Wafer thinning and polishing mechanism

Abstract

The utility model relates to the technical field of thinning and polishing mechanisms, in particular to a wafer thinning and polishing mechanism which comprises a bottom plate, supporting legs are fixedly connected to the bottom end of the bottom plate, a box body is fixedly connected to the top end of the bottom plate, a box cover is arranged at the top end of the box body, and a hydraulic cylinder penetrating through the box cover is arranged at the top end of the box cover. An adsorption block is fixedly connected to the bottom end of the hydraulic cylinder, a vent hole is formed in the bottom end of the adsorption block, a rubber ring fixedly connected to the bottom end of the adsorption block is arranged at the bottom end of the vent hole, and a hose communicated with the vent hole is fixedly connected to the top end of the adsorption block. Through arrangement of the box cover, the hydraulic cylinder, the adsorption block, the vent hole, the rubber ring, the hose and the vacuum pump, wafer breakage caused by clamping can be prevented, before use, the device is powered on, the wafer is placed at the bottom end of the adsorption block, then the vacuum pump is started, the vacuum pump pumps away air in the hose and the vent hole till the wafer and the rubber ring are tightly attached, and then the wafer is clamped. And the wafer can be firmly adsorbed at the bottom end of the adsorption block.

Description

Technical Field

[0001] The utility model relates to the technical field of thinning and polishing mechanisms, in particular to a wafer thinning and polishing mechanism. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually thin round slices made of silicon or other semiconductor materials. Wafers undergo a series of processing steps, such as doping, photolithography and etching, to form the required semiconductor devices, such as transistors, diodes and integrated circuits. In the semiconductor processing industry, during the preparation and processing of wafers, wafers usually need to be thinned and polished. The thinning process can thin the wafer to a certain thickness, and the polishing process can remove the damaged layer on the surface of the thinned wafer and improve the workpiece yield.

[0003] In the prior art, during the thinning and polishing process of the wafer, the wafer is usually fixed by clamping or tightening. Excessive clamping force may cause the wafer to break. After the equipment has been used for a long time, the polishing plate may be damaged. The existing grinder is inconvenient to replace the polishing plate, and the wafer needs to be cleaned after thinning and polishing. The existing thinning and polishing mechanism cannot clean the wafer, nor can it collect and reuse the wafer debris after polishing. Therefore, a wafer thinning and polishing mechanism is proposed to address the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer thinning and polishing mechanism to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The top end of the fixing plate is provided with a fixing block, the fixing plate having a fixing structure and a fixing mechanism, and the fixing plate having a fixing structure and a fixing mechanism being arranged on the fixing plate.

[0007] Preferably, the bottom end of the base plate is fixedly connected to a threaded barrel that passes through the inner side of the box body, a first threaded ring is spirally connected to the inner side of the threaded barrel, a fixed pipe is fixedly connected to the bottom end of the first threaded ring, a filter is fixedly connected to the inner side of the fixed pipe, a second threaded ring is fixedly connected to the bottom end of the fixed pipe, and a water spray assembly that passes through the inner side of the box body is provided on one side of the box body.

[0008] Preferably, the first threaded ring and the second threaded ring have the same specifications, the number of the filter screens is two, and the number of the water spray assemblies is two.

[0009] Preferably, the number of the legs is four, the legs are evenly distributed at the bottom edge of the bottom plate, the number of the vents is several, the vents are distributed in an array at the bottom of the adsorption block, and the number of the rubber rings is the same as the number of the vents.

[0010] Preferably, the vacuum pump is fixedly connected to the top of the box cover, the top of the rotating shaft is fixedly connected to the bottom of the rotating joint, the inner diameter of the engaging groove is larger than the outer diameter of the engaging block, and the number of the engaging groove and the engaging block are both four.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. In the utility model, the box cover, hydraulic cylinder, adsorption block, vent hole, rubber ring, hose and vacuum pump are provided to prevent the wafer from being broken due to clamping. Before use, the device is powered on, the wafer is placed at the bottom of the adsorption block, and then the vacuum pump is started. The vacuum pump removes the air in the hose and the vent hole until the wafer and the rubber ring are tightly fitted, and the wafer can be firmly adsorbed at the bottom of the adsorption block;

