air flow, but the cooling fan 323 itself and the heat dissipation plate assembly may accumulate impurities such as dust and oil mist, which may reduce the life of the cooling fan 323 and reduce the heat dissipation efficiency of the heat dissipation plate assembly. Therefore, some protective structures can be set to address the above risks.

[0070] As an optional implementation, continue to refer to Figure 3 The heat sink 32 further includes an air filter 324, which is fixed to the side of the first heat sink group 321 away from the heat sink fan 323. That is, the air filter 324 is arranged on the air inlet side of the entire heat sink 32, and the air needs to be first filtered by the air filter 324 when being sucked into the heat sink 32. By setting the air filter 324, part of the dust, oil mist, etc. in the air can be filtered out, thereby reducing the adhesion of dust and oil mist on the heat sink fan 323 and the heat sink 325.

[0071] Of course, in addition to the heat dissipation fan 323, other auxiliary heat dissipation structures may also be provided. Figure 4 As an optional embodiment, the heat sink assembly further includes heat sink fins 326, and the heat sink fins 326 are fixed to at least one heat sink 325 in the heat sink assembly. In a specific implementation, the heat sink fins 326 can be as follows: Figure 4 The wave shape shown can also be a grid shape or other shapes. Figure 4Only the heat dissipation fins 326 of the first heat dissipation plate group 321 are shown. The fin arrangement of the second heat dissipation plate group 322 can refer to the first heat dissipation plate group 321 and will not be shown again here. The heat dissipation fins 326 can be fixed to the heat dissipation plate 325 by welding or the like, or can be integrally formed with the heat dissipation plate 325. By providing the heat dissipation fins 326 fixedly connected to the heat dissipation plate 325, the contact area between the heat dissipation plate 325 and the air can be increased, thereby assisting the heat dissipation of the heat dissipation plate 325 and improving the heat dissipation efficiency of the heat dissipation device 32.

[0072] It should be understood that the heat dissipation fins 326 here can be fixed to the heat dissipation plates 325 in the first heat dissipation plate group 321, can also be fixed to the heat dissipation plates 325 in the second heat dissipation plate group 322, and can also be fixed to the heat dissipation plates 325 in both the first heat dissipation plate group 321 and the second heat dissipation plate group 322. And if the heat dissipation fins 326 are provided in both the first heat dissipation plate group 321 and the second heat dissipation plate group 322, the heat dissipation fins 326 provided in the first heat dissipation plate group 321 and the heat dissipation fins 326 provided in the second heat dissipation plate group 322 can be the same or different.

[0073] When the first heat sink group 321 and the second heat sink group 322 are specifically arranged, each heat sink group includes at least one heat sink 325 , and the number of heat sinks 325 in each heat sink group can be one, two, three, four, etc.

[0074] As an optional embodiment, the first heat sink group 321 and the second heat sink group 322 each include at least two heat sinks 325, at least two heat sinks 325 in any heat sink group are arranged at intervals, and the heat dissipation channels in at least two heat sinks 325 are connected in parallel. Figure 4 , Figure 4 The first heat sink group 321 shown in the figure includes five heat sinks 325, and the five heat sinks 325 are arranged in parallel with the heat absorbing plate 31 and are spaced apart from each other by a distance. When the five heat sinks 325 are specifically arranged, each heat sink 325 is provided with a heat dissipation channel, and these heat dissipation channels are connected in parallel and connected to the heat exchange circuit as a whole. When the heat exchange medium heated up in the heat absorption channel flows to the heat dissipation device 32, it can be divided into five parts and pass through the heat dissipation channels in the five heat sinks 325 respectively. By setting two or more heat sinks 325, the heat exchange medium with a higher temperature flowing out of the heat absorption channel can be dissipated through two or more heat sinks 325, thereby improving the heat dissipation rate of the heat sink group. In addition, by setting two or more heat sinks 325 at intervals, both sides of each heat sink group can be in contact with the air, and heat dissipation fins 326 can be set at the intervals between the heat sinks 325, thereby improving the heat dissipation rate of the heat sink group.

[0075] The embodiment of the present application also provides a laser device, the laser device body, and any of the above-mentioned heat dissipation systems arranged on the laser device body. When the heat dissipation system is specifically arranged, different heating elements can be arranged to be thermally connected to the first heat absorption zone or the second heating element according to the heat dissipation requirements of different heating elements on the laser device. For example, for a laser marking machine, the resonant cavity of the laser marking machine can be arranged to be thermally connected to the first heat absorption zone, and the pump source of the laser marking machine can be arranged to be thermally connected to the heat conduction device.

