Half silicon wafer transmission device

Abstract

The utility model discloses a half silicon wafer conveying device which comprises a conveying machine body. The flower basket lifting mechanism comprises a flower basket lifting assembly and a flower basket fixing frame, a flower basket placing position is arranged on the flower basket fixing frame, and the flower basket lifting assembly is connected with the flower basket fixing frame; the silicon wafer taking device is located on the conveying machine body, the silicon wafer taking device comprises a silicon wafer taking mechanism and a wafer taking moving mechanism, the silicon wafer taking mechanism comprises a wafer taking fixing plate, the wafer taking moving mechanism is a linear module, the linear module is connected with the wafer taking fixing plate, and the wafer taking moving mechanism is connected with the wafer taking fixing plate. A plurality of sheet taking fixing positions are arranged on the sheet taking fixing plate at intervals, sheet taking fixing hooks are arranged at the two ends of each sheet taking fixing position respectively, and the basket lifting mechanism is located at one end of the sheet taking fixing plate. Movement of the silicon wafer is achieved through the linear module, and compared with belt conveying in the prior art, damage to the surface of the silicon wafer is greatly reduced, and defective battery pieces are avoided.

Description

Technical Field

[0001] The present application relates to the technical field of crystalline silicon solar cells, and in particular to a half-silicon wafer transmission device. Background Art

[0002] In the processing and production of crystalline silicon solar cells, after the solar cell silicon wafers are loaded into the basket jig, the basket with silicon wafers needs to be transported to the designated processing area, and then the silicon wafers are taken out from the basket one by one by a robot, and transported to the designated location by the transmission mechanism. At present, most transmission mechanisms use belt transmission, and the silicon wafers are directly placed on the belt. The belt contacts the surface of the silicon wafer during the transmission process, which will cause damage to the surface of the silicon wafer. Summary of the invention

[0003] The embodiment of the present application provides a half-wafer transmission device to solve the problems existing in the related art. The technical solution is as follows:

[0004] The embodiment of the present application provides a half-wafer transmission device, comprising:

[0005] Transmission body;

[0006] The flower basket lifting mechanism comprises a flower basket lifting assembly and a flower basket fixing frame, the flower basket fixing frame is provided with a flower basket placement position, and the flower basket lifting assembly is connected to the flower basket fixing frame;

[0007] The silicon wafer picking device is located on the transmission body. The silicon wafer picking device includes a silicon wafer picking mechanism and a picking moving mechanism. The silicon wafer picking mechanism includes a picking fixing plate. The picking moving mechanism is a linear module. The linear module is connected to the picking fixing plate. The picking fixing plate has a plurality of intervally arranged picking fixing positions. Both ends of the picking fixing positions are respectively provided with picking fixing hooks. The flower basket lifting mechanism is located at one end of the picking fixing plate.

[0008] In one embodiment, it further includes:

[0009] The silicon wafer transverse movement mechanism is located on the transmission body, the silicon wafer transverse movement mechanism is located at the other end of the silicon wafer fixing plate, and the wafer picking movement mechanism drives the wafer picking fixing plate to move back and forth between the flower basket lifting mechanism and the silicon wafer transverse movement mechanism;

[0010] The silicon wafer stepping mechanism is located on the transmission body, and the silicon wafer transverse movement mechanism is located between the silicon wafer stepping mechanism and the silicon wafer fetching device. The silicon wafer on the silicon wafer fetching device is moved to the silicon wafer stepping mechanism through the silicon wafer transverse movement mechanism.

[0011] In one embodiment, the silicon wafer transverse movement mechanism includes a transverse movement fixing seat, a silicon wafer suction cup and a transverse movement driving assembly. The transverse movement fixing seat is connected to the transverse movement driving assembly, and the silicon wafer suction cup is fixed on the transverse movement fixing seat.

[0012] In one embodiment, the silicon wafer stepping mechanism includes a stepping drive assembly and a stepping moving plate, the stepping drive assembly is connected to the stepping moving plate, and a plurality of laterally arranged silicon wafer fixing positions are provided on the stepping moving plate.

