Signal acquisition device and temperature and pressure integrated measurement equipment

Abstract

The utility model provides a signal acquisition device and temperature and pressure integrated measurement equipment. The signal acquisition device comprises a shell, a temperature signal acquisition assembly and a pressure signal acquisition assembly. The shell is provided with a mounting cavity and an opening for communicating the mounting cavity with the outside; the temperature signal acquisition assembly is connected in the installation cavity and specifically comprises a temperature signal acquisition mainboard and a temperature signal acquisition port. And the pressure signal acquisition assembly is also connected into the mounting cavity. The pressure signal acquisition assembly comprises a pressure signal acquisition mainboard and a pressure signal acquisition port, and the temperature signal acquisition port and the pressure signal acquisition port are arranged towards the opening. According to the signal acquisition device, a temperature signal acquisition function and a pressure signal acquisition function are integrated together, synchronous acquisition and transmission of the two signals are realized, butt joint installation is facilitated, and the required space is reduced. The utility model further provides temperature and pressure integrated measuring equipment which comprises a temperature and pressure sensor and the signal acquisition device.

Description

Technical Field

[0001] The present application belongs to the technical field of signal acquisition devices, and more specifically, relates to a signal acquisition device and a temperature and pressure integrated measuring device. Background Art

[0002] In the current field of sensing technology, temperature sensors and pressure sensors are the two most common types of sensors, and they are widely used in many fields such as industrial automation, environmental monitoring, and medical equipment. Usually, these two sensors are set separately, each completing the task of detecting temperature and pressure. However, this setting method not only occupies a large installation space, but also increases the complexity of installation and wiring, and reduces the overall efficiency and reliability of the system. In order to solve the above problems, a new type of sensor technology has emerged in recent years-temperature and pressure integrated sensing film. This sensing film integrates temperature sensing elements and pressure sensing elements on a flexible substrate to achieve simultaneous detection of temperature and pressure, greatly saving installation space and improving the integration of the sensor.

[0003] However, although the integrated temperature and pressure sensing chip realizes the integrated detection of temperature and pressure in structure, in actual application, it still needs to be connected with the corresponding collector in order to transmit the detected signal to the host computer for subsequent processing. This brings new problems: since temperature sensing and pressure sensing are performed separately, the integrated temperature and pressure sensing chip needs to be connected with the temperature collector and the pressure collector respectively, and this separately set collector increases the difficulty of installation and wiring. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a signal acquisition device and a temperature-pressure integrated measurement device to solve the technical problem in the prior art that it is difficult to connect the temperature-pressure integrated sensing piece with the signal collector.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] A signal acquisition device is provided, comprising:

[0007] A housing, comprising a mounting cavity and an opening for communicating the mounting cavity with the outside;

[0008] A temperature signal acquisition component is connected in the installation cavity, wherein the temperature signal acquisition component comprises a temperature signal acquisition mainboard and a temperature signal acquisition port, wherein the temperature signal acquisition port is electrically connected to the temperature signal acquisition mainboard;

[0009] A pressure signal acquisition component is connected to the installation cavity, the pressure signal acquisition component comprises a pressure signal acquisition mainboard and a pressure signal acquisition port, and the pressure signal acquisition port is electrically connected to the pressure signal acquisition mainboard;

[0010] The temperature signal acquisition port and the pressure signal acquisition port are both arranged toward the opening.

[0011] As a further improvement of the above technical solution:

[0012] Optionally, the temperature signal acquisition port includes a positive signal acquisition port and a negative signal acquisition port, and the positive signal acquisition port and the negative signal acquisition port are both electrically connected to the temperature signal acquisition mainboard and are both arranged toward the opening.

[0013] Optionally, the shell includes a shell body and a movable part, the movable part is hinged at the opening of the shell body, the movable part has an open state and a closed state, when the movable part is in the open state, the installation cavity is connected to the outside; when the movable part is in the closed state, the opening is closed.

