Chip conveying device and semiconductor process equipment
By introducing a stop and a barrier structure into the chip transfer device and using the drive member to drive its movement, the problem of displacement of the wafer during the chip transfer process is solved, and the stable clamping of the wafer and the improvement of the yield of the wafer is achieved.
Patent Information
- Application Number
- CN202420518609.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-18
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-03-18
AI Technical Summary
In semiconductor processes, wafers are prone to displace relative to the carrier due to large movement speed in the chip transfer device, resulting in particle generation, affecting the process environment and wafer yield.
A chip transfer device is designed, including a carrier, a stop and a drive member to drive the stop movement through the drive member so that the stop member and the barrier structure can clamp the wafer carried by the carrier to ensure that the wafer is stationary with respect to the carrier.
It effectively avoids the wafer's displacement relative to the carrier during the wafer transfer process, reduces the generation of particles caused by frictional movement, improves the process environment, and improves the yield of the wafer.
Smart Images
Figure CN222619709U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a wafer transmission device and semiconductor process equipment. Background Art
[0002] In the field of semiconductor technology, wafers are usually transferred between a wafer transfer box and a wafer boat using a wafer transfer device. In the prior art, the wafer transfer device includes a carrier for carrying the wafer, and the carrier has a flat surface. During the wafer transfer device transports the wafer, the wafer and the carrier are kept relatively fixed only by the friction between the carrier and the wafer. However, in this case, when the wafer transfer device moves at a high speed, the wafer is prone to positional displacement relative to the carrier, and the friction movement will also cause particles to be generated on the wafer. The particles will not only affect the process environment, but also affect the yield of the wafer. Utility Model Content
[0003] The purpose of the embodiments of the present application is to provide a wafer transfer device and semiconductor process equipment, which can solve the problem in the related art that the wafer is easily displaced relative to the carrier of the wafer transfer device.
[0004] In a first aspect, an embodiment of the present application provides a wafer conveying device, comprising a carrier, a blocking member and a driving member, wherein the carrier is provided with a carrying surface for carrying a wafer, and the carrier is provided with a blocking structure, the blocking structure protrudes from the carrying surface, the driving member is connected to the blocking member, and the blocking member is opposite to the blocking structure, the driving member can drive the blocking member to move relative to the carrier, and the wafer conveying device has a clamping state and a unclamping state,
[0005] When the wafer conveying device is in the clamping state, the blocking member and the blocking structure jointly clamp the wafer carried by the carrying surface;
[0006] When the wafer transfer device is in the unclamping state, the blocking member and the blocking structure release the wafer carried by the carrying surface.
[0007] In a second aspect, an embodiment of the present application further provides a semiconductor process equipment, including the above-mentioned wafer conveying device.
[0008] In the embodiment of the present application, the wafer conveying device drives the blocking member to move through the driving member, so that the blocking member and the blocking structure can jointly clamp the wafer carried by the carrier, so that the wafer is stationary relative to the carrier. Even if the movement speed is relatively high during the wafer conveying process, the displacement of the wafer relative to the carrier can be effectively avoided, thereby avoiding the generation of particles on the wafer due to friction movement, and is not easy to affect the process environment, which is beneficial to improving the yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1is a top view of the film transmission device disclosed in the embodiment of the present application;
[0010] Figure 2 is a front view of the film transmission device disclosed in the embodiment of the present application;
[0011] Figure 3 It is a partial structural schematic diagram of the film transmission device disclosed in the embodiment of the present application;
[0012] Figure 4 is a rear view of the film transmission device disclosed in the embodiment of the present application;
[0013] Figure 5 is a structural schematic diagram of a film transmission device disclosed in another embodiment of the present application;
[0014] Figure 6 It is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiment of the present application.
[0015] Description of reference numerals:
[0016] 100-carrying member, 110-carrying body, 120-first carrying part, 130-second carrying part, 140-blocking structure,
[0017] 200-Block,
[0018] 300-Driver,
[0019] 400-connector, 410-blocking piece,
[0020] 500-position detection element, 510-transmitter, 520-receiver,
[0021] 600-mobile drive mechanism,
[0022] 700-Mobile subject,
[0023] 810-scanning transmitting device, 820-scanning receiving device,
[0024] 910-first tailstock, 920-second tailstock, 930-support base, 940-anti-collision bottom plate,
[0025] 950-process tube, 951-process door, 960-wafer boat, 970-lifting device, 980-wafer transfer box,
[0026] A-first direction, B-second direction. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.
