Side light emitting diode

Abstract

The utility model discloses a side light emitting diode, which comprises a base and a light guide body, the base is provided with a lead frame, a heat conduction and dissipation structure, a reinforcing structure and a light-emitting wafer. A packaging and sealing structure is arranged between the light guide body and the base, and the light guide body is provided with a light gathering structure, a scattering structure and a diffusing structure. According to the utility model, the reinforcing structure is arranged to increase the overall strength of the base, so that deformation during welding installation is prevented, and the shape completeness and the subsequent use effect of the light emitting diode body are ensured; the packaging and sealing structure is arranged to ensure that the light guide body and the base are connected in a balanced and attached mode and installed in place, the gap between the light guide body and the base is reduced, and light is prevented from being exposed; the scattering structure and the emission structure are combined to achieve multiple scattering effects, and the light emitting effect is improved; the heat conduction and heat dissipation structure is used for increasing the direct contact area between the interior of the light-emitting diode body and the outside, the heat dissipation effect and efficiency are improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting diodes, in particular to a side light emitting diode. Background Art

[0002] Generally, LED packages are generally divided into tower-type LED packages and side-view LED packages. Side-view LED packages are combined with the side of the light guide plate of the backlight unit and are mostly used as a backlight light source for display devices. Recently, side-view LED packages are gradually being used in a variety of ways in addition to the existing backlight use of display devices.

[0003] Typically, a side-emitting diode package includes a base and a light-emitting element, wherein the base is used for welding to electrically connect to a substrate, so that the light-emitting element emits light toward the side surface. However, existing side-emitting diodes have the following problems: 1. In order to facilitate installation in a thinner position or space, existing side-emitting diodes usually reduce the thickness of the base. Due to the lack of a reinforcing structure, the side-emitting diodes are deformed due to welding or external force, which causes damage to the side-emitting diodes, affecting subsequent use; 2. When the existing light-emitting diodes are sealed and connected, bulges appear at the glue-coated area due to uneven glue coating or inflow, resulting in uneven bonding between the subsequent base and the light-emitting element, affecting the subsequent packaging effect, and easily causing light to leak from the side, affecting the subsequent lighting effect; 3. The existing side-emitting diodes have poor heat dissipation and a low service life. Summary of the invention

[0004] The utility model aims at solving the technical problems of poor packaging effect, poor heat dissipation effect and low illumination effect of the side light-emitting diode in the prior art by providing a side light-emitting diode.

[0005] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0006] A side-emitting diode comprises a light-emitting diode body, the light-emitting diode body comprises a base and a light guide, the light guide is arranged on the base; the base is provided with a lead frame, a heat-conducting and heat-dissipating structure and a reinforcing structure; the base is provided with a light-emitting chip, and the light-emitting chip is electrically connected to the lead frame; the light guide is arranged on the light-emitting chip; a packaging sealing structure is provided between the light guide and the base, and the light guide is provided with a focusing structure, a scattering structure and a dispersing structure.

[0007] As a further improvement, the reinforcement structure is a mesh structure layer, a side surface of the base is provided with a groove, and the mesh structure layers are respectively arranged in the groove.

[0008] As a further improvement, the mesh structure is composed of a plurality of hexagonal frames connected to each other.

[0009] As a further improvement, the thermal conductive and heat dissipation structure includes multiple contact layers and multiple heat dissipation layers, and the bottom and top of the base are also provided with a first groove, and the groove and the first groove are both provided with multiple openings; the contact layers are respectively arranged on the inner wall of the base, and the heat dissipation layers are respectively arranged in the groove and the first groove.

[0010] As a further improvement, the contact layer is further provided with a plurality of grooves, the contact layer arranged on the inner side is further provided with a central groove, and the light emitting chip is arranged in the central groove;

[0011] The heat dissipation layer arranged in one side of the base is composed of a plurality of heat dissipation silicone columns, and the plurality of heat dissipation silicone columns respectively pass through the openings and are arranged in the hexagonal frame; the heat dissipation silicone columns are provided with a plurality of heat dissipation grooves, and the inner sides of the heat dissipation grooves are all provided with groove 2; in addition, the heat dissipation layer arranged in the first groove is provided with a plurality of heat dissipation grooves arranged in an array, and the heat dissipation grooves are all provided with a first inclined surface.

