Planar damper, loudspeaker, electronic equipment and vehicle

Abstract

The utility model discloses a planar damper, a loudspeaker, electronic equipment and a vehicle. The planar damper comprises a conductive layer and a recovery layer, the restoring layer is arranged on one side of the conducting layer in the first direction, the restoring layer is suitable for providing restoring force in the first direction and limiting movement of the plane damper in the second direction, and the first direction intersects with the second direction. The plane damper is suitable for a high-power loudspeaker.

Description

Technical Field

[0001] The utility model relates to the technical field of loudspeakers, in particular to a plane elastic wave, a loudspeaker, an electronic device and a vehicle. Background Art

[0002] The existing planar elastic wave uses a copper foil layer to provide conductivity and restoring force for the entire speaker. However, the restoring force of the copper foil is relatively low. Therefore, the power of the speaker using copper foil as the planar elastic wave cannot be too large, because the greater the power, the greater the amplitude. Ultimately, due to the lack of extension and restoring force of the copper foil, the shrapnel will break, causing mechanical damage to the speaker.

[0003] Therefore, the existing plane elastic wave is only applicable to speakers with lower power, but cannot be used for speakers with higher power. Utility Model Content

[0004] The utility model aims to provide a plane spring, a loudspeaker, an electronic device and a vehicle, so as to solve the problem that the existing plane spring is not suitable for a high-power loudspeaker.

[0005] In order to achieve the purpose of the utility model, the utility model provides the following technical solutions:

[0006] In a first aspect, the utility model provides a plane wave damper, comprising:

[0007] Conductive layer;

[0008] The recovery layer is disposed on one side of the conductive layer in the first direction, and the recovery layer is suitable for providing a recovery force in the first direction and limiting the movement of the plane elastic wave in the second direction, and the first direction intersects with the second direction.

[0009] In one embodiment, the recovery layer is any one of a spring steel component, a glass fiber component, and a carbon fiber component.

[0010] In one embodiment, the size of the recovery layer in the first direction is d1, which satisfies: 130 μm≤d1≤170 μm.

[0011] In one implementation, a dimension of the conductive layer in the first direction is d2, satisfying: 10 μm≤d2≤15 μm.

[0012] In one embodiment, the plane elastic wave further includes a first insulating layer, and the first insulating layer is disposed between the conductive layer and the recovery layer.

[0013] In one embodiment, the plane elastic wave further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the recovery layer and the first insulating layer, and the second adhesive layer is disposed between the conductive layer and the first insulating layer.

[0014] In one embodiment, the plane elastic wave further includes a second insulating layer, and the second insulating layer is disposed on a side of the recovery layer away from the conductive layer.

[0015] In one embodiment, the plane elastic wave further includes a third adhesive layer, and the third adhesive layer is disposed between the second insulating layer and the recovery layer.

[0016] In one embodiment, the plane elastic wave further includes a third insulating layer, and the third insulating layer is disposed on a side of the conductive layer away from the recovery layer.

[0017] In one embodiment, the plane elastic wave further includes a fourth adhesive layer, and the fourth adhesive layer is disposed between the conductive layer and the third insulating layer.

[0018] In one embodiment, a mounting hole is opened on the plane damper, and the mounting hole passes through the third insulating layer and the fourth adhesive layer.

[0019] In one embodiment, the plane damper further includes a conductive portion, and the conductive portion is received in the mounting hole and connected to the conductive layer.

[0020] In one embodiment, the plane elastic wave comprises an inner ring, an outer ring and a connecting portion, the inner ring and the outer ring are both in a ring shape connected end to end, the outer ring surrounds the inner ring, and the connecting portion connects the inner ring and the outer ring.

[0021] In a second aspect, the utility model provides a loudspeaker, comprising the plane damper described in any one of the various implementations of the first aspect.

[0022] In a third aspect, the utility model provides an electronic device, comprising the speaker described in various embodiments of the second aspect.

[0023] In a fourth aspect, the utility model provides a vehicle, comprising the speaker described in various embodiments of the second aspect and / or the electronic device described in various embodiments of the third aspect.

