Core board capable of protecting pins

By setting up an upper pressure plate and plug-in snap on the core board, and using an insulated rubber pad to tightly contact the chip pin, the problem of exposed and easy damage of the chip pin is solved, achieving effective protection of the pin and convenient installation and removal process.

CN222602649UActive Publication Date: 2025-03-11GUANGZHOU XUNBANG TECH CO LTD
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Patent Information

Application Number
CN202420225100.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-30
Publication Date
2025-03-11
Estimated Expiration
2034-01-30

AI Technical Summary

Technical Problem

The side pins of the chip are exposed, which are prone to damage or short-circuit, resulting in damage to the chip.

Method used

Design a core board that protects the pins. By setting up an upper pressure plate and plug-in snaps, the insulating rubber pad is tightly in contact with the chip pins, protecting the pins, and through the design of the elastic plate and the down pressure rod, it is easy to install and remove the upper pressure plate.

Benefits of technology

Effectively protects the chip pins, prevents short circuits and damage, and simplifies the installation and removal of the upper pressure plate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a core board capable of protecting pins, which comprises a circuit board, a chip pin is welded on the top of the circuit board, a plug-in buckle is arranged on the top of the circuit board, the circuit board is fixedly provided with an upper pressing plate positioned above the chip pin through the plug-in buckle, and the upper pressing plate is fixedly connected with the chip pin through the plug-in buckle. The bottom of the upper pressing plate is fixedly provided with a mounting base located over the chip pins, the bottom of the mounting base is fixedly provided with an insulating rubber pad, and the bottom of the insulating rubber pad abuts against and makes contact with the tops of the chip pins. The upper pressing plate is arranged, and the upper pressing plate is installed above the chip through the insertion buckle, so that the insulating rubber pad is in abutting contact with the chip pin, the chip pin is protected, and short circuit and damage caused by exposure of the chip pin are prevented.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip pin protection, in particular to a core board capable of protecting pins. Background Art

[0002] A computer module is also called a core board. It is a minimized computer system consisting of a processor or a microcontroller, memory, storage, power management and a circuit board. Except for the circuit board, the remaining components are mostly chips. The more common chip packaging is PGA packaging, BGA packaging and QFP packaging. The purpose of packaging is to connect the internal circuit of the chip with the outside world through pins. The pins act as a bridge. The PGA package mainly concentrates the pins at the bottom of the chip. The BGA package is more like a contact and integrates the pins on the motherboard. The QFP package is more traditional and integrates the pins on both sides of the chip. QFP packaging is also a commonly used package for micro-chips and has a more mature process.

[0003] The pins on the side of the chip are exposed to the outside, which is easy to be damaged and also easy to short-circuit, causing damage to the chip.

[0004] To this end, we propose a core board that can protect pins. Utility Model Content

[0005] The utility model aims to provide a core board capable of protecting pins, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a core board capable of protecting pins, comprising a circuit board, a chip pin is welded on the top of the circuit board, a plug-in buckle is arranged on the top of the circuit board, an upper pressure plate located above the chip pin is fixedly installed on the circuit board through the plug-in buckle, a mounting seat located directly above the chip pin is fixedly installed on the bottom of the upper pressure plate, an insulating rubber pad is fixedly installed on the bottom of the mounting seat, and the bottom of the insulating rubber pad is in tight contact with the top of the chip pin.

[0007] Optionally, a heat dissipation port located directly above the chip is opened in the middle of the upper pressing plate, a heat sink is fixedly installed inside the heat dissipation port, and the bottom of the heat sink is in tight contact with the top of the chip.

[0008] Optionally, the insulating rubber pad is made of soft rubber, and the bottom of the insulating rubber pad is configured as an inclined surface with the same inclination as the chip pin.

[0009] Optionally, the plug-in buckle includes an elastic plate fixedly mounted on the top of the circuit board, and a plug-in sleeve integrally arranged below the lower pressure plate, a plug-in groove is provided at the top of the outer peripheral surface of the plug-in sleeve, and a card connector is integrally arranged on the top of the elastic plate, and the card connector is plugged into the card connector groove.