[0028] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.
[0029] The wafer transmission device and semiconductor process equipment provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.
[0030] Please refer to Figure 1-Figure 6 The embodiment of the present application discloses a wafer conveyor device applied to semiconductor process equipment, the wafer conveyor device is used to transfer wafers between different equipment, optionally, the wafer conveyor device is used to transfer wafers between a wafer boat 960 and a wafer transfer box 980, and the wafer conveyor device can also transfer wafers between the wafer transfer box 980 and other equipment.
[0031] The wafer conveying device includes a carrier 100, a stopper 200 and a driving member 300, wherein the carrier 100 is used to support the wafer, and the carrier 100 is provided with a carrying surface for carrying the wafer, and the wafer can be directly placed on the carrying surface, and the lower surface of the wafer contacts the carrying surface.
[0032] The carrier 100 is provided with a blocking structure 140, which is protruding from the carrying surface. Optionally, the protruding structure can be located at the edge of the carrying surface, and the protruding structure can contact the edge of the wafer to prevent the wafer from moving. The blocking structure 140 can be a block-shaped protrusion or a protruding structure of other shapes, as long as the blocking structure 140 can prevent the wafer from moving.
[0033] The driving member 300 is connected to the blocking member 200, and the blocking member 200 is opposite to the blocking structure 140. The driving member 300 can drive the blocking member 200 to move relative to the carrier 100. The blocking member 200 can be a block structure or other structures. The embodiment of the present application does not limit the specific structure of the blocking member 200. Optionally, the driving member 300 can be a driving mechanism that can generate linear displacement, such as a cylinder, a slide module, or a rotating driving mechanism such as a motor; the driving member 300 and the blocking member 200 can be directly connected or indirectly connected.
[0034] The wafer conveying device has a clamping state and an unclamping state. When the wafer conveying device is in the clamping state, the blocking member 200 and the blocking structure 140 jointly clamp the wafer carried by the carrying surface. That is, the blocking member 200 and the blocking structure 140 are respectively located on both sides of the wafer. Under the driving action of the driving member 300, the distance between the blocking member 200 and the blocking structure 140 is reduced, and the blocking member 200 and the blocking structure 140 jointly apply a clamping force to the wafer, so that the wafer is stationary relative to the carrying member 100. When the wafer conveying device is in the unclamping state, the blocking member 200 and the blocking structure 140 release the wafer carried by the carrying surface. That is, the driving member 300 drives the blocking member 200 to move in the reverse direction, and the distance between the blocking member 200 and the blocking structure 140 increases, so that the blocking member 200 and the blocking structure 140 no longer clamp the wafer, and the wafer can be separated from the carrying surface.
[0035] In the embodiment of the present application, the wafer conveying device drives the blocking member 200 to move through the driving member 300, so that the blocking member 200 and the blocking structure 140 can jointly clamp the wafer carried by the carrier 100, so that the wafer is stationary relative to the carrier 100. Even if the movement speed during the wafer conveying process is relatively high, the displacement of the wafer relative to the carrier 100 can be effectively avoided, thereby avoiding the generation of particles on the wafer due to friction movement, and it is not easy to affect the process environment, which is beneficial to improving the yield of the wafer.
[0036] In an optional embodiment, the driving member 300 is directly connected to the blocking member 200 .
[0037] In another embodiment, the film transmission device further includes a connecting member 400, and the driving member 300 is connected to the blocking member 200 through the connecting member 400. Optionally, the connecting member 400 may be Figure 3 In the connecting rod shown, the stopper 200 is fixedly arranged at the end of the connecting rod. Further optionally, the stopper 200 and the connecting rod can be fixedly connected by welding, bonding, etc. Of course, the connecting member 400 can also adopt other structures besides the connecting rod, as long as it can play the role of connecting the driving member 300 and the stopper 200.
[0038] In this embodiment, the connecting member 400 is used as a power transmission component between the driving member 300 and the blocking member 200, so as to avoid direct connection between the driving member 300 and the blocking member 200, thereby solving the problem that it is inconvenient to directly connect the driving member 300 and the blocking member 200.
