Feeding device for semiconductor laser chip processing

Abstract

The utility model discloses a feeding device for semiconductor laser chip processing, relates to the technical field of semiconductor laser chip processing, solves the problems that an existing device is poor in feeding efficiency and low in yield, and adopts the following scheme that hydraulic telescopic rods which are opposite in position are fixedly mounted on the top surface of a fixed seat; according to the feeding device for semiconductor laser chip processing, through the arrangement of the hydraulic lifting rod, the electric telescopic rod C, an air suction pump and an air suction head, a chip can be adsorbed to the air suction head through the acting force of air suction; according to the chip feeding device, chips can be conveyed to the machining box, then conveying and feeding are conducted, the conveying effect is good, the conveying efficiency is high, meanwhile, through the arrangement of the machining groove, the sliding groove and the sliding plate, the chips can be conveyed to the sliding plate, the sliding plate and the chips are moved into the machining box through the sliding groove, feeding is completed, the feeding effect is good, the chips are not prone to being damaged, and the production yield is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser chip processing, in particular to a feeding device for semiconductor laser chip processing. Background Art

[0002] Semiconductor laser chips are made of semiconductor doped compounds and are semiconductor laser devices that generate lasers through photoelectric effects. Due to the complexity of laser chips, they need to be precisely processed manually during processing. However, there are a large number of laser chips and their types are also numerous. During transportation, chips of different types that are transported at the same time need to be classified at the same time.

[0003] After searching, the application with patent number CN218402591U discloses a feeding device for semiconductor laser chip processing, including a feeding table and several processing tables, one side of the feeding table is provided with a first conveyor belt for conveying chips, a feeding mechanism is connected between the first conveyor belt and each processing table, the feeding table is located on the side of the first conveyor belt away from the processing table and is provided with a pushing mechanism, the pushing mechanism pushes the chip onto the feeding mechanism and then conveys it to the processing table, the feeding mechanism includes a bracket, and the setting of the feeding laser and the pushing mechanism reduces the input of manpower and material resources, and improves the practicality of the equipment;

[0004] However, due to the setting of the pushing mechanism, the push plate is pushed by the piston rod of the cylinder, so that the chip is pushed into the corresponding feed hopper, and the chip is small and thin, which makes it difficult for the push plate to stably push the chip away, resulting in poor pushing effect and low efficiency. At the same time, since the chip falls to the unloading slope by inertia, the chip is prone to collision and damage during the falling process, resulting in a low yield.

[0005] Therefore, we propose a loading device for semiconductor laser chip processing. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a feeding device for semiconductor laser chip processing, which solves the problems of poor feeding efficiency and low yield of the prior device.

[0007] To achieve the above purpose, the utility model is implemented by the following technical solutions: a feeding device for semiconductor laser chip processing, comprising a conveying plate, four sets of supporting legs in opposite positions are fixedly installed on the bottom surface of the conveying plate, a fixing seat and a base are respectively installed on the left and right sides of the conveying plate, and a chip is installed on the conveying plate;

[0008] A hydraulic telescopic rod is fixedly installed on the top surface of the fixing seat, and a U-shaped electric telescopic rod is fixedly installed on the top of the hydraulic telescopic rod. A connecting pipe is fixedly installed on the bottom end of the electric telescopic rod. An air suction pump is fixedly installed on the outer wall of the connecting pipe. An air suction head is mounted on the output end of the air suction pump, and uniform air suction holes are opened on the bottom surface of the air suction head.

[0009] A processing box is fixedly installed on the top surface of the base, a processing groove is opened on the left side of the processing box, and sliding grooves with opposite positions are opened on the inner walls on the left and right sides of the processing groove, and a slide plate is slidably connected to the sliding groove.

[0010] Preferably, five groups of hydraulic telescopic rods in opposite positions are fixedly installed on the top surface of the fixed seat, a fixed plate is fixedly installed on the right side of the top surface of the fixed seat, five groups of optical sensors in opposite positions are fixedly installed on the right side of the fixed plate, and the optical sensors are connected to the hydraulic telescopic rods through wires, so that the chips can be classified and transported.

[0011] Preferably, a pressure sensor is fixedly installed inside the bottom surface of the suction head, and the pressure sensor is connected to the hydraulic telescopic rod through a wire, so as to prevent the chip from being squeezed and damaged.

[0012] Preferably, the suction head is trumpet-shaped, and the surface of the suction head is made of silicone material, which can prevent damage to the chip.

[0013] Preferably, five groups of processing boxes in opposite positions are fixedly mounted on the top surface of the base, which can improve the processing efficiency.

[0014] Preferably, five groups of placement seats in opposite positions are fixedly mounted on the top surface of the base, and the top surfaces of the placement seats are provided with grooves that are compatible with the specifications of the skateboard, which can improve the sliding stability of the skateboard.

[0015] The utility model provides a feeding device for semiconductor laser chip processing, which has the following beneficial effects:

[0016] 1. The feeding device for semiconductor laser chip processing can adsorb the chip on the suction head through the setting of hydraulic lifting rod, electric telescopic rod C, suction pump and suction head, and then transport and load the chip, with good transportation effect and high transportation efficiency;

[0017] 2. At the same time, through the setting of the processing groove, slide and slide, the chip can be transported to the slide, and then the slide and the chip are moved to the inside of the processing box through the slide, so as to complete the loading, the loading effect is good, it is not easy to damage the chip, and the production yield is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the optical sensor of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the air suction head of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the processing box of the utility model:

[0022] In the figure: 1. conveying plate; 2. supporting legs; 3. fixing seat; 4. base; 5. chip; 6. fixing plate; 7. optical sensor; 8. hydraulic telescopic rod; 9. electric telescopic rod; 10. connecting pipe; 11. suction pump; 12. suction head; 13. suction hole; 14. processing box; 15. processing groove; 16. slide groove; 17. slide plate; 18. placement seat; 19. groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1:

