Composite heat dissipation module and electronic device

Abstract

A composite heat dissipation module and an electronic device are suitable for heat dissipation of a heat source. The composite heat dissipation module comprises an air-cooled heat dissipation assembly and a liquid-cooled heat dissipation assembly. The air-cooled heat dissipation assembly comprises an airflow generator and a first heat dissipation fin. The airflow generator is provided with a first air outlet. The first heat dissipation fin is adjacent to the first air outlet of the airflow generator and is used for being thermally coupled to a heat source. The liquid-cooled heat dissipation assembly comprises a heat conduction flow pipe and a fluid driver. The heat conduction flow pipe is thermally coupled to the first heat dissipation fins and is used for accommodating a cooling fluid. The fluid driver is communicated with the heat conduction flow pipe to form a circulation flow channel, and is used for driving the cooling fluid to circulate in the circulation flow channel.

Description

Technical Field

[0001] The invention relates to a composite heat dissipation module, in particular to a composite heat dissipation module comprising an air-cooled heat dissipation component and a liquid-cooled heat dissipation component. Background Art

[0002] As the performance of electronic devices continues to improve, the requirements for heat dissipation efficiency of electronic devices are also getting higher and higher, especially in computers. As the performance of processors is improved, the waste heat generated by processors is also increasing. If this waste heat cannot be effectively discharged and accumulates in the electronic device, the performance and life of the electronic device will be reduced.

[0003] Most existing heat dissipation modules adopt air cooling or liquid cooling. The former uses a fan to blow to the heat dissipation fins thermally coupled to the heat source to discharge the heat energy generated by the heat source; the latter uses a circulating water circuit composed of a liquid cooling head, a liquid cooling row and a pump to provide a cooling fluid to flow, and the liquid cooling head thermally coupled to the heat source absorbs the heat energy generated by the heat source. However, the above heat dissipation mode provides sufficient heat dissipation effect for a single heat source, but the heat dissipation effect for electronic devices with multiple heat sources is poor. Therefore, how to solve the heat dissipation needs of electronic devices with multiple heat sources has become a problem that researchers in this field are committed to solving. Utility Model Content

[0004] The purpose of the present invention is to provide a composite heat dissipation module, which integrates air-cooling and liquid-cooling heat dissipation components to solve the heat dissipation requirements of electronic devices with multiple heat sources.

[0005] To achieve the above-mentioned purpose, a composite heat dissipation module disclosed in an embodiment of the present invention is suitable for dissipating heat from a heat source. The composite heat dissipation module includes an air-cooled heat dissipation component and a liquid-cooled heat dissipation component. The air-cooled heat dissipation component includes an airflow generator and a first heat dissipation fin. The airflow generator has a first air outlet. The first heat dissipation fin is adjacent to the first air outlet of the airflow generator and is used to be thermally coupled to the heat source. The liquid-cooled heat dissipation component includes a heat conduction flow tube and a fluid driver. The heat conduction flow tube is thermally coupled to the first heat dissipation fin and is used to accommodate a cooling fluid. The fluid driver is connected to the heat conduction flow tube to form a circulation channel together, and is used to drive the cooling fluid to circulate in the circulation channel.

[0006] In the above-mentioned composite heat dissipation module, the air-cooled heat dissipation component further includes a heat pipe, one end of the heat pipe is thermally coupled to the first heat dissipation fin, and the other end of the heat pipe is used to thermally couple to the heat source.

[0007] In the above-mentioned composite heat dissipation module, the heat conduction pipe is used for thermally coupling to the heat source.

[0008] In the above-mentioned composite heat dissipation module, the airflow generator has a second air outlet, the second air outlet and the first air outlet face in different directions, and the air-cooled heat dissipation component further includes a second heat dissipation fin, which is adjacent to the second air outlet.

[0009] In the above-mentioned composite heat dissipation module, the heat conduction pipe is thermally coupled to the second heat dissipation fin.

[0010] In the above-mentioned composite heat dissipation module, the heat conduction pipe is disposed around the airflow generator.

[0011] To achieve the above-mentioned purpose, an electronic device disclosed in an embodiment of the present invention includes at least one heat source, at least one air-cooled heat dissipation component and a liquid-cooled heat dissipation component. At least one air-cooled heat dissipation component includes an airflow generator and a first heat dissipation fin. The airflow generator has a first air outlet. The first heat dissipation fin is adjacent to the first air outlet of the airflow generator and is used to be thermally coupled to at least one heat source. The liquid-cooled heat dissipation component includes a heat conduction flow tube and a fluid driver. The heat conduction flow tube is thermally coupled to the first heat dissipation fin and is used to accommodate a cooling fluid. The fluid driver is connected to the heat conduction flow tube to form a circulation channel and is used to drive the cooling fluid to circulate in the circulation channel.