[0039] In an optional embodiment, the stopper 200 may be a block structure, and the stopper 200 is fixedly disposed on the connecting member 400. In this way, the friction between the stopper 200 and the wafer is a sliding friction. Optionally, the stopper 200 and the connecting member 400 may be fixedly connected by welding, bonding, etc., that is, the stopper 200 is fixed relative to the connecting member 400.
[0040] In another embodiment, reference Figure 1-Figure 3 As shown, the stopper 200 is a roller, and the roller is rotatably arranged on the connecting member 400. With this embodiment, the friction between the stopper 200 and the wafer is converted from sliding friction to rolling friction, which is beneficial to reduce the friction between the stopper 200 and the wafer in the process of clamping the wafer by the stopper 200 and the blocking structure 140, thereby avoiding damage to the wafer. Optionally, a cylindrical protrusion can be provided at the axis of the roller, and the connecting member 400 can be provided with a cylindrical groove, the cylindrical protrusion extends into the cylindrical groove, and the cylindrical protrusion and the cylindrical groove are rotatably matched to realize that the roller can rotate relative to the connecting member 400. Of course, the roller and the connecting member 400 can also be rotatably connected in other ways.
[0041] In an alternative embodiment, reference Figure 1 As shown, the carrier 100 includes a carrier body 110, a first carrier portion 120 and a second carrier portion 130. The first carrier portion 120 and the second carrier portion 130 are respectively connected to the carrier body 110, and the first carrier portion 120 and the second carrier portion 130 are spaced apart from each other. A blocking structure 140 is provided at one end of the first carrier portion 120 and the second carrier portion 130 away from the carrier body 110, and the blocking member 200 is arranged adjacent to the carrier body 110.
[0042] In this embodiment, the carrier 100 is provided with at least two blocking structures 140, and each blocking structure 140 is located at a different position. Therefore, each blocking structure 140 cooperates with the blocking member 200 to clamp different areas of the wafer, which is beneficial to improving the overall stability of the wafer.
[0043] Optionally, the stopper 200 is located at a side of the carrier body 110 away from the first carrier part 120 and the second carrier part 130, and the first carrier part 120 and the second carrier part 130 are respectively connected to the two ends of the carrier body 110, and the stopper 200 is located in the middle of the carrier body 110. In this way, the blocking structure 140 provided on the first carrier part 120, the blocking structure 140 provided on the second carrier part 130, and the stopper 200 cooperate to clamp the wafer more stably.
[0044] Of course, in other embodiments, the carrier 100 may also adopt other bearing structures, and the carrier 100 may only be provided with one blocking structure 140 , and the blocking structure 140 and the blocking member 200 clamp the wafer together.
[0045] In an optional embodiment, the film transmission device further includes a position detection element 500, which is disposed on the carrier 100 and is used to detect the position of the blocking member 200. The position detection element 500 is in communication connection with the driving member 300. When the position detection element 500 detects that the blocking member 200 has moved to the extreme position, it indicates that the blocking member 200 has moved to the position and the driving member 300 has stopped working. Optionally, the position detection element 500 may include a magnetic field sensor and a magnetic member, one of which is disposed on the carrier 100 and the other is connected to the blocking member 200, and the position of the blocking member 200 is detected by the magnetic field strength detected by the magnetic field sensor; of course, the position detection element 500 may also be other detection elements.
[0046] Optionally, the extreme position includes a first extreme position and a second extreme position, wherein the first extreme position refers to the position of the blocker 200 when the blocker 200 and the blocking structure 140 jointly clamp the wafer, and the second extreme position refers to the position of the blocker 200 when the blocker 200 and the blocking structure 140 release the wafer.
[0047] In this embodiment, the position detection element 500 is used to detect the position of the stopper 200, which is beneficial for accurately controlling the timing of stopping the driving member 300 and avoiding excessive movement of the stopper 200, which may cause the stopper 200 and the blocking structure 140 to clamp the wafer too much.
[0048] Optionally, the film transmission device may further include a controller, which may be a single chip microcomputer or a programmable logic controller, and the controller is respectively connected to the position detection element 500 and the driving member 300. When the position detection element 500 detects that the stopper 200 moves to the limit position, the controller controls the driving member 300 to stop working.
