Pressure maintaining assembly for copper foil patch processing in electronic assembly

Abstract

A pressure maintaining assembly used for copper foil patch processing in electronic assembly comprises a plurality of pressure maintaining structures used for placing copper foil patch PCB products, each pressure maintaining structure comprises an X-direction adjusting carrier, a U-direction adjusting carrier and a Y-direction adjusting carrier, the adjusting carriers are stacked in the vertical direction, and the X-direction adjusting carrier, the U-direction adjusting carrier and the Y-direction adjusting carrier are stacked in the vertical direction. A supporting space used for containing a plurality of pressure maintaining heads is formed between every two adjacent adjusting carriers, and the section contour of each supporting space is matched with the section contour of the copper foil patch PCB product to be subjected to pressure maintaining. According to the scheme, multiple pressure maintaining heads can be contained, space is saved, multiple products can be subjected to pressure maintaining at a time through the multiple arranged pressure maintaining heads, the working efficiency is improved, the pressure maintaining structure can adjust the stroke and angle of the pressure maintaining assembly from different directions, it is ensured that the relative angle of the pressure maintaining heads and the pressure maintaining faces of the copper foil patch PCB products is zero in deviation, and the product quality is improved. Therefore, the pressure maintaining head continuously outputs stable pressure to the copper foil patch PCB product, uniform stress in the pressure maintaining area is realized, and the solid molding effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure-maintaining components, in particular to a pressure-maintaining component used for copper foil patch processing in electronic assembly. Background Art

[0002] At present, electronic equipment usually needs to be pressure-maintained by a pressure-maintaining component during or after assembly, so as to improve the connection tightness of the bonding structure or the clamping structure in the electronic assembly.

[0003] Among them, copper foil patch is a common structure used for PCB heat dissipation, and has good shielding and dustproof effects on electromagnetic interference. The advantages of copper foil patch are its flexibility and high thermal conductivity, which also meet the conditions for us to shape it. If you want to shape the product, you must have the conditions to fix the shape after shaping, so attaching copper foil patch has become one of our common methods for fixing and shaping PCB. After the copper foil patch is attached, in order to ensure its stability on the PCB, it needs to be pressed and held for a certain period of time.

[0004] However, when pressing and holding PCB products with copper foil patches, usually only one piece is pressed and held at a time, which wastes a lot of time. In order to ensure production efficiency, it is necessary to study the pressure holding technology for multiple PCB products with copper foil patches at the same time. The existing multi-piece pressure holding technology often has the problem of uneven force, which affects the solid plastic effect.

[0005] Therefore, how to solve the deficiencies in the above-mentioned prior art and continuously improve the technology of multi-piece pressure holding has become the subject to be studied and solved by the present utility model. Summary of the invention

[0006] The utility model aims to provide a pressure-maintaining component for copper foil patch processing in electronic assembly.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a pressure-holding component for copper foil patch processing in electronic assembly, the pressure-holding component includes several pressure-holding structures for placing copper foil patch PCB products, and the pressure-holding structures are stacked in the vertical direction and generate limiting pressure on the copper foil patch PCB products.

[0008] Among them, the pressure-maintaining structure includes an X-direction adjustment carrier, a U-direction adjustment carrier and a Y-direction adjustment carrier, each adjustment carrier is stacked in the vertical direction, and there is a support space for accommodating several pressure-maintaining heads between two adjacent adjustment carriers, and the cross-sectional profile of the support space matches the cross-sectional profile of the copper foil patch PCB product to be pressurized.

[0009] In the above scheme, multiple carriers are stacked to stably accommodate several pressure-maintaining heads so that multiple products can be pressurized at one time, which generates all-round pressure on the copper foil patch PCB products to be pressed, and the force-bearing area is more uniform, which can better maintain the pressure of the copper foil patch PCB products and improve the solid plastic effect.

[0010] A further technical solution is that the X-direction adjustment carrier is provided with a first U-shaped groove, a second U-shaped groove, an X-direction through-port and a horizontal key groove, the first U-shaped groove is fixedly arranged at the right end of the X-direction adjustment carrier, the second U-shaped groove is fixedly arranged at the left end of the X-direction adjustment carrier, the lateral width of the first U-shaped groove is greater than the lateral width of the second U-shaped groove, the X-direction through-port passes through the center position of the X-direction adjustment carrier, and horizontal key grooves are provided on the four corners of the X-direction adjustment carrier.