[0024] The plane damper of the utility model has good conductivity and restoring force by providing a stacked conductive layer and a restoring layer, and the restoring layer can provide restoring force in the first direction and limit the movement of the plane damper in the second direction. The plane damper of the utility model has good conductivity and restoring force at the same time. The restoring layer prevents the conductive layer from breaking due to insufficient extension and restoring force in the first direction of the plane damper, and can also keep the positions of the plane damper and the voice coil connected to the plane damper stable in the magnetic field in the second direction, thereby avoiding sound distortion, sound quality degradation and additional noise, so that the plane damper can be applied to high-power speakers. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 is a side view of a plane elastic wave of an embodiment;

[0027] Figure 2 FIG. 1 is a top view of a plane elastic wave of an embodiment.

[0028] Description of reference numerals:

[0029] 100-plane elastic wave, 10-conductive layer, 20-recovery layer, 30-first insulating layer, 31-first bonding layer, 32-second bonding layer, 40-second insulating layer, 41-third bonding layer, 50-third insulating layer, 51-fourth bonding layer, 60-conductive part, 70-inner ring, 80-outer ring, 90-connecting part. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0032] Unless otherwise defined, all technical and scientific terms used in this utility model have the same meaning as those commonly understood by technicians in the technical field of this utility model. The terms used in the specification of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used in this utility model includes any and all combinations of one or more related listed items.

[0033] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] Existing loudspeakers include a plane elastic wave, a diaphragm and a voice coil. The plane elastic wave is suitable for connecting the diaphragm and the voice coil and providing stable support for the diaphragm and the voice coil. When the voice coil is driven by the current in the magnetic field and moves, the plane elastic wave ensures that the diaphragm can vibrate along with the movement of the voice coil. The vibration of the voice coil drives the diaphragm to vibrate, and then compresses the air to generate sound waves. At the same time, the plane elastic wave needs to provide the diaphragm with the necessary restoring force, so that the plane elastic wave can drive the diaphragm to quickly return to the initial position after the voice coil stops moving. The plane elastic wave can also prevent the voice coil from contacting the magnet or other components when vibrating.

[0035] In one embodiment, the speaker further includes a magnetic circuit system, which includes a magnet, a magnetic conductive plate and a field core column. The magnet, the magnetic conductive plate and the field core column work together to make the magnetic field of the magnetic circuit system evenly distributed, so that the voice coil can vibrate smoothly.

[0036] Optionally, the speaker may be of cone type, horn type, dome type, etc., without limitation.

[0037] Existing planar springs generally use a single copper foil layer to provide conductivity and restoring force for the entire speaker. Since the restoring force of the copper foil is low, the power of the speaker made with the planar spring cannot be too large. A high-power speaker will cause the amplitude to increase, and eventually the planar spring will break due to the lack of extension and restoring force of the copper foil, causing mechanical damage to the speaker. Therefore, the existing planar springs can only be applied to low-power speakers, not high-power speakers.

[0038] For reference Figure 1 The utility model provides a plane damper 100, comprising a conductive layer 10 and a recovery layer 20. The recovery layer 20 is disposed on one side of the conductive layer 10 in a first direction, and the recovery layer 20 is suitable for providing a recovery force in the first direction and limiting the movement of the plane damper 100 in a second direction, and the first direction intersects with the second direction.

[0039] The conductive layer 10 can be a metal component. Specifically, the conductive layer 10 can be copper, copper alloy, silver, aluminum alloy, etc., without limitation. The conductive layer 10 is provided so that the plane elastic wave 100 has an electromagnetic shielding effect, which helps to reduce or eliminate the impact of electromagnetic interference on the performance of the speaker and ensure the pure transmission of the audio signal. In addition, after using the conductive layer 10, there is no need to set the silk thread, thereby greatly reducing the thickness of the speaker, and avoiding the loss of sound of the speaker due to the breakage of the silk thread, extending the service life of the product, and optimizing the production process of the product.

[0040] Optionally, the orthographic projections of the conductive layer 10 and the recovery layer 20 in the first direction are the same.

[0041] Specifically, limiting the movement of the plane damper 100 in the second direction may be to prevent the plane damper 100 from being displaced in the second direction, or to reduce the displacement of the plane damper 100 in the second direction.