[0010] Optionally, a contraction slope is provided on one side of the elastic plate, the contraction slope is slidably connected with a lower pressure ring, the contraction slope is located directly below the card joint, and the lower pressure ring is located below the card joint.

[0011] Optionally, a connecting rod is integrally connected to the interior of the lower pressure ring, the connecting rod passes through the middle of adjacent elastic plates, and a lower pressure rod is integrally provided on the top of the connecting rod.

[0012] Optionally, the top of the lower pressure rod is flush with the top of the upper pressure plate, and the lower pressure rod is coaxially arranged with the plug-in sleeve.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The core board capable of protecting the pins is provided with an upper pressing plate, and the upper pressing plate is installed above the chip by means of a plug-in buckle, so that the insulating rubber pad is in close contact with the chip pins, thereby protecting the chip pins and preventing the chip pins from being exposed and causing short circuit and damage.

[0015] 2. The core board that can protect the pins is provided with a plug-in buckle, and the plug-in sleeve is sleeved on the outside of the card connector and pressed down, so that the card connector is snapped into the card slot. When the upper pressure plate needs to be removed, the lower pressure rod is pressed down, so that the lower pressure ring moves down along the contraction inclined surface, so that the top of the elastic plate moves toward the middle, thereby loosening the card connector from the card slot, making it convenient to remove the lower pressure plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a core board capable of protecting pins according to the utility model;

[0017] Figure 2 This is a schematic structural diagram of an upper pressing plate of a core board capable of protecting pins according to the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of a heat dissipation port of a core board capable of protecting pins according to the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of a plug-in buckle of a core board capable of protecting pins according to the utility model;

[0020] Figure 5 The utility model is a cross-sectional view of a plug-in buckle of a core board capable of protecting pins.

[0021] In the figure: 1. Circuit board; 2. Chip pin; 3. Plug-in buckle; 31. Plug-in sleeve; 32. Snap-in groove; 33. Elastic plate; 34. Snap-in joint; 35. Contraction slope; 36. Lower pressure ring; 37. Connecting rod; 38. Lower pressure rod; 4. Upper pressure plate; 5. Mounting seat; 6. Insulating rubber pad; 7. Heat dissipation port; 8. Heat sink. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figures 1 to 5 The utility model provides a core board capable of protecting pins, comprising a circuit board 1, a chip pin 2 is welded on the top of the circuit board 1, a plug-in buckle 3 is arranged on the top of the circuit board 1, an upper pressing plate 4 located above the chip pin 2 is fixedly installed on the circuit board 1 through the plug-in buckle 3, a mounting seat 5 located directly above the chip pin 2 is fixedly installed on the bottom of the upper pressing plate 4, an insulating rubber pad 6 is fixedly installed on the bottom of the mounting seat 5, the bottom of the insulating rubber pad 6 is in tight contact with the top of the chip pin 2, the upper pressing plate 4 is arranged, and the upper pressing plate 4 is installed above the chip through the plug-in buckle 3, so that the insulating rubber pad 6 is in tight contact with the chip pin 2, the chip pin 2 is protected, and the chip pin 2 is prevented from being exposed and causing a short circuit and damage.

[0024] A heat dissipation opening 7 is provided in the middle of the upper pressing plate 4 and is located directly above the chip. A heat sink 8 is fixedly installed inside the heat dissipation opening 7 , and the bottom of the heat sink 8 is in close contact with the top of the chip.

[0025] The insulating rubber pad 6 is made of soft rubber, and the bottom of the insulating rubber pad 6 is configured as an inclined surface with the same inclination as the chip pin 2 .

[0026] The plug-in buckle 3 includes an elastic plate 33 fixedly mounted on the top of the circuit board 1, and a plug-in sleeve 31 integrally arranged below the lower pressure plate. A card slot 32 is provided at the top of the outer peripheral surface of the plug-in sleeve 31, and a card connector 34 is integrally arranged on the top of the elastic plate 33, and the card connector 34 is card-engaged with the card slot 32.

[0027] A contraction slope 35 is provided on one side of the elastic plate 33 , and a lower pressure ring 36 is slidably connected to the contraction slope 35 . The contraction slope 35 is located directly below the clamping joint 34 , and the lower pressure ring 36 is located below the clamping joint 34 .