[0012] As a further improvement, a notch is provided on the other side of the base; the packaging sealing structure includes a packaging arc groove, an annular sealing groove, an annular protrusion and an annular protrusion 1, the annular sealing groove is arranged on the outer edge of the notch, the packaging arc groove is arranged on the outside of the annular sealing groove, the annular protrusion is arranged on the light guide, and the annular protrusion 1 is arranged on the inner side of the annular protrusion; the annular protrusion is cooperatively connected with the annular sealing groove; the annular protrusion 1 is cooperatively connected with the notch.

[0013] As a further improvement, the notch is provided with an inclined surface, the annular protrusion 1 is provided with an inclined surface 1 which cooperates with the inclined surface; and the packaging arc groove is provided with a packaging glue layer.

[0014] As a further improvement, the light guide is provided with a cavity, the focusing structure is arranged in the cavity, the focusing structure is a focusing cup structure composed of multiple inclined surfaces, the inner wall of the inclined surface and the outside of the light guide are provided with a reflective layer; the reflective layer is a nano-silicon dioxide layer.

[0015] As a further improvement, the scattering structure is arranged above the light-collecting structure, the scattering structure is a frosted layer, and the frosted layer is arranged on the inner side surface of the cavity.

[0016] As a further improvement, the emitting structure includes a emitting layer and a rough surface, the emitting layer is arranged above the rough surface; the emitting layer is filled with emitting particles with a emitting effect; the rough surface is an uneven surface and a rough surface with scattering ability.

[0017] Compared with the prior art, the above one or more technical solutions in the side-emitting diode provided by the embodiment of the utility model have at least one of the following technical effects:

[0018] 1. The utility model increases the overall strength of the base by setting a reinforcement structure, thereby improving the anti-deformation performance of the light-emitting diode, preventing deformation during welding and installation, and ensuring the integrity of the shape of the light-emitting diode body and the subsequent use effect;

[0019] 2. The encapsulation arc groove is provided to facilitate the inflow of the molten encapsulation glue, thereby preventing the occurrence of convex structures due to uneven inflow of the encapsulation glue during glue coating, ensuring the connection between the light guide and the base is balanced, fitted and installed in place, thereby reducing the gap between the light guide and the base to prevent light exposure; the scattering structure and the emitting structure are combined to achieve multiple scattering effects, improve the divergence rate of light, thereby improving the emitting efficiency and effect, and improving the light emitting effect of the light emitting diode body;

[0020] 3. By providing a heat-conducting and heat-dissipating structure, the direct contact area between the inside of the LED body and the outside is increased, the heat dissipation effect and efficiency are improved, thereby extending the service life of the LED body. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 is a schematic diagram of the overall structure of the side light-emitting diode of this embodiment;

[0023] Figure 2 is a bottom view schematic diagram of the side light emitting diode of this embodiment;

[0024] Figure 3 for Figure 2 AA enlarged schematic diagram. DETAILED DESCRIPTION

[0025] The following description is only a preferred embodiment of the present invention and does not limit the protection scope of the present invention.

[0026] For example, see the attached Figure 1~Figure 3 A side-emitting diode comprises a light-emitting diode body 1, wherein the light-emitting diode body 1 comprises a base 2 and a light guide 3, wherein the light guide 3 is arranged on the base 2; the base 2 is provided with a lead frame 4, a heat-conducting and heat-dissipating structure 5 and a reinforcing structure 6; the base 2 is provided with a light-emitting chip 4, wherein the light-emitting chip 4 is electrically connected to the lead frame 4; the light guide 3 is arranged on the light-emitting chip 4; a packaging sealing structure 7 is provided between the light guide 3 and the base 2, wherein the light guide 3 is provided with a focusing structure 8, a scattering structure 9 and a dispersing structure 10; the lead frame 4 comprises a plurality of lead patches, wherein the plurality of lead patches are electrically connected to the light-emitting chip 4 respectively, and the lead patches are respectively arranged on the outer surface of the base.

[0027] The reinforcing structure 6 is a mesh structure layer, and a groove is provided on one side of the base 2, and the mesh structure layers are respectively arranged in the groove; the mesh structure is composed of a plurality of hexagonal frames 60 connected to each other, and the reinforcing structure 6 is used to increase the overall strength of the base 2, thereby improving the deformation resistance of the light-emitting diode, preventing deformation during welding installation, and ensuring the shape integrity of the light-emitting diode body 1 and the subsequent use effect.