[0013] In one embodiment, it further includes:

[0014] The silicon wafer lifting device is located on the transmission body, and the silicon wafer lifting device includes a first lifting mechanism and a second lifting mechanism. The silicon wafer picking device is located in the middle of the first lifting mechanism, and the first lifting mechanism is lifted and lowered relative to the silicon wafer picking device. The silicon wafer stepping mechanism is located in the middle of the second lifting mechanism, and the second lifting mechanism is lifted and lowered relative to the silicon wafer stepping mechanism.

[0015] In one embodiment, the first lifting mechanism and the second lifting mechanism both include a lifting fixed frame, a lifting frame and a lifting drive assembly, the lifting drive assembly is connected to the lifting frame, and the lifting drive assembly is rotatably connected to the lifting fixed frame.

[0016] In one embodiment, the lifting drive assembly includes a lifting drive motor and a cam, the cam has a rotating shaft, the lifting drive motor is connected to the rotating shaft, the cam is connected to the lifting frame, and the rotating shaft is rotatably connected to the lifting fixed frame.

[0017] In one embodiment, a slider is fixed on the lifting and fixing frame, a slide rail is fixed on the lifting frame, and the slider is slidably connected to the slide rail.

[0018] In one embodiment, it further includes:

[0019] The cache mechanism is located between the silicon wafer taking mechanism and the silicon wafer stepping mechanism. The cache mechanism includes a cache fixing frame, a cache moving component and a cache bracket. The cache fixing frame is fixed on the transmission body, the cache moving component is fixed on the cache fixing frame, the cache bracket is connected to the cache moving component, the cache bracket has multiple cache positions, and the silicon wafer transverse movement mechanism passes through the middle of the cache bracket.

[0020] In one embodiment, it further includes:

[0021] The silicon wafer alignment mechanism is located on one side of the flower basket lifting mechanism. The silicon wafer alignment mechanism includes an alignment driving member and an alignment driving plate. The alignment driving member is connected to the alignment driving plate. The silicon wafer alignment mechanism aligns the silicon wafers on the flower basket lifting mechanism through the alignment driving plate.

[0022] The advantages or beneficial effects of the above technical solution include at least:

[0023] The half-wafer transmission device of the embodiment of the present application includes a flower basket lifting mechanism and a silicon wafer taking device, the silicon wafer taking device includes a silicon wafer taking mechanism and a taking moving mechanism, and the silicon wafer taking mechanism includes a linear module. When the half-wafer transmission device is in use, the flower basket containing the silicon wafers is first transported to the flower basket lifting mechanism, and then the flower basket lifting mechanism drives the silicon wafers to move to a predetermined position, and then the silicon wafer taking mechanism removes the silicon wafers in the flower basket through the taking fixed hook, and finally the linear module drives the silicon wafers to move. The present application realizes the movement of silicon wafers through a linear module, which greatly reduces the damage to the surface of the silicon wafer compared to the belt conveyor of the prior art, and avoids the occurrence of defective battery cells.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0026] Figure 1 It is a structural schematic diagram of a half-wafer transmission device;

[0027] Figure 2 is another structural schematic diagram of a half-wafer transmission device;

[0028] Figure 3 This is a schematic diagram of the half-wafer transfer device without the basket lifting mechanism;

[0029] Figure 4 is a structural schematic diagram of the first lifting mechanism or the second lifting mechanism;

[0030] Figure 5 is another structural schematic diagram of the first lifting mechanism or the second lifting mechanism;

[0031] Description of reference numerals:

[0032] 1. Transmission body; 2. Flower basket lifting mechanism; 21. Flower basket lifting assembly; 22. Flower basket fixing frame; 23. Flower basket conveying assembly; 3. Silicon wafer fetching device; 31. Silicon wafer fetching mechanism; 32. Fetching moving mechanism; 311. Fetching fixing plate; 312. Fetching fixing hook; 4. Silicon wafer alignment mechanism; 41. Alignment drive member; 42. Alignment drive plate; 5. Silicon wafer lateral movement mechanism; 6. Silicon wafer stepping mechanism; 61. Stepping drive assembly; 62. Stepping moving plate; 5 1. Transverse movement fixing seat; 52. Silicon wafer suction cup; 53. Transverse movement driving assembly; 7. Silicon wafer lifting device; 71. First lifting mechanism; 72. Second lifting mechanism; 711. Lifting fixing frame; 712. Lifting frame; 713. Lifting driving assembly; 7131. Lifting driving motor; 7132. Cam; 7133. Rotating shaft; 73. Slider; 74. Slide rail; 8. Cache mechanism; 81. Cache fixing frame; 82. Cache moving assembly; 83. Cache bracket. DETAILED DESCRIPTION