[0012] In the above-mentioned electronic device, the at least one air-cooled heat dissipation component further includes at least one first heat pipe, one end of the at least one first heat pipe is thermally coupled to the first heat dissipation fin, and the other end of the first heat pipe is thermally coupled to the at least one heat source.

[0013] In the above-mentioned electronic device, the number of the at least one heat source and the at least one air-cooled heat dissipation component is two, one end of the two first heat pipes is thermally coupled to the two heat sources respectively, and the other end of the two first heat pipes is thermally coupled to the first heat dissipation fins of the two air-cooled heat dissipation components respectively.

[0014] The electronic device mentioned above further comprises a second heat pipe, one end of which is thermally coupled to one of the first heat sink fins, and the other end of which is thermally coupled to one of the heat sources.

[0015] In the above-mentioned electronic device, the heat conduction pipe is thermally coupled to the at least one heat source.

[0016] In the electronic device, the airflow generator has a second air outlet facing in different directions from the first air outlet, and the at least one air-cooled heat dissipation component further includes a second heat dissipation fin adjacent to the second air outlet.

[0017] In the above-mentioned electronic device, the heat conduction pipe is thermally coupled to the second heat dissipation fin.

[0018] In the above-mentioned electronic device, the heat conduction pipe is disposed around the airflow generator.

[0019] According to the composite heat dissipation module and electronic device of the above-mentioned embodiments, multiple heat dissipations are provided to the heat source through the circulation channel of the liquid-cooled heat dissipation component, and the heat source and the heat conduction flow tube are simultaneously cooled by the air-cooled heat dissipation component, which can effectively improve the heat dissipation efficiency of multiple heat sources in the electronic device and solve the heat dissipation needs of the electronic device with multiple heat sources.

[0020] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional diagram of an electronic device disclosed according to an embodiment of the present invention.

[0022] Figure 2 for Figure 1 Schematic diagram of the exploded view of the air-cooled heat dissipation components.

[0023] Figure 3 for Figure 1 Schematic diagram of the decomposition of the heat source area.

[0024] Figure 4 for Figure 1 Schematic diagram of the heat dissipation path of an electronic device.

[0025] Among them, the reference numerals

[0026] 10: Electronic devices

[0027] 20: Composite heat dissipation module

[0028] 101,102: Heat source

[0029] 200: Air-cooled heat dissipation components

[0030] 210: Airflow generator

[0031] 220: First heat sink fin

[0032] 230: Second heat sink fin

[0033] 240: First heat pipe

[0034] 300: Liquid cooling components

[0035] 310: Heat transfer pipe

[0036] 320: Fluid Drive

[0037] 321: Water outlet

[0038] 322:Water inlet

[0039] 400: Mounting rack

[0040] 500: Second heat pipe

[0041] 600:Fixed bracket

[0042] A1,A2,W:Direction DETAILED DESCRIPTION

[0043] The structural principle and working principle of the utility model are described in detail below in conjunction with the accompanying drawings:

[0044] See also Figure 1 and Figure 2 . Figure 1 It is a three-dimensional diagram of an electronic device 10 disclosed according to an embodiment of the present invention. Figure 2 for Figure 1 In this embodiment, the electronic device 10 comprises two heat sources 101, 102, two air-cooling heat dissipation components 200 and a liquid-cooling heat dissipation component 300, wherein the air-cooling heat dissipation component 200 and the liquid-cooling heat dissipation component 300 can be regarded as a composite heat dissipation module 20.

[0045] In this embodiment, the heat sources 101 and 102 may be, for example, a central processing unit or a graphics processing unit, but are not limited thereto. In other embodiments, the heat sources may also be electronic components such as expansion cards, resistors or capacitors.

[0046] In this embodiment, the air-cooled heat dissipation assembly 200 includes an airflow generator 210, a first heat dissipation fin 220, and a second heat dissipation fin 230. The airflow generator 210 may be, for example, a centrifugal fan with two air outlets. The airflow generator 210 has a first air outlet 211 and a second air outlet 212. The first air outlet 211 and the second air outlet 212 face different directions. The first heat dissipation fin 220 is adjacent to the first air outlet 211 and is thermally coupled to the heat sources 101, 102. The second heat dissipation fin 230 is adjacent to the second air outlet 212.

