Device for detecting stress of test piece of tireative groove

Abstract

The utility model discloses a device for detecting the stress of a Treatier cell test piece, which comprises a test bottom plate, a support and a sensor assembly, a test area is arranged on the test bottom plate, the test area is used for placing a copper sheet to be detected, the support is arranged at one end part of the test bottom plate, the sensor assembly is arranged at the upper end part of the support, and the sensor assembly is used for detecting the stress of the Treatier cell test piece. And the test base plate is arranged above the test area of the test base plate. According to the utility model, the test area is arranged on the test bench, the sensor assembly is fixed on the support, and data acquired by the sensor assembly is transmitted to the external computer for storage and analysis, so that the working efficiency can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of testing equipment, and more specifically, to a device for detecting the stress of a Hall cell test piece. Background Art

[0002] A Hall cell is a test device that can quickly determine the current density and other process conditions required to achieve a qualified coating. It can be used to study the interactions between the main components and additives in the electroplating solution and help analyze the causes of problems during the electroplating process. Plating stress is a key indicator of coating performance. Measuring coating stress is valuable for understanding the mechanical properties of electrodeposited materials and has a significant impact on the quality of diamond wire during the electroplating process.

[0003] Currently, stress within the coating can be measured using a variety of methods, including thin-sheet cathode bending, spiral instrument shrinkage, and disc deformation, depending on the industry. For diamond wire electroplating, determining whether the stress in the copper sheet is tension or compression is currently primarily determined by measuring with a steel ruler and visually observing the surface, with data recorded manually. Greater bending indicates greater stress. This method provides simple and efficient experimental results, but the results are subject to significant error, creating significant uncertainty for subsequent product quality and fault tracing. Therefore, addressing stress errors is crucial for minimizing the impact on material properties and improving diamond wire product quality.

[0004] Therefore, it is urgent to propose a device for detecting the stress of a Hall cell specimen to solve the problem raised. Utility Model Content

[0005] (1) Technical issues to be resolved

[0006] Based on this, the utility model provides a device for detecting the stress of a Hall cell test piece which can effectively detect the stress of a coating.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, the utility model proposes a device for judging the stress of a Hall cell specimen for copper sheet plating, which includes a test base plate, a bracket and a sensor assembly. A test area is provided on the test base plate, and the test area is used to place the copper sheet to be tested. The bracket is arranged at one end of the test base plate, and the sensor assembly is arranged at the upper end of the bracket and is located above the test area of ​​the test base plate.

[0009] Furthermore, the bracket includes a support block and a support plate extending from one side of the support block, the support plate is arranged perpendicular to the support block, the support block is fixed on the test base plate, and adjustment holes are provided on the support plate, and the adjustment holes are arranged at intervals along the vertical direction. The sensor assembly is fixed to the support plate by a locking fixture, and the locking fixture passes through the adjustment hole and is connected to the sensor assembly.

[0010] Furthermore, the distance between the bottom end surface of the sensor assembly and the surface of the test area of ​​the test base plate is 50 mm ± 15 mm.

[0011] Furthermore, a fixing groove is provided on the support block, and the support block is fixed to the test base plate via a locking piece, and the locking piece passes through the fixing groove and is fixed to the test base plate.

[0012] Furthermore, the sensor assembly includes a supporting shell and a sensor disposed in the supporting shell. The supporting shell is in a rectangular shape and is fixed to the support plate by the locking piece.

[0013] Furthermore, the sensor is a laser displacement sensor.

[0014] Furthermore, the test base plate includes a test table and a fixed table arranged on one side of the test table, the upper end surface of the fixed table is higher than the height of the upper end surface of the test table, the test area is placed on the test table, and the bracket is fixed on the fixed table.

[0015] Furthermore, the test platform and the fixing platform are integrally formed.

[0016] Furthermore, the sensor assembly is provided with an RS485 port for connecting to an external computer.

[0017] Furthermore, the copper sheet to be tested is a copper sheet with electroplating on the front and insulation on the back. The thickness of the copper sheet before electroplating is 0.2 mm, and the length and width of the copper sheet before electroplating are 100 mm*65 mm.

[0018] (3) Beneficial effects

[0019] Compared with the prior art, the present invention is a device for detecting the stress of a Hall cell specimen, comprising a test base plate, a bracket and a sensor assembly, wherein a test area is provided on the test base plate, and the test area is used to place a copper sheet to be tested, the bracket is provided at one end of the test base plate, and the sensor assembly is provided at the upper end of the bracket and is above the test area of ​​the test base plate; by providing the test area on the test bench, fixing the sensor assembly on the bracket, and transmitting the data collected by the sensor assembly to an external computer for storage and analysis, work efficiency can be effectively improved; the sensor assembly is firmly fixed on the support plate by a locking fixture, avoiding external interference of the sensor assembly during the period of collecting data of the copper sheet to be tested, thereby effectively improving the measurement accuracy of the warping height of the copper sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0021] Figure 1 This is a schematic structural diagram of a device for detecting stress of a Hall cell specimen disclosed in a preferred embodiment of the present utility model;