[0033] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0034] like Figures 1 to 5 As shown, an embodiment of the present application provides a half-wafer transmission device, comprising: a transmission body 1; a flower basket lifting mechanism 2, comprising a flower basket lifting assembly 21 and a flower basket fixing frame 22, the flower basket fixing frame 22 having a flower basket placement position, and the flower basket lifting assembly 21 is connected to the flower basket fixing frame 22; a silicon wafer picking device 3, located on the transmission body 1, the silicon wafer picking device 3 comprises a silicon wafer picking mechanism 31 and a picking moving mechanism 32, the silicon wafer picking mechanism 31 comprises a picking fixing plate 311, the picking moving mechanism 32 is a linear module, the linear module is connected to the picking fixing plate 311, the picking fixing plate 311 has a plurality of intervally arranged picking fixing positions, and both ends of the picking fixing positions are respectively provided with picking fixing hooks 312, and the flower basket lifting mechanism 2 is located at one end of the picking fixing plate 311.

[0035] When the half-wafer transmission device is in use, the basket containing the silicon wafers is first transported to the basket lifting mechanism 2, and then the basket lifting mechanism 2 drives the silicon wafers to move to a predetermined position, and then the silicon wafer taking mechanism 31 takes the silicon wafers out of the basket through the taking fixed hook 312, and finally the linear module drives the silicon wafers to move. The present application realizes the movement of the silicon wafers through the linear module, which greatly reduces the damage to the surface of the silicon wafers compared to the belt conveyor of the prior art, and avoids the occurrence of defective battery cells.

[0036] In order to realize the loading of silicon wafers, in one embodiment, the flower basket lifting assembly 21 can be an existing linear module, and the flower basket fixing frame 22 is driven to move upward or downward by the linear module. The flower basket containing silicon wafers can be placed on the flower basket placement position of the flower basket fixing frame 22, and then the flower basket lifting assembly 21 drives the silicon wafers to move to the wafer taking position. One side of the flower basket fixing frame 22 is an open surface, and the silicon wafers in the flower basket can be taken out from the open surface. After the silicon wafers in the flower basket are taken out, the empty flower basket can also be directly transported out. In order to realize the transportation of the flower basket, a flower basket conveying assembly 23 can be provided on the flower basket fixing frame 22, and the conveying method of the flower basket conveying assembly 23 is to use an existing motor and a conveyor belt for transportation.

[0037] Before taking the silicon wafer, it is necessary to align the silicon wafer placed on the opening surface so that the silicon wafer taking device 3 can take the silicon wafer normally. In order to achieve the alignment of the silicon wafer, the half-wafer transmission device also includes a silicon wafer alignment mechanism 4. The silicon wafer alignment mechanism 4 is located on one side of the flower basket lifting mechanism 2. The silicon wafer alignment mechanism 4 includes an alignment drive member 41 and an alignment drive plate 42. The alignment drive member 41 is connected to the alignment drive plate 42. The silicon wafer alignment mechanism 4 aligns one end of the silicon wafer on the flower basket lifting mechanism 2 through the alignment drive plate 42. Preferably, the alignment drive member 41 is a driving cylinder. The alignment drive member 41 drives the alignment drive plate 42 to move, and the silicon wafers on the flower basket are aligned through the alignment drive plate 42.

[0038] After the silicon wafer alignment mechanism 4 has aligned the silicon wafers, the flower basket lifting mechanism 2 drives the silicon wafers at the bottom of the flower basket to move downward to the silicon wafer taking position, and then the silicon wafer taking mechanism 31 takes out the silicon wafers on the flower basket. When taking out the silicon wafers, the taking-out moving mechanism 32 moves the taking-out fixed position at one end of the silicon wafer taking mechanism 31 to the bottom of the flower basket, so that the silicon wafers under the flower basket are located between the multiple taking-out fixed hooks 312. Then, the taking-out moving mechanism 32 drives the silicon wafer taking-out moving mechanism 32 to move forward away from the flower basket lifting mechanism 2, and when the silicon wafer taking mechanism 31 moves, the silicon wafers at the bottom of the flower basket are taken out and taken away by the taking-out fixed hooks 312.