[0011] A further technical solution is that the left and right ends of the U-direction adjustment carrier are respectively fixed with a first convex wing and a second convex wing; the first convex wing is provided with a first arc key groove, and a first guide arc key groove is also provided on the inner side of the first arc key groove; the second convex wing is provided with a second arc key groove, and a second guide arc key groove is also provided on the inner side of the second arc key groove; the center position of the U-direction adjustment carrier is connected with a U-direction through opening; the upper and lower end surfaces of the first convex wing are both provided with a longitudinal flat key groove 1, and the upper and lower end surfaces of the second convex wing are both provided with a longitudinal flat key groove 2; and assembly holes are provided on the four corners of the U-direction adjustment carrier.

[0012] Specifically, the first arc key groove, the first guide arc key groove and the second arc key groove, the second guide arc key groove are symmetrically arranged with respect to the center line of the U-direction adjustment carrier in the up-down direction as a reference.

[0013] Specifically, the first longitudinal keyway and the second longitudinal keyway are symmetrically arranged with the center line of the U-direction adjustment carrier in the up-down direction as a reference.

[0014] A further technical solution is that the Y-direction adjustment carrier is provided with a threaded hole band one, a threaded hole band two, a Y-direction through hole, a first guide hole, a second guide hole and a vertical keyway three; the threaded hole band one and the threaded hole band two are symmetrically arranged on the left and right end surfaces of the Y-direction adjustment carrier; the Y-direction through hole passes through the center position of the Y-direction adjustment carrier; the first guide hole is located on the inner side of the threaded hole band one, and the first guide hole passes through the Y-direction adjustment carrier; the second guide hole is located on the inner side of the threaded hole band two, and the second guide hole passes through the Y-direction adjustment carrier; vertical keyways three are provided on the four corners of the Y-direction adjustment carrier.

[0015] Specifically, the threaded hole band 1 and the threaded hole band 2 both have a plurality of threaded holes arranged in an arc shape, the threaded hole band 1 and the first arc key groove are stacked and fitted in the vertical direction, and the threaded hole band 2 and the second arc key groove are stacked and fitted in the vertical direction.

[0016] Specifically, the first guide hole and the first guide type arc key groove are stacked and fitted in the vertical direction; the second guide hole and the second guide type arc key groove are stacked and fitted in the vertical direction.

[0017] The working principle and advantages of this utility model are as follows:

[0018] On the one hand, the present invention can be provided with several stacked pressure-maintaining structures, which can accommodate multiple pressure-maintaining heads, save space, and facilitate the pressure-maintaining of multiple copper foil patch PCB products at one time through the arrangement of multiple pressure-maintaining heads, thereby improving work efficiency.

[0019] On the other hand, the pressure-holding structure of this case is composed of a stack of X-direction adjustment carriers, U-direction adjustment carriers and Y-direction adjustment carriers, which can adjust the stroke and angle of the pressure-holding component from different directions to ensure that the relative angle between the pressure-holding head and the pressure-holding surface of the copper foil patch PCB product has zero deviation, making the two completely parallel, so that the pressure-holding head can continuously output stable pressure to the copper foil patch PCB product, achieve uniform force in the pressure-holding area, and thus improve the solid plastic effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Attached Figure 1 This is a schematic diagram of the structure of the pressure-maintaining assembly in the embodiment of the utility model;

[0021] Attached Figure 2 This is a schematic structural diagram of the pressure-maintaining structure in an embodiment of the utility model;

[0022] Attached Figure 3 This is a schematic diagram of the three-dimensional structure of the X-direction adjustment carrier in the embodiment of the utility model;

[0023] Attached Figure 4 This is a schematic diagram of the structure of the X-direction adjustment carrier in the embodiment of the utility model;

[0024] Attached Figure 5 This is a schematic diagram of the three-dimensional structure of the U-direction adjustment carrier in the embodiment of the utility model;

[0025] Attached Figure 6 This is a schematic diagram of the structure of the U-direction adjustment carrier in the embodiment of the utility model;

[0026] Attached Figure 7 This is a schematic diagram of the three-dimensional structure of the Y-direction adjustment carrier in the embodiment of the utility model;

[0027] Attached Figure 8This is a schematic diagram of the structure of the Y-direction adjustment carrier in the embodiment of the utility model;

[0028] Attached Fig. 9 This is a schematic diagram of the state of the copper foil patch PCB product performing the pressure maintaining operation in the embodiment of the utility model.