[0013] 2. In the utility model, the fixing cylinder, the rotating joint, the fixing seat, the engaging groove, the engaging block and the grinding plate are arranged, so that the replacement of the grinding plate is more convenient. When the grinding plate needs to be replaced, the engaging plate is directly taken down from the top of the fixing seat, the engaging groove is separated from the engaging block, and then a new grinding plate is replaced, and the engaging block is aligned with the engaging groove and pressed, and the grinding plate can be replaced;

[0014] 3. In the utility model, the wafer can be cleaned by the threaded barrel, the first threaded ring, the fixed tube, the filter screen, the second threaded ring and the water spray assembly, and the wafer debris after grinding can be collected and reused. After the wafer is thinned and polished, the water spray assembly is started, and the wafer debris on the wafer is washed off by the water spray assembly. The mixture flows into the inner side of the fixed tube through the threaded barrel and the first threaded ring, the wafer debris is retained by the double filter screen, and water flows out from the second threaded ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall external structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall bottom structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the overall disassembled structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the grinding component of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the adsorption block of the utility model;

[0020] Figure 6 This is a schematic diagram of the disassembled structure of the grinding component of the utility model;

[0021] Figure 7 This is a schematic diagram of the fixed pipe structure of the utility model.

[0022] In the figure: 1, bottom plate; 2, support legs; 3, box body; 4, box cover; 5, hydraulic cylinder; 6, adsorption block; 7, vent hole; 8, rubber ring; 9, hose; 10, vacuum pump; 11, fixed cylinder; 12, rotary joint; 13, fixed seat; 14, snap-fit ​​groove; 15, snap-fit ​​block; 16, grinding plate; 17, rotating shaft; 18, rotating motor; 19, threaded cylinder; 20, first threaded ring; 21, fixed pipe; 22, filter; 23, second threaded ring; 24, water spray assembly. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0025] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0026] See also Figure 1-7 , the utility model provides a technical solution:

[0027] A wafer thinning and polishing mechanism comprises a base plate 1, a support leg 2 is fixedly connected to the bottom end of the base plate 1, a box body 3 is fixedly connected to the top of the base plate 1, a box cover 4 is provided at the top of the box body 3, a hydraulic cylinder 5 penetrating the box cover 4 is provided at the top of the box cover 4, an adsorption block 6 is fixedly connected to the bottom end of the hydraulic cylinder 5, a vent hole 7 is provided at the bottom end of the adsorption block 6, a rubber ring 8 fixedly connected to the bottom end of the adsorption block 6 is provided at the bottom end of the vent hole 7, a hose 9 passing through the vent hole 7 is fixedly connected to the top end of the adsorption block 6, a vacuum pump 10 is fixedly connected to the end of the hose 9 away from the vent hole 7, a fixed cylinder 11 is fixedly connected to the bottom end of the inner side of the box body 3, a rotary joint 12 is fixedly connected to the top end of the fixed cylinder 11, a fixed seat 13 is fixedly connected to the top end of the rotary joint 12, a clamping groove 14 is provided at the top end of the fixed seat 13, a clamping block 15 is provided inside the clamping groove 14, a grinding plate 16 is fixedly connected to the top end of the clamping block 15, a rotating shaft 17 is provided inside the fixed cylinder 11, and a rotating motor 18 is rotatably connected to the rotating shaft 17.

[0028] The bottom end of the bottom plate 1 is fixedly connected to a threaded tube 19 that passes through the inside of the box body 3, the inside of the threaded tube 19 is spirally connected to a first threaded ring 20, the bottom end of the first threaded ring 20 is fixedly connected to a fixed pipe 21, the inside of the fixed pipe 21 is fixedly connected to a filter screen 22, and the bottom end of the fixed pipe 21 is fixedly connected to a second threaded ring 23. One side of the box body 3 is provided with a water spray component 24 that passes through the inside of the box body 3. The first threaded ring 20 and the second threaded ring 23 have the same specifications, and the number of the filter screens 22 is two. There are two components 24, four legs 2, which are evenly distributed at the bottom edge of the bottom plate 1. There are several vents 7, which are distributed in an array at the bottom of the adsorption block 6. The number of rubber rings 8 is the same as the number of vents 7. The vacuum pump 10 is fixedly connected to the top of the box cover 4, the top of the rotating shaft 17 is fixedly connected to the bottom of the rotating joint 12, the inner diameter of the engaging groove 14 is larger than the outer diameter of the engaging block 15, and the number of the engaging groove 14 and the engaging block 15 are both four.