[0042] The plane damper 100 of the present invention is provided with a stacked conductive layer 10 and a restoring layer 20, and the restoring layer 20 can provide a restoring force in a first direction and limit the movement of the plane damper 100 in a second direction. The plane damper 100 of the present invention has good conductivity and restoring force at the same time. The restoring layer 20 prevents the plane damper 100 from breaking due to insufficient extension and restoring force in the first direction, and can also keep the positions of the plane damper 100 and the voice coil connected to the plane damper 100 stable in the magnetic field in the second direction, thereby avoiding sound distortion, sound quality degradation and additional noise, so that the plane damper 100 can be applied to high-power speakers.

[0043] In one embodiment, the recovery layer 20 is any one of a spring steel component, a glass fiber component, and a carbon fiber component.

[0044] Specifically, the main component material of the spring steel component is 65Mn, the tensile strength of 65Mn is a1, and satisfies: a1≥980MPa, and the yield strength of 65Mn is b1, and satisfies: b1≥740MPa.

[0045] Specifically, the main components of the carbon fiber component may be one-dimensional carbon fiber and / or two-dimensional carbon fiber and a resin-based material as a matrix, the tensile strength of the carbon fiber is a2, satisfying: a2≥1600MPa, and the yield strength of the carbon fiber is b2, satisfying: b2≥1000MPa.

[0046] Specifically, the tensile strength of the glass fiber is a3, which satisfies: a3≥1000 MPa, and the yield strength of the glass fiber is b3, which satisfies: b3≥1000 MPa.

[0047] The recovery layer 20 is made of a material such as a spring steel component, a glass fiber component, a carbon fiber component, etc., which has good tensile strength and yield strength. The recovery layer 20 has good recovery force in the first direction, so that the plane elastic wave 100 can drive the diaphragm to quickly return to the initial position after the voice coil of the speaker stops moving. At the same time, it can also avoid the plane elastic wave 100 from breaking due to insufficient extension and recovery force.

[0048] For reference Figure 1 In one embodiment, the size of the recovery layer 20 in the first direction is d1, which satisfies: 130 μm≤d1≤170 μm.

[0049] Optionally, d1 can be 130μm, 140μm, 150μm, 160μm, 170μm, etc. without limitation.

[0050] When d1 is less than 130 μm, the thickness of the recovery layer 20 is too thin, and the recovery force of the recovery layer 20 is insufficient to support the recovery layer 20 to drive the remaining structures of the planar damper 100 to recover to the initial position in the first direction; when d1 is greater than 170 μm, the thickness of the recovery layer 20 can already meet the recovery force requirement, and an overly thick recovery layer 20 will lead to a waste of materials; when 130 μm≤d1≤170 μm, the thickness of the recovery layer 20 is moderate and can provide sufficient recovery force.

[0051] Optionally, the size of the recovery layer 20 in the first direction can be adjusted according to actual conditions. The size of the recovery layer 20 of the plane elastic wave 100 of a high-power speaker is larger than the size of the recovery layer 20 of the plane elastic wave 100 of a low-power speaker (for example, power less than 1 watt) because the recovery layer 20 with a larger d1 can withstand greater vibration.

[0052] For reference Figure 1 In one embodiment, the dimension of the conductive layer 10 in the first direction is d2, satisfying: 10 μm≤d2≤15 μm.

[0053] Optionally, d2 can be 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, etc. without limitation.

[0054] When d2 is less than 10 μm, the structural strength of the conductive layer 10 is too low, and the conductive layer 10 may break during the vibration recovery process. When d2 is greater than 15 μm, the conductive layer 10 is too thick, which increases the overall weight and cost of the planar damper 100. When 10 μm≤d2≤15 μm, the structural strength of the conductive layer 10 can be guaranteed, and the overall weight of the planar damper 100 can be reduced.

[0055] For reference Figure 1In one embodiment, the plane elastic wave 100 further includes a first insulating layer 30 , and the first insulating layer 30 is disposed between the conductive layer 10 and the recovery layer 20 .

[0056] The material of the first insulating layer 30 may be plastic, rubber, etc. Specifically, the plastic may be polyvinyl chloride, polyethylene, polyimide, etc., without limitation.

[0057] The size of the first insulating layer 30 in the first direction is d3, which satisfies: 10 μm≤d3≤15 μm. Optionally, d3 may be 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, etc., without limitation.