[0028] The thermal conductive heat dissipation structure 5 includes a multi-layer contact layer 50 and a multi-layer heat dissipation layer 51. The bottom and top of the base 2 are also provided with a first groove, and the groove and the first groove are both provided with a plurality of openings; the contact layer 50 is respectively arranged on the inner wall of the base 2, and the heat dissipation layer 51 is respectively arranged in the groove and the first groove. The thermal conductive heat dissipation structure 5 is used to increase the direct contact area between the light-emitting diode body 1 and the outside world, improve the heat dissipation effect and efficiency, thereby extending the service life of the light-emitting diode body 1, and the contact layer 50 and the heat dissipation layer 51 are both made of thermal conductive silicone material.

[0029] The contact layer 50 is also provided with a plurality of grooves 500, and the contact layer 50 disposed on the inner side is also provided with a central groove 501, and the light emitting chip 4 is disposed in the central groove 501. The groove 500 is used to increase the contact area, thereby increasing the contact area and efficiency of heat during operation, thereby improving the subsequent heat dissipation effect and efficiency;

[0030] The heat dissipation layer 51 arranged in one side of the base 2 is composed of a plurality of heat dissipation silicone 5100 columns, and the plurality of heat dissipation silicone columns respectively pass through the openings and are arranged in the hexagonal frame; in addition, the heat dissipation layer 51 arranged in the first groove is provided with a plurality of heat dissipation grooves 5101 arranged in an array, and the heat dissipation grooves 5101 are all provided with a first inclined surface; the heat dissipation silicone column 5100 is provided with a plurality of heat dissipation grooves 5102, and the inner side surface of the heat dissipation groove 5102 is provided with a groove 2, and the heat dissipation groove 5102, the heat dissipation groove 5101, the groove 2 and the first inclined surface are all used to increase the heat dissipation area, thereby improving the heat dissipation effect.

[0031] A notch is provided on the other side of the base 2; the packaging sealing structure 7 includes a packaging arc groove 70, an annular sealing groove 71, an annular protrusion 72 and an annular protrusion 1 73, the annular sealing groove 71 is arranged on the outer edge of the notch, the packaging arc groove 70 is arranged on the outside of the annular sealing groove 71, the annular protrusion 72 is arranged on the light guide 3, and the annular protrusion 1 73 is arranged on the inner side of the annular protrusion 72; the annular protrusion 72 is cooperated and connected with the annular sealing groove 71; the annular protrusion 1 73 is cooperated and connected with the notch, and the packaging sealing structure 7 is used to improve the packaging sealing, thereby improving the waterproof performance and anti-light leakage performance.

[0032] The notch is provided with an inverted bevel, and the annular protrusion 73 is provided with an inverted bevel that fits with the bevel; the encapsulation arc groove 70 is provided with an encapsulation glue layer 74, and the encapsulation arc groove 70 facilitates the inflow of the encapsulation glue in a molten state, thereby preventing the occurrence of a convex structure due to uneven inflow of the encapsulation glue during glue coating, ensuring that the connection between the light guide 3 and the base 2 is balanced, fitted and installed in place, thereby reducing the gap between the light guide 3 and the base 2.

[0033] The light guide 3 is provided with a cavity, and the focusing structure 8 is arranged in the cavity. The focusing structure 8 is a focusing cup structure composed of multiple inclined planes 2, and the inner wall of the inclined plane 2 and the outside of the light guide 3 are provided with a reflective layer 80; the reflective layer 80 is a nano-silicon dioxide layer. The focusing structure 8 is used to increase the focusing efficiency, thereby preventing the light emitted by the light-emitting chip 4 from being absorbed or exposed, thereby greatly improving the subsequent lighting effect.

[0034] The scattering structure 9 is arranged above the focusing structure 8. The scattering structure 9 is a frosted layer. The frosted layer is arranged on the inner side of the cavity. The scattering structure 9 is used to make the light be diffusely reflected and reflected and diverged to the emitting structure 10, thereby greatly improving the divergence rate of the light, thereby improving the emitting efficiency and effect of the subsequent emitting structure 10, thereby improving the light emitting effect of the light emitting diode body 1.

[0035] The diffusion structure 10 includes a diffusion layer 100 and a rough surface 101, wherein the diffusion layer 100 is arranged above the rough surface 101; the diffusion layer 100 is filled with diffusion particles having a diffusion effect; the rough surface 101 is an uneven surface and a rough surface 101 with scattering ability, and the diffusion structure 10 is used to achieve multiple scattering, increase the diffusion angle of light, thereby increasing the coverage rate, and thus improving the light output effect and uniformity.