[0029] In the above figures: 1. Pressure-maintaining structure; 2. X-direction adjustment carrier; 21. First U-shaped groove; 22. Second U-shaped groove; 23. X-direction opening; 24. Horizontal flat keyway; 3. U-direction adjustment carrier; 31. First convex wing; 32. Second convex wing; 33. First arc keyway; 34. Second arc keyway; 35. First guide arc keyway; 36. Second guide arc keyway; 37. U-direction opening; 38. Vertical flat keyway 1; 39. Vertical flat keyway 2; 310. Assembly hole; 4. Y-direction adjustment carrier; 41. Threaded hole belt 1; 42. Threaded hole belt 2; 43. Y-direction opening; 44. First guide hole; 45. Second guide hole; 46. Vertical flat keyway 3; 5. Pressure-maintaining head; 6. Copper foil patch PCB product. DETAILED DESCRIPTION

[0030] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0031] Embodiment: The present invention will be clearly described below with diagrams and detailed descriptions. After understanding the embodiments of the present invention, any person skilled in the art can make changes and modifications based on the techniques taught by the present invention without departing from the spirit and scope of the present invention.

[0032] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0033] The terms “first”, “second”, etc. used in this document do not specifically refer to an order or sequence, nor are they used to limit the present case. They are only used to distinguish components or operations described with the same technical terms.

[0034] As used herein, “connected” or “positioned” may refer to two or more components or devices being in direct physical contact with each other, or being in indirect physical contact with each other, or may refer to two or more components or devices operating or moving with each other.

[0035] The terms “include,” “including,” “have,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0036] The terms used in this document generally have the ordinary meaning of each term used in this field, in the context of the case and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present invention.

[0037] The terms "upper", "lower", "left", "right", etc. used in this article are all directional terms. In this case, they are only used to illustrate the positional relationship between the various structures, and are not used to limit the specific direction of the protection plan of this case and its actual implementation.

[0038] See attached Figure 1-2 and Fig. 9 As shown, the utility model is a pressure-holding component for copper foil patch processing in electronic assembly, and the pressure-holding component includes several pressure-holding structures 1 for placing copper foil patch PCB products 6, and the pressure-holding structures 1 are stacked in the vertical direction and generate limiting pressure on the copper foil patch PCB products 6.

[0039] Among them, the pressure holding structure 1 includes an X-direction adjustment carrier 2, a U-direction adjustment carrier 3 and a Y-direction adjustment carrier 4, each adjustment carrier is stacked in the vertical direction, and there is a support space for accommodating several pressure holding heads 5 between two adjacent adjustment carriers, and the cross-sectional profile of the support space matches the cross-sectional profile of the copper foil patch PCB product 6 to be pressurized.

[0040] In order to facilitate the maintenance or repair of each adjustment carrier, each adjustment carrier can be detachably mounted on each other through a connector. For example, the X-direction adjustment carrier 2 and the U-direction adjustment carrier 3, and the U-direction adjustment carrier 3 and the Y-direction adjustment carrier 4 can be fixedly connected by screw connection, clamping connection, plug-in connection, or sleeve connection.

[0041] See attached Figure 3-4 As shown, the X-direction adjustment carrier 2 is provided with a first U-shaped groove 21, a second U-shaped groove 22, an X-direction opening 23 and a horizontal key groove 24. The first U-shaped groove 21 is fixedly arranged at the right end of the X-direction adjustment carrier 2, the second U-shaped groove 22 is fixedly arranged at the left end of the X-direction adjustment carrier 2, the X-direction opening 23 passes through the center position of the X-direction adjustment carrier 2, and horizontal key grooves 24 are arranged on the four corners of the X-direction adjustment carrier 2. The X-direction adjustment carrier 2 can adjust the stroke of the pressure-maintaining structure 1 to ±2.5mm, so as to adjust each copper foil patch PCB product 6 in the X direction.

[0042] Furthermore, the lateral width of the first U-shaped groove 21 is greater than the lateral width of the second U-shaped groove 22, and can be assembled and used with base molds or mounting mechanisms of different sizes; moreover, the first U-shaped groove 21 and the second U-shaped groove 22 serve as a transition and connection of the plane shape, which is more suitable for the edge processing of the X-direction adjustment carrier 2, and effectively prevents the accessories from being scratched or accidentally squeezed and deformed during the construction process.

[0043] See attached Figure 5-6 As shown, the left and right ends of the U-direction adjustment carrier 3 are respectively fixed with a first convex wing 31 and a second convex wing 32; the first convex wing 31 is provided with a first arc key groove 33, and a first guide arc key groove 35 is also provided on the inner side of the first arc key groove 33; the second convex wing 32 is provided with a second arc key groove 34, and a second guide arc key groove 36 is also provided on the inner side of the second arc key groove 34; the center position of the U-direction adjustment carrier 3 is connected through a U-direction opening 37; the upper and lower end surfaces of the first convex wing 31 are both distributed with a vertical flat key groove 1 38, and the upper and lower end surfaces of the second convex wing 32 are both distributed with a vertical flat key groove 2 39; and the four corners of the U-direction adjustment carrier 3 are provided with assembly holes 310. The U-direction adjustment carrier 3 can adjust the angle of the pressure-maintaining structure 1 to ±4°.