[0047] In this embodiment, the air-cooled heat dissipation assembly 200 may further include a first heat pipe 240. One end of the first heat pipe 240 is thermally coupled to the first heat dissipation fin 220, and the other end of the first heat pipe 240 is thermally coupled to the heat source 101, 102. The heat energy generated by the heat source 101, 102 can be transferred to the first heat dissipation fin 220 through the first heat pipe 240 for heat dissipation.

[0048] In this embodiment, the liquid cooling heat dissipation assembly 300 includes a heat conduction pipe 310 and a fluid driver 320. The fluid driver 320 has a water outlet 321 and a water inlet 322. The heat conduction pipe 310 and the fluid driver 320 are connected to form a circulation channel and are used to drive a cooling fluid to flow in the circulation channel.

[0049] In this embodiment, the heat conduction pipe 310 can be, for example but not limited to, arranged around the airflow generator 210, and thermally coupled to the first heat dissipation fins 220, the second heat dissipation fins 230 and the heat sources 101, 102. The heat conduction pipe 310 can conduct the heat energy generated by the heat sources 101, 102 to the first heat dissipation fins 220 and the second heat dissipation fins 230 for heat dissipation.

[0050] In this embodiment, the material of the heat conduction pipe 310 can be, for example, metal such as copper or aluminum, but is not limited thereto. In other embodiments, the material of the heat conduction pipe can also be any material with good thermal conductivity.

[0051] In this embodiment, the first heat dissipation fins 220 and the second heat dissipation fins 230 may be in a sheet shape, but are not limited thereto. In other embodiments, the first heat dissipation fins and the second heat dissipation fins may also be in an arc shape or a needle shape.

[0052] In this embodiment, the number of heat sources 101, 102 and air-cooling heat dissipation components 200 is two, but the present invention is not limited thereto. In other embodiments, the number of heat sources and air-cooling heat dissipation components may also be one or more than three.

[0053] See also Figure 3 . Figure 3 for Figure 1 In this embodiment, the electronic device 10 may further include two mounting racks 400 . The two mounting racks 400 are used to mount the two heat sources 101 , 102 and thermally couple the heat sources 101 , 102 to the first heat pipe 240 and the heat conduction pipe 310 .

[0054] In this embodiment, the electronic device 10 may further include a second heat pipe 500 and a fixing frame 600. One end of the second heat pipe 500 is thermally coupled to one of the first heat sink fins 220, and the other end is thermally coupled to the heat source 101. The heat energy generated by the heat source 101 can be conducted to the first heat sink fins 220 through the second heat pipe 500 for heat dissipation, thereby further improving the heat dissipation efficiency. The fixing frame 600 fixes the second heat pipe 500 and the heat source 101.

[0055] See also Figure 4 . Figure 4 for Figure 1Schematic diagram of the heat dissipation path of the electronic device 10. In this embodiment, the airflow generated by the airflow generator 210 blows toward the first heat dissipation fins 220 through the first air outlet 211 along the direction A1, and the first heat dissipation fins 220 can dissipate heat for the first heat pipe 240, the heat conduction flow pipe 310 and the second heat pipe 500. In addition, the airflow blows toward the second heat dissipation fins 230 along the direction A2 through the second air outlet 212, and the heat conduction flow pipe 310 can dissipate heat for the second heat dissipation fins 230.

[0056] In this embodiment, the fluid driver 320 drives the cooling fluid to flow along the direction W, so that the cooling fluid first flows into the heat conduction pipe 310 from the water outlet 321, and flows to the heat source 101 along the heat conduction pipe 310 to absorb the heat generated by the heat source 101. Then, the cooling fluid after absorbing the heat flows through the second heat dissipation fins 230 and the first heat dissipation fins 220 in sequence, so as to discharge the heat through the second heat dissipation fins 230 and the first heat dissipation fins 220. In other words, the cooling fluid will first dissipate the heat of the first heat source 101, and then discharge the heat generated by the heat source 101 through the second heat dissipation fins 230 and the first heat dissipation fins 220.