[0014] Optionally, the shell body includes a first shell and a second shell, the first shell and the second shell enclose the installation cavity, and the first shell and the second shell are detachably connected to each other.

[0015] Optionally, the movable member is hinged to one of the first shell and the second shell.

[0016] Optionally, the temperature signal acquisition port and the pressure signal acquisition port are both arranged on the same PCB circuit board.

[0017] Optionally, when the movable member is in a closed state, there is a gap between the movable member and the other of the first shell and the second shell.

[0018] Optionally, the temperature signal acquisition port and the pressure signal acquisition port are arranged on the same side of the PCB circuit board, and the positive signal acquisition port and the negative signal acquisition port of the temperature signal acquisition port are respectively arranged on both sides of the pressure signal acquisition port.

[0019] Optionally, the temperature signal acquisition port and the pressure signal acquisition port are arranged on different PCB circuit boards.

[0020] The present application also provides a temperature and pressure integrated measuring device, including a temperature and pressure sensor and the above-mentioned signal acquisition device, wherein the temperature and pressure sensor includes a temperature sensing part, a temperature signal transmission terminal electrically connected to the temperature sensing part, a pressure sensing part, and a pressure signal transmission terminal electrically connected to the pressure sensing part; the temperature signal acquisition port of the signal acquisition device is electrically connected to the temperature signal transmission terminal to realize the transmission of electrical signals between the temperature sensing part and the temperature signal acquisition mainboard, and the pressure signal acquisition port of the signal acquisition device is electrically connected to the pressure signal transmission terminal to realize the transmission of electrical signals between the pressure sensing part and the pressure signal acquisition mainboard.

[0021] The beneficial effects of the signal acquisition device and the temperature and pressure integrated measurement device provided by the present application are:

[0022] The signal acquisition device provided in the present application includes a housing, a temperature signal acquisition component and a pressure signal acquisition component. The housing has an installation cavity and an opening for connecting the installation cavity with the outside world. The temperature signal acquisition component is connected to the installation cavity, and specifically includes a temperature signal acquisition mainboard and a temperature signal acquisition port. The pressure signal acquisition component is also connected to the installation cavity. The pressure signal acquisition component includes a pressure signal acquisition mainboard and a pressure signal acquisition port, and the temperature signal acquisition port and the pressure signal acquisition port are both arranged toward the opening. The signal acquisition device of the present application integrates the temperature signal acquisition function and the pressure signal acquisition function, realizes the synchronous acquisition and transmission of the two signals, which not only simplifies the installation process and reduces the required space, but also improves the efficiency and stability of signal acquisition.

[0023] The present application also provides a temperature and pressure integrated measuring device, comprising a temperature and pressure sensor and the above-mentioned signal acquisition device. Since the temperature and pressure integrated measuring device has the above-mentioned signal acquisition device, it also has the advantages of the above-mentioned signal acquisition device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of the first state of the three-dimensional structure of the signal acquisition device provided by the present application;

[0026] Figure 2 A schematic diagram of a partially enlarged structure of the signal acquisition device provided in this application;

[0027] Figure 3 This is a schematic diagram of the second state three-dimensional structure of the signal acquisition device provided in this application.

[0028] Among them, the reference numerals in the figure are:

[0029] 1. Shell; 11. Shell body;

[0030] 111. a first shell; 112. a second shell;

[0031] 12. Moving parts; 2. Temperature signal acquisition port;

[0032] 21. Positive signal acquisition port; 22. Negative signal acquisition port;

[0033] 3. Pressure signal collection port; 4. Signal light. DETAILED DESCRIPTION

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] like Figures 1 to 3As shown, the present application provides a highly integrated signal acquisition device, which includes a housing 1, a temperature signal acquisition component, and a pressure signal acquisition component, aiming to solve the problems of cumbersome installation and large space occupation of traditional signal acquisition devices, while improving the efficiency and stability of signal acquisition.