[0044] Furthermore, the first arc key groove 33, the first guide arc key groove 35 and the second arc key groove 34, the second guide arc key groove 36 are symmetrically arranged with the center line of the U-direction adjustment carrier 3 in the vertical direction as a reference. For each arc key groove and guide arc key groove, the symmetrical structure is convenient for assembly, debugging and maintenance, which can greatly shorten the processing time and improve production efficiency.

[0045] Furthermore, the first longitudinal keyway 38 and the second longitudinal keyway 39 are symmetrically arranged with the center line of the U-direction adjustment carrier 3 in the vertical direction as a reference, so that the forces between the longitudinal keyways are uniform, deformation and cracking are not easy to occur, and the structure has good stability.

[0046] See attached Figure 7-8As shown, the Y-direction adjustment carrier 4 is provided with a threaded hole belt 1 41, a threaded hole belt 2 42, a Y-direction through hole 43, a first guide hole 44, a second guide hole 45 and a vertical flat key groove 3 46; the threaded hole belt 1 41 and the threaded hole belt 2 42 are symmetrically arranged on the left and right end surfaces of the Y-direction adjustment carrier 4; the Y-direction through hole 43 passes through the center position of the Y-direction adjustment carrier 4; the first guide hole 44 is located on the inner side of the threaded hole belt 1 41, and the first guide hole 44 passes through the Y-direction adjustment carrier 4; the second guide hole 45 is located on the inner side of the threaded hole belt 2 42, and the second guide hole 45 passes through the Y-direction adjustment carrier 4; and vertical flat key groove 3 46 is arranged on the four corners of the Y-direction adjustment carrier 4. The Y-direction adjustment carrier 4 can adjust the stroke of the pressure-maintaining structure 1 to ±2.5mm, so as to adjust each copper foil patch PCB product 6 in the Y direction.

[0047] Furthermore, the threaded hole band 1 41 and the threaded hole band 2 42 are both arranged with a plurality of threaded holes in an arc shape, the threaded hole band 1 41 and the first arc key groove 33 are stacked and matched in the vertical direction, and the threaded hole band 2 42 and the second arc key groove 34 are stacked and matched in the vertical direction. Each threaded hole band is matched and installed with its corresponding arc key groove, and is used for the detachable connection between the U-direction adjustment carrier 3 and the Y-direction adjustment carrier 4 to transmit torque.

[0048] Furthermore, the first guide hole 44 and the first guide arc key slot 35 are stacked and adapted in the vertical direction; the second guide hole 45 and the second guide arc key slot 36 are stacked and adapted in the vertical direction. By changing the orientation of each guide hole corresponding to each guide arc key slot, the stacking plane angle between the U-direction adjustment carrier 3 and the Y-direction adjustment carrier 4 is finely adjusted, and the pressure-maintaining adaptability of multiple copper foil patch PCB products 6 after the plane angle adjustment limit is improved.

[0049] Working principle: After the pressure-holding structure 1 is formed by using the X-direction adjustment carrier 2, the U-direction adjustment carrier 3 and the Y-direction adjustment carrier 4, several pressure-holding structures 1 can be stacked in the vertical direction to form a pressure-holding assembly. The supporting space formed by the pressure-holding assembly can accommodate multiple pressure-holding heads. When the pressure-holding structure 1 on the top surface is performing a pressure-holding operation on the copper foil patch PCB product to be pressed, each pressure-holding head can simultaneously and accurately pressurize each copper foil patch PCB product, and the pressure-holding structure 1 on the bottom surface can accommodate another copper foil patch PCB product to be pressed, so that the pressure-holding structure 1 on the next layer can be used as the pressure-holding plane of the pressure-holding structure 1 on the upper layer, effectively saving space. In this way, the stroke and angle of the pressure-holding component are adjusted by adjusting the carrier 2 in the X direction, the carrier 3 in the U direction and the carrier 4 in the Y direction, so as to achieve the pressure-holding head and the copper foil patch PCB product in the support space, and the horizontal position of the copper foil patch PCB product is accurately adjusted by adjusting the X and Y directions, and the horizontal angle of the copper foil patch PCB product is eliminated by adjusting the U direction, so as to achieve zero deviation of the relative angles of the pressure-holding surfaces of each product, ensure that each pressure-holding head can accurately pressurize the pressure-holding area of ​​each copper foil patch PCB product, optimize the pressure-holding effect, and reduce the damage rate.