[0036] The utility model increases the overall strength of the base by arranging a reinforcing structure, thereby improving the deformation resistance of the light emitting diode, preventing deformation during welding and installation, and ensuring the integrity of the shape of the light emitting diode body and the subsequent use effect; by arranging a packaging arc groove, it is convenient for the inflow of packaging glue in a molten state, thereby preventing the occurrence of a convex structure due to uneven inflow when the packaging glue is applied, ensuring that the connection between the light guide and the base is balanced, fitted and installed in place, thereby reducing the gap between the light guide and the base and preventing light from leaking; combining the scattering structure and the dispersing structure to achieve multiple scattering effects, improve the divergence rate of light, thereby improving the dispersing efficiency and effect, and improving the light emitting effect of the light emitting diode body; by arranging a heat-conducting and heat-dissipating structure to increase the direct contact area between the inside of the light emitting diode body and the outside, the heat dissipation effect and efficiency are improved, thereby extending the service life of the light emitting diode body.

[0037] The present invention is not limited to the above-mentioned embodiments. Other side-emitting diodes obtained by using the same or similar structures or devices as the above-mentioned embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A side-emitting diode, comprising a light-emitting diode body, characterized in that: The light-emitting diode body includes a base and a light guide, and the light guide is arranged on the base; the base is provided with a lead frame, a heat-conducting and heat-dissipating structure and a reinforcing structure; the base is provided with a light-emitting chip, and the light-emitting chip is electrically connected to the lead frame; the light guide is arranged on the light-emitting chip; a packaging sealing structure is provided between the light guide and the base, and the light guide is provided with a focusing structure, a scattering structure and a dispersing structure.

2. The side-emitting diode according to claim 1, characterized in that: The reinforcement structure is a mesh structure layer, a side surface of the base is provided with grooves, and the mesh structure layers are respectively arranged in the grooves.

3. The side-emitting diode according to claim 2, characterized in that: The mesh structure is composed of a plurality of hexagonal frames connected to each other.

4. The side-emitting diode according to claim 3, characterized in that: The thermal conductive heat dissipation structure includes multiple contact layers and multiple heat dissipation layers. The bottom and top of the base are also provided with a first groove, and the groove and the first groove are both provided with multiple openings; the contact layers are respectively arranged on the inner wall of the base, and the heat dissipation layers are respectively arranged in the groove and the first groove.

5. The side-emitting diode according to claim 4, characterized in that: The contact layer is also provided with a plurality of grooves, and the contact layer arranged on the inner side is also provided with a central groove, and the light emitting chip is arranged in the central groove; The heat dissipation layer arranged in one side of the base is composed of a plurality of heat dissipation silicone columns, and the plurality of heat dissipation silicone columns respectively pass through the openings and are arranged in the hexagonal frame; the heat dissipation silicone columns are provided with a plurality of heat dissipation grooves, and the inner sides of the heat dissipation grooves are all provided with groove 2; in addition, the heat dissipation layer arranged in the first groove is provided with a plurality of heat dissipation grooves arranged in an array, and the heat dissipation grooves are all provided with a first inclined surface.

6. The side-emitting diode according to claim 5, characterized in that: A notch is provided on the other side of the base; the packaging sealing structure includes a packaging arc groove, an annular sealing groove, an annular protrusion and an annular protrusion 1, the annular sealing groove is arranged on the outer edge of the notch, the packaging arc groove is arranged on the outside of the annular sealing groove, the annular protrusion is arranged on the light guide, and the annular protrusion 1 is arranged on the inner side of the annular protrusion; the annular protrusion is cooperatively connected with the annular sealing groove; the annular protrusion 1 is cooperatively connected with the notch.

7. The side-emitting diode according to claim 6, characterized in that: The notch is provided with an inclined surface, and the annular protrusion 1 is provided with an inclined surface 1 which cooperates with the inclined surface; and the packaging arc groove is provided with a packaging glue layer.

8. The side-emitting diode according to claim 7, characterized in that: The light guide is provided with a cavity, the focusing structure is arranged in the cavity, the focusing structure is a focusing cup structure composed of multiple inclined planes 2, the inner wall of the inclined plane 2 and the outside of the light guide are provided with a reflective layer; the reflective layer is a nano silicon dioxide layer.

9. The side-emitting diode according to claim 8, characterized in that: The scattering structure is arranged above the light-collecting structure. The scattering structure is a frosted layer. The frosted layer is arranged on the inner side surface of the cavity.

10. The side-emitting diode according to claim 9, characterized in that: The scattering structure comprises a scattering layer and a rough surface, wherein the scattering layer is arranged above the rough surface; the scattering layer is filled with scattering particles having a scattering effect; and the rough surface is an uneven surface and a rough surface having scattering ability.

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