[0039] The housing 1 is the main body of the device and is designed with an installation cavity and an opening for connecting the installation cavity with the outside world. The housing 1 can not only provide support and protection for the internal components, but also facilitate connection and communication with external devices.

[0040] The temperature signal acquisition component is connected to the installation cavity, and specifically includes a temperature signal acquisition mainboard and a temperature signal acquisition port 2. The temperature signal acquisition mainboard includes a PCB circuit board and a temperature signal processing element, which is responsible for processing the electrical signal transmitted from the temperature sensing element. The temperature signal acquisition port 2 is responsible for receiving the electrical signal transmitted from the temperature sensing element. By means of electrical connection, the temperature signal acquisition port 2 is closely connected to the temperature signal acquisition mainboard to ensure accurate transmission of the signal.

[0041] Similarly, the pressure signal acquisition component is also connected to the installation cavity. The pressure signal acquisition component includes a pressure signal acquisition mainboard and a pressure signal acquisition port 3. The pressure signal acquisition mainboard includes a PCB circuit board and a pressure signal processing element, which is responsible for processing the electrical signal transmitted from the pressure sensing element. The pressure signal acquisition port 3 is responsible for receiving the electrical signal transmitted from the pressure sensing element. Similar to the temperature signal acquisition port 2, the pressure signal acquisition port 3 is also closely connected to the pressure signal acquisition mainboard by electrical connection.

[0042] The temperature signal acquisition port 2 and the pressure signal acquisition port 3 are both arranged toward the opening, thereby making the signal acquisition device more convenient to connect to external devices without complicated adjustments or changes to the device.

[0043] The signal acquisition device of the present application integrates the temperature signal acquisition function and the pressure signal acquisition function, realizing the synchronous acquisition and transmission of the two signals, which not only simplifies the installation process and reduces the required space, but also improves the efficiency and stability of signal acquisition. In addition, due to the integrated design, the device does not need to set up multiple signal collectors, thereby further reducing costs and maintenance difficulties.

[0044] like Figure 1 and Figure 2As shown, in one embodiment of the present application, the temperature signal acquisition port 2 includes a positive signal acquisition port 21 and a negative signal acquisition port 22, the positive signal acquisition port 21 is used to connect to the temperature positive signal transmission terminal of the temperature and pressure integrated sensing piece, and the negative signal acquisition port 22 is used to connect to the temperature negative signal transmission terminal of the temperature and pressure integrated sensing piece. The positive signal acquisition port 21 and the negative signal acquisition port 22 are both closely connected to the temperature signal acquisition mainboard through an electrical connection to ensure stable signal transmission. At the same time, they are all set toward the opening to facilitate docking with external devices.

[0045] Specifically, both the positive signal acquisition port 21 and the negative signal acquisition port 22 are provided with a movable pressure plate and a docking contact pin for connecting with the temperature signal transmission terminal of the temperature-pressure integrated sensing piece. The movable pressure plate is arranged on one side of the docking contact pin and has a flipping function. By flipping the movable pressure plate, the docking contact pin can be easily exposed or blocked, and the quick connection and disconnection with the temperature-pressure integrated sensing piece can be achieved. When the temperature signal transmission terminal of the temperature-pressure integrated sensing piece is docked with the docking contact pins of the positive signal acquisition port 21 and the negative signal acquisition port 22, the user only needs to flip the movable pressure plates of the two ports respectively so that the docking contact pins are blocked. At the same time, the clamping force formed between the movable pressure plate and the docking contact pin firmly fixes the temperature signal transmission terminal on the temperature signal acquisition port 2, effectively preventing it from falling off during use, which not only improves the stability of the docking, but also reduces the risk of signal interruption caused by falling off.

[0046] Similarly, the pressure signal acquisition port 3 also adopts a similar port structure. It also has a movable pressure plate and a docking contact pin for connecting with the pressure signal transmission terminal of the temperature-pressure integrated sensing piece. When the pressure signal transmission terminal of the temperature-pressure integrated sensing piece is docked with the docking contact pin of the pressure signal acquisition port 3, the user only needs to flip the movable pressure plate to achieve stable signal transmission and firm fixation of the port.