[0049] In an alternative embodiment, reference Figure 3As shown, the connecting member 400 is a connecting rod, the blocking member 200 is arranged at the first end of the connecting rod, and the second end of the connecting rod is provided with a blocking piece 410, which is used to block the signal of the position detection element 500 for detecting position information; the position detection element 500 includes a relative transmitter 510 and a receiver 520, and the transmitter 510 and the receiver 520 are both arranged on the carrier 100. Of course, they can also be arranged on other components on the transmission device that are stationary relative to the carrier 100; the transmitter 510 and the receiver 520 can both be photoelectric sensors, the transmitter 510 is used to transmit optical fiber signals, and the receiver 520 is used to receive optical fiber signals, and the blocking piece 410 is used to block the optical fiber signal. The optical fiber signal emitted by the transmitter 510 can be received by the receiver 520. When the blocking piece 410 moves between the transmitter 510 and the receiver 520, the blocking piece 410 blocks the optical fiber signal, the optical fiber signal received by the receiver 520 is weakened, or the receiver 520 cannot receive the optical fiber signal, and the driving member 300 stops working.
[0050] The position of the blocking member 200 is detected by the combined structure of the blocking piece 410 , the transmitter 510 and the receiver 520 , and the detection accuracy is high, which is more conducive to accurately controlling the timing of stopping the driving member 300 .
[0051] In an optional embodiment, the driving member 300 can drive the blocking member 200 to move relative to the bearing member 100 along the first direction A, and the extension direction of the connecting rod is parallel to the first direction A. Optionally, the driving member 300 is connected to the middle position of the connecting rod, which is conducive to the driving member 300 stably driving the entire connecting rod to drive the blocking member 200 and the blocking piece 410 to move together.
[0052] The driving member 300 drives the blocking member 200 to move directly along the direction in which the connecting rod extends. Then, the direction of the force applied by the connecting rod to the blocking member 200 is opposite to the direction of the force applied by the wafer to the blocking member 200, which is beneficial to maintaining the stability of the state of the blocking member 200 and further beneficial to the blocking member 200 to stably clamp the wafer.
[0053] Of course, in other embodiments, the direction in which the driving member 300 drives the blocking member 200 to move may intersect with the direction in which the connecting rod extends.
[0054] In an optional embodiment, the number of the supporting member 100 , the blocking member 200 and the driving member 300 are all one.
[0055] In an alternative embodiment, reference Figure 2As shown, the number of the carrier 100, the stopper 200 and the driving member 300 are all multiple, and the carrier 100, the stopper 200 and the driving member 300 correspond to each other one by one. Optionally, multiple carriers 100 are arranged at intervals along the second direction B, and each carrier 100 carries different wafers respectively. The second direction B is a direction perpendicular to the carrying surface. With this embodiment, the wafer conveying device can carry multiple wafers at the same time through multiple carriers 100, and then transport multiple wafers at the same time, which is conducive to improving the wafer transportation efficiency and the operation efficiency of the semiconductor process equipment.
[0056] In an alternative embodiment, reference Figure 1 As shown, the driving member 300 can drive the blocking member 200 to move relative to the carrier 100 along the first direction A, and the first direction A is parallel to the carrier surface. In this embodiment, the driving member 300 can drive the blocking member 200 to move along the direction parallel to the carrier surface, so the direction of the clamping force applied by the blocking member 200 to the wafer is also parallel to the carrier surface, which is conducive to the wafer being stably located on the carrier surface and avoids the direction of the clamping force applied by the blocking member 200 to the wafer intersecting with the carrier surface, causing the wafer to be separated from the carrier surface.
[0057] Of course, in other embodiments, the first direction A may intersect with the bearing surface but not be parallel to it.
[0058] In an alternative embodiment, reference Figure 5 As shown, the film transmission device also includes a mobile driving mechanism 600 and a mobile body 700. The mobile body 700 serves as a basic component for installing the bearing member 100, the stopper 200 and the driving member 300. The bearing member 100, the stopper 200 and the driving member 300 are all arranged on the mobile body 700. The mobile driving mechanism 600 is connected to the mobile body 700. The mobile driving mechanism 600 can drive the mobile body 700 to move along the second direction B. The mobile body 700 drives the bearing member 100, the stopper 200 and the driving member 300 to move along the second direction B. The second direction B intersects with the bearing surface. Optionally, the second direction B can be perpendicular to the bearing surface. Optionally, the mobile driving mechanism 600 can be a component that can generate linear displacement, such as a cylinder, an electric cylinder, a slide module, etc.