[0058] The first insulating layer 30 is provided to prevent electrical connection between the conductive layer 10 and the recovery layer 20, which would result in the loss of speaker performance.

[0059] For reference Figure 1 In one embodiment, the plane elastic wave 100 further includes a first adhesive layer 31 and a second adhesive layer 32 , wherein the first adhesive layer 31 is disposed between the recovery layer 20 and the first insulating layer 30 , and the second adhesive layer 32 is disposed between the conductive layer 10 and the first insulating layer 30 .

[0060] Optionally, the material of the first adhesive layer 31 and the second adhesive layer 32 can be resin, rubber, curing agent, etc., without limitation. Specifically, the material of the first insulating layer 30 is polyimide, and a partial cross-linking structure can be formed between the polyimide and the first adhesive layer 31 and the second adhesive layer 32, which is beneficial to improve the bonding strength between the first insulating layer 30 and the first adhesive layer 31 and the second adhesive layer 32, so that the layer structure of the plane elastic wave is not easily separated as a whole, thereby improving the structural strength of the plane elastic wave 100.

[0061] Optionally, other structural layers may be provided between the first adhesive layer 31 and the recovery layer 20 , and / or between the first adhesive layer 31 and the first insulating layer 30 , and / or between the second adhesive layer 32 and the conductive layer 10 , and / or between the second adhesive layer 32 and the first insulating layer 30 .

[0062] The dimension of the first adhesive layer 31 in the first direction is d4, which satisfies: 20 μm≤d4≤30 μm. Optionally, d4 can be 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, etc., without limitation.

[0063] The size of the second adhesive layer 32 in the first direction is d5, which satisfies: 10 μm≤d5≤15 μm. Optionally, d5 can be 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, etc., without limitation.

[0064] Since the size of the recovery layer 20 in the first direction is larger than that of the conductive layer 10 , the size of the first adhesive layer 31 needs to be larger to provide sufficient adhesive force, which is beneficial to improving the structural stability of the planar damper 100 .

[0065] For reference Figure 1 In one embodiment, the plane damper 100 further includes a second insulating layer 40 . The second insulating layer 40 is disposed on a side of the recovery layer 20 away from the conductive layer 10 .

[0066] The material of the second insulating layer 40 may be plastic, rubber, etc. Specifically, the plastic may be polyvinyl chloride, polyethylene, polyimide, etc., without limitation.

[0067] The size of the second insulating layer 40 in the first direction is d6, which satisfies: 20 μm≤d6≤30 μm. Optionally, d6 can be 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, etc., without limitation.

[0068] The second insulating layer 40 is provided to achieve insulation between the recovery layer 20 and the outside world and to prevent oxidation of the recovery layer 20 , thereby increasing the service life of the recovery layer 20 .

[0069] For reference Figure 1 In one embodiment, the plane damper 100 further includes a third adhesive layer 41 , and the third adhesive layer 41 is disposed between the second insulating layer 40 and the recovery layer 20 .

[0070] The dimension of the third adhesive layer 41 in the first direction is d7, which satisfies: 20 μm≤d7≤30 μm. Optionally, d7 may be 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, etc., without limitation.

[0071] The third adhesive layer 41 is provided to achieve good anti-oxidation and insulation effects of the second insulating layer 40 on the recovery layer 20 , thereby increasing the service life of the planar damper 100 .

[0072] For reference Figure 1 In one embodiment, the plane elastic wave 100 further includes a third insulating layer 50 . The third insulating layer 50 is disposed on a side of the conductive layer 10 away from the recovery layer 20 .

[0073] The dimension of the third insulating layer 50 in the first direction is d8, which satisfies: 20 μm≤d8≤30 μm. Optionally, d6 may be 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, etc., without limitation.

[0074] The third insulating layer 50 is suitable for insulating the conductive layer 10 from the outside and preventing the conductive layer 10 from being oxidized, thereby increasing the service life of the conductive layer 10 .

[0075] For reference Figure 1In one implementation, the plane elastic wave 100 further includes a fourth adhesive layer 51 , and the fourth adhesive layer 51 is disposed between the conductive layer 10 and the third insulating layer 50 .