[0047] like Figure 1 and Figure 3As shown, in one embodiment of the present application, the housing 1 includes a housing body 11 and a movable part 12, the movable part 12 is hinged at the opening of the housing body 11, and the movable part 12 has an open state and a closed state. When the movable part 12 is in the open state, the installation cavity is connected to the outside; when the movable part 12 is in the closed state, the opening is closed. When in use, the opening is exposed through the movable part 12, and the temperature signal transmission terminal of the temperature-pressure integrated sensing piece is connected to the temperature signal acquisition port 2 to realize the electrical signal transmission between the temperature signal processing element and the temperature-pressure integrated sensing piece, and the pressure signal transmission terminal is connected to the pressure signal acquisition port 3 to realize the electrical signal transmission between the pressure signal processing element and the temperature-pressure integrated sensing piece. When the movable part 12 is in the open state, the opening is open, which is convenient for the docking operation on the temperature signal acquisition port 2 and the pressure signal acquisition port 3. When the movable part 12 is in the closed state, the opening is closed, effectively blocking the interference and damage of the external environment to the inside of the signal acquisition device.

[0048] like Figure 1 As shown, in one embodiment of the present application, the shell body 11 includes a first shell 111 and a second shell 112, and the first shell 111 and the second shell 112 are enclosed to form an installation cavity. A detachable connection method is adopted between the first shell 111 and the second shell 112 to facilitate assembly and maintenance. In practical applications, users can easily disassemble or assemble the two shells as needed, so as to conveniently replace, upgrade or repair the internal components. In order to ensure that the connection between the first shell 111 and the second shell 112 is stable and reliable, the detachable connection method between the first shell 111 and the second shell 112 is preferably a screw connection. Through a plurality of fastening screws, the first shell 111 and the second shell 112 are tightly combined together to form a shell body 11 with strong integrity and stable structure.

[0049] like Figure 1 As shown, in one embodiment of the present application, the movable member 12 is hinged to the first shell 111. Specifically, the movable member 12 is provided with a rotating shaft at both ends, and correspondingly, the first shell 111 is provided with an axial hole that matches the rotating shaft. When the rotating shaft of the movable member 12 is inserted into the axial hole of the first shell 111, the two form a stable and flexible hinge structure. This enables the movable member 12 to rotate smoothly and stably relative to the first shell 111, and can be easily switched between the open and closed states, which is convenient to operate.

[0050] like Figure 3As shown, in one embodiment of the present application, when the movable part 12 is in a closed state, a certain gap is reserved between the movable part 12 and the second housing 112, and the gap is used to accommodate the temperature-pressure integrated sensing piece or its transmission wire and other parts. In practical applications, when the temperature-pressure integrated sensing piece is connected to the temperature signal acquisition component and the pressure signal acquisition component, even if the movable part 12 is closed, it will not produce pressure on the temperature-pressure integrated sensing piece, so that the temperature-pressure integrated sensing piece can be partially placed in the gap, which not only ensures the stable connection between the sensing piece and the acquisition component, but also avoids damage or signal distortion that may be caused by pressure.

[0051] In one embodiment of the present application, a magnetic attraction structure is included, and the magnetic attraction structure includes a first magnetic member connected to the movable member 12, and a second magnetic member on the second shell 112. When the movable member 12 is in a closed state, the first magnetic member and the second magnetic member are attached to each other through magnetic attraction. This magnetic attraction design not only allows the movable member 12 to maintain a stable state when closed, but also avoids random shaking caused by external factors, thereby ensuring the tightness of the shell and the stability of the signal acquisition component.

[0052] In one embodiment of the present application, the temperature signal acquisition mainboard and the pressure signal acquisition mainboard are integrated structures. The temperature signal processing element, the pressure signal processing element, the temperature signal acquisition port 2 and the pressure signal acquisition port 3 are all arranged on the same PCB circuit board.