[0022] Figure 2 It is a schematic diagram of the principle of detecting the stress of a Hall cell specimen according to a preferred embodiment of the present utility model. DETAILED DESCRIPTION

[0023] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without violating the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium; it can mean internal communication between two elements, or a "transmission connection," i.e., a power connection through various appropriate means such as a belt drive, a gear drive, or a sprocket drive. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0025] like Figure 1 and Figure 2As shown, an embodiment of the present invention discloses a device for detecting the stress of a Hall cell specimen, including a test base plate 100, a bracket 200 and a sensor assembly 300. A test area 101 is provided on the test base plate 100, and the test area 101 is used to place a copper sheet to be tested. Specifically, the copper sheet to be tested is placed in the Hall cell for electroplating before testing, thereby generating a coating structure on the copper sheet to be tested. This is a known technology and need not be described in detail here; the bracket 200 is provided at one end of the test base plate 100, and the sensor assembly 300 is provided at the upper end of the bracket 200 and is located above the test area 101 of the test base plate 100, so as to facilitate the testing operation of the copper sheet to be tested placed on the test base plate 100.

[0026] In this embodiment, the copper sheet to be tested is a copper sheet with electroplating on the front and insulation on the back. This product is a prior art and can be obtained by purchasing or preparing it yourself using prior art. There is no need to elaborate here. The thickness of the copper sheet before electroplating is 0.2 mm, and the length and width of the copper sheet are 100 mm*65 mm.

[0027] In one embodiment, the bracket 200 includes a support block 210 and a support plate 220 extending from one side of the support block 210. The support plate 220 is arranged perpendicular to the support block 210. The support block 210 is fixed to the test base plate 100. The support plate 220 is provided with adjustment holes 221. The adjustment holes 221 are arranged at intervals in the vertical direction. The sensor assembly 300 is fixed to the support plate 220 by a locking piece. The locking piece passes through the adjustment hole 221 and is connected to the sensor assembly 300, thereby firmly fixing the sensor assembly 300 on the support plate 220; by matching the sensor assembly 300 with different adjustment holes 221 settings, the height of the fixed position of the sensor assembly 300 on the support plate 220 is changed, so as to adjust the distance between the sensor assembly 300 and the test base plate 100, thereby facilitating the acquisition of different test data of the sensor assembly 300, providing more reference data for subsequent determination of the copper sheet plating stress, and improving the accuracy of the test.

[0028] In this embodiment, by matching the sensor assembly 300 with different adjustment holes 221 settings, the distance between the bottom end surface of the sensor assembly 300 and the surface of the test area 101 of the test base plate 100 is 50 mm ± 15 mm, so as to improve the measurement accuracy of the copper sheet to be tested by the sensor assembly 300, and the measurement accuracy is ± 0.1% mm.

[0029] Specifically, a fixing slot 211 is provided on the support block 210 , and the support block 210 is fixed to the test base plate 100 via a locking member, thereby firmly fixing the bracket 200 on the test base plate 100 . The locking member passes through the fixing slot 211 and is fixed to the test base plate 100 .

[0030] In this embodiment, the locking member and the locking member are both screw structures.

[0031] Furthermore, the sensor assembly 300 includes a support shell 310 and a sensor (not shown) disposed in the support shell 310. The support shell 310 is rectangular in shape and is fixed to the support plate 220 by a locking member, thereby firmly fixing the sensor assembly 300 on the support plate 220. In this embodiment, the sensor is a laser displacement sensor.

[0032] In one embodiment, the test base plate 100 includes a test table 110 and a fixed table 120 arranged on one side of the test table 110. The test table 110 and the fixed table 120 are integrally formed, the upper end surface of the fixed table 120 is higher than the height of the upper end surface of the test table 110, the test area 101 is placed on the test table 110, and the bracket 200 is fixed on the fixed table 120, thereby separating the bracket 200 from the test area 101, to avoid the test base plate 100 being connected to the external structure after the copper sheet to be tested is placed in the test area 101, causing the surface flatness of the test area 101 to change and affect the accuracy of the test result; that is, the fixed table 120 is set separately from the test table 110, to avoid the fixed table 120 affecting the surface flatness of the test table 110 during the process of fixing the bracket 200, thereby affecting the accuracy of the coating stress detection on the copper sheet to be tested.

[0033] In one embodiment, the sensor assembly 300 is provided with an RS485 port for connecting to an external computer, thereby transmitting the data collected by the sensor assembly 300 to the external computer for recording and subsequent analysis and processing. This is a known technology and need not be elaborated here.

[0034] When the present invention is in operation, a copper sheet with a thickness of 0.2 mm and a length and width of 100 mm*65 mm before electroplating is selected and placed in a Hall cell for electroplating. The plated copper sheet to be tested is then placed on a test bench 110. The plated copper sheet in the Hall cell will undergo physical deformation, and the right angles of the plated copper sheet will produce a certain degree of warping. The plated copper sheet is placed in a test area 101 on the horizontal surface of the test bench 110. The sensor assembly 300 measures the distance to the right angle of the copper sheet through a laser beam. The warping of the copper sheet can be obtained after calculation. The warping of the right angle of the copper sheet to be tested can also be randomly measured by moving the copper sheet. The obtained copper sheet warping data can be displayed in real time. If the data is within the standard range, the stress result can be quickly determined. The calculation process is a commonly used technology in this field and need not be elaborated here.