[0076] The size of the fourth adhesive layer 51 in the first direction is d9, which satisfies: 20 μm≤d9≤30 μm. Optionally, d9 can be 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, etc., without limitation.

[0077] The fourth adhesive layer 51 is provided to relatively fix the third insulating layer 50 and the conductive layer 10, so that the third insulating layer 50 can insulate the conductive layer 10 from the outside, and prevent the conductive layer 10 from being oxidized, thereby increasing the service life of the conductive layer 10 and the planar damper 100, which is beneficial to the use of the speaker.

[0078] In one embodiment, a mounting hole is opened on the plane damper 100 , and the mounting hole passes through the third insulating layer 50 and the fourth adhesive layer 51 .

[0079] There can be one or more mounting holes, and the multiple mounting holes are arranged at intervals. The shape of the mounting holes can be circular, rectangular, elliptical, etc., without limitation.

[0080] During the assembly of the planar damper 100, a mounting hole may be firstly opened on the third insulating layer 50 and then the third insulating layer 50, the fourth adhesive layer 51 and the conductive layer 10 are installed. Alternatively, a mounting hole may be opened on the third insulating layer 50 and the fourth adhesive layer 51 after the third insulating layer 50, the fourth adhesive layer 51 and the conductive layer 10 are installed. There is no limitation.

[0081] For reference Figure 2 In one embodiment, the plane damper 100 further includes a conductive portion 60 , which is received in the mounting hole and connected to the conductive layer 10 .

[0082] The conductive part 60 is connected to the conductive layer 10 by welding. The conductive part 60 is a conductive component. Specifically, the conductive part 60 can be made of tin-based, silver-based, aluminum, stainless steel, nickel-based, etc., without limitation.

[0083] The conductive portion 60 is electrically connected to the conductive layer 10 , and indirectly realizes electrical connection between the planar damper 100 and the voice coil of the speaker, thereby realizing transduction and control of the electrical signal of the voice coil.

[0084] For reference Figure 2 In one embodiment, the plane elastic wave 100 includes an inner ring 70 , an outer ring 80 and a connecting portion 90 . The inner ring 70 and the outer ring 80 are both in a ring shape connected end to end. The outer ring 80 surrounds the inner ring 70 , and the connecting portion 90 connects the inner ring 70 and the outer ring 80 .

[0085] Optionally, the number of the inner rings 70 may be one or more. The multiple inner rings 70 may be arranged at intervals, and two adjacent inner rings 70 may be connected by a connecting portion 90 .

[0086] The inner ring 70 is suitable for connecting with the voice coil to control the movement of the voice coil, ensure that the voice coil can maintain a stable position and posture during vibration, and effectively transfer the vibration generated by the voice coil to the diaphragm of the speaker, thereby ensuring the generation and propagation of sound.

[0087] Optionally, the loudspeaker further includes a basin frame, which is suitable for supporting and protecting the plane damper 100, the voice coil, the diaphragm, etc., and preventing foreign objects from falling into the magnetic gap, ensuring that the sound can be effectively transmitted to the air. The basin frame can be made of iron sheet, cast aluminum, plastic, etc., without limitation. The outer periphery of the outer ring 80 away from the inner ring 70 is suitable for connection with the basin frame, which is conducive to improving the structural stability of the loudspeaker.

[0088] The connecting portion 90 may be straight or curved, that is, S-shaped, wavy, etc., without limitation. There may be multiple connecting portions 90 connecting the same inner ring 70 and outer ring 80, which is suitable for improving the connection strength between the inner ring 70 and the outer ring 80 and improving the structural strength of the speaker. Multiple connecting portions 90 are arranged at intervals.

[0089] The inner ring 70 is provided with a first positive electrode and a first negative electrode, and the outer ring 80 is provided with a second positive electrode and a second negative electrode. The first positive electrode is provided in a one-to-one correspondence with the first negative electrode, and the second positive electrode is provided in a one-to-one correspondence with the second negative electrode. The positive and negative electrodes on the inner ring 70 and the outer ring 80 are provided in a corresponding manner to the positive and negative electrodes of the voice coil, and the positions of the positive and negative electrodes on the inner ring 70 and the outer ring 80 are also provided in a corresponding manner to the conductive part 60. The positive and negative electrodes of the inner ring 70 and the outer ring 80 are provided in a corresponding manner to the positive and negative electrodes of the voice coil, so that the voice coil can vibrate in a preset direction, thereby ensuring the sound quality and performance of the speaker.