[0028] The interior of the lower pressure ring 36 is integrally connected to a connecting rod 37, which passes through the middle of the adjacent elastic plate 33. A lower pressure rod 38 is integrally provided on the top of the connecting rod 37. By providing a plug-in buckle 3, the plug-in sleeve 31 is sleeved on the outside of the card joint 34 and pressed down, so that the card joint 34 is carded with the card slot 32. When the upper pressure plate 4 needs to be removed, the lower pressure rod 38 is pressed down, so that the lower pressure ring 36 moves downward along the contraction inclined surface 35, so that the top of the elastic plate 33 moves closer to the middle, thereby loosening the card joint 34 from the card slot 32, making it convenient to remove the lower pressure plate.

[0029] The top of the lower pressing rod 38 is flush with the top of the upper pressing plate 4 , and the lower pressing rod 38 and the plug-in sleeve 31 are coaxially arranged.

[0030] Working principle:

[0031] The plug-in sleeve 31 is put on the outside of the card connector 34 and pressed down to make the card connector 34 and the card slot 32 be snapped together. The upper pressure plate 4 is installed above the chip through the plug-in buckle 3, so that the insulating rubber pad 6 is in close contact with the chip pin 2 to protect the chip pin 2 and prevent the chip pin 2 from being exposed and causing a short circuit and damage. When the upper pressure plate 4 needs to be removed, the lower pressure rod 38 is pressed down to make the lower pressure ring 36 move down along the contraction slope 35, so that the top of the elastic plate 33 moves toward the middle, thereby making the card connector 34 loose from the card slot 32, making it convenient to remove the lower pressure plate.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A core board capable of protecting pins, comprising a circuit board (1), characterized in that: A chip pin (2) is welded to the top of the circuit board (1), a plug-in buckle (3) is provided on the top of the circuit board (1), an upper pressure plate (4) located above the chip pin (2) is fixedly mounted on the circuit board (1) via the plug-in buckle (3), a mounting seat (5) located directly above the chip pin (2) is fixedly mounted on the bottom of the upper pressure plate (4), an insulating rubber pad (6) is fixedly mounted on the bottom of the mounting seat (5), and the bottom of the insulating rubber pad (6) is in tight contact with the top of the chip pin (2).

2. A core board capable of protecting pins according to claim 1, characterized in that: A heat dissipation opening (7) located directly above the chip is provided in the middle of the upper pressing plate (4), a heat sink (8) is fixedly installed inside the heat dissipation opening (7), and the bottom of the heat sink (8) is in tight contact with the top of the chip.

3. A core board capable of protecting pins according to claim 1, characterized in that: The insulating rubber pad (6) is made of soft rubber, and the bottom of the insulating rubber pad (6) is arranged as an inclined plane with the same inclination as the chip pin (2).

4. The core board capable of protecting pins according to claim 1, characterized in that: The plug-in buckle (3) comprises an elastic plate (33) fixedly mounted on the top of the circuit board (1), and a plug-in sleeve (31) integrally arranged below the lower pressure plate, a plug-in sleeve (31) having a card slot (32) formed at the top of the outer peripheral surface, and a card connector (34) integrally arranged at the top of the elastic plate (33), the card connector (34) being card-connected with the card slot (32).

5. A core board capable of protecting pins according to claim 4, characterized in that: A contraction slope (35) is provided on one side of the elastic plate (33), and the contraction slope (35) is slidably connected to a lower pressure ring (36). The contraction slope (35) is located directly below the clamping joint (34), and the lower pressure ring (36) is located below the clamping joint (34).

6. A core board capable of protecting pins according to claim 5, characterized in that: The interior of the lower pressure ring (36) is integrally connected with a connecting rod (37), the connecting rod (37) passes through the middle of the adjacent elastic plates (33), and the top of the connecting rod (37) is integrally provided with a lower pressure rod (38).

7. A core board capable of protecting pins according to claim 6, characterized in that: The top of the lower pressing rod (38) is flush with the top of the upper pressing plate (4), and the lower pressing rod (38) is coaxially arranged with the plug-in sleeve (31).