[0059] By moving the driving mechanism 600 and the moving body 700 , the carrier 100 can drive the wafer to move along the second direction B, thereby realizing the wafer conveying process of the wafer conveying device in the vertical direction.
[0060] In a further optional embodiment, the film transmission device may further include a guide rail extending along the second direction B, and the guide rail cooperates with the movable body 700 to guide in the second direction B, so that the movable body 700 moves along the second direction B accurately.
[0061] In an optional embodiment, if Figure 4As shown, the film transmission device also includes a scanning emission device 810 and a scanning receiving device 820. The scanning emission device 810 and the scanning receiving device 820 can be arranged on the mobile body 700. The scanning emission device 810 and the scanning receiving device 820 can be photoelectric sensors. The scanning emission device 810 is used to emit optical fiber signals, and the scanning receiving device 820 is used to receive optical fiber signals. The optical fiber signals are used to scan the wafers to be transmitted by the film transmission device to ensure that the wafers transmitted by the film transmission device are wafers that meet the requirements. Moreover, the mobile driving mechanism 600 is used to drive the mobile body 700 and its upper components to move along the second direction B, which can drive the scanning emission device 810 and the scanning receiving device 820 to move to the scanning position, so as to facilitate scanning.
[0062] In the embodiment where there are multiple carriers 100, each carrier 100 adopts the structure of a mechanical finger in the prior art, and the mechanical finger can move by its own joints to realize the transfer of wafers. Figure 5 As shown, the film transmission device also includes a first tailstock 910, a second tailstock 920, a support base 930 and an anti-collision bottom plate 940, wherein at least one carrier 100 is connected to the first tailstock 910, and the other carriers 100 are connected to the second tailstock 920, the first tailstock 910 and the second tailstock 920 respectively provide support for different carriers 100, and the first tailstock 910 and the second tailstock 920 are both arranged on the support base 930, and the first tailstock 910 and the second tailstock 920 are connected through the support base 930. 30 is used to support the first tailstock 910 and the second tailstock 920, and then support each carrier 100, and the support base 930 is connected to the mobile body 700. In this way, under the action of the mobile drive mechanism 600, the mobile body 700 drives the support base 930 to move along the second direction B, and at the same time, the support base 930 drives the first tailstock 910 and the second tailstock 920 to move along the second direction B, and the first tailstock 910 and the second tailstock 920 respectively drive the corresponding supported carrier 100 and the wafer to move along the second direction B.
[0063] like Figure 5 As shown, the anti-collision bottom plate 940 is arranged at the bottom of the support base 930 and protrudes from the surface of the support base 930 facing away from the mobile body 700. The anti-collision bottom plate 940 can prevent the support base 930 from being hit, thereby protecting the support base 930.
[0064] Optionally, the first tailstock 910 and the corresponding bearing member, and the second tailstock 920 and the corresponding bearing member can be fixedly connected by bolt connection or the like, and the first tailstock 910 and the supporting base 930, the second tailstock 920 and the supporting base 930, and the supporting base 930 and the moving body 700 can be fixedly connected by welding, bonding or the like.
[0065] Optionally, five carriers 100 may be provided, each of which carries one wafer, one of which is connected to the first tailstock 910 , and the other four carriers are connected to the second tailstock 920 .
[0066] Based on the wafer conveying device disclosed in the present application, the present application also provides a semiconductor process equipment, which includes the above-mentioned wafer conveying device. In this way, the wafer conveying device of the semiconductor process equipment can stably clamp the wafer, and during the wafer conveying process, the wafer is kept stationary relative to the carrier 100, which effectively avoids the displacement of the wafer relative to the carrier 100, thereby avoiding the generation of particles on the wafer due to friction movement, and is not easy to affect the process environment, which is conducive to improving the yield of the wafer.
[0067] Optionally, refer to Figure 6 As shown, the semiconductor process equipment also includes a process tube 950, a wafer boat 960, a lifting device 970 and a wafer transfer box 980, wherein the wafer transfer device is located between the wafer boat 960 and the wafer transfer box 980, and the wafer transfer device can transfer the wafers in the wafer transfer box 980 to the wafer boat 960; the process tube 950 is located above the wafer boat 960, and a process door 951 is provided at the opening of the process tube 950, and the lifting device 970 is connected to the wafer boat 960. Under the driving action of the lifting device 970, the wafer boat 960 can carry the wafers to rise and extend into the process tube 950, and the process door 951 closes the opening, so that the wafers undergo a process in the process tube 950.