[0039] After the silicon wafer taking device 3 takes away the silicon wafer, the silicon wafer is further conveyed forward. In order to realize the conveying of silicon wafers, the half-wafer transmission device of this embodiment also includes a silicon wafer transverse movement mechanism 5 and a silicon wafer stepping mechanism 6. The silicon wafer transverse movement mechanism 5 and the silicon wafer stepping mechanism 6 are both located on the transmission body 1, and the silicon wafer transverse movement mechanism 5 is located between the silicon wafer stepping mechanism 6 and the silicon wafer taking device 3, and the silicon wafer on the silicon wafer taking device 3 is moved to the silicon wafer stepping mechanism 6 through the silicon wafer transverse movement mechanism 5. The wafer taking moving mechanism 32 drives the wafer taking fixing plate 311 to move back and forth between the flower basket lifting mechanism 2 and the silicon wafer transverse movement mechanism 5, and the silicon wafer transverse movement mechanism 5 moves back and forth between the silicon wafer stepping mechanism 6 and the silicon wafer taking device 3.

[0040] The silicon wafer transverse movement mechanism 5 comprises a transverse movement fixing seat 51, a silicon wafer suction cup 52 and a transverse movement driving assembly 53. The transverse movement fixing seat 51 is connected to the transverse movement driving assembly 53, and the silicon wafer suction cup 52 is fixed on the transverse movement fixing seat 51. Preferably, the transverse movement driving assembly 53 can also be a linear module.

[0041] When the silicon wafer on the silicon wafer picking device 3 is transferred to the silicon wafer stepping mechanism 6 , the transverse driving component 53 drives the silicon wafer suction cup 52 to suck the silicon wafer on the silicon wafer picking device 3 , and then the transverse driving component 53 drives the silicon wafer to move to the silicon wafer stepping mechanism 6 .

[0042] After the silicon wafer moves to the silicon wafer stepping mechanism 6, the silicon wafer is driven by the silicon wafer stepping mechanism 6 to continue to move forward. The silicon wafer stepping mechanism 6 includes a stepping drive component 61 and a stepping moving plate 62, wherein the stepping drive component 61 is connected to the stepping moving plate 62, and the stepping moving plate 62 is provided with a plurality of laterally arranged silicon wafer fixing positions. Preferably, the stepping drive component 61 is also a linear module, and the linear module is driven by a servo motor. A plurality of fixing hooks may also be provided at both ends of the silicon wafer fixing position, and the silicon wafer is fixed by the fixing hooks, and then the silicon wafer thereon is driven to move when the silicon wafer drive component 61 drives the stepping moving plate 62 to move.

[0043] In order to realize the transportation of silicon wafers between the silicon wafer taking device 3 , the silicon wafer lateral movement mechanism 5 and the silicon wafer stepping mechanism 6 , the half-wafer transmission device of the present embodiment further includes a silicon wafer lifting device 7 .

[0044] Specifically, the wafer lifting device 7 is located on the transmission body 1, and the wafer lifting device 7 includes a first lifting mechanism 71 and a second lifting mechanism 72. The wafer pick-up device 3 is located in the middle of the first lifting mechanism 71, and the first lifting mechanism 71 is lifted relative to the wafer pick-up device 3. The wafer stepping mechanism 6 is located in the middle of the second lifting mechanism 72, and the second lifting mechanism 72 is lifted relative to the wafer stepping mechanism 6.