[0090] The plane damper 100 of the utility model can provide positioning for the voice coil, and the restoring layer 20 of the plane damper 100 can provide restoring force for the voice coil in the first direction, so that the voice coil can return to the initial position after stopping moving in the first direction. In addition, the speaker using the plane damper 100 of the utility model conducts electricity through the plane damper 100, avoiding the use of silk thread, thereby greatly reducing the thickness of the speaker, and also avoiding the loss of sound of the speaker due to the breakage of the silk thread, extending the service life of the product, and optimizing the production process of the product.

[0091] The utility model provides an electronic device, comprising a speaker as described in any one of the above various embodiments. Specifically, the electronic device can be an audio system, a mobile phone, a computer, a television, etc., without limitation.

[0092] The utility model provides a vehicle, including the speaker described in any one of the various embodiments described above and / or the electronic device described in any one of the various embodiments described above. The vehicle may be directly provided with a speaker, and / or the vehicle may be provided with an electronic device including the speaker described in any one of the various embodiments described above. Specifically, the vehicle may be provided with a speaker and a vehicle-mounted tablet computer with the speaker.

[0093] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0094] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A plane wave damper, characterized in that: include: Conductive layer; The recovery layer is disposed on one side of the conductive layer in the first direction, and the recovery layer is suitable for providing a recovery force in the first direction and limiting the movement of the plane elastic wave in the second direction, and the first direction intersects with the second direction.

2. The plane wave damper according to claim 1, characterized in that: The recovery layer is any one of a spring steel component, a glass fiber component, and a carbon fiber component.

3. The plane wave damper according to claim 1, characterized in that: The size of the recovery layer in the first direction is d1, which satisfies: 130 μm≤d1≤170 μm.

4. The plane wave damper according to claim 1, characterized in that: The dimension of the conductive layer in the first direction is d2, which satisfies: 10 μm≤d2≤15 μm.

5. The plane wave damper according to claim 1, characterized in that: The plane damper further includes a first insulating layer, and the first insulating layer is disposed between the conductive layer and the recovery layer.

6. The plane wave damper according to claim 5, characterized in that: The plane elastic wave further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the recovery layer and the first insulating layer, and the second adhesive layer is disposed between the conductive layer and the first insulating layer.

7. The plane wave damper according to claim 1, characterized in that: The plane damper further includes a second insulating layer, and the second insulating layer is disposed on a side of the recovery layer away from the conductive layer.

8. The plane wave damper according to claim 7, characterized in that: The plane elastic wave further includes a third adhesive layer, and the third adhesive layer is disposed between the second insulating layer and the recovery layer.

9. The plane wave damper according to claim 1, characterized in that: The plane damper further includes a third insulating layer, and the third insulating layer is disposed on a side of the conductive layer away from the recovery layer.

10. The plane wave damper according to claim 9, characterized in that: The plane damper further includes a fourth adhesive layer, and the fourth adhesive layer is disposed between the conductive layer and the third insulating layer.

11. The plane wave damper according to claim 10, characterized in that: A mounting hole is formed on the plane elastic wave, and the mounting hole penetrates the third insulating layer and the fourth adhesive layer.

12. The plane wave damper according to claim 11, characterized in that: The plane damper further includes a conductive portion received in the mounting hole and connected to the conductive layer.

13. The plane wave damper according to any one of claims 1 to 12, characterized in that: The plane elastic wave comprises an inner ring, an outer ring and a connecting portion. The inner ring and the outer ring are both in a ring shape connected end to end. The outer ring surrounds the inner ring. The connecting portion connects the inner ring and the outer ring.

14. A loudspeaker, characterized in that: It comprises the plane elastic wave as claimed in any one of claims 1 to 13.

15. An electronic device, characterized in that: Comprising a speaker as claimed in claim 14.

16. A vehicle, characterized in that: Comprising the speaker as claimed in claim 14 and / or the electronic device as claimed in claim 15.

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