[0057] Next, the cooling fluid flows through the heat source 101 and the heat source 102 in sequence along the heat conduction flow pipe 310 to absorb the heat generated by the heat source 101 and the heat source 102. In other words, the cooling fluid will first perform a second heat dissipation on the heat source 101, and then perform a first heat dissipation on the heat source 102. After absorbing heat, the cooling fluid will then flow through another first heat dissipation fin 220 and a second heat dissipation fin 230 in sequence to discharge heat again through the first heat dissipation fin 220 and the second heat dissipation fin 230. Finally, after performing a second heat dissipation on the heat source 102, the cooling fluid flows back to the fluid driver 320 from the water inlet along the direction W.

[0058] According to the composite heat dissipation module and electronic device of the above-mentioned embodiments, multiple heat dissipations are provided to the heat source through the circulation channel of the liquid-cooled heat dissipation component, and the heat source and the heat conduction flow tube are simultaneously cooled by the air-cooled heat dissipation component, which can effectively improve the heat dissipation efficiency of multiple heat sources in the electronic device and solve the heat dissipation needs of the electronic device with multiple heat sources.

[0059] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field can make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A composite heat dissipation module, suitable for dissipating heat from a heat source, characterized in that: The composite heat dissipation module includes: An air-cooled heat dissipation component, comprising: an airflow generator having a first air outlet; and a first heat dissipation fin, adjacent to the first air outlet of the airflow generator and used for thermally coupling to the heat source; and A liquid cooling heat dissipation assembly, comprising: a heat conducting fluid pipe thermally coupled to the first heat sink fin and used to contain a cooling fluid; and A fluid driver is connected with the heat-conducting fluid pipe to form a circulation channel and is used to drive the cooling fluid to circulate in the circulation channel.

2. The composite heat dissipation module according to claim 1, characterized in that: The air-cooled heat dissipation component further comprises a heat pipe, one end of which is thermally coupled to the first heat dissipation fin, and the other end of which is thermally coupled to the heat source.

3. The composite heat dissipation module according to claim 1, characterized in that: The heat conduction pipe is used for thermally coupling with the heat source.

4. The composite heat dissipation module according to claim 1, characterized in that: The airflow generator has a second air outlet, and the second air outlet faces a different direction from the first air outlet. The air-cooled heat dissipation component also includes a second heat dissipation fin, and the second heat dissipation fin is adjacent to the second air outlet.

5. The composite heat dissipation module according to claim 4, characterized in that: The heat conduction pipe is thermally coupled to the second heat dissipation fin.

6. The composite heat dissipation module according to claim 1, characterized in that: The heat conduction pipe is disposed around the airflow generator.

7. An electronic device, characterized in that: Include: at least one heat source; At least one air-cooled heat dissipation component, comprising: an airflow generator having a first air outlet; and a first heat dissipation fin, adjacent to the first air outlet of the airflow generator and thermally coupled to the at least one heat source; and A liquid cooling heat dissipation assembly, comprising: a heat conducting fluid pipe, thermally coupled to the first heat sink fin and used to contain a cooling fluid; A fluid driver is connected with the heat-conducting fluid pipe to form a circulation channel and is used to drive the cooling fluid to circulate in the circulation channel.

8. The electronic device as claimed in claim 7, characterized in that: The at least one air-cooled heat dissipation component further includes at least one first heat pipe, one end of the at least one first heat pipe is thermally coupled to the first heat dissipation fin, and the other end of the first heat pipe is thermally coupled to the at least one heat source.

9. The electronic device as claimed in claim 8, characterized in that: The number of the at least one heat source and the at least one air-cooled heat dissipation component is two, one end of the two first heat pipes is thermally coupled to the two heat sources respectively, and the other end of the two first heat pipes is thermally coupled to the first heat dissipation fins of the two air-cooled heat dissipation components respectively.

10. The electronic device according to claim 9, wherein: The invention also comprises a second heat pipe, one end of which is thermally coupled to one of the first heat sinks, and the other end of which is thermally coupled to one of the heat sources.

11. The electronic device according to claim 7, wherein: The heat conduction pipe is thermally coupled to the at least one heat source.

12. The electronic device according to claim 7, wherein: The airflow generator has a second air outlet, and the second air outlet faces a different direction from the first air outlet. The at least one air-cooled heat dissipation component further includes a second heat dissipation fin, and the second heat dissipation fin is adjacent to the second air outlet.

13. The electronic device according to claim 12, wherein: The heat conduction pipe is thermally coupled to the second heat dissipation fin.

14. The electronic device as claimed in claim 7, characterized in that: The heat conduction pipe is arranged around the airflow generator.

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