[0053] As a preferred solution, when the temperature signal processing element, the pressure signal processing element, the temperature signal acquisition port 2 and the pressure signal acquisition port 3 are all arranged on the same PCB circuit board, the temperature signal acquisition port 2 and the pressure signal acquisition port 3 are arranged on the same side of the PCB circuit board, and the positive signal acquisition port 21 and the negative signal acquisition port 22 of the temperature signal acquisition port 2 are respectively arranged on both sides of the pressure signal acquisition port 3. It can be understood that the temperature signal acquisition port 2 and the pressure signal acquisition port 3 are arranged on the same side of the PCB circuit board, which is more convenient for users to install and dock when using; at the same time, the positive signal acquisition port 21 and the negative signal acquisition port 22 of the temperature signal acquisition port 2 are respectively arranged on both sides of the pressure signal acquisition port 3, which is more convenient for users to identify the positive signal acquisition port 21 and the negative signal acquisition port 22 of the temperature signal acquisition port 2, and avoid docking errors.

[0054] In another embodiment of the present application, the temperature signal acquisition component and the pressure signal acquisition component are each arranged on two different PCB circuit boards, and the two PCB circuit boards are respectively fixed on the housing 1. The PCB circuit board of the temperature signal acquisition component and the PCB circuit board of the pressure signal acquisition component are stacked in sequence. In other words, the temperature signal acquisition port 2 and the pressure signal acquisition port 3 are arranged on different PCB circuit boards.

[0055] The present application does not impose any specific restrictions on the specific positions of the temperature signal acquisition component and the pressure signal acquisition component, and only requires that the temperature signal acquisition port 2 of the temperature signal acquisition component and the pressure signal acquisition port 3 of the pressure signal acquisition component be arranged toward the opening. The present application does not impose any specific restrictions on the fixing method between the circuit board and the housing, and the circuit board and the housing can be fixed by fasteners, buckles, ultrasonic welding, etc.

[0056] like Figure 1 and Figure 3 As shown, in one embodiment of the present application, a signal light 4 is also included, and the signal light 4 can provide the user with intuitive and clear feedback on the signal acquisition status. The signal light 4 is connected to the temperature signal acquisition mainboard and / or the pressure signal acquisition mainboard. The signal light 4 is used to indicate the working status of the temperature signal acquisition component and the pressure signal acquisition component. It can not only indicate whether the temperature-pressure integrated sensing piece is successfully connected to the temperature signal acquisition component or the pressure signal acquisition component, but also display whether the temperature signal acquisition component is in the temperature acquisition state, and whether the pressure signal acquisition component is performing the pressure acquisition task. Through the on and off, flashing or color change of the signal light 4, the user can quickly understand the current working status of the signal acquisition device, so as to make corresponding operations or adjustments. Multiple signal lights 4 can be set, each signal light corresponds to a specific state, so that the user can directly judge the working status of the signal acquisition device by observing the on and off of different signal lights. Or a single signal light 4 is used to distinguish different states by different flashing modes or colors. Regardless of which scheme is used, the introduction of the signal light 4 greatly improves the user-friendliness and practicality of the signal acquisition device. It enables users to monitor the signal acquisition process more conveniently, discover and solve problems in a timely manner, thereby improving work efficiency and accuracy.

[0057] The present application also provides a temperature-pressure integrated measuring device, including a temperature-pressure sensor and the signal acquisition device in the above-mentioned embodiment. The temperature-pressure sensor can specifically be a temperature-pressure integrated sensing piece, which includes a temperature sensing part, a temperature signal transmission terminal, a pressure sensing part and a pressure signal transmission terminal. The temperature signal transmission terminal and the pressure signal transmission terminal both include signal contacts, and the signal contacts can specifically be a copper-gold-plated circular signal contact array. The temperature signal acquisition port of the signal acquisition device is electrically connected to the temperature signal transmission terminal to realize the transmission of electrical signals between the temperature sensing part and the temperature signal acquisition mainboard, and the pressure signal acquisition port of the signal acquisition device is electrically connected to the pressure signal transmission terminal to realize the transmission of electrical signals between the pressure sensing part and the pressure signal acquisition mainboard. Since the temperature-pressure integrated measuring device has the signal acquisition device in the above-mentioned embodiment, it also has the advantages of the signal acquisition device in the above-mentioned embodiment.