[0029] Working process: Power on the device before use, place the wafer at the bottom of the adsorption block 6, then start the vacuum pump 10, the vacuum pump 10 will extract the air in the hose 9 and the vent 7 until the wafer and the rubber ring 8 fit tightly, and the wafer can be firmly adsorbed on the bottom of the adsorption block 6, then start the rotating motor 18, the rotating motor 18 drives the rotating shaft 17, the rotating joint 12, the fixing seat 13 and the grinding plate 16 to rotate, start the hydraulic cylinder 5, the hydraulic cylinder 5 drives the adsorption block 6 to descend, until the wafer fits tightly with the grinding plate 16, and the grinding plate 16 can thin and polish the wafer. After the wafer is thinned and polished, the water spray assembly 24 is started. The water spray assembly 24 flushes the wafer debris on the wafer, and the mixture flows into the inner side of the fixed tube 21 through the threaded barrel 19 and the first threaded ring 20. The wafer debris is retained by the double filter screen 22, and water flows out from the second threaded ring 23. The processing of the wafer can be completed. When the grinding plate 16 needs to be replaced, the clamping plate is directly removed from the top of the fixed seat 13, the clamping groove 14 is separated from the clamping block 15, and then a new grinding plate 16 is replaced. The clamping block 15 is aligned with the clamping groove 14 and pressed to complete the replacement of the grinding plate 16.

[0030] The contents not described in detail in this specification belong to the prior art known to the professional and technical personnel in this field. The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer thinning and polishing mechanism, comprising a base plate (1), characterized in that: The bottom end of the base plate (1) is fixedly connected to a support leg (2); the top end of the base plate (1) is fixedly connected to a box body (3); the top end of the box body (3) is provided with a box cover (4); the top end of the box cover (4) is provided with a hydraulic cylinder (5) penetrating the box cover (4); the bottom end of the hydraulic cylinder (5) is fixedly connected to an adsorption block (6); the bottom end of the adsorption block (6) is provided with an air vent (7); the bottom end of the air vent (7) is provided with a rubber ring (8) fixedly connected to the bottom end of the adsorption block (6); the top end of the adsorption block (6) is fixedly connected to a hose (9) penetrating the air vent (7); the hose (9) is away from the air vent One end of the housing (7) is fixedly connected to a vacuum pump (10), the bottom end of the inner side of the box body (3) is fixedly connected to a fixed cylinder (11), the top end of the fixed cylinder (11) is fixedly connected to a rotary joint (12), the top end of the rotary joint (12) is fixedly connected to a fixed seat (13), the top end of the fixed seat (13) is provided with a snap-fit ​​groove (14), the inner side of the snap-fit ​​groove (14) is provided with a snap-fit ​​block (15), the top end of the snap-fit ​​block (15) is fixedly connected to a grinding plate (16), the inner side of the fixed cylinder (11) is provided with a rotating shaft (17), and the rotating shaft (17) is rotatably connected to a rotating motor (18).

2. A wafer thinning and polishing mechanism according to claim 1, characterized in that: The bottom end of the bottom plate (1) is fixedly connected to a threaded barrel (19) which passes through the inner side of the box body (3); the inner side of the threaded barrel (19) is spirally connected to a first threaded ring (20); the bottom end of the first threaded ring (20) is fixedly connected to a fixed pipe (21); the inner side of the fixed pipe (21) is fixedly connected to a filter screen (22); the bottom end of the fixed pipe (21) is fixedly connected to a second threaded ring (23); and a water spray assembly (24) which passes through the inner side of the box body (3) is provided on one side of the box body (3).

3. A wafer thinning and polishing mechanism according to claim 2, characterized in that: The first threaded ring (20) and the second threaded ring (23) have the same specifications, the number of the filter screens (22) is two, and the number of the water spraying assemblies (24) is two.

4. The wafer thinning and polishing mechanism according to claim 1, characterized in that: The number of the legs (2) is four, and the legs (2) are evenly distributed at the bottom edge of the bottom plate (1). The number of the vent holes (7) is a plurality, and the vent holes (7) are distributed in an array at the bottom end of the adsorption block (6). The number of the rubber rings (8) is the same as the number of the vent holes (7).

5. The wafer thinning and polishing mechanism according to claim 1, characterized in that: The vacuum pump (10) is fixedly connected to the top of the box cover (4), the top of the rotating shaft (17) is fixedly connected to the bottom of the rotating joint (12), the inner diameter of the engaging groove (14) is larger than the outer diameter of the engaging block (15), and the number of the engaging groove (14) and the number of the engaging block (15) are both four.

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