[0076] The laser device dissipates heat for the first heating element through the first heat absorption zone, and dissipates heat for the second heating element through the second heat absorption zone and the heat conducting device, thereby achieving the goal of using the same heat dissipation system to dissipate heat for different heating elements and simultaneously satisfying the heat dissipation requirements of the different heating elements, thereby ensuring that the heat dissipation system has a high degree of integration; and furthermore, by providing a heat exchange loop and using a circulating medium to dissipate heat for the heat absorption plate, the heat dissipation efficiency of the heat dissipation system is improved.

[0077] One or more embodiments of this specification are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification should be included in the scope of protection of this disclosure.

[0078] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation system, applied to a laser device, wherein the laser device comprises a first heating element and a second heating element, and the heat generated by the first heating element is less than the heat generated by the second heating element; characterized in that: The heat dissipation system includes a heat absorbing plate and a heat dissipation device; wherein, The heat absorbing plate is provided with a heat absorbing channel inside, and the heat absorbing channel and the heat dissipation device form a heat exchange circuit for the circulation of heat exchange medium; the heat absorbing plate comprises a first heat absorbing area and a second heat absorbing area which are sequentially arranged along the flow direction of the heat exchange medium; The first heat absorption area is used for thermally connecting with the first heating element; The heat dissipation system also includes a heat conducting device thermally connected to the second heat absorbing area, and the second heat absorbing area is thermally connected to the second heating element through the heat conducting device; the heat exchange efficiency of the second heating element thermally connected to the heat absorbing plate through the heat conducting device is higher than the heat exchange efficiency between the first heat absorbing area and the first heating element.

2. The heat dissipation system according to claim 1, characterized in that: The heat conduction device includes a heat conduction substrate and a heat exchange chip; wherein, The thermally conductive substrate is used for thermally connecting with the second heating element; The cold pole of the heat exchange chip is thermally connected to the heat conductive substrate, and the hot pole of the heat exchange chip is thermally connected to the second heat absorption area.

3. The heat dissipation system according to claim 1, characterized in that: The number of the second heating element is at least one; The number of the heat-conducting device is at least one, wherein each of the heat-conducting devices is thermally connected to at least part of the second heating element.

4. The heat dissipation system according to any one of claims 1 to 3, characterized in that: The heat dissipation system also includes a driving device; The driving device is used to drive the heat exchange medium to circulate in the heat exchange circuit.

5. The heat dissipation system according to claim 4, characterized in that: The heat dissipation device comprises a heat dissipation plate assembly and a heat dissipation fan; The heat dissipation plate assembly is provided with a heat dissipation channel, one end of the heat dissipation channel is connected to the driving device, and the other end of the heat dissipation channel is connected to the heat absorption channel; The heat dissipation fan is used to accelerate the air circulation speed on the surface of the heat dissipation plate assembly.

6. The heat dissipation system according to claim 5, characterized in that: The heat dissipation plate assembly includes a first heat dissipation plate group and a second heat dissipation plate group, the first heat dissipation plate group and the second heat dissipation plate group each include at least one heat dissipation plate, and a heat dissipation channel is provided in each of the heat dissipation plates; The heat dissipation channel in the first heat dissipation plate group is connected in parallel with the heat dissipation channel in the second heat dissipation plate group; The first heat dissipation plate group is arranged on the air inlet side of the heat dissipation fan, and the second heat dissipation plate group is arranged on the air outlet side of the heat dissipation fan.

7. The heat dissipation system according to claim 6, characterized in that: The heat sink assembly further comprises heat sink fins, and the heat sink fins are fixed to at least one heat sink in the heat sink assembly.

8. The heat dissipation system according to claim 6, characterized in that: The first heat dissipation plate group and the second heat dissipation plate group each include at least two heat dissipation plates; At least two heat sinks in any heat sink group are spaced apart, and heat sink channels in at least two heat sinks are connected in parallel.

9. The heat dissipation system according to claim 6, characterized in that: The heat dissipation device also includes an air filter; The air filter is fixed to a side of the first heat dissipation plate group facing away from the heat dissipation fan.

10. A laser device, characterized in that: The invention comprises a laser device body and a heat dissipation device as claimed in any one of claims 1 to 9 arranged on the laser device body.

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