[0045] In one embodiment, the first lifting mechanism 71 and the second lifting mechanism 72 have the same structure. Both the first lifting mechanism 71 and the second lifting mechanism 72 include a lifting fixed frame 711, a lifting frame 712 and a lifting drive assembly 713. The lifting drive assembly 713 is connected to the lifting frame 712, and the lifting fixed frame 711 is rotatably connected to the lifting drive assembly 713. The lifting drive assembly 713 includes a lifting drive motor 7131 and a cam 7132. The lifting drive motor 7131 is connected to the cam 7132, and the lifting drive motor 7131 drives the cam 7132 to rotate. The cam 7132 is connected to the lifting frame 712, and the cam 7132 drives the lifting frame 712 to rise and fall when rotating. The cam 7132 is connected to a rotating shaft 7133, and the lifting drive motor 7131 can be connected to the rotating shaft 7133, thereby driving the cam 7132 to rotate, and one end of the rotating shaft 7133 is rotatably connected to the lifting fixed frame 711. A slider 73 is fixed on the lifting and fixing frame 711 , a slide rail 74 is fixed on the lifting and fixing frame 712 , and the slider 73 is slidably connected to the slide rail 74 .

[0046] The half-wafer transmission device of this embodiment further includes a buffer mechanism 8, which is located between the wafer fetching mechanism 31 and the wafer stepping mechanism 6. The buffer mechanism 8 includes a buffer fixing frame 81, a buffer moving component 82 and a buffer bracket 83. The buffer fixing frame 81 is fixed on the transmission body 1, the buffer moving component 82 is fixed on the buffer fixing frame 81, the buffer bracket 83 is connected to the buffer moving component 82, the buffer bracket 83 has a plurality of buffer positions, and the wafer transverse movement mechanism 5 passes through the middle of the buffer bracket 83. Preferably, the buffer moving component 82 is also a linear module.

[0047] The working process of the half-wafer transfer device of this embodiment is as follows:

[0048] First, the flower basket containing silicon wafers is transported to the flower basket lifting mechanism 2 by external equipment, and then the flower basket lifting mechanism 2 drives the silicon wafers to move upward to one side of the silicon wafer straightening mechanism 4, and the straightening driving member 41 of the silicon wafer straightening mechanism 4 drives the straightening driving plate 42 to move, and the silicon wafers are straightened by the straightening driving plate 42.

[0049] Then, the flower basket lifting mechanism 2 drives the silicon wafer to move downward, so that the silicon wafer at the bottom of the flower basket is located at the silicon wafer taking position. Then, the taking-up moving mechanism 32 drives the silicon wafer taking mechanism 31 to move toward the bottom of the flower basket, and the taking-up fixed position at the end of the silicon wafer taking mechanism 31 is located directly below the silicon wafer, so that the silicon wafer is located between the multiple taking-up fixed hooks 312. Then, the flower basket lifting mechanism 2 drives the silicon wafer to move downward 5.44 mm, and the taking-up moving mechanism 32 drives the silicon wafer taking mechanism 31 to move toward the front away from the flower basket, and the silicon wafer at the bottom of the flower basket is taken away by the taking-up fixed hooks 312.

[0050] In the process of the wafer taking mechanism 32 driving the wafer taking mechanism 31 to move toward the bottom of the flower basket, the wafer taking mechanism 31 moves 280 mm, the wafer lateral movement mechanism 5 moves 561 mm toward the direction close to the flower basket, and the wafer stepping mechanism 6 moves 216 mm toward the direction close to the flower basket. The wafer taking mechanism 31, the wafer lateral movement mechanism 5, and the wafer stepping mechanism 6 move simultaneously. When the wafer taking mechanism 31 and the wafer stepping mechanism 6 move toward the direction close to the flower basket lifting mechanism 2, the cams 7132 of the first lifting mechanism 71 and the second lifting mechanism 72 are both at the highest position, and the height of the lifting frame 712 is higher than the wafer taking mechanism 31 and the wafer stepping mechanism 6. When the wafer taking mechanism 32 drives the wafer taking mechanism 31 to move away from the flower basket, the cams 7132 of the first lifting mechanism 71 and the second lifting mechanism 72 are at the lowest position, and the height of the lifting frame 712 is lower than the wafer taking mechanism 31 and the wafer stepping mechanism 6.