[0035] The utility model utilizes the sensor component 300 to connect to an external computer via the RS485 port, compares the real-time measured distance between the sensor component 300 and the surface of the copper sheet to be detected, and the initial measured distance between the sensor component 300 and the surface of the test bench 110, and obtains the real-time stress value and the initial stress value of the copper sheet to be detected, thereby obtaining the stress change detection result of the copper sheet to be detected in real time; or after uploading the sampled data to the computer for data statistics and analysis, it is convenient to have documented quality faults occurring in the process of producing electroplating products. Compared with the traditional method of measuring with a steel ruler, there is a certain error in steel ruler measurement. The standard ruler error is ±0.1mm. The steel ruler body is affected by temperature and will produce errors such as ruler length error, alignment error, and tension error during use, which will directly affect the measurement accuracy. In addition, the use of a steel ruler to measure uses a vertical measurement method. When the steel ruler is suspended in the air for measurement, a vertical bending error will occur, which will make the measured length greater than the actual length. When observing the scale, the visual line of sight cannot be completely guaranteed to be horizontal, which will cause a certain viewing angle inclination error of 1°. Therefore, using a steel ruler to measure the warping height of the copper sheet cannot fully ensure the measurement accuracy, resulting in a affected product qualification rate. Compared with the traditional method of measuring with a steel ruler, which requires skilled personnel to perform manual measurement and greatly reduces the work efficiency of manual measurement, the utility model adopts a test platform in conjunction with the detection device of the sensor component 300 to transmit the data collected by the sensor component 300 to an external computer for storage and analysis, which can effectively improve work efficiency. In addition, the sensor component 300 is firmly fixed on the support plate 220 through a locking fixture, avoiding external interference of the sensor component 300 during the collection of data of the copper sheet to be tested, thereby effectively improving the measurement accuracy of the warping height of the copper sheet.

[0036] In summary, the present invention provides a device for detecting the stress of a Hall cell specimen by setting a test area 101 on a test bench 110, fixing a sensor assembly 300 on a bracket 200, and transmitting the data collected by the sensor assembly 300 to an external computer for storage and analysis, thereby effectively improving work efficiency; the sensor assembly 300 is firmly fixed on the support plate 220 by a locking fixture, thereby avoiding external interference with the sensor assembly 300 during the period of collecting data of the copper sheet to be tested, thereby effectively improving the measurement accuracy of the warping height of the copper sheet.

[0037] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A device for detecting stress of a Hall cell specimen, characterized in that: It includes a test base plate, a bracket and a sensor assembly. The test base plate is provided with a test area, and the test area is used to place the copper sheet to be tested. The bracket is arranged at one end of the test base plate, and the sensor assembly is arranged at the upper end of the bracket and is located above the test area of ​​the test base plate.

2. The device for detecting stress of a Hall cell specimen according to claim 1, characterized in that: The bracket includes a support block and a support plate extending from one side of the support block, the support plate is vertically arranged with respect to the support block, the support block is fixed to the test base plate, the support plate is provided with adjustment holes, the adjustment holes are spaced apart in the vertical direction, the sensor assembly is fixed to the support plate by a locking piece, and the locking piece passes through the adjustment hole and is connected to the sensor assembly.

3. The device for detecting stress of a Hall cell specimen according to claim 2, characterized in that: The distance between the bottom end surface of the sensor assembly and the surface of the test area of ​​the test base plate is 50 mm±15 mm.

4. The device for detecting stress of a Hall cell specimen according to claim 2, characterized in that: The support block is provided with a fixing groove, and the support block is fixed to the test base plate through a locking piece, and the locking piece passes through the fixing groove and is fixed to the test base plate.

5. The device for detecting stress of a Hall cell specimen according to claim 2, characterized in that: The sensor assembly includes a support shell and a sensor disposed in the support shell. The support shell is in a rectangular shape and is fixed to the support plate by the locking piece.

6. The device for detecting stress of a Hall cell specimen according to claim 2, characterized in that: The sensor is a laser displacement sensor.

7. The device for detecting stress of a Hall cell specimen according to claim 1 or 2, characterized in that: The test base plate includes a test table and a fixed table arranged on one side of the test table, the upper end surface of the fixed table is higher than the height of the upper end surface of the test table, the test area is placed on the test table, and the bracket is fixed on the fixed table.

8. The device for detecting stress of a Hall cell specimen according to claim 7, characterized in that: The testing platform and the fixing platform are integrally formed.

9. The device for detecting stress of a Hall cell specimen according to claim 1 or 2, characterized in that: The sensor assembly is provided with an RS485 port for connecting to an external computer.

10. The device for detecting stress of a Hall cell specimen according to claim 1 or 2, characterized in that: The copper sheet to be tested is a copper sheet with electroplating on the front side and insulation on the back side. The thickness of the copper sheet before electroplating is 0.2 mm, and the length and width of the copper sheet before electroplating are 100 mm*65 mm.

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