[0025] like Figure 1-4 As shown: a hydraulic telescopic rod 8 is fixedly installed on the top surface of the fixed seat 3, a U-shaped electric telescopic rod 9 is fixedly installed on the top of the hydraulic telescopic rod 8, a connecting pipe 10 is fixedly installed on the bottom end of the electric telescopic rod 9, an air suction pump 11 is fixedly installed on the outer wall of the connecting pipe 10, an air suction head 12 is mounted on the output end of the air suction pump 11, and uniform air suction holes 13 are opened on the bottom surface of the air suction head 12. Through the arrangement of the hydraulic lifting rod 8, the electric telescopic rod C9, the air suction pump 11 and the air suction head 12, the chip 5 can be adsorbed on the air suction head 12 by the force of air suction, and then transported and loaded, with good transportation effect and high transportation efficiency.

[0026] Embodiment 2:

[0027] like Figure 3-4A processing box 14 is fixedly installed on the top surface of the base 4, a processing groove 15 is opened on the left side of the processing box 14, and slide grooves 16 are opened on the inner walls on the left and right sides of the processing groove 15, which are opposite to each other. A slide plate 17 is slidably connected to the slide groove 16. At the same time, through the arrangement of the processing groove 15, the slide groove 16 and the slide plate 17, the chip 5 can be transported to the slide plate 17, and then the slide plate 17 and the chip 5 are moved to the interior of the processing box 14 through the slide groove 16, so as to complete the loading, the loading effect is good, it is not easy to damage the chip 5, and the production yield is improved.

[0028] Embodiment 3:

[0029] like Figure 1-2 As shown: five groups of hydraulic telescopic rods 8 are fixedly installed on the top surface of the fixed seat 3, a fixed plate 6 is fixedly installed on the right side of the top surface of the fixed seat 3, five groups of optical sensors 7 are fixedly installed on the right side of the fixed plate 6, and the optical sensor 7 is connected to the hydraulic telescopic rod 8 through a wire, and five groups of processing boxes 14 are fixedly installed on the top surface of the base 4. In this way, the specifications and shapes of the chip 5 are sensed by the optical sensor 7, and then a suitable feeding channel is selected, and the chip 5 is sucked by the suction head 12 and then transported to a suitable processing box 14 to complete the processing, thereby improving the processing efficiency and effect.

[0030] The working principle and use process of the utility model are as follows: when the device is needed to work, the chip 5 is first placed on the conveying plate 1 for transportation, and then the size of the chip 5 is sensed by the optical sensor 7, and then the appropriate hydraulic telescopic rod 8 is controlled to drive the suction head 12 to descend, completing the classification and transportation of the chip 5, and then the suction pump 11 is started to adsorb the chip 5 on the suction head 12, and the setting of the pressure sensor prevents the suction head 12 from squeezing the chip 5, and then the chip 5 is transported to the corresponding slide 17 through the electric telescopic rod 9, and then the slide 17 transports the chip 5 to the inside of the processing box 14 through the slide 16 for processing.

[0031] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0032] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A feeding device for semiconductor laser chip processing, comprising a conveying plate (1), the bottom surface of which is fixedly mounted with four sets of supporting legs (2) in opposite positions, the left and right sides of the conveying plate (1) are respectively equipped with a fixing seat (3) and a base (4), and a chip (5) is mounted on the conveying plate (1); Features: A hydraulic telescopic rod (8) is fixedly mounted on the top surface of the fixing seat (3) and is positioned opposite to each other; a U-shaped electric telescopic rod (9) is fixedly mounted on the top end of the hydraulic telescopic rod (8); a connecting pipe (10) is fixedly mounted on the bottom end of the electric telescopic rod (9); an air suction pump (11) is fixedly mounted on the outer wall of the connecting pipe (10); an air suction head (12) is mounted on the output end of the air suction pump (11); and uniform air suction holes (13) are provided on the bottom surface of the air suction head (12); A processing box (14) is fixedly mounted on the top surface of the base (4), a processing groove (15) is provided on the left side of the processing box (14), and sliding grooves (16) located opposite to each other are provided on the inner walls on the left and right sides of the processing groove (15), and a slide plate (17) is slidably connected to the sliding groove (16).

2. A semiconductor laser chip processing feeding device according to claim 1, characterized in that: Five groups of hydraulic telescopic rods (8) in opposite positions are fixedly mounted on the top surface of the fixing seat (3), a fixing plate (6) is fixedly mounted on the right side of the top surface of the fixing seat (3), and five groups of optical sensors (7) in opposite positions are fixedly mounted on the right side of the fixing plate (6), and the optical sensors (7) are connected to the hydraulic telescopic rods (8) via wires.

3. A semiconductor laser chip processing feeding device according to claim 1, characterized in that: A pressure sensor is fixedly installed inside the bottom surface of the suction head (12), and the pressure sensor is connected to the hydraulic telescopic rod (8) through a wire.

4. A semiconductor laser chip processing feeding device according to claim 1, characterized in that: The air suction head (12) is trumpet-shaped, and the surface of the air suction head (12) is made of silicone material.

5. The semiconductor laser chip processing feeding device according to claim 1, characterized in that: Five groups of processing boxes (14) in opposite positions are fixedly mounted on the top surface of the base (4).

6. A semiconductor laser chip processing feeding device according to claim 1, characterized in that: Five groups of placement seats (18) in opposite positions are fixedly mounted on the top surface of the base (4), and grooves (19) matching the specifications of the slide plate (17) are formed on the top surfaces of the placement seats (18).

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