[0051] Similarly, when the silicon wafer taking mechanism 31 moves away from the flower basket, the silicon wafer transverse movement mechanism 5 and the silicon wafer stepping mechanism 6 also move away from the flower basket, wherein the silicon wafer taking mechanism 31 moves a distance of 280 mm, the silicon wafer transverse movement mechanism 5 moves a distance of 561 mm, and the silicon wafer stepping mechanism 6 moves a distance of 216 mm.

[0052] After the silicon wafer taking mechanism 31 takes the silicon wafer out of the flower basket and moves forward once, the lifting drive motor 7131 of the first lifting mechanism 71 and the second lifting mechanism 72 drives the cam 7132 to move to the highest position of the cam 7132, so that the lifting frame 712 moves upward, and drives the silicon wafer taking mechanism 31 or the silicon wafer stepping mechanism 6 to move upward during the upward movement of the lifting frame 712. After the silicon wafer taking mechanism 31 and the silicon wafer stepping mechanism 6 move backward once, the lifting drive motor 7131 of the first lifting mechanism 71 and the second lifting mechanism 72 drives the cam 7132 to move to the lowest position of the cam 7132, so that the lifting frame 712 moves downward, and the silicon wafer on the lifting frame 712 falls into the silicon wafer taking mechanism 31 or the silicon wafer stepping mechanism 6. After the silicon wafer taking mechanism 31 and the silicon wafer stepping mechanism 6 move forward again, the silicon wafer is driven to move forward once again. In the process of the reciprocating movement of the silicon wafer taking mechanism 31 and the silicon wafer stepping mechanism 6, the silicon wafer moves forward.

[0053] When the silicon wafer moves to the silicon wafer taking mechanism 31 and is close to the silicon wafer stepping mechanism 6, the silicon wafer is at the last station of the silicon wafer taking mechanism 31, and the silicon wafer lateral movement mechanism 5 takes the silicon wafer off the silicon wafer taking mechanism 31 and moves it to the silicon wafer stepping mechanism 6. The silicon wafer on the silicon wafer stepping mechanism 6 is sucked and transferred out by an external silicon wafer suction cup.

[0054] When the silicon wafer stepping mechanism 6 stops working, the cache moving component 82 drives the cache bracket 83 to move downward, and the uppermost cache position of the cache bracket 83 corresponds to the position of the silicon wafer transverse movement mechanism 5, and the silicon wafer on the silicon wafer fetching mechanism 31 is moved to the cache position by the silicon wafer transverse movement mechanism 5. Then the cache moving component 82 drives the cache bracket 83 to move upward, so that the second cache position at the top corresponds to the position of the silicon wafer transverse movement mechanism 5, and then the silicon wafer is cached in the cache position, and so on, until the silicon wafer on the silicon wafer fetching mechanism 31 is cached.

[0055] When the silicon wafer moves from the last station of the silicon wafer taking mechanism 31 to the silicon wafer stepping mechanism 6, the displacement of the silicon wafer is 561 mm. When the silicon wafer moves from the last station of the silicon wafer taking mechanism 31 to the buffer mechanism 8, the displacement of the silicon wafer is 280 mm.

[0056] In this embodiment, a micrometer head 9 is further provided at one end of the silicon wafer traverse mechanism 5 close to the silicon wafer fetching mechanism 31. In this embodiment, there are two silicon wafer fetching mechanism 31, fetching movement mechanism 32, silicon wafer alignment mechanism 4, silicon wafer traverse mechanism 5, silicon wafer stepping mechanism 6 and silicon wafer buffer mechanism 8.

[0057] The spacing between adjacent silicon wafer taking-up fixing positions of the silicon wafer taking-up mechanism 31 is 70 mm, and the spacing between adjacent silicon wafer fixing positions of the silicon wafer stepping mechanism 6 is 6 mm.

[0058] The half-wafer transmission device of the present embodiment automatically realizes the retrieval and transmission of silicon wafers, has a high degree of automation, and improves work efficiency. Since the silicon wafer does not need to contact the belt, the defect rate is reduced.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0060] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0061] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A half-wafer transfer device, characterized in that: include: Transmission body; The flower basket lifting mechanism comprises a flower basket lifting assembly and a flower basket fixing frame, the flower basket fixing frame is provided with a flower basket placement position, and the flower basket lifting assembly is connected to the flower basket fixing frame; The silicon wafer picking device is located on the transmission body. The silicon wafer picking device includes a silicon wafer picking mechanism and a picking moving mechanism. The silicon wafer picking mechanism includes a picking fixing plate. The picking moving mechanism is a linear module. The linear module is connected to the picking fixing plate. The picking fixing plate has a plurality of intervally arranged picking fixing positions. Both ends of the picking fixing positions are respectively provided with picking fixing hooks. The flower basket lifting mechanism is located at one end of the picking fixing plate.