[0068] Further optionally, the number of wafer transport boxes 980 is at least two, and each wafer transport box 980 is arranged at intervals in the second direction B. By moving the driving mechanism 600 and the moving body 700, the position of the carrier 100 in the second direction B is changed, so that the wafer transport device can transfer the wafers in different wafer transport boxes 980 to the wafer boat 960.
[0069] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.
Claims
1. A film conveying device used in semiconductor process equipment, characterized in that: The invention comprises a carrier (100), a blocking member (200) and a driving member (300), wherein the carrier (100) is provided with a carrying surface for carrying a wafer, and the carrier (100) is provided with a blocking structure (140), wherein the blocking structure (140) protrudes from the carrying surface, the driving member (300) is connected to the blocking member (200), and the blocking member (200) is opposite to the blocking structure (140), and the driving member (300) can drive the blocking member (200) to move relative to the carrier (100), and the wafer transmission device has a clamping state and a releasing state. When the wafer conveying device is in the clamping state, the blocking member (200) and the blocking structure (140) jointly clamp the wafer carried by the carrying surface; When the wafer transfer device is in the unclamping state, the blocking member (200) and the blocking structure (140) release the wafer carried by the carrying surface.
2. The film transmission device according to claim 1, characterized in that: The film transmission device further comprises a connecting member (400), and the driving member (300) is connected to the blocking member (200) via the connecting member (400).
3. The film transmission device according to claim 2, characterized in that: The blocking member (200) is a roller, and the roller is rotatably disposed on the connecting member (400).
4. The film transmission device according to claim 2, characterized in that: The film transmission device further comprises a position detection element (500), wherein the position detection element (500) is arranged on the carrier (100), and the position detection element (500) is used to detect the position of the blocking element (200). The position detection element (500) is in communication connection with the driving element (300). When the position detection element detects that the blocking member (200) moves to the limit position, the driving member (300) stops working.
5. The film transmission device according to claim 4, characterized in that: The connecting member (400) is a connecting rod, the blocking member (200) is arranged at a first end of the connecting rod, a blocking piece (410) is arranged at a second end of the connecting rod, and the position detection element (500) comprises a transmitter (510) and a receiver (520) which are opposite to each other. When the blocking piece (410) moves between the transmitter (510) and the receiver (520), the driving member (300) stops working.
6. The film transmission device according to claim 5, characterized in that: The driving member (300) can drive the blocking member (200) to move relative to the supporting member (100) along a first direction (A), and the extending direction of the connecting rod is parallel to the first direction (A).
7. The film transmission device according to claim 1, characterized in that: The carrier (100) comprises a carrier body (110), a first carrier portion (120) and a second carrier portion (130); the first carrier portion (120) and the second carrier portion (130) are respectively connected to the carrier body (110), and the first carrier portion (120) and the second carrier portion (130) are arranged at intervals; the blocking structure (140) is provided at one end of the first carrier portion (120) and the second carrier portion (130) away from the carrier body (110); and the blocking member (200) is arranged adjacent to the carrier body (110).
8. The film transmission device according to claim 1, characterized in that: The number of the bearing member (100), the blocking member (200) and the driving member (300) are all multiple, and the bearing member (100), the blocking member (200) and the driving member (300) correspond to each other one by one.
9. The film transmission device according to claim 1, characterized in that: The driving member (300) can drive the blocking member (200) to move relative to the supporting member (100) along a first direction (A), wherein the first direction (A) is parallel to the supporting surface.
10. The film transmission device according to claim 1, characterized in that: The film transmission device also includes a mobile driving mechanism (600) and a mobile body (700), the supporting member (100), the blocking member (200) and the driving member (300) are all arranged on the mobile body (700), the mobile driving mechanism (600) is connected to the mobile body (700), and the mobile driving mechanism (600) can drive the mobile body (700) to move along a second direction (B), and the second direction (B) intersects with the supporting surface.
11. A semiconductor process equipment, characterized in that: The invention comprises a film transmission device as described in any one of claims 1 to 10.