[0058] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A signal acquisition device, characterized in that: include A housing (1) comprising a mounting cavity and an opening for communicating the mounting cavity with the outside; A temperature signal acquisition component is connected to the installation cavity, the temperature signal acquisition component comprises a temperature signal acquisition mainboard and a temperature signal acquisition port (2), the temperature signal acquisition port (2) is electrically connected to the temperature signal acquisition mainboard; A pressure signal acquisition component is connected to the installation cavity, the pressure signal acquisition component comprises a pressure signal acquisition mainboard and a pressure signal acquisition port (3), and the pressure signal acquisition port (3) is electrically connected to the pressure signal acquisition mainboard; The temperature signal acquisition port (2) and the pressure signal acquisition port (3) are both arranged towards the opening.

2. The signal acquisition device according to claim 1, characterized in that: The temperature signal acquisition port (2) comprises a positive signal acquisition port (21) and a negative signal acquisition port (22); the positive signal acquisition port (21) and the negative signal acquisition port (22) are both electrically connected to the temperature signal acquisition mainboard and are both arranged toward the opening.

3. The signal acquisition device according to claim 1, characterized in that: The housing (1) comprises a housing body (11) and a movable part (12); the movable part (12) is hinged to an opening of the housing body (11); the movable part (12) has an open state and a closed state; when the movable part (12) is in the open state, the installation cavity is connected to the outside; when the movable part (12) is in the closed state, the opening is closed.

4. The signal acquisition device according to claim 3, characterized in that: The housing body (11) comprises a first shell (111) and a second shell (112); the first shell (111) and the second shell (112) enclose the installation cavity; the first shell (111) and the second shell (112) are detachably connected to each other.

5. The signal acquisition device according to claim 4, characterized in that: The movable member (12) is hinged to one of the first shell (111) and the second shell (112).

6. The signal acquisition device according to claim 5, characterized in that: When the movable member (12) is in a closed state, a gap exists between the movable member (12) and the other of the first shell (111) and the second shell (112).

7. The signal acquisition device according to claim 2, characterized in that: The temperature signal acquisition port (2) and the pressure signal acquisition port (3) are both arranged on the same PCB circuit board.

8. The signal acquisition device according to claim 7, characterized in that: The temperature signal acquisition port (2) and the pressure signal acquisition port (3) are arranged on the same side of the PCB circuit board, and the positive signal acquisition port (21) and the negative signal acquisition port (22) of the temperature signal acquisition port (2) are respectively arranged on both sides of the pressure signal acquisition port (3).

9. The signal acquisition device according to any one of claims 1 to 6, characterized in that: The temperature signal acquisition port (2) and the pressure signal acquisition port (3) are arranged on different PCB circuit boards.

10. A temperature and pressure integrated measuring device, characterized in that: A temperature and pressure sensor and a signal acquisition device as claimed in any one of claims 1 to 9, wherein the temperature and pressure sensor comprises a temperature sensing part, a temperature signal transmission terminal electrically connected to the temperature sensing part, a pressure sensing part and a pressure signal transmission terminal electrically connected to the pressure sensing part; The temperature signal acquisition port (2) of the signal acquisition device is electrically connected to the temperature signal transmission terminal to realize the transmission of electrical signals between the temperature sensing part and the temperature signal acquisition mainboard, and the pressure signal acquisition port (3) of the signal acquisition device is electrically connected to the pressure signal transmission terminal to realize the transmission of electrical signals between the pressure sensing part and the pressure signal acquisition mainboard.

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