[0050] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A pressure-maintaining component for copper foil patch processing in electronic assembly, characterized in that: The pressure-holding component comprises a plurality of pressure-holding structures (1) for placing copper foil patch PCB products (6), wherein the pressure-holding structures (1) are stacked in a vertical direction and generate a vertical limiting pressure on the copper foil patch PCB products (6); The pressure-maintaining structure (1) comprises an X-direction adjustment carrier (2), a U-direction adjustment carrier (3) and a Y-direction adjustment carrier (4), wherein the adjustment carriers are stacked in a vertical direction, and a support space for accommodating a plurality of pressure-maintaining heads (5) is provided between two adjacent adjustment carriers, wherein the cross-sectional profile of the support space matches the cross-sectional profile of a copper foil patch PCB product (6) to be pressure-maintained.

2. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 1, characterized in that: The X-direction adjustment carrier (2), the U-direction adjustment carrier (3) and the Y-direction adjustment carrier (4) all adopt a plate-shaped structure.

3. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to any one of claims 1 to 2, characterized in that: The X-direction adjustment carrier (2) is provided with a first U-shaped groove (21), a second U-shaped groove (22), an X-direction opening (23) and a horizontal key groove (24); the first U-shaped groove (21) is fixedly arranged at the right end of the X-direction adjustment carrier (2); the second U-shaped groove (22) is fixedly arranged at the left end of the X-direction adjustment carrier (2); the X-direction opening (23) passes through the center position of the X-direction adjustment carrier (2); and the horizontal key grooves (24) are provided at the four corners of the X-direction adjustment carrier (2).

4. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 3, characterized in that: The transverse width of the first U-shaped groove (21) is greater than the transverse width of the second U-shaped groove (22).

5. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 4, characterized in that: The left and right ends of the U-direction adjustment carrier (3) are respectively fixed with a first convex wing (31) and a second convex wing (32); the first convex wing (31) is provided with a first arc key groove (33), and a first guide arc key groove (35) is also provided on the inner side of the first arc key groove (33); the second convex wing (32) is provided with a second arc key groove (34), and a second guide arc key groove (36) is also provided on the inner side of the second arc key groove (34); the center position of the U-direction adjustment carrier (3) is connected through a U-direction opening (37); the upper and lower end surfaces of the first convex wing (31) are both provided with a first longitudinal flat key groove (38), and the upper and lower end surfaces of the second convex wing (32) are both provided with a second longitudinal flat key groove (39); and assembly holes (310) are provided on the four corners of the U-direction adjustment carrier (3).

6. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 5, characterized in that: The first arc key groove (33), the first guide arc key groove (35) and the second arc key groove (34), the second guide arc key groove (36) are symmetrically arranged with the center line of the U-direction adjustment carrier (3) in the up-down direction as a reference.

7. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 6, characterized in that: The first longitudinal keyway (38) and the second longitudinal keyway (39) are symmetrically arranged with the center line of the U-direction adjustment carrier (3) in the up-down direction as a reference.

8. The pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 7, characterized in that: The Y-direction adjustment carrier (4) is provided with a threaded hole band 1 (41), a threaded hole band 2 (42), a Y-direction opening (43), a first guide hole (44), a second guide hole (45) and a vertical flat keyway 3 (46); the threaded hole band 1 (41) and the threaded hole band 2 (42) are symmetrically arranged on the left and right end surfaces of the Y-direction adjustment carrier (4); the Y-direction opening (43) passes through the center position of the Y-direction adjustment carrier (4); the first guide hole (44) is located on the inner side of the threaded hole band 1 (41), and the first guide hole (44) passes through the Y-direction adjustment carrier (4); the second guide hole (45) is located on the inner side of the threaded hole band 2 (42), and the second guide hole (45) passes through the Y-direction adjustment carrier (4); and vertical flat keyways 3 (46) are provided on the four corners of the Y-direction adjustment carrier (4).

9. A pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 8, characterized in that: The threaded hole band one (41) and the threaded hole band two (42) both have a plurality of threaded holes arranged in an arc shape, the threaded hole band one (41) and the first arc key groove (33) are stacked and fitted in the vertical direction, and the threaded hole band two (42) and the second arc key groove (34) are stacked and fitted in the vertical direction.

10. The pressure-maintaining assembly for copper foil patch processing in electronic assembly according to claim 8, characterized in that: The first guide hole (44) and the first guide arc key groove (35) are stacked and fitted in the vertical direction; and the second guide hole (45) and the second guide arc key groove (36) are stacked and fitted in the vertical direction.

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