2. The half-wafer transfer device according to claim 1, characterized in that: Also includes: The silicon wafer transverse movement mechanism is located on the transmission body, the silicon wafer transverse movement mechanism is located at the other end of the silicon wafer fixing plate, and the wafer picking movement mechanism drives the wafer picking fixing plate to move back and forth between the flower basket lifting mechanism and the silicon wafer transverse movement mechanism; The silicon wafer stepping mechanism is located on the transmission body, and the silicon wafer transverse movement mechanism is located between the silicon wafer stepping mechanism and the silicon wafer fetching device. The silicon wafer on the silicon wafer fetching device is moved to the silicon wafer stepping mechanism through the silicon wafer transverse movement mechanism.

3. The half-wafer transfer device according to claim 2, characterized in that: The silicon wafer transverse movement mechanism comprises a transverse movement fixing seat, a silicon wafer suction cup and a transverse movement driving assembly. The transverse movement fixing seat is connected to the transverse movement driving assembly, and the silicon wafer suction cup is fixed on the transverse movement fixing seat.

4. The half-wafer transfer device according to claim 2, characterized in that: The silicon wafer stepping mechanism comprises a stepping driving assembly and a stepping moving plate, wherein the stepping driving assembly is connected to the stepping moving plate, and a plurality of silicon wafer fixing positions arranged transversely are arranged on the stepping moving plate.

5. The half-wafer transfer device according to claim 2, characterized in that: Also includes: The silicon wafer lifting device is located on the transmission body, and the silicon wafer lifting device includes a first lifting mechanism and a second lifting mechanism. The silicon wafer picking device is located in the middle of the first lifting mechanism, and the first lifting mechanism is lifted and lowered relative to the silicon wafer picking device. The silicon wafer stepping mechanism is located in the middle of the second lifting mechanism, and the second lifting mechanism is lifted and lowered relative to the silicon wafer stepping mechanism.

6. The half-wafer transfer device according to claim 5, characterized in that: The first lifting mechanism and the second lifting mechanism both include a lifting fixed frame, a lifting frame and a lifting drive assembly, the lifting drive assembly is connected to the lifting frame, and the lifting drive assembly is rotatably connected to the lifting fixed frame.

7. The half-wafer transfer device according to claim 6, characterized in that: The lifting drive assembly includes a lifting drive motor and a cam, the cam is provided with a rotating shaft, the lifting drive motor is connected to the rotating shaft, the cam is connected to the lifting frame, and the rotating shaft is rotatably connected to the lifting fixed frame.

8. The half-wafer transfer device according to claim 6, characterized in that: A slider is fixed on the lifting and fixing frame, a slide rail is fixed on the lifting frame, and the slider is slidably connected to the slide rail.

9. The half-wafer transfer device according to any one of claims 2 to 8, characterized in that: Also includes: The cache mechanism is located between the silicon wafer taking mechanism and the stepping and lateral movement mechanism. The cache mechanism includes a cache fixing frame, a cache moving component and a cache bracket. The cache fixing frame is fixed on the transmission body, the cache moving component is fixed on the cache fixing frame, the cache bracket is connected to the cache moving component, the cache bracket has multiple cache positions, and the silicon wafer lateral movement mechanism passes through the middle of the cache bracket.

10. The half-wafer transfer device according to any one of claims 1 to 8, characterized in that: Also includes: The silicon wafer alignment mechanism is located on one side of the flower basket lifting mechanism. The silicon wafer alignment mechanism includes an alignment driving member and an alignment driving plate. The alignment driving member is connected to the alignment driving plate. The silicon wafer alignment mechanism aligns the silicon wafers on the flower basket lifting mechanism through the alignment driving plate.

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